JP2000070873A - Base treating apparatus - Google Patents
Base treating apparatusInfo
- Publication number
- JP2000070873A JP2000070873A JP10241656A JP24165698A JP2000070873A JP 2000070873 A JP2000070873 A JP 2000070873A JP 10241656 A JP10241656 A JP 10241656A JP 24165698 A JP24165698 A JP 24165698A JP 2000070873 A JP2000070873 A JP 2000070873A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- substrate
- liquid flow
- flow path
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、半導体ウエハや液
晶表示器用のガラス基板、フォトマスク用のガラス基
板、光ディスク用の基板などの基板を基板保持手段に保
持し、基板保持手段に保持された基板の上方に配置され
た洗浄液供給部の先端の液吐出口から基板の上面に洗浄
液を供給して洗浄処理を行った後、基板保持手段に基板
が保持された状態で基板を乾燥する乾燥処理を行う基板
処理装置に係り、特には、洗浄液供給部の改良技術に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of holding a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a substrate for an optical disk in a substrate holding means. A drying process in which the cleaning liquid is supplied to the upper surface of the substrate from the liquid discharge port at the tip of the cleaning liquid supply unit disposed above the substrate to perform the cleaning process, and then the substrate is dried while the substrate is held by the substrate holding unit. More particularly, the present invention relates to a technique for improving a cleaning liquid supply unit.
【0002】[0002]
【従来の技術】従来のこの種の基板処理装置としては、
例えば、図8に示すものがある。この装置は、スピンチ
ャック100に基板Wを水平姿勢に保持して、保持した
基板Wを鉛直方向の軸芯J周りで回転させるように構成
されている。スピンチャック100の上方には、雰囲気
遮断部材101が配置されている。この雰囲気遮断部材
101は、支軸102の下端部に支持されていて、この
支軸102を介して、スピンチャック100に保持され
た基板Wの上面に対して接離自在に構成されている。雰
囲気遮断部材101及び支軸102には、洗浄液供給管
103が貫通されている。この洗浄液供給管103内の
液流路104を流れてきた洗浄液が、洗浄液供給管10
3(液流路104)の先端の液吐出口105からスピン
チャック100に保持された基板Wの上面の回転中心付
近に供給される。2. Description of the Related Art Conventional substrate processing apparatuses of this type include:
For example, there is one shown in FIG. This apparatus is configured to hold a substrate W in a horizontal posture on a spin chuck 100 and rotate the held substrate W around a vertical axis J. Above the spin chuck 100, an atmosphere blocking member 101 is arranged. The atmosphere blocking member 101 is supported by the lower end of a support shaft 102, and is configured to be able to freely contact and separate from the upper surface of the substrate W held by the spin chuck 100 via the support shaft 102. A cleaning liquid supply pipe 103 passes through the atmosphere blocking member 101 and the support shaft 102. The cleaning liquid flowing through the liquid flow path 104 in the cleaning liquid supply pipe 103 is supplied to the cleaning liquid supply pipe 10.
3 (liquid flow path 104), the liquid is supplied from the liquid discharge port 105 near the center of rotation of the upper surface of the substrate W held by the spin chuck 100.
【0003】この装置によれば、スピンチャック100
に保持された基板Wの上面に雰囲気遮断部材101が近
接配置され、基板Wを軸芯J周りで回転させながら液吐
出口105から洗浄液が基板Wの上面に供給されて洗浄
処理が行われる。そして、所定の洗浄処理時間が経過す
ると、液吐出口105からの洗浄液の供給が停止される
一方で、基板Wの回転が継続され、基板Wに付着してい
る洗浄液を振り切って基板Wを乾燥する乾燥処理が行わ
れる。乾燥処理が終わると、雰囲気遮断部材101は上
昇されて基板Wの上面から離され、その状態で処理済の
基板Wの搬出が行われる。According to this apparatus, a spin chuck 100 is provided.
An atmosphere blocking member 101 is disposed in close proximity to the upper surface of the substrate W held in the substrate W, and the cleaning liquid is supplied to the upper surface of the substrate W from the liquid discharge port 105 while rotating the substrate W around the axis J to perform the cleaning process. When a predetermined cleaning processing time has elapsed, the supply of the cleaning liquid from the liquid discharge port 105 is stopped, while the rotation of the substrate W is continued, and the cleaning liquid attached to the substrate W is shaken off to dry the substrate W. Drying process is performed. When the drying process is completed, the atmosphere blocking member 101 is raised and separated from the upper surface of the substrate W, and the processed substrate W is carried out in that state.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来装置では、雰囲気遮断部材101及び支軸102に貫
通された洗浄液供給管103は内径が均一な単一の管で
構成され、洗浄液供給管103内の液流路104の内径
が均一である。基板Wの上面へ供給する洗浄液の液量を
十分に確保するためには、洗浄液供給管103内の液流
路104の内径をある程度大きくしなければならない。
そのため、洗浄液供給停止後に洗浄液供給管103内の
液流路104に残る洗浄液が液吐出口105から落下し
ないように働く表面張力が弱くなり、例えば、雰囲気遮
断部材101の上昇による振動や、外部から雰囲気遮断
部材101に伝わる振動などにより、乾燥処理中や乾燥
処理後の基板Wの上面に、液吐出口105から洗浄液が
落下する、いわゆる洗浄液のボタ落ちが起こることがあ
り、処理の仕上がり精度が悪くなるという問題があっ
た。However, in the above-mentioned conventional apparatus, the cleaning liquid supply pipe 103 penetrated by the atmosphere blocking member 101 and the support shaft 102 is constituted by a single pipe having a uniform inner diameter. Of the liquid flow path 104 is uniform. In order to ensure a sufficient amount of the cleaning liquid to be supplied to the upper surface of the substrate W, the inner diameter of the liquid flow path 104 in the cleaning liquid supply pipe 103 must be increased to some extent.
For this reason, the surface tension acting to prevent the cleaning liquid remaining in the liquid flow path 104 in the cleaning liquid supply pipe 103 from dropping from the liquid discharge port 105 after the supply of the cleaning liquid is stopped is weakened. Due to vibrations transmitted to the atmosphere blocking member 101, the cleaning liquid may drop from the liquid discharge port 105 on the upper surface of the substrate W during or after the drying processing, that is, a so-called dripping of the cleaning liquid may occur. There was a problem of getting worse.
【0005】本発明は、このような事情に鑑みてなされ
たものであって、洗浄液供給停止後に液吐出口から基板
上面へ洗浄液がボタ落ちすることを防止する基板処理装
置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has as its object to provide a substrate processing apparatus for preventing the cleaning liquid from dripping from the liquid discharge port onto the upper surface of the substrate after the supply of the cleaning liquid is stopped. And
【0006】[0006]
【課題を解決するための手段】本発明は、このような目
的を達成するために、次のような構成をとる。すなわ
ち、請求項1に記載の発明は、基板保持手段に保持され
た基板の上方に配置された洗浄液供給部の先端の液吐出
口から基板の上面に洗浄液を供給して洗浄処理を行った
後、前記基板保持手段に基板が保持された状態で基板を
乾燥する乾燥処理を行う基板処理装置において、少なく
とも前記洗浄液供給部の液吐出口側の液流路部分を複数
の液流路に分割したことを特徴とするものである。The present invention has the following configuration in order to achieve the above object. That is, according to the first aspect of the present invention, after the cleaning process is performed by supplying the cleaning liquid to the upper surface of the substrate from the liquid discharge port at the tip of the cleaning liquid supply unit disposed above the substrate held by the substrate holding means, In a substrate processing apparatus for performing a drying process for drying a substrate while the substrate is held by the substrate holding unit, at least a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit is divided into a plurality of liquid flow paths. It is characterized by the following.
【0007】請求項2に記載の発明は、上記請求項1に
記載の基板処理装置において、複数の液流路が形成され
た液流路部材を、前記洗浄液供給部の液吐出口側の液流
路部分に装着して、前記洗浄液供給部の液吐出口側の液
流路部分を複数の液流路に分割したことを特徴とするも
のである。According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, a liquid flow path member having a plurality of liquid flow paths formed thereon is connected to a liquid discharge port side of the cleaning liquid supply section. The cleaning liquid supply unit is mounted on a flow path portion, and a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths.
【0008】請求項3に記載の発明は、上記請求項1に
記載の基板処理装置において、前記洗浄液供給部の液吐
出口側の液流路部分に複数の細管を束ねて装着し、前記
洗浄液供給部の液吐出口側の液流路部分を複数の液流路
に分割したことを特徴とするものである。According to a third aspect of the present invention, in the substrate processing apparatus according to the first aspect, a plurality of thin tubes are bundled and attached to a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply section, and the cleaning liquid is provided. The liquid flow path on the liquid discharge port side of the supply unit is divided into a plurality of liquid flow paths.
【0009】[0009]
【作用】請求項1に記載の発明によれば、少なくとも洗
浄液供給部の液吐出口側の液流路部分を複数の液流路に
分割して、これら複数の液流路を介して基板の上面に洗
浄液を供給して、基板に洗浄処理を施す。According to the first aspect of the present invention, at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths, and the substrate of the cleaning liquid supply section is separated through the plurality of liquid flow paths. A cleaning liquid is supplied to the upper surface to perform a cleaning process on the substrate.
【0010】このように少なくとも洗浄液供給部の液吐
出口側の液流路部分を複数の液流路に分割したことで、
分割した個々の液流路の内径が小さくなるので、個々の
液流路の先端から洗浄液が落下しないように働く表面張
力が強くなり、乾燥処理中や乾燥処理後に、基板の上面
に個々の液流路から洗浄液がボタ落ちすることを防止す
ることができる。また、洗浄液供給部の液吐出口側の液
流路部分の内径を単に絞ったわけではなく、少なくとも
洗浄液供給部の液吐出口側の液流路部分を複数の液流路
に分割しているので、基板の上面に供給される洗浄液の
液量を十分に確保することができる。As described above, at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths.
Since the inner diameter of each divided liquid flow path becomes smaller, the surface tension that acts to prevent the cleaning liquid from dropping from the tip of each liquid flow path becomes stronger, and the individual liquid flows on the upper surface of the substrate during or after the drying process. The washing liquid can be prevented from dripping from the flow path. Also, since the inner diameter of the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is not simply reduced, at least the liquid flow path section on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths. In addition, a sufficient amount of the cleaning liquid supplied to the upper surface of the substrate can be secured.
【0011】請求項2に記載の発明によれば、洗浄液供
給部の液吐出口側の液流路部分に装着した液流路部材に
形成された複数の液流路を介して基板の上面に洗浄液を
供給して、基板に洗浄処理を施す。According to the second aspect of the present invention, the upper surface of the substrate is formed through a plurality of liquid flow paths formed in the liquid flow path member mounted on the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section. A cleaning liquid is supplied to perform a cleaning process on the substrate.
【0012】請求項3に記載の発明によれば、洗浄液供
給部の液吐出口側の液流路部分に装着した複数の束ねた
細管を介して基板の上面に洗浄液を供給して、基板に洗
浄処理を施す。According to the third aspect of the present invention, the cleaning liquid is supplied to the upper surface of the substrate via a plurality of bundled thin tubes attached to the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section, and the cleaning liquid is supplied to the substrate. A cleaning process is performed.
【0013】[0013]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態を説明する。図1は本発明の一実施例に係る基
板処理装置の構成を示す一部省略正面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partially omitted front view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention.
【0014】基板Wは、基板保持手段に相当するスピン
チャック1に水平姿勢に保持される。スピンチャック1
は、電動モーター2によって鉛直方向の軸芯J周りに回
転可能な回転軸3の上端部に円板状のスピンベース4が
一体回転可能に連結され、スピンベース4の上面外周部
に3個以上の基板保持部材5が等間隔に立設されてい
る。なお、図1では、図面が煩雑になるのを避けるため
に基板保持部材5を1個だけ示している。The substrate W is held in a horizontal posture by a spin chuck 1 corresponding to a substrate holding means. Spin chuck 1
A disk-shaped spin base 4 is integrally rotatably connected to an upper end of a rotating shaft 3 rotatable around a vertical axis J by an electric motor 2, and three or more spin bases are attached to an outer peripheral portion of an upper surface of the spin base 4. Are held upright at equal intervals. Note that FIG. 1 shows only one substrate holding member 5 to avoid complicating the drawing.
【0015】各基板保持部材5は、基板Wの外周部を下
方から支持する支持部5aと、各支持部5aに支持され
た基板Wの外周端縁を押圧して基板Wを保持する保持部
5bとを備えていて、基板Wをスピンベース4の上面か
ら離間した状態で基板Wの外周部を3箇所以上で保持す
る。各基板保持部材5は、保持部5bが基板Wの外周端
縁を押圧する保持状態と、保持部5bが基板Wの外周端
縁から離れる非保持状態とで切換えられる。この保持状
態と非保持状態との切換えは、例えば、特公平3−96
07号公報に開示のリンク機構などによって実現するこ
とができる。Each of the substrate holding members 5 includes a supporting portion 5a for supporting the outer peripheral portion of the substrate W from below, and a holding portion for pressing the outer peripheral edge of the substrate W supported by each supporting portion 5a to hold the substrate W. 5b, and the outer peripheral portion of the substrate W is held at three or more places in a state where the substrate W is separated from the upper surface of the spin base 4. Each substrate holding member 5 is switched between a holding state in which the holding portion 5b presses the outer peripheral edge of the substrate W and a non-holding state in which the holding portion 5b is separated from the outer peripheral edge of the substrate W. The switching between the holding state and the non-holding state is performed, for example, in Japanese Patent Publication No. 3-96.
07 can be realized by a link mechanism or the like disclosed in JP-A-07-07.
【0016】なお、スピンベース4としては、円板状の
ものに限らず、回転軸3に一体回転可能に取り付けられ
た中央回転部から3本以上のアームが放射状に延出され
た星型のものであってもよい。この星型のスピンベース
を用いた場合には、各アームの先端部に基板保持部材5
が立設される。The spin base 4 is not limited to a disc-shaped one, but may be a star-shaped one in which three or more arms are radially extended from a central rotating part attached to the rotating shaft 3 so as to be integrally rotatable. It may be something. When this star-shaped spin base is used, a substrate holding member 5 is provided at the tip of each arm.
Is erected.
【0017】また、図1では、メカニカル式のスピンチ
ャック1を示しているが、スピンチャック1としてはメ
カニカル式のものに限らず、基板Wの下面の回転中心を
含む所定領域を真空吸着保持する真空吸着式のスピンチ
ャックであってもよい。Although FIG. 1 shows the mechanical type spin chuck 1, the spin chuck 1 is not limited to the mechanical type, and a predetermined area including the rotation center on the lower surface of the substrate W is held by vacuum suction. It may be a vacuum chuck type spin chuck.
【0018】回転軸3は中空部を有する筒状体で構成さ
れ、回転軸3の中空部には、下部洗浄液供給管10が貫
通されている。この下部洗浄液供給管10の先端が、ス
ピンチャック1に保持された基板Wの下面の回転中心付
近に洗浄液を噴出供給する下部液吐出口11になってい
る。下部洗浄液供給管10には、開閉弁12が介装され
た配管13を介してフッ酸などの薬液を供給する薬液供
給部80が連通接続されているとともに、開閉弁14が
介装された配管15を介して純水などのリンス液を供給
するリンス液供給部81が連通接続されている。そし
て、開閉弁12、14を切換え制御することで、スピン
チャック1に保持された基板Wの下面の回転中心付近に
薬液とリンス液とを選択的に切換えて供給できる。The rotating shaft 3 is formed of a cylindrical body having a hollow portion, and a lower cleaning liquid supply pipe 10 penetrates the hollow portion of the rotating shaft 3. The distal end of the lower cleaning liquid supply pipe 10 serves as a lower liquid discharge port 11 for supplying the cleaning liquid to the vicinity of the rotation center on the lower surface of the substrate W held by the spin chuck 1. A chemical solution supply section 80 for supplying a chemical such as hydrofluoric acid is connected to the lower cleaning liquid supply pipe 10 via a pipe 13 provided with an on-off valve 12, and a pipe provided with an on-off valve 14. A rinsing liquid supply unit 81 that supplies a rinsing liquid such as pure water through the communication unit 15 is connected to the rinsing liquid supply unit 81. By controlling the switching of the open / close valves 12 and 14, the chemical liquid and the rinsing liquid can be selectively switched and supplied to the vicinity of the rotation center on the lower surface of the substrate W held by the spin chuck 1.
【0019】また、回転軸3の内壁面と洗浄液供給管1
0の外壁面との間の空間が下部気体供給路20になって
いる。下部気体供給路20には、開閉弁21が介装され
た配管22を介して、気体供給部82が連通接続されて
いて、開閉弁21を開に切換えることで、下部気体供給
路20の先端の下部気体供給口23からスピンベース4
の上面とスピンチャック1に保持された基板Wの下面と
の間の空間に、窒素ガスなどの不活性ガスやドライエア
ーなどの清浄な気体を供給できる。Further, the inner wall surface of the rotating shaft 3 and the cleaning liquid supply pipe 1
A space between the outer gas wall and the outer wall of the lower gas supply passage 20 is a lower gas supply passage 20. A gas supply unit 82 is connected to the lower gas supply path 20 via a pipe 22 in which an on-off valve 21 is interposed. By switching the on-off valve 21 to open, the tip of the lower gas supply path 20 From the lower gas supply port 23 to the spin base 4
A clean gas such as an inert gas such as nitrogen gas or dry air can be supplied to a space between the upper surface of the substrate and the lower surface of the substrate W held by the spin chuck 1.
【0020】スピンチャック1の上方には雰囲気遮断部
材30が配置されている。この雰囲気遮断部材30は支
軸31の先端部に一体回転可能に支持されている。支軸
31は、支持アーム32の先端部に回転可能に取り付け
られている。支持アーム32は、ボールネジやエアシリ
ンダなどの周知の一軸方向駆動機構によって構成される
昇降駆動部33によって昇降可能に構成され、この支持
アーム32の昇降によって、雰囲気遮断部材30は、ス
ピンチャック1に保持された基板Wの上面に対して接離
自在になっている。また、支軸31は支持アーム32に
設けられたモーター34に連動連結されていて、モータ
ー34を駆動することにより、支軸31とともに、雰囲
気遮断部材30が軸芯J周りで回転可能である。An atmosphere blocking member 30 is disposed above the spin chuck 1. The atmosphere blocking member 30 is supported by a tip of a support shaft 31 so as to be integrally rotatable. The support shaft 31 is rotatably attached to the distal end of the support arm 32. The support arm 32 is configured to be able to move up and down by an elevating drive unit 33 configured by a well-known uniaxial drive mechanism such as a ball screw and an air cylinder. It can freely contact and separate from the upper surface of the held substrate W. The support shaft 31 is linked to a motor 34 provided on the support arm 32, and by driving the motor 34, the atmosphere blocking member 30 can rotate around the axis J together with the support shaft 31.
【0021】雰囲気遮断部材30及び支軸31には中空
部が形成され、この中空部には、洗浄液供給部に相当す
る上部洗浄液供給管40が貫通されている。この上部洗
浄液供給管40の先端が、スピンチャック1に保持され
た基板Wの上面の回転中心付近に洗浄液を噴出供給す
る、液吐出口に相当する上部液吐出口41になってい
る。A hollow portion is formed in the atmosphere blocking member 30 and the support shaft 31, and an upper cleaning liquid supply pipe 40 corresponding to a cleaning liquid supply portion is penetrated through the hollow portion. The top end of the upper cleaning liquid supply pipe 40 is an upper liquid discharge port 41 corresponding to a liquid discharge port for jetting and supplying the cleaning liquid to the vicinity of the rotation center of the upper surface of the substrate W held by the spin chuck 1.
【0022】本実施例では、上部洗浄液供給管40内の
液流路42のうち、上部液吐出口41側の一部の液流路
部分43を複数の液流路44に分割している。In this embodiment, a part of the liquid flow path 43 in the upper cleaning liquid supply pipe 40 on the side of the upper liquid discharge port 41 is divided into a plurality of liquid flow paths 44.
【0023】上部液吐出口41側の液流路部分43を複
数の液流路44に分割するための具体的な構成を図2な
いし図5を参照して説明する。A specific structure for dividing the liquid flow path portion 43 on the upper liquid discharge port 41 side into a plurality of liquid flow paths 44 will be described with reference to FIGS.
【0024】図2は第1の構成例を示しており、同図
(a)はその縦断面図、同図(b)はスピンチャック側
から見た上部液吐出口の構成を示す図、同図(c)は液
流路部材の構成を示す斜視図である。この第1の構成例
では、複数の液流路44が形成された液流路部材50
を、上部洗浄液供給管40内の上部液吐出口41側の液
流路部分43に装着して、上部洗浄液供給管40内の上
部液吐出口41側の液流路部分43を複数の液流路44
に分割したものである。なお、液流路部分43に装着し
た液流路部材50は、例えば、接着やネジ止めなどによ
って液流路部分43に固定される。また、図2では断面
形状が円形の上部洗浄液供給管40を示しているが、上
部洗浄液供給管40の断面形状は円形に限らず、矩形や
多角形のものであってもよく、液流路部材50の形状は
上部洗浄液供給管40の断面形状に合わせた形状に形成
すればよい。FIG. 2 shows a first configuration example, in which FIG. 2A is a longitudinal sectional view, and FIG. 2B is a diagram showing the configuration of an upper liquid discharge port viewed from the spin chuck side. FIG. 3C is a perspective view showing the configuration of the liquid flow path member. In the first configuration example, a liquid flow path member 50 in which a plurality of liquid flow paths 44 are formed
Is attached to the liquid flow path portion 43 on the upper liquid discharge port 41 side in the upper cleaning liquid supply pipe 40, and the liquid flow path section 43 on the upper liquid discharge port 41 side in the upper cleaning liquid supply pipe 40 is supplied with a plurality of liquid flows. Road 44
It is divided into The liquid channel member 50 attached to the liquid channel portion 43 is fixed to the liquid channel portion 43 by, for example, bonding or screwing. Further, FIG. 2 shows the upper cleaning liquid supply pipe 40 having a circular cross section, but the cross sectional shape of the upper cleaning liquid supply pipe 40 is not limited to a circle, and may be rectangular or polygonal. The shape of the member 50 may be formed according to the cross-sectional shape of the upper cleaning liquid supply pipe 40.
【0025】また、液流路部材50に形成する複数の液
流路44の断面形状も円形に限らず、例えば、図3に示
すように、格子状に分割して複数の液流路44を形成し
たものであってもよい。The sectional shape of the plurality of liquid flow paths 44 formed in the liquid flow path member 50 is not limited to a circle. For example, as shown in FIG. It may be formed.
【0026】図4は第2の構成例を示しており、同図
(a)はその縦断面図、同図(b)はスピンチャック側
から見た上部液吐出口の構成を示す図である。この第2
の構成例では、複数の細管51を溶接などによって一体
化して束ねたものを、上部洗浄液供給管40内の上部液
吐出口41側の液流路部分43に装着し、例えば、接着
やネジ止めなどによって液流路部分43に固定して、上
部洗浄液供給管40内の上部液吐出口41側の液流路部
分43を複数の液流路44に分割したものである。な
お、各細管51間の隙間や細管51と上部洗浄液供給管
40の内壁面との間の隙間も液流路44として残してお
いてもよいし、これら隙間を閉止して、各細管51の先
端からのみ基板Wに洗浄液を供給するようにしてもよ
い。また、図4では、断面形状が円形の細管50を示し
ているが、断面形状が矩形などのその他も形状の細管5
1を束ねたものであってもよい。FIG. 4 shows a second configuration example. FIG. 4A is a longitudinal sectional view of the second configuration example, and FIG. 4B is a diagram showing the configuration of the upper liquid discharge port viewed from the spin chuck side. . This second
In the configuration example, a plurality of thin tubes 51 integrated and bundled by welding or the like are attached to the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40, for example, by bonding or screwing. The liquid passage portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 is fixed to the liquid passage portion 43 by, for example, divided into a plurality of liquid passages 44. The gap between the small tubes 51 and the gap between the small tube 51 and the inner wall surface of the upper cleaning liquid supply tube 40 may be left as the liquid flow path 44, or these gaps may be closed to close the small tubes 51. The cleaning liquid may be supplied to the substrate W only from the tip. FIG. 4 shows a thin tube 50 having a circular cross section, but other thin tubes 5 having a rectangular cross section, etc.
1 may be bundled.
【0027】図5は第3の構成例を示しており、同図は
その縦断面図である。この第3の構成例では、先端側の
液流路部分43を複数の液流路44に分割して一体的に
形成された管を上部洗浄液供給管40として用いたもの
である。FIG. 5 shows a third configuration example, and FIG. 5 is a longitudinal sectional view thereof. In the third configuration example, a pipe integrally formed by dividing the liquid flow path portion 43 on the distal end side into a plurality of liquid flow paths 44 is used as the upper cleaning liquid supply pipe 40.
【0028】上記構成例は上部洗浄液供給管40内の上
部液吐出口41側の液流路部分43を複数の液流路44
に分割するための一例であり、その他の構成で上部洗浄
液供給管40内の上部液吐出口41側の液流路部分43
を複数の液流路44に分割してもよい。In the above configuration example, the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 is divided into a plurality of liquid flow paths 44.
This is an example of dividing the liquid flow path 43 into a liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 in another configuration.
May be divided into a plurality of liquid flow paths 44.
【0029】なお、各液流路44の断面が、例えば、円
形の場合にはその直径を0.5〜2.0mm程度とし、正
方形の場合にはその一辺を0.5〜2.0mm程度とする
ことが好ましい。このように各液流路44を細くするこ
とで、後述するように、各液流路44からの不所望な洗
浄液のボタ落ちを防止できる。When the cross section of each liquid flow path 44 is, for example, circular, the diameter is about 0.5 to 2.0 mm, and when the cross section is square, one side is about 0.5 to 2.0 mm. It is preferable that By making each of the liquid flow paths 44 thinner in this way, it is possible to prevent undesired dripping of the cleaning liquid from each of the liquid flow paths 44 as described later.
【0030】図1に戻って、上部洗浄液供給管40に
は、開閉弁45が介装された配管46を介して薬液供給
部80が連通接続されているとともに、開閉弁47が介
装された配管48を介してリンス液供給部81が連通接
続されている。そして、開閉弁45、47を切換え制御
することで、スピンチャック1に保持された基板Wの上
面の回転中心付近に薬液とリンス液とを選択的に切換え
て供給できる。Returning to FIG. 1, a chemical solution supply section 80 is connected to the upper cleaning liquid supply pipe 40 through a pipe 46 in which an on-off valve 45 is interposed, and an on-off valve 47 is interposed. A rinsing liquid supply unit 81 is connected through a pipe 48. By controlling the switching of the open / close valves 45 and 47, the chemical liquid and the rinsing liquid can be selectively switched and supplied to the vicinity of the rotation center on the upper surface of the substrate W held by the spin chuck 1.
【0031】また、雰囲気遮断部材30及び支軸31の
中空部の内壁面と上部洗浄液供給管40の外壁面との間
の空間が気体供給路60として形成されている。気体供
給路60には、開閉弁61が介装された配管62を介し
て、気体供給部82が連通接続されていて、開閉弁61
を開に切換えることで、気体供給路60の先端部の上部
気体供給口63からスピンチャック1に保持された基板
Wの上面と雰囲気遮断部材30の下面との間の空間に清
浄な気体を供給できる。A space between the inner wall surface of the hollow portion of the atmosphere blocking member 30 and the support shaft 31 and the outer wall surface of the upper cleaning liquid supply pipe 40 is formed as a gas supply passage 60. A gas supply unit 82 is connected to the gas supply path 60 via a pipe 62 in which an on-off valve 61 is interposed.
Is switched to open, a clean gas is supplied from the upper gas supply port 63 at the end of the gas supply path 60 to the space between the upper surface of the substrate W held by the spin chuck 1 and the lower surface of the atmosphere blocking member 30. it can.
【0032】スピンチャック1及びそれによって保持さ
れた基板Wの周囲には、洗浄液の飛散を防止する飛散防
止カップ70が配設されている。この飛散防止カップ7
0とスピンチャック1とは図示しない昇降機構によって
相対昇降可能に構成されている。A scattering prevention cup 70 for preventing the cleaning liquid from scattering is provided around the spin chuck 1 and the substrate W held by the spin chuck. This shatterproof cup 7
0 and the spin chuck 1 are configured to be able to move up and down relative to each other by a lifting mechanism (not shown).
【0033】次に、上記構成を有する実施例装置の動作
を説明する。まず、スピンチャック1と飛散防止カップ
70とが相対昇降されて飛散防止カップ70の上方にス
ピンチャック1を配置させるとともに、そのスピンチャ
ック1の上方の退避位置に雰囲気遮断部材30が退避さ
れている状態で、図示しない基板搬送機構によって基板
Wが搬入されてスピンチャック1に引き渡される。スピ
ンチャック1は受け取った基板Wを保持する。次に、ス
ピンチャック1と飛散防止カップ70とが上記と逆方向
に相対昇降されてスピンチャック1及びそれに保持され
た基板Wが飛散防止カップ70内に収容される。そし
て、雰囲気遮断部材30が、上記退避位置より下方の処
理位置まで下降され、雰囲気遮断部材30がスピンチャ
ック1に保持された基板Wの上面に近接配置される(図
1に示す状態)。Next, the operation of the embodiment apparatus having the above configuration will be described. First, the spin chuck 1 and the scattering prevention cup 70 are moved up and down relatively to dispose the spin chuck 1 above the scattering prevention cup 70, and the atmosphere blocking member 30 is retracted to a retracted position above the spin chuck 1. In this state, the substrate W is carried in by a substrate transport mechanism (not shown) and delivered to the spin chuck 1. The spin chuck 1 holds the received substrate W. Next, the spin chuck 1 and the scattering prevention cup 70 are relatively moved up and down in the opposite direction to the above, and the spin chuck 1 and the substrate W held thereon are accommodated in the scattering prevention cup 70. Then, the atmosphere blocking member 30 is lowered to the processing position below the retreat position, and the atmosphere blocking member 30 is disposed close to the upper surface of the substrate W held by the spin chuck 1 (the state shown in FIG. 1).
【0034】この状態で、スピンチャック1及びそれに
保持された基板Wが軸芯J周りに回転される。そして、
上部液吐出口41及び下部液吐出口11から基板Wの上
下両面に薬液が供給されて、薬液による基板洗浄処理が
行われる。このとき、必要に応じて、上部気体供給口6
3及び下部気体供給口23から気体を供給するようにし
てもよい。In this state, the spin chuck 1 and the substrate W held thereon are rotated around the axis J. And
A chemical is supplied to the upper and lower surfaces of the substrate W from the upper liquid discharge port 41 and the lower liquid discharge port 11, and a substrate cleaning process using the chemical is performed. At this time, if necessary, the upper gas supply port 6
The gas may be supplied from the third gas supply port 23 and the lower gas supply port 23.
【0035】所定の薬液洗浄処理時間が経過すると、上
部液吐出口41及び下部液吐出口11から基板Wの上下
両面に供給する洗浄液を薬液からリンス液に切り換え
て、基板Wに付着残留している薬液をリンス液で洗い落
とすリンス洗浄処理が行われる。このリンス洗浄処理中
も、必要に応じて上部気体供給口63及び下部気体供給
口23から気体を供給するようにしてもよい。When a predetermined chemical cleaning time has elapsed, the cleaning liquid supplied to the upper and lower surfaces of the substrate W from the upper liquid discharge port 41 and the lower liquid discharge port 11 is switched from a chemical liquid to a rinsing liquid. A rinse cleaning process is performed in which the existing chemical is rinsed off with a rinse. During this rinsing process, gas may be supplied from the upper gas supply port 63 and the lower gas supply port 23 as necessary.
【0036】所定のリンス洗浄処理時間が経過すると、
上部液吐出口41及び下部液吐出口11から基板Wの上
下両面へのリンス液の供給を停止する一方で、スピンチ
ャック1の回転を継続して、基板Wに付着残留している
リンス液を振り切って基板Wを乾燥させる乾燥処理を行
う。このとき、上部気体供給口63及び下部気体供給口
23から気体を供給すると、乾燥処理を促進でき、乾燥
処理時間を短縮することができる。When a predetermined rinsing cleaning time has elapsed,
While the supply of the rinsing liquid to the upper and lower surfaces of the substrate W from the upper liquid discharging port 41 and the lower liquid discharging port 11 is stopped, the rotation of the spin chuck 1 is continued to remove the rinsing liquid remaining on the substrate W. A drying process of shaking off and drying the substrate W is performed. At this time, if gas is supplied from the upper gas supply port 63 and the lower gas supply port 23, the drying process can be promoted and the drying process time can be shortened.
【0037】所定の乾燥処理時間が経過すると、スピン
チャック1の回転を停止させる。そして、雰囲気遮断部
材30が処理位置から退避位置へ上昇され、スピンチャ
ック1と飛散防止カップ70とが相対昇降されて飛散防
止カップ70の上方にスピンチャック1が配置され、ス
ピンチャック1による基板Wの保持が解除される。その
状態で、基板搬送機構により基板Wがスピンチャック1
から取り出され、装置外へと搬出される。When a predetermined drying time has elapsed, the rotation of the spin chuck 1 is stopped. Then, the atmosphere blocking member 30 is raised from the processing position to the retreat position, and the spin chuck 1 and the scattering prevention cup 70 are relatively moved up and down, so that the spin chuck 1 is disposed above the scattering prevention cup 70 and the substrate W Is released. In this state, the substrate W is transferred to the spin chuck 1 by the substrate transfer mechanism.
And is carried out of the apparatus.
【0038】この実施例によれば、スピンチャック1に
保持された基板Wの上面に薬液やリンス液などの洗浄液
を供給するために、スピンチャック1に保持された基板
Wの上方に配置された上部洗浄液供給管40内の上部液
吐出口41側の液流路部分43を複数の液流路44に分
割したので、個々の液流路44の内径が、上部洗浄液供
給管40の基端部側の液流路42の内径、すなわち、従
来装置の液吐出口105の内径よりも小さくなる。従っ
て、個々の液流路44の先端から洗浄液が落下しないよ
うに働く表面張力が強くなり、乾燥処理中や乾燥処理後
の基板Wの上面に個々の液流路44から洗浄液がボタ落
ちするのを防止することができる。また、基板Wの上面
に洗浄液を供給する液吐出口の供給面積は、全ての液流
路44の断面積の合計であるので、図6に示すように、
上部洗浄液供給管40の上部液吐出口41側の液流路部
分43の内径を単に絞った場合に比べて、基板Wの上面
に供給される洗浄液の液量は十分に確保される。According to this embodiment, in order to supply a cleaning liquid such as a chemical solution or a rinsing liquid to the upper surface of the substrate W held by the spin chuck 1, the substrate W is disposed above the substrate W held by the spin chuck 1. Since the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 is divided into a plurality of liquid flow paths 44, the inner diameter of each liquid flow path 44 is set at the base end of the upper cleaning liquid supply pipe 40. Side, that is, smaller than the inside diameter of the liquid discharge port 105 of the conventional device. Accordingly, the surface tension acting to prevent the cleaning liquid from dropping from the tip of the individual liquid flow path 44 is increased, and the cleaning liquid is dripped from the individual liquid flow path 44 on the upper surface of the substrate W during or after the drying process. Can be prevented. Further, since the supply area of the liquid discharge port for supplying the cleaning liquid to the upper surface of the substrate W is the sum of the cross-sectional areas of all the liquid flow paths 44, as shown in FIG.
A sufficient amount of the cleaning liquid supplied to the upper surface of the substrate W is ensured compared to a case where the inner diameter of the liquid flow path portion 43 on the upper liquid discharge port 41 side of the upper cleaning liquid supply pipe 40 is simply reduced.
【0039】また、図2、図3に示すように、複数の液
流路44が形成された液流路部材50を、上部洗浄液供
給管40内の上部液吐出口41側の液流路部分43に装
着したり、図4に示すように、複数の細管51を束ねた
ものを上部洗浄液供給管40内の上部液吐出口41側の
液流路部分43に装着したりして、上部洗浄液供給管4
0内の上部液吐出口41側の液流路部分43を複数の液
流路44に分割した構成の場合、簡単な構成で上部洗浄
液供給管40内の上部液吐出口41側の液流路部分43
を複数の液流路44に分割することができる。また、こ
の構成によれば、従来装置などの既存の装置の洗浄液供
給管103内の液吐出口105側の液流路部分を複数の
液流路44に分割することができ、既存の装置を大幅に
改造することなく、本発明を適用することができる。As shown in FIGS. 2 and 3, a liquid flow path member 50 having a plurality of liquid flow paths 44 is connected to a liquid flow path portion on an upper liquid discharge port 41 side in an upper cleaning liquid supply pipe 40. 4 or a bundle of a plurality of thin tubes 51 attached to the liquid flow path portion 43 on the side of the upper liquid discharge port 41 in the upper cleaning liquid supply pipe 40 as shown in FIG. Supply pipe 4
In the case of a configuration in which the liquid flow path portion 43 on the upper liquid discharge port 41 side is divided into a plurality of liquid flow paths 44, the liquid flow path on the upper liquid discharge port 41 side in the upper cleaning liquid supply pipe 40 has a simple configuration. Part 43
Can be divided into a plurality of liquid flow paths 44. Further, according to this configuration, the liquid flow path portion on the liquid discharge port 105 side in the cleaning liquid supply pipe 103 of the existing apparatus such as the conventional apparatus can be divided into the plurality of liquid flow paths 44, and the existing apparatus can be used. The invention can be applied without significant modification.
【0040】なお、上記実施例では、基板Wの上下両面
に洗浄液を供給して洗浄処理する場合について説明した
が、基板Wの上面のみに洗浄液を供給して洗浄処理する
場合や、基板Wの上面のみに洗浄液を供給して洗浄処理
するように構成された装置についても本発明は同様に適
用できる。Although the above embodiment has been described with reference to the case where the cleaning liquid is supplied to the upper and lower surfaces of the substrate W to perform the cleaning processing, the cleaning liquid is supplied only to the upper surface of the substrate W to perform the cleaning processing. The present invention can be similarly applied to an apparatus configured to perform a cleaning process by supplying a cleaning liquid only to the upper surface.
【0041】また、雰囲気遮断部材30を軸芯J周りで
回転させて、洗浄処理や乾燥処理を行う場合もあるが、
このような処理においては、雰囲気遮断部材30の回転
に伴う雰囲気遮断部材30の振動が起こり易くなるが、
そのような振動によっても、上部洗浄液供給管40の上
部液吐出口41の液流路部分43を複数の液流路44に
分割したことで、乾燥処理中や乾燥処理後の基板Wへの
各液流路44からの洗浄液のボタ落ちを防止することが
できる。In some cases, the atmosphere shielding member 30 is rotated around the axis J to perform a cleaning process or a drying process.
In such a process, the vibration of the atmosphere blocking member 30 accompanying the rotation of the atmosphere blocking member 30 is likely to occur.
Even by such a vibration, the liquid flow path portion 43 of the upper liquid discharge port 41 of the upper cleaning liquid supply pipe 40 is divided into a plurality of liquid flow paths 44, so that each of the substrates W during and after the drying processing is applied to the substrate W. The dripping of the cleaning liquid from the liquid flow path 44 can be prevented.
【0042】なお、各液流路44の長さ(液流路部分4
3の長さ)を十分に長くすれば、それだけ、各液流路4
4内の洗浄液がボタ落ちし難くなり、各液流路44から
の不所望な洗浄液の落下を確実に防止することができる
が、洗浄液の粘度や表面張力により、各液流路44内の
洗浄液のボタ落ちが十分に防止できる各液流路44の長
さを決めればよい。なお、必要に応じて、上部洗浄液供
給管40の全体を複数の液流路44に分割してもよい。The length of each liquid flow path 44 (liquid flow path portion 4)
3), the longer the length of each liquid flow path 4
The cleaning liquid in each of the liquid flow paths 44 can be reliably prevented from dropping and the undesired drop of the cleaning liquid from each of the liquid flow paths 44. It is sufficient to determine the length of each liquid flow path 44 that can sufficiently prevent the dropping of the liquid. Note that the entire upper cleaning liquid supply pipe 40 may be divided into a plurality of liquid flow paths 44 as necessary.
【0043】また、上記実施例では、スピンチャック1
に保持された基板Wの上方に配置される雰囲気遮断部材
30に設けられた上部洗浄液供給管40を洗浄液供給部
とした場合について説明したが、例えば、図7に示すよ
うに、スピンチャック1に保持された基板Wの上方に配
置され、基板Wの上面に洗浄液を供給する洗浄液供給部
としての洗浄液供給ノズル90についても上記実施例と
同様の構成によって本発明を適用することができる。図
7中の符号91はノズル90内の液流路を、92はノズ
ル70の先端の液吐出口を、93はノズル90内の液流
路91のうちの、複数の液流路94に分割した液吐出口
92側の液流路部分をそれぞれ示している。なお、この
洗浄液供給ノズル90の場合も、必要に応じて、ノズル
90内の液流路91の全体を複数の液流路94に分割し
てもよい。In the above embodiment, the spin chuck 1
The case where the upper cleaning liquid supply pipe 40 provided in the atmosphere blocking member 30 disposed above the substrate W held in the above is used as the cleaning liquid supply unit, for example, as shown in FIG. The present invention can be applied to a cleaning liquid supply nozzle 90 disposed above the held substrate W and serving as a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the substrate W, with the same configuration as that of the above-described embodiment. 7, reference numeral 91 denotes a liquid flow path in the nozzle 90, 92 denotes a liquid discharge port at the tip of the nozzle 70, and 93 denotes a plurality of liquid flow paths 94 of the liquid flow path 91 in the nozzle 90. The liquid flow path portion on the liquid discharge port 92 side is shown. In the case of the cleaning liquid supply nozzle 90 as well, the entire liquid flow path 91 in the nozzle 90 may be divided into a plurality of liquid flow paths 94 as necessary.
【0044】また、スピンチャック1に保持された基板
Wの上方に配置され、基板Wの上面に洗浄液を供給する
その他の洗浄液供給部についても本発明は同様に適用す
ることができる。The present invention can be similarly applied to other cleaning liquid supply units disposed above the substrate W held by the spin chuck 1 and supplying the cleaning liquid to the upper surface of the substrate W.
【0045】[0045]
【発明の効果】以上の説明から明らかなように、請求項
1に記載の発明によれば、少なくとも洗浄液供給部の液
吐出口側の液流路部分を複数の液流路に分割したので、
基板の上面に供給される洗浄液の液量を十分に確保しつ
つ、乾燥処理中や乾燥処理後に基板の上面に各液流路か
ら洗浄液がボタ落ちするのを防止することができる。As is clear from the above description, according to the first aspect of the present invention, at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section is divided into a plurality of liquid flow paths.
The cleaning liquid can be prevented from dripping from each liquid flow path onto the upper surface of the substrate during or after the drying process, while ensuring a sufficient amount of the cleaning liquid supplied to the upper surface of the substrate.
【0046】少なくとも洗浄液供給部の液吐出口側の液
流路部分を複数の液流路に分割するためには、請求項2
に記載の発明のように複数の液流路が形成された液流路
部材を、洗浄液供給部の液吐出口側の液流路部分に装着
してもよいし、請求項3に記載の発明のように洗浄液供
給部の液吐出口側の液流路部分に複数の細管を束ねて装
着してもよい。In order to divide at least the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section into a plurality of liquid flow paths,
The liquid flow path member in which a plurality of liquid flow paths are formed as in the invention described in (3) may be mounted on the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply unit. As described above, a plurality of thin tubes may be bundled and attached to the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply unit.
【0047】請求項2、3に記載の発明によれば、簡単
な構成で洗浄液供給部の液吐出口側の液流路部分を複数
の液流路に分割することができるとともに、既存の装置
の洗浄液供給部の液吐出口側の液流路部分を複数の液流
路に分割することができるので、既存の装置にも本発明
を容易に適用することができる。According to the second and third aspects of the present invention, the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply section can be divided into a plurality of liquid flow paths with a simple configuration, and the existing apparatus can be used. Since the liquid flow path portion on the liquid discharge port side of the cleaning liquid supply unit can be divided into a plurality of liquid flow paths, the present invention can be easily applied to existing devices.
【図1】本発明の一実施例に係る基板処理装置の構成を
示す一部省略正面図である。FIG. 1 is a partially omitted front view showing a configuration of a substrate processing apparatus according to one embodiment of the present invention.
【図2】上部液吐出口側の液流路部分を複数の液流路に
分割するための第1の構成例を示す図である。FIG. 2 is a diagram showing a first configuration example for dividing a liquid flow path portion on an upper liquid discharge port side into a plurality of liquid flow paths.
【図3】液流路部材の変形例の構成を示す図である。FIG. 3 is a diagram showing a configuration of a modified example of the liquid flow path member.
【図4】上部液吐出口側の液流路部分を複数の液流路に
分割するための第2の構成例を示す図である。FIG. 4 is a diagram showing a second configuration example for dividing the liquid flow path portion on the upper liquid discharge port side into a plurality of liquid flow paths.
【図5】上部液吐出口側の液流路部分を複数の液流路に
分割するための第3の構成例を示す図である。FIG. 5 is a diagram showing a third configuration example for dividing the liquid flow path portion on the upper liquid discharge port side into a plurality of liquid flow paths.
【図6】上部洗浄液供給管の上部液吐出口側の液流路部
分の内径を単に絞った場合の縦断面図である。FIG. 6 is a vertical cross-sectional view when the inner diameter of the liquid flow path portion on the upper liquid discharge port side of the upper cleaning liquid supply pipe is simply reduced.
【図7】洗浄液供給ノズルに本発明を適用した縦断面図
である。FIG. 7 is a longitudinal sectional view in which the present invention is applied to a cleaning liquid supply nozzle.
【図8】従来装置の構成を示す一部省略正面図である。FIG. 8 is a partially omitted front view showing the configuration of a conventional apparatus.
1:スピンチャック 40:上部洗浄液供給管 41、91:液吐出口 44、94:複数に分割した個々の液流路 50:液流路部材 51:細管 90:洗浄液供給ノズル W:基板 1: spin chuck 40: upper cleaning liquid supply pipe 41, 91: liquid discharge port 44, 94: individual liquid flow path divided into plural parts 50: liquid flow path member 51: thin tube 90: cleaning liquid supply nozzle W: substrate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 上山 勉 京都府京都市伏見区羽束師古川町322 大 日本スクリーン製造株式会社洛西事業所内 Fターム(参考) 3B201 AA03 AB08 AB34 AB44 BB62 BB93 BB96 CB12 CC01 CC13 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tsutomu Ueyama F-term (reference) 3N201 AA03 AB08 AB34 AB44 BB62 BB93 BB96 CB12 CC01 CC13
Claims (3)
配置された洗浄液供給部の先端の液吐出口から基板の上
面に洗浄液を供給して洗浄処理を行った後、前記基板保
持手段に基板が保持された状態で基板を乾燥する乾燥処
理を行う基板処理装置において、 少なくとも前記洗浄液供給部の液吐出口側の液流路部分
を複数の液流路に分割したことを特徴とする基板処理装
置。A cleaning liquid supply unit configured to supply a cleaning liquid to a top surface of the substrate from a liquid discharge port at a tip of a cleaning liquid supply unit disposed above the substrate held by the substrate holding unit, to perform a cleaning process; In a substrate processing apparatus for performing a drying process for drying a substrate while holding the substrate, at least a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit is divided into a plurality of liquid flow paths. Processing equipment.
て、 複数の液流路が形成された液流路部材を、前記洗浄液供
給部の液吐出口側の液流路部分に装着して、前記洗浄液
供給部の液吐出口側の液流路部分を複数の液流路に分割
したことを特徴とする基板処理装置。2. The substrate processing apparatus according to claim 1, wherein a liquid flow path member having a plurality of liquid flow paths is attached to a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit. A substrate processing apparatus, wherein a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply unit is divided into a plurality of liquid flow paths.
て、 前記洗浄液供給部の液吐出口側の液流路部分に複数の細
管を束ねて装着し、前記洗浄液供給部の液吐出口側の液
流路部分を複数の液流路に分割したことを特徴とする基
板処理装置。3. The substrate processing apparatus according to claim 1, wherein a plurality of thin tubes are bundled and attached to a liquid flow path portion on a liquid discharge port side of the cleaning liquid supply section, and a plurality of thin tubes are mounted on the liquid discharge port side of the cleaning liquid supply section. A substrate processing apparatus, wherein a liquid flow path is divided into a plurality of liquid flow paths.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10241656A JP2000070873A (en) | 1998-08-27 | 1998-08-27 | Base treating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10241656A JP2000070873A (en) | 1998-08-27 | 1998-08-27 | Base treating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000070873A true JP2000070873A (en) | 2000-03-07 |
Family
ID=17077574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10241656A Pending JP2000070873A (en) | 1998-08-27 | 1998-08-27 | Base treating apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000070873A (en) |
-
1998
- 1998-08-27 JP JP10241656A patent/JP2000070873A/en active Pending
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