JP2000070827A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a strong ascending flow corresponding to the central part of a substrate without almost providing a lateral component. SOLUTION: A substrate treatment apparatus has a treatment tank 1, a round pipe-shaped first treatment liquid supply pipe 2 provided to the bottom part of the treatment tank 1 in order to emit a treatment liquid downwardly, a round pipe-shaped second treatment liquid supply member 3 provided to the bottom part of the treatment tank 1 in order to emit the treatment liquid upwardly, and a distribution plate 4 provided slightly above the first and the second treatment liquid supply pipes 2, 3. All of the surfaces of a plurality of substrates 5 supported in the state vertically provided in parallel above the distribution plate 4 are almost uniformly treated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a processing liquid supply pipe provided at the bottom of a processing tank to supply a processing liquid. The processing liquid is rectified by a rectifying plate, guided upward, and erected in parallel. The present invention relates to a substrate processing apparatus that processes a surface of a plurality of substrates.

[0002]

2. Description of the Related Art Conventionally, a processing liquid supply pipe is provided at the bottom of a processing tank to supply a processing liquid, the processing liquid is rectified by a rectifying plate and guided upward, and a plurality of sheets arranged in parallel are provided. JP-A-6-20 describes a substrate processing apparatus for processing the surface of a substrate.
No. 8984, JP-A-7-1
One described in Japanese Patent No. 61678 is proposed.

[0003] The substrate processing apparatus described in Japanese Patent Application Laid-Open No. 6-208984 has a processing tank in which the bottom surface of a processing tank is bulged upward just below the central axis of a plurality of substrates.
A configuration is adopted in which a pair of processing liquid supply pipes for discharging the processing liquid horizontally or obliquely upward is provided at both ends with the bulging portion as the center.

In the substrate processing apparatus described in Japanese Patent Application Laid-Open No. Hei 7-161678, a portion of a bottom surface of a processing tank, which is directly below a central axis of a plurality of substrates, is recessed downward.
A pair of processing liquid supply pipes for discharging the processing liquid horizontally or obliquely downward is provided at both ends around the recess, and the discharged processing liquid is caused to collide with the recess so as to flow in the flow direction. Is adopted to provide a plate member for changing the direction upward.

[0005] Regardless of the configuration of the substrate processing apparatus, the portion having the highest fluid resistance, that is, the portion having the highest fluid resistance, is used.
It is believed that the flow rate at the portion corresponding to the central portion of the substrate can be maximized to treat the entire surface of the substrate almost uniformly.

[0006]

Problems to be Solved by the Invention
In the case of employing the substrate processing apparatus described in Japanese Patent Application Laid-Open No. 4 (1999) -1991, the processing liquid discharged from the pair of processing liquid supply pipes collide with each other to obtain a strong upward flow corresponding to the central portion of the substrate. However, since the upward flow obtained by the collision also has a strong horizontal component, the processing liquid flows in the horizontal direction while rising, and in a state where the distance between the substrates is reduced. However, a sufficient flow of the processing liquid cannot be formed at the center of the substrate row, and as a result, it is almost impossible to uniformly process the entire surface of the substrate.

When a substrate processing apparatus described in Japanese Patent Application Laid-Open No. Hei 7-161678 is employed, the processing liquid discharged from a pair of processing liquid supply pipes is caused to collide with a plate material to correspond to a central portion of the substrate. It is trying to obtain a strong upward flow, but the upward flow obtained by collision also has a strong horizontal component, so the processing liquid flows in the horizontal direction while rising, and the substrate In a state in which the distance between the substrates is reduced, a sufficient flow of the processing liquid cannot be formed in the central portion of the substrate row. As a result, it is almost impossible to uniformly process the entire surface of the substrate. I will.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a substrate capable of obtaining a strong upward flow corresponding to the central portion of the substrate with almost no strong lateral component. It is intended to provide a processing device.

[0009]

According to a first aspect of the present invention, a substrate processing apparatus discharges a processing liquid toward a bottom surface of a processing tank at a symmetric position with respect to a virtual vertical reference plane including a central axis of a plurality of substrates. A first processing liquid supply pipe having a hole is provided, and a second processing liquid supply member having a hole for vertically discharging the processing liquid is provided at an intermediate position between the first processing liquid supply pipes. .

According to a second aspect of the present invention, the second processing liquid supply member employs a round pipe having a plurality of processing liquid discharge holes formed on an upper surface of a round pipe.

According to a third aspect of the present invention, in the substrate processing apparatus, the round pipe is provided above the bottom surface of the processing tank.

According to a fourth aspect of the present invention, there is provided the substrate processing apparatus wherein the round pipe is provided flush with a bottom surface of a processing tank.

According to a fifth aspect of the present invention, in the substrate processing apparatus, the second processing liquid supply member employs a plurality of processing liquid discharge holes formed at an upper top side of a triangular pipe.

According to a sixth aspect of the present invention, as the second processing liquid supply member, an elongated groove-shaped processing liquid discharge port is formed on the upper top side of a triangular pipe.

According to a seventh aspect of the present invention, in the substrate processing apparatus, a plurality of pipes provided through the bottom wall of the processing tank are used as the second processing liquid supply member.

According to an eighth aspect of the present invention, in the substrate processing apparatus, the pipe whose upper end is provided flush with the bottom of the processing tank is used.

According to a ninth aspect of the present invention, in the substrate processing apparatus, the pipe has an upper end protruding above the bottom of the processing tank.

According to a tenth aspect of the present invention, as the second processing liquid supply member, an elongated groove-like processing liquid discharge port formed by a flat plate member penetrating the bottom wall of the processing tank is employed. Things.

In the substrate processing apparatus according to the eleventh aspect, the processing liquid discharge port has a top end provided flush with a bottom surface of the processing tank.

According to a twelfth aspect of the present invention, the processing liquid discharge port employs a processing liquid discharge port whose upper end is projected above the bottom of the processing tank.

According to a thirteenth aspect of the present invention, in the substrate processing apparatus, the second processing liquid supply member penetrates a processing liquid supply pipe integrally provided below a bottom wall of the processing tank and a bottom wall of the processing tank. And a through-hole for discharging the processing liquid from the processing liquid supply pipe.

According to a fourteenth aspect of the present invention, as the bottom wall of the processing tank constituting the upper wall of the processing liquid supply pipe, the central part is formed linearly upward so as to protrude upward, and the most protruding part is formed. In which a plurality of through holes are formed.

According to a fifteenth aspect of the present invention, a bottom wall of a processing tank constituting an upper wall of a processing liquid supply pipe is formed in an upwardly arcuate shape so that a central portion protrudes upward. A structure in which a plurality of through holes are formed is employed.

According to a sixteenth aspect of the present invention, the second processing liquid supply member penetrates a processing liquid supply pipe integrally provided below a bottom wall of the processing tank and a bottom wall of the processing tank. And an elongated groove-shaped processing liquid discharge port for discharging the processing liquid from the processing liquid supply pipe.

According to a seventeenth aspect of the present invention, as a bottom wall of a processing tank constituting an upper wall of a processing liquid supply pipe, a central portion is formed linearly upward so as to protrude upward, and the most protruding portion is formed. In this case, an elongated processing liquid discharge port is formed.

In the substrate processing apparatus of the present invention, the bottom wall of the processing tank constituting the upper wall of the processing liquid supply pipe is formed in an upwardly arcuate shape so that the central portion protrudes upward, and is formed at the most protruding portion. An elongated groove-shaped processing liquid discharge port is formed.

According to a nineteenth aspect of the present invention, the amount of the processing liquid supplied through the first processing liquid supply pipe and the amount of the processing liquid supplied through the second processing liquid supply member are set in advance. Things.

According to a twentieth aspect of the present invention, the ratio between the amount of the processing liquid supplied through the first processing liquid supply pipe and the amount of the processing liquid supplied through the second processing liquid supply member can be adjusted. Things.

[0029]

According to the substrate processing apparatus of the present invention, a processing liquid supply pipe is provided at the bottom of the processing tank to supply the processing liquid, and the processing liquid is rectified by a rectifying plate and guided upward to stand in parallel. In performing the processing on the surfaces of the plurality of substrates provided, the bottom of the processing tank is taken from the hole of the first processing liquid supply pipe provided symmetrically with respect to the virtual vertical reference plane including the central axis of the plurality of substrates. And the processing liquid can be discharged vertically upward from a hole of the second processing liquid supply member provided at an intermediate position between both the first processing liquid supply pipes.

Therefore, the processing liquid discharged from the hole of the first processing liquid supply pipe once collides with the bottom of the processing tank and is converted into an obliquely upward flow, and then discharged from the hole of the second processing liquid supply member. And is converted into a strong upward flow by the flow of the processing liquid. And this upward flow is
It has almost no strong lateral component and can supply a sufficient amount of processing liquid to the central portion of the substrate where the fluid resistance is the highest, so that the entire surface of the substrate can be processed almost uniformly. .

In the substrate processing apparatus according to the second aspect, since the second processing liquid supply member employs a round pipe having a plurality of processing liquid discharge holes formed on the upper surface thereof.
The same operation as the first aspect can be achieved.

In the substrate processing apparatus according to the third aspect, since the round pipe provided above the bottom surface of the processing tank is employed, the manufacturing process can be simplified, and the round pipe can be used. A similar effect can be achieved.

In the substrate processing apparatus according to the fourth aspect, since the round pipe is provided flush with the bottom surface of the processing tank, the processing discharged from the second processing liquid supply member is adopted. The effect of inducing the flow of the liquid to convert it into an upward flow can be enhanced, and the same operation as in claim 2 can be achieved.

In the substrate processing apparatus according to the fifth aspect, since the second processing liquid supply member has a plurality of processing liquid discharge holes formed at the upper top side of the triangular pipe, the triangular pipe has a triangular shape. Since the processing liquid is squeezed at the time of discharge by the effect of the shape of the inside of the pipe, the processing liquid is rectified into an upward flow, the effect of converting the processing liquid into an upward flow can be enhanced, and the same effect as in claim 1 is achieved. be able to.

According to the substrate processing apparatus of claim 6, since the second processing liquid supply member is formed by forming an elongated groove-shaped processing liquid discharge port on the upper top side of the triangular pipe, Since the processing liquid is squeezed at the time of discharge by the effect of the shape of the inside of the triangular pipe, it is rectified into an upward flow, and the effect of converting the processing liquid into an upward flow can be enhanced. can do.

According to the substrate processing apparatus of the present invention, since a plurality of pipes penetrating through the bottom wall of the processing tank are employed as the second processing liquid supply member, only the necessary portions are provided. The same operation as in claim 1 can be achieved only by providing the pipe.

According to the substrate processing apparatus of claim 8, since the pipe whose upper end is provided flush with the bottom of the processing tank is employed, the pipe is discharged from the first processing liquid supply pipe. In addition to increasing the effect of converting the processing liquid converted into an obliquely upward flow into an upward flow,
The same function as the seventh aspect can be achieved.

In the substrate processing apparatus according to the ninth aspect, since the pipe whose upper end protrudes above the bottom surface of the processing tank is employed as the pipe, the pipe may be formed depending on the shape of the bottom surface of the processing tank. (1) The effect of converting the processing liquid discharged from the processing liquid supply pipe and converted into an obliquely upward flow into an upward flow can be enhanced, and the same operation as in claim 7 can be achieved.

According to a tenth aspect of the present invention, as the second processing liquid supply member, an elongated groove-shaped processing liquid discharge port formed by a flat plate member penetrating the bottom wall of the processing tank is used. Since this is adopted, the same operation as that of the first aspect can be achieved only by providing an elongated groove-like processing liquid discharge port.

In the substrate processing apparatus according to the eleventh aspect, since the processing liquid discharge port has an upper end provided flush with the bottom surface of the processing tank, the first processing liquid supply pipe is provided. In addition to the effect of converting the processing liquid ejected from the liquid and converted into an obliquely upward flow into an upward flow, the same operation as that of claim 10 can be achieved.

In the substrate processing apparatus according to the twelfth aspect, since the processing liquid discharge port has an upper end protruding above the bottom surface of the processing tank, the processing liquid discharge port is formed depending on the shape of the bottom surface of the processing tank. The present invention can enhance the effect of converting the processing liquid discharged from the first processing liquid supply pipe and converted into an obliquely upward flow into an upward flow.
The same operation as 0 can be achieved.

In the substrate processing apparatus according to the thirteenth aspect, as the second processing liquid supply member, a processing liquid supply pipe integrally provided below a bottom wall of the processing tank, and a bottom wall of the processing tank. And a through-hole through which the processing liquid is discharged from the processing liquid supply pipe. Therefore, the manufacturing process for providing the processing liquid supply pipe integrally with the processing tank is simplified. Besides, the same operation as the first aspect can be achieved.

According to the fourteenth aspect of the present invention, the bottom wall of the processing tank constituting the upper wall of the processing liquid supply pipe is formed linearly upward so that the central portion protrudes upward. Since a plurality of through holes are formed in the above-described portion, the production of the protruding portion can be simplified, and the same operation as that of the thirteenth aspect can be achieved.

In the substrate processing apparatus according to the fifteenth aspect, the bottom wall of the processing tank constituting the upper wall of the processing liquid supply pipe is formed in an upwardly arcuate shape so that the central portion protrudes upward, and projects most. Since a plurality of through-holes are formed in the portion, the processing liquid is throttled at the time of discharge by the effect of the arc shape inside the second processing liquid supply conduit, and is rectified into an upward flow, The effect of converting the processing liquid into an upward flow can be enhanced, and the same operation as in the thirteenth aspect can be achieved.

In the substrate processing apparatus according to the sixteenth aspect, the second processing liquid supply member may include a processing liquid supply pipe integrally provided below the bottom wall of the processing tank, and a bottom wall of the processing tank. And an elongated groove-like processing liquid discharge port for discharging the processing liquid from the processing liquid supply pipe through the processing liquid supply pipe, so that the processing liquid supply pipe is provided integrally with the processing tank. In addition to simplifying the manufacturing process, the same operation as in claim 1 can be achieved.

According to the substrate processing apparatus of the present invention, the bottom wall of the processing tank constituting the upper wall of the processing liquid supply pipe is formed in an upward straight line so that the central portion protrudes upward, and is most protruded. Since an elongated groove-shaped processing liquid discharge port is formed in the portion formed, the production of the protruding portion can be simplified, and the same operation as in claim 16 can be achieved.

In the substrate processing apparatus according to the eighteenth aspect, the bottom wall of the processing bath constituting the upper wall of the processing liquid supply pipe is formed in an upwardly arcuate shape so that the central portion protrudes upward, and projects most. Since an elongated groove-shaped processing liquid discharge port is formed in the portion, the processing liquid is throttled at the time of discharge due to the arc-shaped effect inside the second processing liquid supply pipe, and is rectified into an upward flow. Therefore, the effect of converting the processing liquid into an upward flow can be enhanced, and the same operation as in claim 16 can be achieved.

In the substrate processing apparatus according to the nineteenth aspect, the amount of the processing liquid supplied through the first processing liquid supply pipe and the amount of the processing liquid supplied through the second processing liquid supply member are set in advance. Therefore, the same operation as in any one of claims 1 to 18 can be achieved without controlling the ratio of the supply amount of the processing liquid.

According to the substrate processing apparatus of the present invention, the ratio of the amount of the processing liquid supplied through the first processing liquid supply pipe to the amount of the processing liquid supplied through the second processing liquid supply member is adjusted. Since it is possible, the ratio of the supply amount of the processing liquid can be adjusted optimally.
The same operation as any of the above can be achieved.

[0050]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the substrate processing apparatus of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a longitudinal sectional view showing one embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus comprises a processing tank 1, a first processing liquid supply pipe 2 having a round pipe shape provided at the bottom of the processing tank 1, a second processing liquid supply member 3 having a round pipe shape, and a first processing liquid supply member 3 having a round pipe shape. A rectifying plate 4 provided slightly above the processing liquid supply pipe 2 and the second processing liquid supply member 3 and a plurality of substrates 5 supported in a state of being erected in parallel above the rectifying plate 4 (for example, (Semiconductor wafer) and a drain pipe 6 for extracting a processing liquid from the processing bath 1.

The processing tank 1 has a shape in which the lower part is narrowed down with reference to a vertical plane including the central axis of the plurality of substrates 5, and a drain pipe 6 is connected to the center of the bottom wall. .

The first processing liquid supply pipe 2 is provided at a predetermined position near the end of the processing tank 1 so as to extend in parallel with the central axis of the plurality of substrates 5, and discharges the processing liquid obliquely downward. The position of the discharge port 2a is set as desired.

The second processing liquid supply member 3 is positioned so as to be located in a vertical plane including the central axis of the plurality of substrates 5, and the position of the discharge port 3 a for discharging the processing liquid vertically upward. Is set.

The rectifying plate 4 is a plate material having a large number of through holes that allow the passage of the processing liquid.

FIG. 2 is a piping system diagram applied to the substrate processing apparatus of FIG.

The processing liquid from the processing liquid tank 7 is supplied to a pipe 1 through a pump 8, a filter 9, and a valve 10.
1 to the first processing liquid supply pipe 2 and the second processing liquid supply member 3.

The operation of the substrate processing apparatus having the above configuration is as follows.

A part of the processing liquid discharged from the first processing liquid supply pipe 2 is directed diagonally outward and downward, while the remaining part is directed diagonally inward and downward. The processing liquid guided obliquely inward and downward is reflected on the bottom surface of the processing tank 1 and guided obliquely inward and upward.

The processing liquid discharged from the second processing liquid supply member 3 is guided vertically upward.

Therefore, outside the first processing liquid supply pipe 2, only the processing liquid discharged from one of the first processing liquid supply pipes 2 and reflected on the bottom surface of the processing tank 1 is guided upward. On the other hand, between the first processing liquid supply pipes 2, the processing liquid discharged from the first processing liquid supply pipes 2 and reflected on the bottom surface of the processing tank 1 and the second processing liquid supply member 3 The processing liquid discharged vertically upward is guided upward. Here, the processing liquid discharged from both the first processing liquid supply pipes 2 and reflected on the bottom surface of the processing tank 1 is guided by the processing liquid discharged vertically upward from the second processing liquid supply member 3. Therefore, the flow of the processing liquid as a whole hardly contains a strong lateral component, and the flow velocity corresponding to the central portion of the substrate 5 becomes the largest as shown by an arrow in FIG. Since the ideal flow velocity distribution shown can be approximated, a sufficient amount of the processing liquid can be supplied to the central portion of the substrate 5 and the surface of the substrate 5 can be processed substantially uniformly despite the high fluid resistance. .

FIG. 4 is another piping system diagram applied to the substrate processing apparatus of FIG.

This piping system diagram is different from the piping system diagram of FIG. 2 in that the piping 11 and the valve 10 on the downstream side of the filter 9 are set to two systems, one of which is the first processing liquid supply pipe 2, and the other is the one. Is connected only to the second processing liquid supply member 3.

When the configuration shown in the piping system diagram is adopted, the amount of the processing liquid supplied from the first processing liquid
The amount of the processing liquid supplied from the processing liquid supply member 3 can be easily set, and the same operation as in the above case can be achieved.

FIG. 5 is a longitudinal sectional view showing another embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus differs from the substrate processing apparatus of FIG. 1 in that the bottom wall of the processing bath 1 is recessed directly below the first processing liquid supply pipe 2 and slightly upwards between the two recessed portions. A point that the second processing liquid supply member 3 is set in a protruding shape, and the second processing liquid supply member 3 is provided in an embedded state at a portion of the bottom wall that protrudes upward;
The only difference is that the drain tube 6 is provided in each of the concave portions.

When this embodiment is adopted, the discharge position of the processing liquid from the second processing liquid supply member 3 can be made substantially coincident with the bottom surface of the processing tank, so that the processing liquid can be smoothly guided upward. In addition, the same operation as the embodiment of FIG. 1 can be achieved.

FIG. 6 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus according to the present invention, and FIG. 7 is a perspective perspective view.

This substrate processing apparatus differs from the substrate processing apparatus of FIG. 1 only in that a triangular pipe-shaped second processing liquid supply member 3 is used instead of the round pipe-shaped second processing liquid supply member 3. It is. The direction of the triangular pipe-shaped second processing liquid supply member 3 is set so that one top side is located at the top, and a plurality of processing liquid discharge holes 3a are formed on this top side. Have been. The shape of the processing liquid discharge hole 3a is not limited to a round hole shape as shown in FIG. 6, but may be an oval shape, a square shape, or the like.

In the case of adopting this embodiment, the processing liquid is squeezed at the time of discharge by the shape effect inside the triangular pipe.
The flow is rectified into an upward flow, and the effect of converting the processing liquid into an upward flow can be enhanced. In addition, the same operation as the embodiment of FIG. 1 can be achieved.

FIG. 8 is a perspective view showing still another embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus differs from the substrate processing apparatus of FIG. 7 only in that a long and narrow groove-shaped processing liquid discharge port 3b is formed instead of the plurality of processing liquid discharge holes 3a.

When this embodiment is adopted, the same operation as that of the embodiment shown in FIG. 7 can be achieved by forming the elongated groove-shaped processing liquid discharge port 3b.

FIG. 9 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention, and FIG. 10 is a perspective view showing a perspective view.

This substrate processing apparatus is different from the substrate processing apparatus shown in FIG. 5 in that a round pipe-shaped second processing liquid supply member 3 is provided in the most upwardly protruding portion of the bottom wall in place of the bottom wall. The only difference is that a plurality of second processing liquid supply members 3 are provided so as to penetrate the most upwardly protruding portion of the substrate and to make the upper end thereof flush with the upper surface of the bottom wall. Processing liquid discharge hole 3
The shape of “a” is not limited to a round hole shape as shown in FIG. 10 and may be an oval shape, a square shape, or the like.

When this embodiment is employed, the attachment of the second processing liquid supply member 3 to the processing tank 1 can be simplified, and the same operation as the embodiment of FIG. 5 can be achieved. .

FIG. 11 is a perspective view showing still another embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus is different from the substrate processing apparatus of FIG. 10 only in that an elongated groove-shaped processing liquid discharge port 3b is formed instead of the plurality of processing liquid discharge holes 3a.

In the case of adopting this embodiment, an elongated groove-like processing liquid discharge port 3b is formed, so that the structure shown in FIG.
The same operation as that of the embodiment can be achieved.

FIG. 12 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention, and FIG. 13 is a perspective view showing a perspective view.

This substrate processing apparatus differs from the substrate processing apparatuses of FIGS. 9 and 10 only in that the upper end of the second processing liquid supply member 3 is made to protrude from the upper surface of the bottom wall. The shape of the processing liquid discharge hole 3a is not limited to a round hole shape as shown in FIG. 13, but may be an oval shape, a square shape, or the like.

When this embodiment is adopted, the positioning and mounting of the second processing liquid supply member 3 with respect to the processing tank 1 can be simplified, and the same operation as that of the embodiment shown in FIGS. can do.

FIG. 14 is a perspective view showing still another embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus is different from the substrate processing apparatus of FIG. 13 only in that an elongated groove-shaped processing liquid discharge port 3b is formed instead of the plurality of processing liquid discharge holes 3a.

In the case of adopting this embodiment, by forming the elongated processing liquid discharge port 3b in the shape of a groove, FIG.
The same operation as that of the embodiment can be achieved.

FIG. 15 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention, and FIG. 16 is a perspective view showing a perspective view.

This substrate processing apparatus is different from the substrate processing apparatus shown in FIG. 5 in that a round pipe-shaped second processing liquid supply member 3 is provided at the most upwardly protruding portion of the bottom wall instead of being embedded. The only difference is that a pentagonal pipe-shaped second processing liquid supply member 3 having a top plate is provided. The shape of the processing liquid discharge hole 3a is not limited to a round hole shape as shown in FIG. 15, but may be an oval shape, a square shape, or the like.

When this embodiment is adopted, the processing liquid is throttled at the time of discharge by the shape effect of the inside of the pentagonal pipe, so that it is rectified into an upward flow, and the effect of converting the processing liquid into an upward flow can be enhanced. Besides, the same operation as the embodiment of FIG. 5 can be achieved.

FIG. 17 is a perspective view showing still another embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus is different from the substrate processing apparatus of FIG. 16 only in that an elongated groove-shaped processing liquid discharge port 3b is formed instead of the plurality of processing liquid discharge holes 3a.

In the case of adopting this embodiment, by forming the elongated processing liquid discharge port 3b in the shape of a groove, FIG.
The same operation as that of the embodiment can be achieved.

FIG. 18 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention, and FIG. 19 is a perspective view showing a perspective view.

This substrate processing apparatus is different from the substrate processing apparatuses shown in FIGS. 15 and 16 in that the upper surface plate of the pentagonal pipe-shaped second processing liquid supply member 3 is projected upward in an arc instead of being made flat. The only difference is that a shaped top plate is used. The shape of the processing liquid discharge hole 3a is not limited to a round hole shape as shown in FIG. 18, but may be an oval shape, a square shape, or the like.

When this embodiment is adopted, the processing liquid is squeezed at the time of discharge by the effect of the arc shape inside the second processing liquid supply pipe, so that the processing liquid is rectified into an upward flow, and the processing liquid flows upward. To the effect of converting to
The same operation as the embodiment of FIGS. 15 and 16 can be achieved.

FIG. 20 is a perspective view showing still another embodiment of the substrate processing apparatus of the present invention.

This substrate processing apparatus is different from the substrate processing apparatus of FIG. 19 only in that an elongated groove-shaped processing liquid discharge port 3b is formed instead of the plurality of processing liquid discharge holes 3a.

In the case of adopting this embodiment, by forming the processing liquid discharge port 3b in the form of a long and narrow groove, the processing liquid shown in FIG.
The same operation as that of the embodiment can be achieved.

[0099]

According to the first aspect of the present invention, the processing liquid discharged from the hole of the first processing liquid supply pipe once collides with the bottom of the processing tank and is converted into a lateral flow, and thereafter, the second processing liquid is supplied. The upward flow is guided by the flow of the processing liquid discharged from the hole of the supply member and is converted into an upward flow. Therefore, the upward flow has almost no strong lateral component, and the substrate having the largest fluid resistance. It is possible to supply a sufficient amount of the processing liquid to the central portion, and thus to achieve a unique effect that the entire surface of the substrate can be processed substantially uniformly.

The second aspect of the invention has the same effect as the first aspect.

According to the third aspect of the invention, the manufacturing process can be simplified, and the same effects as those of the second aspect can be obtained.

According to the fourth aspect of the present invention, it is possible to enhance the effect of converting the processing liquid discharged from the second processing liquid supply member into an upward flow by guiding the processing liquid, and to obtain the same effect as that of the second aspect. Play.

According to the fifth aspect of the present invention, when discharged from the second processing liquid supply pipe, the effect of converting the processing liquid into an upward flow can be enhanced depending on the internal shape of the pipe. A similar effect is achieved.

According to the sixth aspect of the present invention, when discharged from the second processing liquid supply pipe, the effect of converting the processing liquid into an upward flow can be enhanced depending on the internal shape of the pipe. A similar effect is achieved.

According to the seventh aspect of the present invention, the same effects as those of the first aspect can be obtained only by providing pipes only at necessary places.

According to the eighth aspect of the present invention, the effect of converting the processing liquid discharged from the first processing liquid supply pipe and having a horizontal component flow into an upward flow can be enhanced. It works.

According to the ninth aspect of the present invention, depending on the shape of the bottom surface of the processing tank, the effect of converting the processing liquid discharged from the first processing liquid supply pipe and having a horizontal component flow into an upward flow can be enhanced. In addition to the above, the same effects as those of the seventh aspect are obtained.

According to the tenth aspect of the present invention, the same effect as that of the first aspect can be obtained only by providing an elongated groove-like processing liquid discharge port.

According to the eleventh aspect of the present invention, the effect of converting the processing liquid discharged from the first processing liquid supply pipe and having a horizontal component flow into an upward flow can be enhanced.
An effect similar to that of the tenth aspect is obtained.

According to the twelfth aspect of the invention, depending on the shape of the bottom surface of the processing tank, the effect of converting the processing liquid discharged from the first processing liquid supply pipe and having a horizontal component flow into an upward flow can be enhanced. In addition to the above, the same effects as those of the tenth aspect are exhibited.

According to the thirteenth aspect of the present invention, since the processing liquid supply pipe is provided integrally with the processing tank, the processing liquid discharged from the second processing liquid supply member is guided by the flow of the processing liquid and converted into an upward flow. And the same effect as that of claim 1 can be obtained.

According to a fourteenth aspect of the present invention, the processing liquid is rectified upward and discharged by the shape of the projecting portion.
It has the same effect as 3.

According to a fifteenth aspect of the present invention, the processing liquid is throttled at the time of discharge by the effect of the arc shape inside the second processing liquid supply pipe.
Since the flow is rectified into an upward flow, the effect of converting the processing liquid into an upward flow can be enhanced.
It has the same effect as.

According to the sixteenth aspect of the present invention, since the processing liquid supply pipe is provided integrally with the processing tank, the processing liquid is guided by the flow of the processing liquid discharged from the second processing liquid supply member and converted into an upward flow. And the same effect as that of claim 1 can be obtained.

According to a seventeenth aspect of the present invention, the processing liquid is rectified upward and discharged by the shape of the projecting portion.
The same effect as that of No. 6 is obtained.

According to the eighteenth aspect of the present invention, the processing liquid is narrowed at the time of discharge by the effect of the arc shape inside the second processing liquid supply pipe,
Since the flow is rectified into an upward flow, the effect of converting the processing liquid into an upward flow can be enhanced.
It has the same effect as.

According to the nineteenth aspect, the same effect as any one of the first to eighteenth aspects can be obtained without controlling the ratio of the supply amount of the processing liquid.

According to the twentieth aspect, the ratio of the supply amount of the processing solution can be optimally adjusted, and the same effect as any one of the first to eighteenth aspects can be obtained.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing one embodiment of a substrate processing apparatus of the present invention.

FIG. 2 is a piping system diagram applied to the substrate processing apparatus of FIG. 1;

FIG. 3 is a diagram showing an ideal flow velocity distribution.

FIG. 4 is another piping system diagram applied to the substrate processing apparatus of FIG. 1;

FIG. 5 is a longitudinal sectional view showing another embodiment of the substrate processing apparatus of the present invention.

FIG. 6 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 7 is a transparent perspective view.

FIG. 8 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 9 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 10 is a perspective perspective view.

FIG. 11 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 12 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 13 is a perspective perspective view.

FIG. 14 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 15 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 16 is a transparent perspective view.

FIG. 17 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 18 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

FIG. 19 is a transparent perspective view.

FIG. 20 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Processing tank 2 1st processing liquid supply pipe 3 2nd processing liquid supply member 3a Processing liquid discharge hole 3b Processing liquid discharge port 4 Rectifier plate 5 Substrate

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Ki Kanan 1304 Kanaokacho, Sakai City, Osaka Daikin Industries Inside the Kanaoka Plant of Sakai Seisakusho Co., Ltd. (72) Inventor Masao Ohno 1304 Kanaokacho, Sakai City, Osaka Daikin Industries, Ltd. (72) Inventor Dai Awaihara Daikin Industries, Inc. 1304 Kanaokacho, Sakai City, Osaka Prefecture Daikin Industries Co., Ltd. (72) Inventor Naoaki Izumiya, 1304 Kanaokacho, Sakai City, Osaka Daikin Industries, Ltd. F-term in the Kanaoka Plant (Reference) 2H096 GA23 3B201 AA03 AB01 BB03 BB87 BB92 CB12 4F042 AA07 BA08 CA06 CB19

Claims (20)

[Claims] 1. A processing liquid supply pipe (2) (3) is provided at the bottom of a processing tank (1) to supply a processing liquid, and the processing liquid is rectified by a rectifying plate (4) and guided upward, and is connected in parallel. A substrate processing apparatus for processing the surface of a plurality of substrates (5) erected in a shape, wherein the processing is performed at symmetrical positions with respect to a virtual vertical reference plane including a central axis of the plurality of substrates (5). A first processing liquid supply pipe (2) having a hole (2a) for discharging the liquid toward the bottom surface of the processing tank (1) is provided, and an intermediate position between the first processing liquid supply pipes (2) is provided. A substrate processing apparatus comprising a second processing liquid supply member (3) having a hole (3a) for vertically discharging a processing liquid. 2. The substrate processing apparatus according to claim 1, wherein the second processing liquid supply member has a plurality of processing liquid discharge holes formed on an upper surface of a round pipe. 3. The substrate processing apparatus according to claim 2, wherein the round pipe is provided above a bottom surface of the processing tank (1). 4. The substrate processing apparatus according to claim 2, wherein the round pipe is provided flush with a bottom surface of the processing tank. 5. The substrate processing apparatus according to claim 1, wherein the second processing liquid supply member (3) has a plurality of processing liquid discharge holes (3a) formed at an upper top side of a triangular pipe. . 6. The elongated processing liquid discharge port (3b) in the upper end of the triangular pipe is provided with the second processing liquid supply member (3).
The substrate processing apparatus according to claim 1, wherein the substrate is formed. 7. The substrate processing apparatus according to claim 1, wherein the second processing liquid supply member (3) is a plurality of pipes (3c) provided through a bottom wall of the processing tank (1). . 8. The substrate processing apparatus according to claim 7, wherein the pipe (3c) has an upper end provided flush with a bottom surface of the processing tank (1). 9. The substrate processing apparatus according to claim 6, wherein the pipe (3c) has an upper end protruding above a bottom surface of the processing tank (1). 10. The processing liquid supply member (3) is an elongated groove-shaped processing liquid discharge port (3b) formed by a flat plate member provided through the bottom wall of the processing tank (1). The substrate processing apparatus according to claim 1. 11. The substrate processing apparatus according to claim 10, wherein an upper end of the processing liquid discharge port (3b) is provided flush with a bottom surface of the processing tank (1). 12. The substrate processing apparatus according to claim 10, wherein an upper end of the processing liquid discharge port (3b) protrudes above a bottom surface of the processing tank (1). 13. The processing liquid supply member (3) penetrates a processing liquid supply pipe provided integrally below the bottom wall of the processing tank (1) and a bottom wall of the processing tank. The substrate processing apparatus according to claim 1, further comprising a through hole (3a) for discharging the processing liquid from the processing liquid supply pipe. 14. A bottom wall of a processing tank (1) constituting an upper wall of a processing liquid supply pipe is formed in an upward straight line so that a central portion protrudes upward. 14. The substrate processing apparatus according to claim 13, wherein a through hole is formed. 15. A bottom wall of the processing tank (1) constituting an upper wall of the processing liquid supply pipe is formed in an upwardly arcuate shape so that a central portion protrudes upward. 14. The substrate processing apparatus according to claim 13, wherein a through hole is formed. 16. The processing liquid supply member (3) penetrates a processing liquid supply pipe provided integrally below a bottom wall of the processing tank (1) and a bottom wall of the processing tank. 2. The substrate processing apparatus according to claim 1, further comprising: an elongated groove-shaped processing liquid discharge port (3b) for discharging the processing liquid from the processing liquid supply pipe. 17. A bottom wall of a processing tank (1) constituting an upper wall of a processing liquid supply pipe is formed in an upward straight line so that a central portion protrudes upward. The substrate processing apparatus according to claim 16, wherein the processing liquid discharge port (3b) is formed. 18. A bottom wall of the processing tank (1) which forms an upper wall of the processing liquid supply pipe is formed in an upwardly arcuate shape so that a central portion protrudes upward, and an elongated groove is formed in a most bulged portion. The substrate processing apparatus according to claim 16, wherein the processing liquid discharge port (3b) is formed. 19. An amount of the processing liquid supplied through the first processing liquid supply pipe (2) and an amount of the processing liquid supplied through the second processing liquid supply member (3) are set in advance. The substrate processing apparatus according to any one of claims 1 to 18. 20. The ratio between the amount of the processing liquid supplied through the first processing liquid supply pipe (2) and the amount of the processing liquid supplied through the second processing liquid supply member (3) is adjustable. The substrate processing apparatus according to claim 1.