JP2000070873A - Base treating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a cleaning liq. from falling flop on the top face of a base from a liq. outlet after the cleaning liq. is stopped to be fed. SOLUTION: In this apparatus, after cleaning treatment is performed by feeding a cleaning liq. on the top face of a base W from a liq. outlet 41 at the apex of a top part cleaning liq. feeding pipe 40 arranged above the base W held by means of a spin chuck 1, drying treatment for drying the base W is performed under a condition where the base W is held by means of the spin chuck 1. In this case, at least a liq. flow path part 43 on the liq. outlet 41 side of the top part cleaning liq. feeding pipe 40 is divided into a plurality of liq. flow paths 44 and the cleaning liq. is fed on the top face of the base W through a plurality of these liq. flow paths 44.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of holding a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk in a substrate holding means. A drying process in which the cleaning liquid is supplied to the upper surface of the substrate from the liquid discharge port at the tip of the cleaning liquid supply unit disposed above the substrate to perform the cleaning process, and then the substrate is dried while the substrate is held by the substrate holding unit. More particularly, the present invention relates to a technique for improving a cleaning liquid supply unit.

[0002]

2. Description of the Related Art Conventional substrate processing apparatuses of this type include:
For example, there is one shown in FIG. This apparatus is configured to hold a substrate W in a horizontal posture on a spin chuck 100 and rotate the held substrate W around a vertical axis J. Above the spin chuck 100, an atmosphere blocking member 101 is arranged. The atmosphere blocking member 101 is supported by the lower end of a support shaft 102, and is configured to be able to freely contact and separate from the upper surface of the substrate W held by the spin chuck 100 via the support shaft 102. A cleaning liquid supply pipe 103 passes through the atmosphere blocking member 101 and the support shaft 102. The cleaning liquid flowing through the liquid flow path 104 in the cleaning liquid supply pipe 103 is supplied to the cleaning liquid supply pipe 10.
3 (liquid flow path 104), the liquid is supplied from the liquid discharge port 105 near the center of rotation of the upper surface of the substrate W held by the spin chuck 100.

According to this apparatus, a spin chuck 100 is provided.
An atmosphere blocking member 101 is disposed in close proximity to the upper surface of the substrate W held in the substrate W, and the cleaning liquid is supplied to the upper surface of the substrate W from the liquid discharge port 105 while rotating the substrate W around the axis J to perform the cleaning process. When a predetermined cleaning processing time has elapsed, the supply of the cleaning liquid from the liquid discharge port 105 is stopped, while the rotation of the substrate W is continued, and the cleaning liquid attached to the substrate W is shaken off to dry the substrate W. Drying process is performed. When the drying process is completed, the atmosphere blocking member 101 is raised and separated from the upper surface of the substrate W, and the processed substrate W is carried out in that state.

[0004]

However, in the above-mentioned conventional apparatus, the cleaning liquid supply pipe 103 penetrated by the atmosphere blocking member 101 and the support shaft 102 is constituted by a single pipe having a uniform inner diameter. Of the liquid flow path 104 is uniform. In order to ensure a sufficient amount of the cleaning liquid to be supplied to the upper surface of the substrate W, the inner diameter of the liquid flow path 104 in the cleaning liquid supply pipe 103 must be increased to some extent.
For this reason, the surface tension acting to prevent the cleaning liquid remaining in the liquid flow path 104 in the cleaning liquid supply pipe 103 from dropping from the liquid discharge port 105 after the supply of the cleaning liquid is stopped is weakened. Due to vibrations transmitted to the atmosphere blocking member 101, the cleaning liquid may drop from the liquid discharge port 105 on the upper surface of the substrate W during or after the drying processing, that is, a so-called dripping of the cleaning liquid may occur. There was a problem of getting worse.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has as its object to provide a substrate processing apparatus for preventing the cleaning liquid from dripping from the liquid discharge port onto the upper surface of the substrate after the supply of the cleaning liquid is stopped. And

[0006]

The present invention has the following configuration in order to achieve the above object. That is, according to the first aspect of the present invention, after the cleaning process is performed by supplying the cleaning liquid to the upper surface of the substrate from the liquid discharge port at the tip of the cleaning liquid supply unit disposed above the substrate held by the substrate holding means, In a substrate processing apparatus for performing a drying process for drying a substrate while the substrate is held by the substrate holding unit, at least a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit is divided into a plurality of liquid flow paths. It is characterized by the following.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, a liquid flow path member having a plurality of liquid flow paths formed thereon is connected to a liquid discharge port side of the cleaning liquid supply section. The cleaning liquid supply unit is mounted on a flow path portion, and a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths.

According to a third aspect of the present invention, in the substrate processing apparatus according to the first aspect, a plurality of thin tubes are bundled and attached to a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply section, and the cleaning liquid is provided. The liquid flow path on the liquid discharge port side of the supply unit is divided into a plurality of liquid flow paths.

[0009]

According to the first aspect of the present invention, at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths, and the substrate of the cleaning liquid supply section is separated through the plurality of liquid flow paths. A cleaning liquid is supplied to the upper surface to perform a cleaning process on the substrate.

As described above, at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths.
Since the inner diameter of each divided liquid flow path becomes smaller, the surface tension that acts to prevent the cleaning liquid from dropping from the tip of each liquid flow path becomes stronger, and the individual liquid flows on the upper surface of the substrate during or after the drying process. The washing liquid can be prevented from dripping from the flow path. Also, since the inner diameter of the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is not simply reduced, at least the liquid flow path section on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths. In addition, a sufficient amount of the cleaning liquid supplied to the upper surface of the substrate can be secured.

According to the second aspect of the present invention, the upper surface of the substrate is formed through a plurality of liquid flow paths formed in the liquid flow path member mounted on the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section. A cleaning liquid is supplied to perform a cleaning process on the substrate.

According to the third aspect of the present invention, the cleaning liquid is supplied to the upper surface of the substrate via a plurality of bundled thin tubes attached to the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section, and the cleaning liquid is supplied to the substrate. A cleaning process is performed.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partially omitted front view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention.

The substrate W is held in a horizontal posture by a spin chuck 1 corresponding to a substrate holding means. Spin chuck 1
A disk-shaped spin base 4 is integrally rotatably connected to an upper end of a rotating shaft 3 rotatable around a vertical axis J by an electric motor 2, and three or more spin bases are attached to an outer peripheral portion of an upper surface of the spin base 4. Are held upright at equal intervals. Note that FIG. 1 shows only one substrate holding member 5 to avoid complicating the drawing.

Each of the substrate holding members 5 includes a supporting portion 5a for supporting the outer peripheral portion of the substrate W from below, and a holding portion for pressing the outer peripheral edge of the substrate W supported by each supporting portion 5a to hold the substrate W. 5b, and the outer peripheral portion of the substrate W is held at three or more places in a state where the substrate W is separated from the upper surface of the spin base 4. Each substrate holding member 5 is switched between a holding state in which the holding portion 5b presses the outer peripheral edge of the substrate W and a non-holding state in which the holding portion 5b is separated from the outer peripheral edge of the substrate W. The switching between the holding state and the non-holding state is performed, for example, in Japanese Patent Publication No. 3-96.
07 can be realized by a link mechanism or the like disclosed in JP-A-07-07.

The spin base 4 is not limited to a disc-shaped one, but may be a star-shaped one in which three or more arms are radially extended from a central rotating part attached to the rotating shaft 3 so as to be integrally rotatable. It may be something. When this star-shaped spin base is used, a substrate holding member 5 is provided at the tip of each arm.
Is erected.

Although FIG. 1 shows the mechanical type spin chuck 1, the spin chuck 1 is not limited to the mechanical type, and a predetermined area including the rotation center on the lower surface of the substrate W is held by vacuum suction. It may be a vacuum chuck type spin chuck.

The rotating shaft 3 is formed of a cylindrical body having a hollow portion, and a lower cleaning liquid supply pipe 10 penetrates the hollow portion of the rotating shaft 3. The distal end of the lower cleaning liquid supply pipe 10 serves as a lower liquid discharge port 11 for supplying the cleaning liquid to the vicinity of the rotation center on the lower surface of the substrate W held by the spin chuck 1. A chemical solution supply section 80 for supplying a chemical such as hydrofluoric acid is connected to the lower cleaning liquid supply pipe 10 via a pipe 13 provided with an on-off valve 12, and a pipe provided with an on-off valve 14. A rinsing liquid supply unit 81 that supplies a rinsing liquid such as pure water through the communication unit 15 is connected to the rinsing liquid supply unit 81. By controlling the switching of the open / close valves 12 and 14, the chemical liquid and the rinsing liquid can be selectively switched and supplied to the vicinity of the rotation center on the lower surface of the substrate W held by the spin chuck 1.

Further, the inner wall surface of the rotating shaft 3 and the cleaning liquid supply pipe 1
A space between the outer gas wall and the outer wall of the lower gas supply passage 20 is a lower gas supply passage 20. A gas supply unit 82 is connected to the lower gas supply path 20 via a pipe 22 in which an on-off valve 21 is interposed. By switching the on-off valve 21 to open, the tip of the lower gas supply path 20 From the lower gas supply port 23 to the spin base 4
A clean gas such as an inert gas such as nitrogen gas or dry air can be supplied to a space between the upper surface of the substrate and the lower surface of the substrate W held by the spin chuck 1.

An atmosphere blocking member 30 is disposed above the spin chuck 1. The atmosphere blocking member 30 is supported by a tip of a support shaft 31 so as to be integrally rotatable. The support shaft 31 is rotatably attached to the distal end of the support arm 32. The support arm 32 is configured to be able to move up and down by an elevating drive unit 33 configured by a well-known uniaxial drive mechanism such as a ball screw and an air cylinder. It can freely contact and separate from the upper surface of the held substrate W. The support shaft 31 is linked to a motor 34 provided on the support arm 32, and by driving the motor 34, the atmosphere blocking member 30 can rotate around the axis J together with the support shaft 31.

A hollow portion is formed in the atmosphere blocking member 30 and the support shaft 31, and an upper cleaning liquid supply pipe 40 corresponding to a cleaning liquid supply portion is penetrated through the hollow portion. The top end of the upper cleaning liquid supply pipe 40 is an upper liquid discharge port 41 corresponding to a liquid discharge port for jetting and supplying the cleaning liquid to the vicinity of the rotation center of the upper surface of the substrate W held by the spin chuck 1.

In this embodiment, a part of the liquid flow path 43 in the upper cleaning liquid supply pipe 40 on the side of the upper liquid discharge port 41 is divided into a plurality of liquid flow paths 44.

A specific structure for dividing the liquid flow path portion 43 on the upper liquid discharge port 41 side into a plurality of liquid flow paths 44 will be described with reference to FIGS.

FIG. 2 shows a first configuration example, in which FIG. 2A is a longitudinal sectional view, and FIG. 2B is a diagram showing the configuration of an upper liquid discharge port viewed from the spin chuck side. FIG. 3C is a perspective view showing the configuration of the liquid flow path member. In the first configuration example, a liquid flow path member 50 in which a plurality of liquid flow paths 44 are formed
Is attached to the liquid flow path portion 43 on the upper liquid discharge port 41 side in the upper cleaning liquid supply pipe 40, and the liquid flow path section 43 on the upper liquid discharge port 41 side in the upper cleaning liquid supply pipe 40 is supplied with a plurality of liquid flows. Road 44
It is divided into The liquid channel member 50 attached to the liquid channel portion 43 is fixed to the liquid channel portion 43 by, for example, bonding or screwing. Further, FIG. 2 shows the upper cleaning liquid supply pipe 40 having a circular cross section, but the cross sectional shape of the upper cleaning liquid supply pipe 40 is not limited to a circle, and may be rectangular or polygonal. The shape of the member 50 may be formed according to the cross-sectional shape of the upper cleaning liquid supply pipe 40.

The sectional shape of the plurality of liquid flow paths 44 formed in the liquid flow path member 50 is not limited to a circle. For example, as shown in FIG. It may be formed.

FIG. 4 shows a second configuration example. FIG. 4A is a longitudinal sectional view of the second configuration example, and FIG. 4B is a diagram showing the configuration of the upper liquid discharge port viewed from the spin chuck side. . This second
In the configuration example, a plurality of thin tubes 51 integrated and bundled by welding or the like are attached to the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40, for example, by bonding or screwing. The liquid passage portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 is fixed to the liquid passage portion 43 by, for example, divided into a plurality of liquid passages 44. The gap between the small tubes 51 and the gap between the small tube 51 and the inner wall surface of the upper cleaning liquid supply tube 40 may be left as the liquid flow path 44, or these gaps may be closed to close the small tubes 51. The cleaning liquid may be supplied to the substrate W only from the tip. FIG. 4 shows a thin tube 50 having a circular cross section, but other thin tubes 5 having a rectangular cross section, etc.
1 may be bundled.

FIG. 5 shows a third configuration example, and FIG. 5 is a longitudinal sectional view thereof. In the third configuration example, a pipe integrally formed by dividing the liquid flow path portion 43 on the distal end side into a plurality of liquid flow paths 44 is used as the upper cleaning liquid supply pipe 40.

In the above configuration example, the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 is divided into a plurality of liquid flow paths 44.
This is an example of dividing the liquid flow path 43 into a liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 in another configuration.
May be divided into a plurality of liquid flow paths 44.

When the cross section of each liquid flow path 44 is, for example, circular, the diameter is about 0.5 to 2.0 mm, and when the cross section is square, one side is about 0.5 to 2.0 mm. It is preferable that By making each of the liquid flow paths 44 thinner in this way, it is possible to prevent undesired dripping of the cleaning liquid from each of the liquid flow paths 44 as described later.

Returning to FIG. 1, a chemical solution supply section 80 is connected to the upper cleaning liquid supply pipe 40 through a pipe 46 in which an on-off valve 45 is interposed, and an on-off valve 47 is interposed. A rinsing liquid supply unit 81 is connected through a pipe 48. By controlling the switching of the open / close valves 45 and 47, the chemical liquid and the rinsing liquid can be selectively switched and supplied to the vicinity of the rotation center on the upper surface of the substrate W held by the spin chuck 1.

A space between the inner wall surface of the hollow portion of the atmosphere blocking member 30 and the support shaft 31 and the outer wall surface of the upper cleaning liquid supply pipe 40 is formed as a gas supply passage 60. A gas supply unit 82 is connected to the gas supply path 60 via a pipe 62 in which an on-off valve 61 is interposed.
Is switched to open, a clean gas is supplied from the upper gas supply port 63 at the end of the gas supply path 60 to the space between the upper surface of the substrate W held by the spin chuck 1 and the lower surface of the atmosphere blocking member 30. it can.

A scattering prevention cup 70 for preventing the cleaning liquid from scattering is provided around the spin chuck 1 and the substrate W held by the spin chuck. This shatterproof cup 7
0 and the spin chuck 1 are configured to be able to move up and down relative to each other by a lifting mechanism (not shown).

Next, the operation of the embodiment apparatus having the above configuration will be described. First, the spin chuck 1 and the scattering prevention cup 70 are moved up and down relatively to dispose the spin chuck 1 above the scattering prevention cup 70, and the atmosphere blocking member 30 is retracted to a retracted position above the spin chuck 1. In this state, the substrate W is carried in by a substrate transport mechanism (not shown) and delivered to the spin chuck 1. The spin chuck 1 holds the received substrate W. Next, the spin chuck 1 and the scattering prevention cup 70 are relatively moved up and down in the opposite direction to the above, and the spin chuck 1 and the substrate W held thereon are accommodated in the scattering prevention cup 70. Then, the atmosphere blocking member 30 is lowered to the processing position below the retreat position, and the atmosphere blocking member 30 is disposed close to the upper surface of the substrate W held by the spin chuck 1 (the state shown in FIG. 1).

In this state, the spin chuck 1 and the substrate W held thereon are rotated around the axis J. And
A chemical is supplied to the upper and lower surfaces of the substrate W from the upper liquid discharge port 41 and the lower liquid discharge port 11, and a substrate cleaning process using the chemical is performed. At this time, if necessary, the upper gas supply port 6
The gas may be supplied from the third gas supply port 23 and the lower gas supply port 23.

When a predetermined chemical cleaning time has elapsed, the cleaning liquid supplied to the upper and lower surfaces of the substrate W from the upper liquid discharge port 41 and the lower liquid discharge port 11 is switched from a chemical liquid to a rinsing liquid. A rinse cleaning process is performed in which the existing chemical is rinsed off with a rinse. During this rinsing process, gas may be supplied from the upper gas supply port 63 and the lower gas supply port 23 as necessary.

When a predetermined rinsing cleaning time has elapsed,
While the supply of the rinsing liquid to the upper and lower surfaces of the substrate W from the upper liquid discharging port 41 and the lower liquid discharging port 11 is stopped, the rotation of the spin chuck 1 is continued to remove the rinsing liquid remaining on the substrate W. A drying process of shaking off and drying the substrate W is performed. At this time, if gas is supplied from the upper gas supply port 63 and the lower gas supply port 23, the drying process can be promoted and the drying process time can be shortened.

When a predetermined drying time has elapsed, the rotation of the spin chuck 1 is stopped. Then, the atmosphere blocking member 30 is raised from the processing position to the retreat position, and the spin chuck 1 and the scattering prevention cup 70 are relatively moved up and down, so that the spin chuck 1 is disposed above the scattering prevention cup 70 and the substrate W Is released. In this state, the substrate W is transferred to the spin chuck 1 by the substrate transfer mechanism.
And is carried out of the apparatus.

According to this embodiment, in order to supply a cleaning liquid such as a chemical solution or a rinsing liquid to the upper surface of the substrate W held by the spin chuck 1, the substrate W is disposed above the substrate W held by the spin chuck 1. Since the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 is divided into a plurality of liquid flow paths 44, the inner diameter of each liquid flow path 44 is set at the base end of the upper cleaning liquid supply pipe 40. Side, that is, smaller than the inside diameter of the liquid discharge port 105 of the conventional device. Accordingly, the surface tension acting to prevent the cleaning liquid from dropping from the tip of the individual liquid flow path 44 is increased, and the cleaning liquid is dripped from the individual liquid flow path 44 on the upper surface of the substrate W during or after the drying process. Can be prevented. Further, since the supply area of the liquid discharge port for supplying the cleaning liquid to the upper surface of the substrate W is the sum of the cross-sectional areas of all the liquid flow paths 44, as shown in FIG.
A sufficient amount of the cleaning liquid supplied to the upper surface of the substrate W is ensured compared to a case where the inner diameter of the liquid flow path portion 43 on the upper liquid discharge port 41 side of the upper cleaning liquid supply pipe 40 is simply reduced.

As shown in FIGS. 2 and 3, a liquid flow path member 50 having a plurality of liquid flow paths 44 is connected to a liquid flow path portion on an upper liquid discharge port 41 side in an upper cleaning liquid supply pipe 40. 4 or a bundle of a plurality of thin tubes 51 attached to the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 as shown in FIG. Supply pipe 4
In the case of a configuration in which the liquid flow path portion 43 on the upper liquid discharge port 41 side is divided into a plurality of liquid flow paths 44, the liquid flow path on the upper liquid discharge port 41 side in the upper cleaning liquid supply pipe 40 has a simple configuration. Part 43
Can be divided into a plurality of liquid flow paths 44. Further, according to this configuration, the liquid flow path portion on the liquid discharge port 105 side in the cleaning liquid supply pipe 103 of the existing apparatus such as the conventional apparatus can be divided into the plurality of liquid flow paths 44, and the existing apparatus can be used. The invention can be applied without significant modification.

Although the above embodiment has been described with reference to the case where the cleaning liquid is supplied to the upper and lower surfaces of the substrate W to perform the cleaning processing, the cleaning liquid is supplied only to the upper surface of the substrate W to perform the cleaning processing. The present invention can be similarly applied to an apparatus configured to perform a cleaning process by supplying a cleaning liquid only to the upper surface.

In some cases, the atmosphere shielding member 30 is rotated around the axis J to perform a cleaning process or a drying process.
In such a process, the vibration of the atmosphere blocking member 30 accompanying the rotation of the atmosphere blocking member 30 is likely to occur.
Even by such a vibration, the liquid flow path portion 43 of the upper liquid discharge port 41 of the upper cleaning liquid supply pipe 40 is divided into a plurality of liquid flow paths 44, so that each of the substrates W during and after the drying processing is applied to the substrate W. The dripping of the cleaning liquid from the liquid flow path 44 can be prevented.

The length of each liquid flow path 44 (liquid flow path portion 4)
3), the longer the length of each liquid flow path 4
The cleaning liquid in each of the liquid flow paths 44 can be reliably prevented from dropping and the undesired drop of the cleaning liquid from each of the liquid flow paths 44. It is sufficient to determine the length of each liquid flow path 44 that can sufficiently prevent the dropping of the liquid. Note that the entire upper cleaning liquid supply pipe 40 may be divided into a plurality of liquid flow paths 44 as necessary.

In the above embodiment, the spin chuck 1
The case where the upper cleaning liquid supply pipe 40 provided in the atmosphere blocking member 30 disposed above the substrate W held in the above is used as the cleaning liquid supply unit, for example, as shown in FIG. The present invention can be applied to a cleaning liquid supply nozzle 90 disposed above the held substrate W and serving as a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the substrate W, with the same configuration as that of the above-described embodiment. 7, reference numeral 91 denotes a liquid flow path in the nozzle 90, 92 denotes a liquid discharge port at the tip of the nozzle 70, and 93 denotes a plurality of liquid flow paths 94 of the liquid flow path 91 in the nozzle 90. The liquid flow path portion on the liquid discharge port 92 side is shown. In the case of the cleaning liquid supply nozzle 90 as well, the entire liquid flow path 91 in the nozzle 90 may be divided into a plurality of liquid flow paths 94 as necessary.

The present invention can be similarly applied to other cleaning liquid supply units disposed above the substrate W held by the spin chuck 1 and supplying the cleaning liquid to the upper surface of the substrate W.

[0045]

As is clear from the above description, according to the first aspect of the present invention, at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths.
The cleaning liquid can be prevented from dripping from each liquid flow path onto the upper surface of the substrate during or after the drying process, while ensuring a sufficient amount of the cleaning liquid supplied to the upper surface of the substrate.

In order to divide at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section into a plurality of liquid flow paths,
The liquid flow path member in which a plurality of liquid flow paths are formed as in the invention described in (3) may be mounted on the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply unit. As described above, a plurality of thin tubes may be bundled and attached to the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply unit.

According to the second and third aspects of the present invention, the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section can be divided into a plurality of liquid flow paths with a simple configuration, and the existing apparatus can be used. Since the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply unit can be divided into a plurality of liquid flow paths, the present invention can be easily applied to existing devices.

[Brief description of the drawings]

FIG. 1 is a partially omitted front view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing a first configuration example for dividing a liquid flow path portion on an upper liquid discharge port side into a plurality of liquid flow paths.

FIG. 3 is a diagram showing a configuration of a modified example of the liquid flow path member.

FIG. 4 is a diagram showing a second configuration example for dividing the liquid flow path portion on the upper liquid discharge port side into a plurality of liquid flow paths.

FIG. 5 is a diagram showing a third configuration example for dividing the liquid flow path portion on the upper liquid discharge port side into a plurality of liquid flow paths.

FIG. 6 is a vertical cross-sectional view when the inner diameter of the liquid flow path portion on the upper liquid discharge port side of the upper cleaning liquid supply pipe is simply reduced.

FIG. 7 is a longitudinal sectional view in which the present invention is applied to a cleaning liquid supply nozzle.

FIG. 8 is a partially omitted front view showing the configuration of a conventional apparatus.

[Explanation of symbols]

 1: spin chuck 40: upper cleaning liquid supply pipe 41, 91: liquid discharge port 44, 94: individual liquid flow path divided into plural parts 50: liquid flow path member 51: thin tube 90: cleaning liquid supply nozzle W: substrate

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tsutomu Ueyama F-term (reference) 3N201 AA03 AB08 AB34 AB44 BB62 BB93 BB96 CB12 CC01 CC13

Claims (3)

[Claims] A cleaning liquid supply unit configured to supply a cleaning liquid to a top surface of the substrate from a liquid discharge port at a tip of a cleaning liquid supply unit disposed above the substrate held by the substrate holding unit, to perform a cleaning process; In a substrate processing apparatus for performing a drying process for drying a substrate while holding the substrate, at least a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit is divided into a plurality of liquid flow paths. Processing equipment. 2. The substrate processing apparatus according to claim 1, wherein a liquid flow path member having a plurality of liquid flow paths is attached to a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit. A substrate processing apparatus, wherein a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit is divided into a plurality of liquid flow paths. 3. The substrate processing apparatus according to claim 1, wherein a plurality of thin tubes are bundled and attached to a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply section, and a plurality of thin tubes are mounted on the liquid discharge port side of the cleaning liquid supply section. A substrate processing apparatus, wherein a liquid flow path is divided into a plurality of liquid flow paths.