JP2000068357A - Wafer cut-out position detector and wafer characteristic measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a position detector which can detect the position of a wafer cutout such as a notch and an orientation flat without damaging a wafer with a simple structure using an edge handling device for handling the periphery of a wafer. SOLUTION: A wafer W is placed on a holding stage 1 which holds the wafer W by the periphery. A sensor 22 is moved, while being revolved along the periphery of the wafer by means of a drive section 23 to detect the outer shape of the wafer. In parallel with the detection, the position (angle of rotation) of the sensor is detected by an encoder, which generates a pulse according to the rotation of the driving section 23. A notch position detecting section 25 detects the position of a notch from the position of the sensor at detecting the notch. Thus, the notch position can be detected during the edge handling operation. Therefore, the contamination on the rear face of the wafer can be prevented, and thereby reliability, quality and yield can be increased, which leads to reduction in manufacturing cost. Moreover, due to the mechanism being one for making a sensor rotate without rotating an edge handling equipment, the transfer time to a space or a stage can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer notch position detecting device for detecting a position of a notch such as an orientation flat or a notch provided on an outer periphery of a wafer, and a wafer characteristic measuring device using the same. is there.

[0002]

2. Description of the Related Art Usually, a notch (orientation flat or notch) indicating the crystal orientation is formed on the outer periphery of a semiconductor wafer. In each manufacturing process, the position of the wafer is determined with reference to the position of the notch. The processing is performed after. For this reason, it is necessary to detect the position of the notch in advance before the manufacturing process of each wafer. As a wafer notch position detecting device for detecting the position of the above notch (hereinafter, represented by a notch), for example, Japanese Patent Application Laid-Open Nos. 7-260432 and 8
The one proposed in, for example, US Pat. As shown in FIG. 14, for example, these notch position detecting devices A0 fix a wafer W on a turntable 101 in the vicinity of its center position and rotate it, and rotate the edge portion of the wafer W with a sensor 102 (for example, a light projecting portion 102a and a light receiving portion 102b
), And the notch position is detected by a change in the output signal. As a method of fixing the wafer W to the rotary table 101, for example, a method of vacuum-sucking the back surface of the wafer is used.

[0003]

However, in the notch position detecting device A0, since the back surface of the wafer is directly held, there is a problem that dirt and the like adhere to the back surface of the wafer and the yield decreases. Therefore, edge handling for holding the outer peripheral portion of the wafer when handling the wafer has been performed. As shown in FIG. 15, the edge handling apparatus includes four wafer holding units 112a to 112 on a stage 111.
d (112a and 112b are fixed, and 112c and 112d are movable in the direction of the arrow in the drawing), and the wafer W is fixedly held only at the outer peripheral portion thereof. However, if the notch position detection is to be performed by the same method as the notch position detection device A0 using the above-described edge handling device, the entire edge handling device including the moving mechanism of the wafer holding units 112c and 112d, etc. It is necessary to rotate the device, and there is a problem that the whole device becomes large. In addition, since the wafer must be firmly fixed to some extent so as not to wobble during rotation, there is a possibility that a large force acts on the outer peripheral portion of the wafer from the wafer holding portion to damage the outer peripheral portion of the wafer. As described above, there are still many problems to be solved before the notch position detecting device using the edge handling device is put to practical use.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a notch and an orientation flat without damaging a wafer by a simple device configuration using an edge handling device that holds an outer peripheral portion of the wafer. It is an object of the present invention to provide a wafer notch position detecting device capable of detecting the position of a notch such as the above, and a wafer characteristic measuring device using the same.

[0004]

In order to achieve the above object, a first aspect of the present invention is to detect a position of a notch formed on an outer peripheral portion of a wafer while holding the wafer at the outer peripheral portion. In the wafer notch position detecting device, a sensor for detecting an outer peripheral shape of the wafer, a sensor moving means for moving the sensor along the outer circumference of the wafer, and a position of the sensor moved by the sensor moving means are detected. A sensor position detecting means, and a notch position detecting means for detecting a position of the notch based on an output from the sensor and the sensor position obtained by the sensor position detecting means. The device is configured as a wafer notch position detecting device. As the sensor moving means, for example, a rotation mechanism having a rotation center coaxial with the center of the wafer can be provided. In this case, the sensor position detecting means may detect the angular position of the sensor moved by the sensor moving means around the rotation center. Further, the sensor moving means further comprises a mechanism for moving the position of the sensor in a radial direction of the wafer, wherein the notch position detecting means detects an output from the sensor at a plurality of radial positions and the sensor respectively. If the position of the notch is detected based on the sensor position obtained by the position detecting means, the position detection accuracy of the notch is further improved. Further, as the sensor, for example, a reflection type optical sensor that detects reflected light of light irradiated on the wafer, or a line sensor that captures an image of an outer peripheral portion of the wafer can be used.

Further, in order to prevent dust generated by the moving mechanism of the sensor moving means from adhering to the wafer, for example, a sealing process is performed on the moving mechanism of the sensor moving means, or the moving mechanism of the sensor moving means is moved. It is desirable to provide a dust adhesion preventing means such as providing a shielding plate between the wafer and the wafer. A second invention utilizes the first invention, and detects a position of a notch formed on an outer peripheral portion of the wafer while holding the wafer at the outer peripheral portion, and detects the position of the notch. A wafer characteristic measuring device for measuring a characteristic at a predetermined position on the wafer obtained based on a position of the notch by a measuring means for measuring a characteristic of the wafer; Moving the sensor along the outer periphery of the wafer, sensor position detecting means for detecting the position of the sensor moved by the sensor moving means, output from the sensor, and sensor position detecting means. A notch position detecting means for detecting the position of the notch based on the sensor position, and a position obtained by the notch position detecting means. Measuring position calculating means for calculating the predetermined position on the wafer based on the position of the notch, and moving the wafer or the measuring means held at the outer periphery to calculate the predetermined position on the wafer; And a wafer positioning means for positioning the above predetermined position to the measuring section of the measuring means.

[0006]

In the wafer notch position detecting device according to the first invention, the sensor is moved along the outer periphery of the wafer by the sensor moving means while the wafer is held at the outer periphery thereof, and the sensor is moved by the sensor. Is detected. Further, in parallel with the detection by the sensor, the position of the sensor is detected by the sensor position detecting means. Then, in the notch position detecting means, the position of the notch is detected based on the output from the sensor position detecting means when the sensor detects the notch, that is, the sensor position. in this way,
Since the notch position of the wafer can be detected while the edge handling is performed, the adhesion of dirt on the back surface of the wafer can be prevented, and the product is improved by improving reliability and quality, and production is improved by improving yield. Cost reduction can be achieved. In addition, since the sensor is rotated instead of rotating the edge handling device, cost, space, and transfer time to the stage can be reduced as compared with the conventional method. Further, in the wafer characteristic measuring device according to the second invention, based on the notch position measured by the wafer notch position detecting device according to the first invention, a measurement position calculating unit performs a measurement on the wafer by measuring position calculation means. The predetermined position, which is the characteristic measurement position, is calculated. Then, the predetermined position on the wafer calculated by the measurement position calculating means is measured by the measuring means by moving the wafer held at the outer periphery or the measuring means in parallel by the wafer positioning means. Is positioned in the part. As described above, since the wafer is positioned on the measurement unit without rotating the wafer, there is no need to provide a rotation mechanism for adjusting the direction of the wafer, and the cost and measurement time can be reduced.

[0007]

Embodiments and examples of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention. The following embodiments and examples are mere examples embodying the present invention, and do not limit the technical scope of the present invention. Here, FIG. 1 is a schematic diagram showing a schematic configuration of a wafer characteristic measuring apparatus A1 according to an embodiment of the present invention, and FIG. 2 is a holding section 11a (31a), 11b (31).
FIG. 3B is an explanatory view of the shape and the holding mechanism thereof, FIG. 3 is an explanatory view of the sensor unit 22 and its rotating mechanism, FIG. 4 is an explanatory view showing the installation position of the optical fiber bundle 22a of the sensor unit 22, and FIG. FIG. 6 shows an example of a sensor output distribution diagram in the section 22.
FIG. 7 is a view showing an example of setting a measurement position on the wafer W, FIG. 7 is a schematic view showing another example of the configuration of the rotation mechanism of the sensor unit 22,
FIG. 8 is a schematic diagram showing another configuration example of the rotation mechanism of the sensor unit 22, FIG. 9 is an explanatory diagram showing each movement locus when the sensor unit 22 is moved in the radial direction, and FIG. FIG. 11 is an explanatory diagram showing an example of a method of obtaining a final notch position from a plurality of notch positions obtained by detection by the method, and FIG. 11 is a schematic diagram showing a schematic configuration when a line sensor 51 is used as another configuration example of the sensor. FIG. 12 is a view showing an example of a picked-up image near the notch position by the line sensor 51. FIG. 13 shows a case where a disk 61 and an electrostatic removal device 62 as an example of dust adhesion preventing means are attached to the notch position detection device 2. It is a schematic diagram which shows the schematic structure of.

A wafer characteristic measuring apparatus A1 according to the present embodiment embodies the wafer characteristic measuring apparatus according to the second invention (including the wafer notch position detecting apparatus according to the first invention). As shown in FIG. 1, a holding stage 1 for holding a wafer W, and a notch position detecting device 2 provided above the wafer W held by the holding stage 1 (a wafer notch portion according to the first invention). An example of a position detecting device) and an XY stage 3 for moving the holding stage 1 (an example of a wafer positioning unit)
And a characteristic measuring device 4 (an example of a measuring unit) for measuring characteristics of the wafer W on the holding stage 1 moved by the XY stage 3, and mounting and removing the wafer W on the holding stage 1. And a control device 6 (an example of a measurement position calculating unit) for controlling the entire system. It is assumed that a notch is formed in the wafer W to be processed in the present embodiment as an example of a notch. On the holding stage 1, similarly to the edge handling device shown in FIG.
The four holding parts 11a, 11a, 11b, 11b (11a
Is fixed, and 11b is movable in the direction of the arrow).
As shown in FIG.
2a and a projection 12b.
b, the wafer W (FIG. 2A) mounted on the inclined portion 12a is
And fixed only at the outer periphery (Fig. 2
(B)). In the holding stage 1, the diameter of the wafer W can be calculated by measuring the amount of movement of the holding section 11b. The wafer W fixed on the holding stage 1 is transferred by the transfer robot 5. On the arm 5a of the transfer robot 5, four holding parts 31a, 31a, 31 substantially similar to those provided on the holding stage 1 are provided.
b, 31b (31a is fixed, 31b is movable). The method of holding the wafer W by the holding unit is exactly the same as that of the holding stage 1. However, the arm 5
After the wafer W on the holding stage 1 is transferred onto the holding stage 1, the arm 5a is pulled out from under the wafer W. It is set sufficiently smaller than the height. The transfer robot 5 is provided with the holding stage 1
Removal of the wafer W from above is performed similarly. The notch position detecting device 2 includes a rotating arm 21 having a rotation center coaxial with the center of the wafer W fixed on the holding stage 1, and a sensor unit 2 mounted near the tip of the rotating arm 21.
2 (an example of a sensor), a driving unit 23 (an example of a sensor moving unit) that rotationally drives the rotary arm 21, and outputs a pulse according to the rotation of the rotary arm 12 that is rotationally driven by the driving unit 23. A notch position on the outer peripheral portion of the wafer W is calculated based on an encoder (an example of a sensor position detecting unit) not shown, an arm 24 holding the driving unit 23, and outputs from the sensor unit 22 and the encoder. And a notch position calculating unit 25 (an example of a notch position detecting unit). The sensor section 22 includes an optical fiber bundle 22a as shown in FIG. 3A. The optical fiber bundle 22a passes between the outer periphery of the wafer W and the bottom of the notch N. Position (see FIG. 4). The sensor unit 22
Is a wafer W of light emitted from the optical fiber bundle 22a.
This is a reflection-type laser sensor that receives light reflected on the surface of the optical fiber by the optical fiber bundle 22a (see FIG. 3B) and outputs a value corresponding to the intensity of the received light. That is, when the optical fiber bundle 22a is on the wafer W, the output of the sensor unit 22 is ON, and while the optical fiber bundle 22a is passing through the notch N, the output of the sensor unit 22 is OFF. Therefore, it can be determined that the portion where the output of the sensor unit 22 is OFF is the notch position (FIG. 5).
reference). In the notch position calculating section 25, the driving section 2
While the sensor unit 22 is being rotated by 3, the rotation angle is calculated based on the count number of the output pulse from the encoder, and the output from the sensor unit 22 is turned off.
The rotation angle (actually, the intermediate value of the angle range while the switch is OFF, see the inside of the circle in FIG. 5) is output as the value indicating the notch position. Note that it is desirable that the notch position detecting device 2 as a whole and at least the driving unit 23 be subjected to a sealing process so that dust does not come out and contaminate the wafer W.

Here, the notch position detecting device 2 is an example in which the wafer notch position detecting device according to the first invention is embodied. The notch position (angle) detected by the notch position detection device 2 is sent to the control device 6, where the coordinate value of a predetermined measurement position on the wafer W is calculated. The measurement position is a position on the wafer W for measuring a predetermined characteristic by the characteristic measuring device 4,
As shown in FIG. 6, the coordinates are set in advance as relative coordinates (referred to as basic patterns) with respect to the notch positions. Therefore,
The actual coordinate value (absolute coordinate value) of the measurement position can be obtained by performing coordinate conversion of the measurement coordinate on the basic pattern with the angle of the notch position. For example, the center coordinate of the wafer W is defined as the origin (0, 0), the case where the notch is on the Y axis is defined as the basic pattern, and a certain measured coordinate value on the basic pattern is (X
1, Y1). Notch position detecting device 2
If it is determined that there is a notch at a position rotated by θ degrees counterclockwise with respect to the basic pattern, (X1, Y
The actual measurement position (X2, Y2) in 1) is obtained by the following equation.

(Equation 1) If there are a plurality of measurement positions (9 points in FIG. 6), actual coordinate values are calculated for each measurement position. When the actual coordinate values are obtained for all the measurement points, the control device 6 operates the XY stage 3 to sequentially transfer the measurement positions on the wafer W to the measurement unit 4a of the characteristic measurement device 4. Position. The XY stage 3 is composed of two stages 3a and 3b orthogonal to each other.
It is composed of The stage 3a slidably supports the holding stage 1 and the stage 3b slidably supports the stage 3a. By appropriately operating both, the wafer W on the holding stage 1 is moved two-dimensionally. Is possible. The above characteristic measuring device 4
Then, the characteristics of the wafer W are measured at each of the positioned measurement positions. In the present embodiment, although the resistivity of the wafer is assumed as the above characteristic, p / n
Of course, it is also possible to measure other characteristic values such as judgment, film thickness, wafer thickness, and minority carrier lifetime. Subsequently, a notch position detection and a characteristic measurement processing flow by the wafer characteristic measuring device A1 will be briefly summarized. still,
All operations are controlled by the control device 6.

First, the wafer W is transferred by the transfer robot 5.
Is transferred onto the holding stage 1. The transferred wafer W is fixed by the protrusions 12b of the holding parts by moving the holding parts 11b in the direction of the holding parts 11a. When the wafer W is fixed on the holding stage 1, the driving unit 23 starts operating, whereby the sensor unit 22 is moved along the outer periphery of the wafer W, and the encoder of the driving unit 23 operates. Is done. Outputs from the sensor unit 22 and the encoder are sequentially sent to a notch position calculation unit 25. The notch position calculation unit 25 calculates the rotation angle based on the count number of the output pulse from the encoder, and determines the notch position as an intermediate value of the angle range while the output from the sensor unit 22 is OFF. It is output to the control device 6 as the indicated value. The control device 6
Here, the coordinate value of a predetermined measurement position on the wafer W is calculated by the above-described method. By operating the XY stage 3, the measurement positions on the wafer W are sequentially positioned on the measurement unit 4 a of the characteristic measurement device 4. The characteristic measuring device 4 sequentially measures the characteristics of the wafer W, for example, the wafer resistivity, at each of the positioned measurement positions. When the characteristic measurement at all the measurement positions is completed, the holding stage 1 is moved again to the notch position detection position by the XY stage 3, where the measured wafer W is removed by the transfer robot 3, and a new wafer is removed. W is placed on the holding stage 1. As described above, in the wafer characteristic measuring apparatus A1 according to the present embodiment, the notch position of the wafer W can be detected by the notch position detecting apparatus 2 while the edge handling is performed. Adhesion can be prevented, so that high reliability and high quality can improve the merchantability, and the yield can reduce the production cost. In addition, the mechanism that rotates the sensor unit instead of rotating the edge handling device makes it possible to reduce costs and costs compared to the conventional method.
It is possible to reduce the space and the transfer time to the stage. In addition, since the actual coordinate value of each measurement position is calculated based on the notch position obtained by the notch position detection device 2 and the wafer W is positioned on the characteristic measurement device 4 without rotating, the characteristic measurement device There is no need to provide a rotating mechanism for adjusting the orientation of the wafer, so that cost and measurement time can be reduced.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the notch position detecting device 2, as a means for moving the sensor section 22 along the outer periphery of the wafer W, a driving section 23 is provided coaxially with the center of the wafer W.
However, the present invention is not limited to this. For example, as shown in FIG. 7, the sensor unit 22 is attached to a donut-shaped rotating frame 40 having a rotation center coaxial with the center of the wafer W, and the driving unit 41 rotates the rotating frame 40 to mount the sensor unit 22. You may make it move along the outer periphery of the wafer W. Further, as shown in FIG. 8, the sensor unit 22 may be attached to the articulated arm 42 to move the sensor unit 22 along the outer periphery of the wafer W. In addition, the notch position detecting device 2
A mechanism for moving the position of the sensor unit 22 in the radial direction of the wafer W is provided, and sensing is performed by the sensor unit 22 at a plurality of radial positions as shown in FIG. If the final notch position is determined by performing statistical processing such as
0), and more accurate notch position detection becomes possible.
Of course, even if the detection is performed a plurality of times at the same rotational radius without changing the radial position, and the average of the detected values is taken, the improvement of the accuracy can be expected. Further, as the sensor unit, a line sensor that captures an image of the outer peripheral portion of the wafer W may be used instead of the laser sensor 22 described above. As shown in FIG. 11, the line sensor 51 receives the reflected light emitted from the light source 52 and reflected by the wafer W, and forms an image. The image near the notch position captured by the line sensor 51 is, for example, as shown in FIG. That is, since the surface of the wafer W is picked up brightly and the other portions are picked up dark, the ratio of the light and dark portions changes only in the notch portion. Therefore, the notch position can be detected by obtaining the center position of the notch opening from the binarized image of the above image. In this case, by increasing the number of pixels of the line sensor and the number of steps in the rotation direction of the sensor, the resolution of the image is improved, and the detection accuracy of the notch position is improved. In the notch position detecting device 2, a disk 61 (an example of a shielding plate) having a larger diameter than the wafer W is used instead of the rotary arm 21 for connecting the driving unit 23 and the sensor unit 22 as shown in FIG. It can also be used. Accordingly, it is possible to prevent dust coming out of the vicinity of the driving unit 23 from falling onto the wafer W. Furthermore, if the static electricity removing device 62 for removing static electricity from the disk 61 is provided, dust can be prevented from adhering to the disk 61, and the effect of preventing foreign matter from adhering to the wafer W can be further enhanced. Also,
In the above embodiment, the holding stage 1 is replaced with the XY stage 3
However, the moving mechanism is not limited to the XY stage. Instead of moving the holding stage 1 to position the wafer W with respect to the property measuring device 4, the property measuring device 4 may be moved toward the holding stage 1. In the above example, a description has been given of a wafer in which a notch is formed, but the present invention can be similarly applied to a wafer in which an orientation flat is formed.

[0012]

As described above, the first aspect of the present invention is a wafer notch position detecting method for detecting a position of a notch formed on an outer peripheral portion of a wafer while holding the wafer at its outer peripheral portion. In the apparatus, a sensor for detecting an outer peripheral shape of the wafer, a sensor moving means for moving the sensor along the outer circumference of the wafer, and a sensor position detecting means for detecting a position of the sensor moved by the sensor moving means And a notch position detecting means for detecting the position of the notch based on the output from the sensor and the sensor position obtained by the sensor position detecting means. Since the device is configured as a notch position detecting device, the notch position of the wafer can be detected while edge handling is performed. As a result, it is possible to prevent the adhesion of dirt on the back surface of the wafer, and to improve the marketability by improving the reliability and quality, and to reduce the production cost by improving the yield. In addition, since the sensor is rotated instead of rotating the edge handling device, cost, space, and transfer time to the stage can be reduced as compared with the conventional method. The sensor moving means further includes a mechanism for moving the position of the sensor in a radial direction of the wafer, wherein the notch position detecting means detects an output from the sensor at a plurality of radial positions,
If the position of the notch is detected based on the sensor position obtained by the sensor position detecting means, the position detection accuracy of the notch is further improved.

Further, for example, a seal treatment is performed on the moving mechanism of the sensor moving means, or a dust adhesion preventing means such as providing a shielding plate between the moving mechanism of the sensor moving means and the wafer is provided. The dust generated by the moving mechanism of the sensor moving means can be prevented from adhering to the wafer. The second invention is
The present invention utilizes the first invention, and detects a position of a notch formed on an outer peripheral portion of the wafer while holding the wafer at the outer peripheral portion, and obtains a position based on the position of the notch. In a wafer characteristic measuring device for measuring the characteristic at a predetermined position on the wafer by measuring means for measuring the characteristic of the wafer, a sensor for detecting an outer peripheral shape of the wafer and a sensor are arranged along the outer periphery of the wafer. A sensor moving means for moving, a sensor position detecting means for detecting a position of the sensor moved by the sensor moving means, an output from the sensor, and the sensor position obtained by the sensor position detecting means. A notch position detecting means for detecting the position of the notch, and a position of the notch obtained by the notch position detecting means. A measuring position calculating means for calculating the predetermined position on the wafer, and moving the wafer or the measuring means held at the outer peripheral portion to calculate the predetermined position on the wafer calculated by the measuring position calculating means. Since it is configured as a wafer characteristic measuring device characterized by comprising a wafer positioning means for positioning the measuring part of the measuring means, there is no need to provide a rotating mechanism for adjusting the orientation of the wafer, Cost and measurement time can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a schematic configuration of a wafer characteristic measuring device A1 according to an embodiment of the present invention.

FIG. 2 shows holding units 11a (31a) and 11b (31b).
FIG. 4 is an explanatory view of the shape of the device and its holding mechanism.

FIG. 3 is an explanatory diagram of a sensor unit 22 and a rotation mechanism thereof.

FIG. 4 is an explanatory diagram showing an installation position of an optical fiber bundle 22a of the sensor unit 22.

FIG. 5 is an example of a sensor output distribution diagram in the sensor section 22;

FIG. 6 is a diagram showing an example of setting a measurement position on a wafer W.

FIG. 7 is a schematic diagram showing another configuration example of the rotation mechanism of the sensor unit 22.

FIG. 8 is a schematic diagram showing another configuration example of the rotation mechanism of the sensor unit 22.

FIG. 9 is an explanatory diagram showing respective movement trajectories when the sensor unit 22 is moved in a radial direction.

FIG. 10 is an explanatory diagram showing an example of a method for obtaining a final notch position from a plurality of notch positions obtained by detection using a plurality of sensor radii.

FIG. 11 shows a line sensor 5 as another configuration example of the sensor.
FIG. 1 is a schematic diagram showing a schematic configuration in the case of using No. 1.

FIG. 12 is a diagram showing an example of a captured image near a notch position by the line sensor 51.

FIG. 13 is a schematic diagram showing a schematic configuration when a disc 61 and a static eliminator 62 as an example of dust adhesion preventing means are attached to the notch position detecting device 2.

FIG. 14 is a schematic diagram showing a schematic configuration of a notch position detecting device A0 according to a conventional technique.

FIG. 15 is a schematic diagram showing a schematic configuration of an edge handling device according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Holding stage 2 ... Notch position detection apparatus (an example of a wafer notch position detection apparatus) 3 ... XY stage (an example of a wafer positioning means) 4 ... Characteristic measurement apparatus (an example of a measurement means) 4a ... Measurement section 6 ... Control apparatus (Example of measurement position calculating means) 22 ... Sensor part (Example of sensor) 23 ... Drive part (Example of sensor moving means) 25 ... Notch position calculating part (Example of notch position detecting means) 61 ... Disc (of shielding plate) Example: W: Wafer N: Notch (Example of notch)

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor: Akishi Imanishi 1-5-5 Takatsukadai, Nishi-ku, Kobe City, Hyogo Prefecture Inside Kobe Research Institute, Kobe Steel Ltd. (72) Inventor: Tsutomu Morimoto Takatsuka, Nishi-ku, Kobe City, Hyogo Prefecture Kobe Steel Co., Ltd.Kobe Research Institute, Kobe Steel Ltd. (72) Inventor Hiroyuki Takamatsu 1-5-5 Takatsukadai, Nishi-ku, Kobe City, Hyogo Prefecture Kobe Steel Co., Ltd.Kobe Research Institute (72) Inventor Yuji Yamamoto 1-5-5 Takatsukadai, Nishi-ku, Kobe-shi, Hyogo Prefecture Kobe Steel No. 5 Building Genesis Technology Co., Ltd. F-term (reference) 5F031 CC13 GG02 GG06 GG15 GG18 GG20 KK09 LL07

Claims (9)

[Claims] 1. A wafer notch position detecting device for detecting a position of a notch formed on an outer peripheral portion of a wafer while holding the wafer at an outer peripheral portion thereof.
A sensor for detecting an outer peripheral shape of the wafer, a sensor moving means for moving the sensor along the outer circumference of the wafer, a sensor position detecting means for detecting a position of the sensor moved by the sensor moving means, and the sensor Notch position detecting means for detecting the position of the notch based on the output from the sensor and the sensor position obtained by the sensor position detecting means. Detection device. 2. The apparatus according to claim 1, wherein said sensor moving means includes a rotation mechanism having a rotation center coaxial with the center of said wafer, and wherein said sensor position detecting means moves said rotation of said sensor moved by said sensor moving means. 2. The wafer notch position detecting device according to claim 1, wherein an angular position around the center is detected. 3. The sensor moving means further comprises a mechanism for moving a position of the sensor in a radial direction of the wafer, wherein the notch position detecting means outputs an output from the sensor at a plurality of radial positions, 3. The wafer notch position detecting device according to claim 2, wherein the position of the notch is detected based on each of the sensor positions obtained by the sensor position detecting means. 4. The wafer notch position detecting device according to claim 1, wherein said sensor is a reflection type optical sensor for detecting reflected light of light irradiated on said wafer. 5. The wafer notch position detecting device according to claim 1, wherein the sensor is a line sensor that captures an image of an outer peripheral portion of the wafer. 6. The wafer notch position detection according to claim 1, further comprising dust adhesion preventing means for preventing dust generated by a moving mechanism of said sensor moving means from adhering to said wafer. apparatus. 7. The wafer notch position detecting device according to claim 6, wherein said dust adhesion preventing means is a sealing process performed on a moving mechanism of said sensor moving means. 8. The wafer notch position detecting device according to claim 6, wherein said dust adhesion preventing means is a shielding plate provided between a moving mechanism of said sensor moving means and said wafer. 9. A position of a notch formed on an outer peripheral portion of the wafer while holding the wafer at the outer peripheral portion thereof, and a predetermined position on the wafer obtained based on the position of the notch portion. A sensor for detecting the outer shape of the wafer, a sensor moving means for moving the sensor along the outer circumference of the wafer, and a sensor for measuring the characteristics of the wafer by measuring means for measuring the characteristics of the wafer; The position of the notch is determined based on a sensor position detecting means for detecting a position of the sensor moved by the sensor moving means, an output from the sensor, and the sensor position obtained by the sensor position detecting means. Based on the notch position detecting means to be detected and the notch position obtained by the notch position detecting means,
Measuring position calculating means for calculating the predetermined position on the wafer; and moving the wafer or the measuring means held at the outer peripheral portion to calculate the predetermined position on the wafer calculated by the measuring position calculating means. A wafer characteristic measuring device, comprising: a wafer positioning means for positioning the measuring part of the measuring means.