JP2000068307A - Jig for opening lsi - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the degeneration of lead surfaces and the deformation of leads by adhering a protection sheet to the opening of a cover that is adhered to a case body, and by hermetically sealing a portion other than the opening portion of an LSI package with the protection sheet. SOLUTION: The peripheral edge portion of a protection sheet 1 having an aperture 1a whose size is adjusted to the opening portion of an LSI package 8 is adhered to a cover 2, and the peripheral edge of the aperture 1a is adhered to the front surface of the package 8. Next, such a spacer 7 as to make the sum of the thickness of the package 8 and that of the spacer 7 almost equal to the dimension from the front surface of the cover 2 to the inner bottom surface of an LSI accommodating chamber 4a of a case body 4 is selected, and the selected spacer 7 is mounted on the inner bottom surface of the chamber 4a. Then the package 8 and the cover 2 with the sheet 1 are mounted on a packing 3 on the body 4. As a result, leads are no longer damaged by an opening agent and a cleaning agent, and the degeneration and deformation of the surfaces of the leads can be prevented, and hence sufficient electrical contact can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for unpacking an LSI package, for example, for unpacking a resin of the LSI package and taking out a semiconductor chip in order to analyze a cause of a malfunction of the LSI package.

[0002]

2. Description of the Related Art As a method of opening an LSI package, there is a technique described in Japanese Patent Application Laid-Open No. 58-15258.

In this technique, as shown in FIG. 5, an opening 1 having a size to expose only an unsealed portion of an LSI package is provided.
The LSI package 8 is covered with an opening protection cover 13 having an opening 4, and an opening agent is dropped from the upper surface to open the LSI package 8 without dissolving the lead wires 8a.

FIG. 6 is a view showing another conventional example of a method for opening an LSI package. In place of the above-described opening protection cover 13 for covering the LSI package 8, a mechanism for ejecting an opening agent is the same as the opening protection cover 13. An effect is added, and an opening area adjusting packing 12 is provided on an upper portion of a container 11 accommodating the medicine spraying mechanism 10.

[0005] On this opening area adjustment packing 12,
The LSI package 8 whose resin sealing is to be opened is placed and pressed against the packing 12 with the pressure bar 9 to seal the unopened portion of the LSI package 8.

[0006] Then, an opening agent for dissolving the resin is sprayed from the chemical spraying mechanism 10 toward the LSI package 8, and the opening agent after dissolving the resin in the opening portion flows along the arrow and is collected.

In the opening method shown in FIGS. 5 and 6, when the opening amount reaches a target, the opening is terminated, and the LSI package 8 is immersed in a cleaning solution such as a surfactant to increase the opening amount due to the chemical. stop.

[0008]

However, in the above-mentioned prior art, the following problems remain.

That is, the prior art shown in FIG. 5 requires a protective cover in accordance with the size of the unsealed portion and the type of the LSI package 8, and has a problem that various types of protective covers must be prepared. Was.

On the other hand, the prior art shown in FIG. 6 solves the problem of facilitating various types of protective covers, but the lead wire of the LSI package 8 is exposed to the vapor of the opening agent at the end of opening, and There was a problem that the surface of the wire deteriorated.

Then, in order to stop the progress of the opening, LS
When the I package 8 is immersed in a cleaning agent such as a surfactant, crystals of the cleaning liquid adhere to the lead wire surface, and after opening, the LSI is opened.
When mounting the package 8 on a substrate or the like, there is a problem that sufficient electrical contact cannot be obtained.

Further, there is a problem that the lead wire is deformed because a force is applied to the lead wire when the crystal is scraped to remove the adhered chemical.

In view of the above, the present invention has been made in view of the problems in the above-described conventional LSI opening jig, and it is not necessary to prepare various types of protective covers, and the surface of the lead wire may be deteriorated. An object of the present invention is to provide an LSI opening jig that does not deform a lead wire and that can obtain sufficient electrical contact even when an LSI package is mounted on a substrate or the like after opening.

[0014]

According to the first aspect of the present invention,
An LSI opening jig, comprising: a case main body having an LSI accommodating chamber having an opening; and an opening at a central portion, and when mounted on the case main body, a peripheral edge of the opening and the case. A cover in which the periphery of the opening of the main body is in close contact, and one surface is placed on the inner bottom surface of the LSI housing chamber;
A spacer for mounting the LSI package on the other surface, and a hole having the same size as the size of the unsealing portion of the LSI package provided in the center, and a protection closely attached to the surface of the LSI package and the periphery of the cover. And a seat.

According to a second aspect of the present invention, there is further provided a packing for sealing a gap between the peripheral portion of the opening of the case main body and the peripheral portion of the opening of the cover, and the case main body and the cover. And a clamp mechanism for clamping the pressure.

According to a third aspect of the present invention, the cover and the protection sheet are formed of a material having corrosion resistance to an opening agent of the LSI package.

According to a fourth aspect of the present invention, the surface of the cover mounted on the case main body is formed by an opening on the upper surface of the LSI.
It is a mounting surface to be mounted on a container provided with a chemical ejection mechanism for ejecting a package opening agent.

According to the first aspect of the present invention, the protective sheet is in close contact with the opening of the cover which is in close contact with the case body.
The LSI package in the LSI accommodating chamber is hermetically sealed by the LSI opening jig because the protective sheet seals the portion other than the opening portion of the LSI package, so that the lead wire is not affected by the opening agent or the cleaning agent. Of the surface and deformation of the lead wire can be prevented, and sufficient electrical contact can be obtained.

Further, since the above-mentioned LSI opening jig can be used for various LSI packages simply by replacing the protective sheet and the spacer, it is not necessary to prepare various kinds of protective covers.

According to the second aspect of the present invention, there is further provided a packing for sealing between the periphery of the opening of the case body and the periphery of the opening of the cover, and a clamp for clamping the case body and the cover. The provision of the mechanism makes it possible to easily seal the overlapping surface of the peripheral portion of the opening of the case body and the cover.

According to the third aspect of the present invention, since the cover and the protection sheet are formed of a material having corrosion resistance to the opening agent of the LSI package, the jig for opening the LSI has durability. And the life of the jig is extended.

According to a fourth aspect of the present invention, there is provided a mounting method wherein the surface of the cover mounted on the case main body is mounted on a container provided with a chemical ejection mechanism for ejecting an opening agent for an LSI package from an opening on the upper surface. Even if it is used by placing it on a chemical ejecting device that ejects the opening agent of the LSI package from the opening on the top surface with the surface of the cover facing downward, it is not affected by the vapor of the opening agent. In addition, deterioration of the surface of the lead wire can be prevented.

[0023]

Next, a specific example of an embodiment of an LSI opening jig according to the present invention will be described with reference to the drawings.

FIG. 1 is a view showing an embodiment of an LSI opening jig according to the present invention. This LSI opening jig comprises a protective sheet 1, a cover 2, a packing 3, a case body, and the like. The case main body 4 is provided with a clamp mechanism including a fixing hook 5 and a spring 6.

The protective sheet 1 is preferably formed of aluminum tape or the like in order to impart corrosion resistance to agents such as an opening agent and a cleaning agent. A hole 1a having the same size as that of the unsealing portion of the LSI package 8 is formed in the center of the protection sheet 1. Protective sheet 1
An adhesive is applied to one surface of the substrate to make it adhere to the cover 2 and the LSI package 8.

The cover 2 is a frame for holding the protective sheet 1. An opening is provided in the center, and when the peripheral edge of the opening overlaps with the peripheral edge 4c of the opening 4b of the case body 4, the hook claw is provided. 5a can be disengaged.

The cover 2 to which the protective sheet 1 is adhered and the case body 4 cover and protect the LSI package 8 from chemicals. For long-term use, it is preferable that the cover 2 be made of a hard material which does not cause aging distortion. It is. Further, since the cover 2 has many chances to come into contact with the medicine, and the medicine may adhere to the case body 4, the cover 2 must be made of a material that is strong against erosion of the medicine. For this reason, the cover 2 and the case main body 4 are made of a material that is hard and resistant to erosion of a chemical, such as a glass material.

The case main body 4 is provided with an LSI accommodating chamber 4a which is opened at the center of the overlapping surface with the cover 2.
The depth and width of the accommodation room 4a are formed to be large enough to accommodate the LSI package 8 of any size.

A fixing hook 5 having a hook claw 5a at the tip is rotatably mounted at four locations around the outer periphery of the case body 4, and a direction in which the tip of the fixing hook 5 stands up by a spring 6. It is urged to.

The packing 3 is used to increase the degree of sealing of the overlapping surface between the cover 2 and the case body 4.
Rubber or the like is used as an elastic material.

The spacer 7 is a mounting table for adjusting the surface of the LSI package 8 of various sizes to substantially the same height as the surface of the cover 2, and uses rubber or the like as the packing 3.

Next, an opening method using the LSI opening jig having the above configuration will be described.

The peripheral edge of the protective sheet 1 having the hole 1a having the size of the opening portion of the LSI package 8 is adhered to the cover 2, and the peripheral edge of the hole 1a is adhered to the surface of the LSI package 8.

Next, a spacer 7 is set such that the sum of the thickness of the LSI package 8 and the thickness of the spacer 7 is substantially equal to the dimension from the surface of the cover 2 to the inner bottom surface of the LSI housing chamber 4a of the case body 4. Select and place it on the inner bottom surface of the LSI accommodation room 4a.

Then, the LSI package 8 and the cover 2 with the protection sheet 1 are placed on the packing 3 on the case body 4. Then, the fixing hook 5 pressed by the cover 2 is once opened outward, but when the cover 2 is pressed by a predetermined amount, the hook claws 5a engage with the cover 2 and the cover 2 is fixed to the case main body 4. As shown in FIGS. 2 and 3, the LSI package 8 is completely sealed except for the unsealing portion.

FIG. 4 is a longitudinal sectional view for explaining a method of opening the LSI package 8 by the container 11 having the medicine spraying mechanism 10 built therein.
When the opening jig is placed on the container 11, the LSI package 8 is completely sealed from the medicine except for the opening place.
Even when the package is opened with a chemical and then a cleaning agent is used, the lead wire does not corrode or the crystal of the cleaning agent adheres.

[0037]

As described above, according to the first aspect of the present invention, the LSI package in the LSI accommodation room is LS
I It is sealed by the opening jig, and the lead wire is not affected by the opening agent or the cleaning agent, and the deterioration of the surface of the lead wire and the deformation of the lead wire can be prevented, and sufficient electric contact can be obtained. A simple LSI opening jig can be provided.

Further, since this LSI opening jig can be used for various LSI packages simply by replacing the protective sheet and the spacer, it is not necessary to prepare various kinds of protective covers.

According to the second aspect of the present invention, it is possible to provide an LSI opening jig capable of easily sealing the overlapping surface of the peripheral portion of the opening of the case body and the cover.

According to the third aspect of the present invention, the LSI opening jig can be made durable and has a long life.
An opening jig can be provided. . According to the fourth aspect of the present invention, even when the cover is used with the surface of the cover facing downward and placed on a chemical ejecting apparatus for ejecting the opening agent of the LSI package from the opening on the upper surface, it is affected by the vapor of the opening agent. Thus, it is possible to provide an LSI opening jig capable of preventing deterioration of the surface of the lead wire without causing the deterioration.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an LSI opening jig according to the present invention.

FIG. 2 is a perspective view showing an assembled state of the LSI opening jig of FIG. 1;

FIG. 3 is a sectional view taken along line XX of FIG. 2;

FIG. 4 is a longitudinal sectional view for explaining an example of an opening operation using an LSI opening jig according to the present invention.

FIG. 5 is a cross-sectional view showing an example of a conventional LSI package opening method.

FIG. 6 is a cross-sectional view showing another example of a conventional LSI package opening method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Protective sheet 1a Hole 2 Cover 3 Packing 4 Case main body 4a LSI accommodation room 4b Opening 4c Peripheral edge 5 Fixing hook 5a Hook claw 6 Spring 7 Spacer 8 LSI package 10 Drug spraying mechanism 11 Container 12 Sealing for opening area adjustment

Claims (4)

[Claims] 1. A case body having an LSI housing chamber having an opening, an opening in a central portion, and when mounted on the case body, a peripheral edge of the opening and the opening of the case body. A cover closely contacting the periphery of the portion; a spacer having one surface mounted on the inner bottom surface of the LSI housing chamber and mounting the LSI package on the other surface; and a central portion having an opening portion of the LSI package. An LSI opening jig comprising a protective sheet provided with a hole having the same dimension as the dimension, and comprising a surface of the LSI package and a peripheral portion of the cover. 2. A packing for hermetically sealing between the peripheral edge of the opening of the case main body and the peripheral edge of the opening of the cover, and a clamp mechanism for clamping the case main body and the cover. The LSI opening jig according to claim 1, further comprising: 3. The device according to claim 1, wherein the cover and the protection sheet are formed of a material having corrosion resistance to an opening agent of the LSI package.
The described jig for opening LSI. 4. A surface of the cover mounted on the case body serves as a mounting surface mounted on a container provided with a chemical ejection mechanism for ejecting an opening agent of an LSI package from an opening on an upper surface. 4. The LSI opening jig according to claim 1, wherein: