JP2000068363A - Thin plate storage and transport container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin plate storage and transport container which generates almost no gas and thereby hardly contaminates a silicon wafer or the like which is stored airtightly therein. SOLUTION: An aromatic polycarbonate resin has viscosity mean molecular weight of at least 14,000 and at most 30,000, and when it is heated at 150 deg.C for one hour in an airtight container, it generates gas amount of at most 1.5 ppm, calculated in terms of toluene weight and it conforms to ASTM D4526. Both the main body and a cover of a thin plate storage and transport container is constituted of such a material. A plate-like body 4 and a wafer carrier are constituted of a resin composition which has an antistatic property made of resin, whose secondary transistion temperature is 135 deg.C or above, for example, antistatic type polyether-ether ketone resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin plate storage / transport container for storing and supporting a large number of thin plates, such as silicon wafers, for storage, transportation and the like. And a thin plate storage container.

[0002]

2. Description of the Related Art As a thin plate storage / transport container, a container for accommodating and transporting a silicon wafer inside is generally known. In such a wafer storage / transport container, it is important to transport the wafer while keeping the inside of the container clean in order to prevent contamination of the surface of the stored wafer.

[0003] As described above, a polypropylene resin and an aromatic polycarbonate resin are well known as typical materials constituting a container whose inside needs to be kept clean.

[0004] Of the above-mentioned materials used as constituent materials of thin plate storage / transport containers, polypropylene resin is widely used from a comprehensive viewpoint such as economical efficiency, light weight, mechanical properties and moldability, which are advantageous in terms of cost. I have.

[0005]

However, in the case of a polypropylene resin, various additives, such as antioxidants, processing aids, and ultraviolet absorbers, which are added in large amounts to the resin, are decomposed during the molding process. The gas generated by this and the solvent remaining in the resin cause contamination of the silicon wafer surface during storage and transportation. In addition, since the polypropylene resin has a low surface hardness, there is also a problem that a large amount of fine particles are generated and scattered due to friction when opening / closing the storage / transport container, and adhere to and contaminate a clean wafer surface.

As one of measures for overcoming this problem, there has been proposed a polypropylene resin container described in JP-A-8-250581. However, even if such measures are taken, the polypropylene resin cannot meet the demand for reducing contamination on the wafer surface during storage and transportation.

[0007] Polybutylene terephthalate resin and polyether ether ketone resin are also known as resins used for semiconductor applications and with less contamination on the wafer surface. However, these resins have no transparency,
There is a problem that the mechanical strength is inferior to the aromatic polycarbonate or the price is high. Therefore, it is not suitable as a material for a thin plate storage / transport container requiring transparency, mechanical strength, and the like.

On the other hand, the quality required for the wafer storage / transport container is to maintain the cleanliness of the silicon wafer surface during storage or transportation of the silicon wafer as described above. It is quantitatively determined by the amount of organic matter, fine particles, metal or ionic substance attached to the surface. As one of the methods for evaluating the degree of contamination of the wafer surface during storage or transportation, there is a method of measuring an angle formed by pure water dropped on the wafer surface with the wafer surface, that is, a contact angle.

When the contact angle of pure water with the surface of a wafer stored in a thin plate storage / transport container made of an aromatic polycarbonate resin is measured by this method, the contact angle is reduced as compared with the surface of a wafer stored in a polypropylene resin container. The effect of using an aromatic polycarbonate resin is recognized. For this reason, the use of an aromatic polycarbonate resin with a low degree of contamination for a lid or the like as a material for a thin plate storage / transportation container is increasing even if the price is high.

However, the aromatic polycarbonate resin has different production processes, that is, the reaction and the solvent, and the molecular weight and the type and amount of the additive vary depending on the brand. Therefore, the aromatic polycarbonate resin is measured depending on the brand of the aromatic polycarbonate resin used as a raw material. The resulting contact angles differ greatly. That is, there is a problem that the quality of the wafer storage / transport container differs depending on the type of the aromatic polycarbonate resin.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a thin plate storage / transport container capable of maintaining a high level of cleanliness while maintaining a high quality of a material to be used. With the goal.

[0012]

According to a first aspect of the present invention, there is provided a thin plate storage / transport container comprising: a container body for accommodating and supporting a plurality of thin plates therein; and a thin plate inside the container body. In a thin plate storage / transport container provided with a lid that keeps the inside clean by covering the container in a stored state, both the container body and the lid have a viscosity average molecular weight of 14,000 or more and 30,000 or less. It is characterized by comprising an aromatic polycarbonate resin as a raw material.

A thin plate storage / transport container according to a second invention is
A thin plate storage / transport container comprising: a container main body for accommodating and supporting a plurality of thin plates inside; and a lid for keeping the inside clean by covering the thin plates inside the container main body. Both the lid and the lid are made from an aromatic polycarbonate resin whose amount of generated gas when heated at 150 ° C. for 1 hour in a closed container in accordance with ASTM D4526 is 1.5 ppm or less in terms of toluene weight. It is characterized by the following.

[0014] A thin plate storage / transport container according to a third aspect of the present invention comprises:
A thin plate storage / transport container comprising: a container main body for accommodating and supporting a plurality of thin plates inside; and a lid for keeping the inside clean by covering the thin plates inside the container main body. And the lid both have a viscosity average molecular weight of 14,
Between 000 and 30,000 and ASTM D4
The amount of gas generated when heated at 150 ° C. for 1 hour in a closed container in accordance with 526 is 1.5 ppm in terms of toluene weight.
It is characterized by comprising the following aromatic polycarbonate resin as a raw material.

[0015] A thin plate storage / transport container according to a fourth aspect of the present invention comprises:
In the thin plate storage / transport container according to any one of the first to third inventions, a plate-like object having comb teeth for storing and holding a large number of thin plates at regular intervals is formed on an inner wall portion of the container body. It is characterized in that it is detachably attached to the.

A thin plate storage / transport container according to a fifth aspect of the present invention
In the thin plate storage / transport container according to any one of the first to third inventions, it is preferable that an open-type thin plate storage container integrally supporting a large number of thin plates at predetermined intervals is stored in the container body. Features.

A thin plate storage / transport container according to a sixth invention is
In the thin plate storage / transport container according to a fourth aspect, the plate-like material is made of a resin having a secondary transition temperature of 135 ° C. or more.
It is characterized by comprising a resin composition having antistatic performance.

A thin plate storage / transport container according to a seventh aspect of the present invention comprises:
In the thin plate storage / transport container according to the fifth invention,
The open-type thin plate container is made of a resin composition having antistatic performance.

In the first invention, both the main body and the lid of the thin plate storage / transport container are made of an aromatic polycarbonate resin having a viscosity average molecular weight of 14,000 or more and 30,000 or less. And there is the following problem. When the viscosity average molecular weight is 30,000 or more, the solvent used in the production tends to remain in the resin, and the melt viscosity at the time of molding also increases. Absent.

When the viscosity average molecular weight is 14,000 or less, the mechanical properties of the polycarbonate resin are reduced, and the strength of the molded storage / transport container is also reduced.

In the present invention, the viscosity average molecular weight (M)
Is the specific viscosity (η) determined from a solution of 0.7 g of a polycarbonate resin dissolved in 100 ml of methylene chloride at 20 ° C.
sp) into the following equation.

Ηsp / C = [η] 10.45 × [η] ²
× C (C = 0.7) [η] = 1.23 × 10 ⁻⁴ × M ^0.83 where [η] is the limiting viscosity In the second invention, both the main body and the lid of the thin plate storage / transport container are ASTM. 15 in a closed container according to D4526
An aromatic polycarbonate resin in which the amount of gas generated when heated at 0 ° C. for 1 hour is 1.5 ppm or less in terms of toluene weight is used as a raw material, but when the amount generated in terms of toluene weight becomes 1.5 ppm or more. In addition, surface contamination of a silicon wafer or the like during storage / transport in a storage / transport container rapidly increases, which is not preferable. For this reason, 1.5 ppm or less of an aromatic polycarbonate resin is used as a raw material.

In the third invention, both the main body and the lid of the thin plate storage / transport container have a viscosity average molecular weight of not less than 14,000 and not more than 30,000 and at 150 ° C. in a closed container in accordance with ASTM D4526. A polycarbonate resin whose amount of generated gas when heated for 1.5 hours is 1.5 ppm or less in terms of toluene weight is used as a raw material. As described above, when the viscosity average molecular weight is 30,000 or more, generation of gas increases, and when the viscosity average molecular weight is 14,000 or less, mechanical properties are deteriorated. When the amount of toluene generated is 1.5 ppm or more, contamination on the surface of a silicon wafer or the like increases rapidly. For this reason, by using the aromatic polycarbonate resin set to the numerical values described above as a raw material,
A thin plate storage / transport container excellent in mechanical properties and less contaminated with storage items such as silicon wafers can be provided.

In the fourth aspect of the present invention, since the plate-like object is detachably mounted, the plate-like object is removed when cleaning the thin plate storage / transport container. Thus, the thin plate storage / transport container can be thoroughly washed, and gas and fine particles contaminating the thin plate surface such as a silicon wafer can be suppressed. In addition, as the plate-like material, a resin having a higher surface hardness and a smaller amount of generated gas than an aromatic polycarbonate resin, for example, a polybutylene terephthalate resin or the like, in order to suppress generation of fine particles and prevent contamination by generated gas from constituent materials. It is desirable to use a polyetheretherketone resin.

In the fifth invention, in order to put a large number of silicon wafers and the like in and out of the storage / transport container at once,
The open-type thin plate storage container can be stored in the main body. Thus, as in the case of the fourth aspect, the container can be thoroughly cleaned, and gas and fine particles contaminating the surface of a thin plate such as a silicon wafer can be suppressed. In addition, in order to suppress generation of fine particles and to prevent contamination by generated gas from constituent materials, the open-type thin plate storage container is a resin having a higher surface hardness and a smaller amount of generated gas than an aromatic polycarbonate resin, for example, a polybutylene terephthalate resin. Or a polyetheretherketone resin.

In the sixth aspect of the present invention, the plate-like material is made of a resin having a secondary transition temperature of 135.degree.
Contamination of the surface of a silicon wafer or the like during transportation can be reliably suppressed. As the resin composition, an antistatic polyetheretherketone resin or the like is used.

In the seventh invention, the open-type thin plate container is made of a resin composition having an antistatic property made of a resin having a secondary transition temperature of 135 ° C. or more, so that it can be stored and transported with fine particles or the like. Contamination of the surface of a silicon wafer or the like can be reliably suppressed. As the resin composition, an antistatic polyetheretherketone resin or the like is used.

[0028]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

In the present embodiment, an explanation will be made by taking a storage / transport container for 8 inch silicon wafers as an example. It is needless to say that the thin plate storage / transport container according to the present invention is not limited to this 8-inch silicon wafer storage / transport container, but may be another size silicon wafer storage / transport container.
The present invention is not limited to a silicon wafer, but may be applied to any thin plate that may be adversely affected by gas, fine particles, or the like.

Here, three types of silicon wafer storage and storage
A description will be given of a transport container as an example. First silicon wafer storage
The transport container is a container having a configuration in which a plate-like material having comb teeth for storing and holding a large number of silicon wafers at regular intervals is detachably mounted on the inner wall of the container body. The second silicon wafer storage / transport container is a vertical container configured to store an open thin plate storage container (wafer carrier) integrally supporting a large number of thin plates at fixed intervals in a container body from above. is there. The third silicon wafer storage / transport container is a vertical container configured to store the open thin plate storage container in a container body from the side.

The first silicon wafer storage / transport container is:
It is configured as shown in FIGS.

This silicon wafer storage / transport container 1 is
A container body 2 for accommodating and supporting a large number of silicon wafers (not shown) therein, and a plurality of silicon wafers provided on respective opposed side walls within the container body 2 and accommodated therein at regular intervals. It has a plate-like object 4 having comb teeth 3 for storing and holding from both sides, and a lid (not shown) that keeps the inside clean by closing the upper opening of the container body 2 airtightly. I have.

The entire container body 2 is formed in a substantially cubic shape. Inside the side walls 2A and 2B of the container body 2, there is provided a support base 5 for supporting a plate-like object 4 which is detachably attached. The support base 5 has a lower base 5A.
And an upper base 5B. A lower support projection 6 is provided on the lower base 5A. The lower support projections 6 are fitted into lower support holes 15 of the plate 4 to be described later, and support the lower portion of the plate 4.

An upper support projection 7 is provided on the upper base 5B. The upper support projection 7 is fitted into an upper support hole 16 of the plate-like material 4 described later to support the upper portion of the plate-like material 4. Further, a locking claw 8 is provided on the upper base 5B. The locking claw 8 is locked in the upper support hole 16,
The plate-like object 4 is prevented from falling off.

At the upper end of the container body 2, a lid receiving step 9 for fitting the lid is provided. The lid receiving step 9 is formed by extending the upper end of the container body 2 to the size of the lid. An annular groove 10 is provided at the upper end of the lid receiving step 9 over the entire periphery thereof, and a gasket (not shown) attached to the lower surface of the lid fits into the silicon wafer storage / transport container. The inside is sealed.

The plate 4 is removably attached to a support 5 in the container body 2. Specifically, the plate-like object 4 is configured as shown in FIGS. A large number of plate-like objects 4 are arranged in parallel at regular intervals, and the comb teeth 3 support each silicon wafer one by one.
And a supporting plate portion 1 for integrally supporting the comb teeth 3 at three positions in a state where the comb teeth 3 are arranged in parallel at a constant interval.
2 and a silicon wafer supporting V formed on the inner surface (contact surface with the silicon wafer) of the innermost support plate portion 12A.
And a U-shaped groove 13.

Surface of each comb tooth 3 (surface on the silicon wafer side)
Is formed to be curved in an arc shape along the periphery of a circular silicon wafer. Thereby, the comb teeth 3 are supported in a state of being slightly overlapped along the peripheral edge of the silicon wafer, and the adverse effect on the surface of the silicon wafer is minimized. Further, the area where the comb teeth 3 overlap with each other is reduced, so that dust and the like adhering to the surface of each comb tooth 3 are reduced, and the cleaning of each comb tooth 3 is facilitated.

On the back surface of the plate-like object 4, a lower support hole 15 for fitting the lower support protrusion 6 of the support base 5 to support the lower part of the plate-like object 4 and an upper support protrusion 7 are fitted. An upper support hole 16 for supporting the upper portion of the plate-shaped object 4 is provided.

This plate-like material 4 has a secondary transition temperature of 135 ° C.
It is composed of a resin composition having antistatic performance, comprising the above resin. Specifically, it is composed of an antistatic polyetheretherketone resin.

Second silicon wafer storage / transport container 21
Is configured as shown in FIG.

Reference numeral 22 in the figure denotes a container body. In the container main body 22, a wafer carrier 23 as an open-type thin plate storage container for integrally supporting a large number of thin plates (silicon wafers) at regular intervals is stored in a state where a large number of silicon wafers are supported. You. This wafer carrier 23
It is composed of a resin composition having a secondary transition temperature of 135 ° C. or higher and having antistatic performance. Specifically, similarly to the plate-like member 4, the plate-like member 4 is made of an antistatic polyetheretherketone resin.

In the drawing, reference numeral 24 denotes a lid for closing the container body 22. The cover 24 covers the upper half of the silicon wafer 25 stored in the container
Can be mounted airtight. The container main body 22 is provided with an internal pressure adjusting valve 26 for adjusting the internal pressure according to the change in the external pressure. A wafer support 27 is provided on the upper plate in the lid 24.
Is attached.

Third silicon wafer storage / transport container 31
Is configured as shown in FIG.

The wafer carrier 32 is formed in a cage shape with an open top, and is provided with comb teeth inside thereof so as to support a large number of silicon wafers in parallel at regular intervals.

The silicon wafer storage / transport container 31 is composed of a container body 34 formed with an opening at the front to store the wafer carrier 32 and a lid 35 for hermetically closing the front opening of the container body 34. I have.

Both the container body and the lid of each of the thin plate storage / transport containers configured as described above are made of the aromatic polycarbonate resin of each of the following examples as a raw material. [Example 1] An aromatic polycarbonate resin having a viscosity average molecular weight of 20,500 and an amount of generated gas in terms of toluene of 0.8 ppm was used as a raw material, and molding aids such as a mold release agent and a lubricant were substantially used. Without being used, the storage / transport container 1 for 8 inch silicon wafers and the like were injection molded. The open storage containers (wafer carriers 23, 32) that can be stored in the main body are made of antistatic polyetheretherketone resin used for semiconductor applications as a raw material, and are substantially used for molding a release agent, a lubricant, and the like. Injection molding was performed without using an agent.

An 8-inch silicon wafer having a clean surface was stored in this open storage container, and the whole was sealed in the storage and transport container. After keeping the sealed state at room temperature for 2 weeks,
The silicon wafer was taken out, and the contact angle with pure water was measured at a total of five places at the center of the surface and four places at the periphery thereof. The average value was 3.5 °. The average value of the contact angle of the control sample before sealing was 2.5 °. [Example 2] An aromatic polycarbonate resin having a viscosity average molecular weight of 18,500 and an amount of generated gas in terms of toluene of 0.4 ppm was used as a raw material, and molding aids such as a mold release agent and a lubricant were substantially used. Without use, a storage / transport container for 8 inch silicon wafers was injection molded. An 8-inch silicon wafer having a clean surface was stored in the open-type storage container injection-molded in Example 1, and the whole was sealed in the storage / transport container. After keeping the sealed state at room temperature for 2 weeks,
The silicon wafer was taken out, and the contact angles with pure water were measured at a total of five locations, namely, a central portion of the surface and four peripheral portions thereof. The average value was 3.2 °. The average value of the contact angles of the control sample before sealing was 2.4 °. [Comparative Example 1] An aromatic polycarbonate resin having a viscosity average molecular weight of 19,300 and a generated gas amount in terms of toluene of 1.8 ppm was used as a raw material, and a molding aid such as a mold release agent and a lubricant was substantially used. Without use, a storage / transport container for 8 inch silicon wafers was injection molded. An 8-inch silicon wafer having a clean surface was stored in the open-type storage container injection-molded in Example 1, and the whole was sealed in a storage / transport container. After keeping the sealed state at room temperature for 2 weeks, the silicon wafer was taken out, and the contact angle with pure water was measured at a total of five places at the center part of the surface and four places at the peripheral part. The average value was 6.1 °. Was. The average value of the contact angles of the control sample before sealing was 2.7 °. [Comparative Example 2] An aromatic polycarbonate resin having a viscosity average molecular weight of 13,100 and an amount of generated gas in terms of toluene of 0.7 ppm was used as a raw material, and molding aids such as a mold release agent and a lubricant were substantially used. Without use, a storage / transport container for 8 inch silicon wafers was injection molded. When an 8-inch silicon wafer having a clean surface was stored in the open-type storage container injection-molded in Example 1, and the whole was to be sealed in the storage / transportation container, cracks occurred in the lid or the main body or both. The experiment was stopped. [Others] In addition to the above Examples and Comparative Examples, as shown in the table of FIG. 1, Examples 3 and 4, Comparative Examples 3 and 4, and commercially available products A, B, and C were the same as in the above Examples. It experimented on condition of. [Modification] In each of the above embodiments, the plate-like material 4 and the open-type storage containers (wafer carriers 23 and 32) are formed of an antistatic polyetheretherketone resin, but an antistatic polybutylene terephthalate resin is used. It may be formed by molding. In this case, substantially the same results as in the above embodiments can be obtained.

[0048]

As described in detail above, the thin plate storage / transport container of the present invention has the following effects.

The present invention is a thin plate storage / transport container in which both the container main body and the lid are made of an aromatic polycarbonate resin, wherein both the main body and the lid are (1) a viscosity average molecular weight of 14,000 or more. 30,000 or less, (2) AST
According to MD4526, the amount of gas generated when heated at 150 ° C. for 1 hour in a closed vessel was calculated as 1.
When an aromatic polycarbonate resin satisfying one or both of the two conditions of 5 ppm or less is used as a raw material,
Pollution can be significantly reduced. That is, contamination of the surface of a silicon wafer or the like which is tightly stored in a thin plate storage / transport container may be caused by a storage / transport container made of an aromatic polycarbonate resin under other conditions or a commercially available storage / transport container. Compared to the case where
Significantly reduced. As a result, it is possible to provide a thin plate storage / transport container that is superior in cost without requiring an extra washing step for processing a silicon wafer or the like.

Further, a plate-shaped object having comb teeth for storing and holding silicon wafers and the like, and an open thin plate storage container for integrally supporting a large number of silicon wafers and the like at fixed intervals are provided inside the container body. Since it is stored in a space, it is possible to clean every corner where it is difficult to remove fine particles and the like. As a result, contamination of the surface of a silicon wafer or the like can be significantly reduced.

Further, a plate-like object or an open-type thin plate container is
Since it is composed of a resin composition having an antistatic property and made of a resin having a secondary transition temperature of 135 ° C. or more, it is possible to greatly reduce the contamination of the surface of a silicon wafer or the like in combination with the material of the container body and the lid. it can.

[Brief description of the drawings]

FIG. 1 is a table showing experimental results of Examples and Comparative Examples of the present invention.

FIG. 2 is a perspective view showing a first silicon wafer storage / transport container according to the present invention.

FIG. 3 is a cross-sectional view of a first silicon wafer storage / transport container.

FIG. 4 is a front view showing a plate-like object of a first silicon wafer storage / transport container.

FIG. 5 is a side view showing a plate-like object of a first silicon wafer storage / transport container.

FIG. 6 is a sectional view showing a second silicon wafer storage / transport container according to the present invention.

FIG. 7 is an exploded perspective view showing a third silicon wafer storage / transport container according to the present invention.

[Explanation of symbols]

1,21,31: Silicon wafer storage / transport container 2:
Container body, 3: comb teeth, 4: plate, 5: support, 5A:
Lower base, 5B: Upper base, 6: Lower support projection, 7:
Upper support projection, 8: locking claw, 9: lid receiving step, 1
0: annular groove, 12: support plate, 12A: support plate, 1
3: V-shaped groove, 15: lower support hole, 16: upper support hole, 22: container body, 23, 32: wafer carrier, 2
4: lid, 25: silicon wafer, 26: internal pressure regulating valve,
27: wafer support, 34: container body, 35: lid.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Akira Yuki 1-2-2 Uchisaiwaicho, Chiyoda-ku, Tokyo F-term in Teijin Chemicals Limited (Reference) 3E096 AA06 BA16 BB03 CA02 CB03 DA05 DC04 EA02X EA02Y FA01 FA03 FA07 GA01 GA07 5F031 BB01 BB04 BC01 BC03 LL09 MM06

Claims (7)

[Claims] 1. A thin plate storage / transport container comprising: a container main body for accommodating and supporting a plurality of thin plates therein; and a lid for covering the thin plate inside the container main body and keeping the inside clean. In the above, both the container body and the lid have a viscosity average molecular weight of 1
A thin plate storage / transport container characterized by comprising an aromatic polycarbonate resin having a molecular weight of 4,000 to 30,000 as a raw material. 2. A thin plate storage / transport container comprising: a container body for accommodating and supporting a large number of thin plates therein; and a lid for covering the thin plate inside the container body and keeping the inside clean. In the above, both the container main body and the lid are made to ASTM D4526.
A thin plate storage / transport characterized by comprising, as a raw material, an aromatic polycarbonate resin having an amount of gas generated when heated at 150 ° C. for 1 hour in a closed container in an amount of 1.5 ppm or less in terms of toluene weight according to container. 3. A thin plate storage / transport container comprising: a container body for accommodating and supporting a plurality of thin plates therein; and a lid for covering the thin plate inside the container body and keeping the inside clean. In the above, both the container body and the lid have a viscosity average molecular weight of 1
Between 4,000 and 30,000 and ASTM
The amount of gas generated when heated at 150 ° C. for 1 hour in a closed container in accordance with D4526 is 1.5 p in terms of toluene weight.
A thin plate storage / transport container comprising an aromatic polycarbonate resin having a viscosity of not more than pm or less as a raw material. 4. The thin plate storage / transport container according to claim 1, wherein a plate-like object having comb teeth for storing and holding a large number of thin plates at regular intervals is provided. A thin plate storage / transport container, which is detachably attached to an inner wall portion of the container body. 5. The thin-plate storage / transport container according to claim 1, wherein the open-type thin-plate storage container integrally supporting a plurality of thin plates at a predetermined interval. A thin plate storage / transport container characterized by being stored inside. 6. The thin plate storage / transport container according to claim 4, wherein the plate-like material is made of a resin having a secondary transition temperature of 135 ° C. or higher and having an antistatic property. Characterized as a thin plate storage / transport container. 7. The thin-plate storage / transport container according to claim 5, wherein the open-type thin-plate storage container is made of a resin composition having a secondary transition temperature of 135 ° C. or more and having an antistatic property. A thin plate storage / transport container, characterized in that: