JP2000066065A - Optical connector and mounting method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical connector easily mountable onto a printed wiring board, and also surface-mountable. SOLUTION: Attaching parts 10 are formed on both sides of an optical connector 1 housing 2. These housing 2 and attaching parts 10 are formed of a conductive resin, and electrodes 11 are embedded in the attaching parts 10. The electrodes 11 are structured so as to be directly soldered to a wiring pattern 50 formed on the attached plane Pa of the printed wiring board P.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical connector for optically coupling an optical fiber and a photoelectric device, and more particularly to an optical connector having a shielding performance and a method of mounting the same.

[0002]

2. Description of the Related Art As this type of optical connector, a housing for covering a photoelectric element such as a light emitting element and a light receiving element is formed of a conductive resin, and the housing is connected to a wiring pattern of a printed wiring board on which the optical connector is mounted. There is a device which is grounded to ground to thereby protect the photoelectric device inside from external noise.

[0003] In this case, conventionally, for example, the actual open flat 7-
As disclosed in JP-A-8811, there is an apparatus in which a housing is fixed to a printed wiring board by screws, and grounding is performed via the screws.

[0004] For example, see Japanese Patent Application Laid-Open No. 57-177580.
As disclosed in Japanese Patent Application Laid-Open Publication No. H10-210, a pin is implanted in a housing, the pin is inserted into a through hole formed in a printed wiring board, and soldered to a grounding wiring pattern formed on the lower surface of the printed wiring board. Some have been made.

[0005]

However, in the former case, it is necessary to screw a screw into the screw hole on the housing side, and there is a problem that the screwing operation itself is troublesome.

In the case of the latter, since the pins implanted in the housing are soldered to the printed wiring board, there is a problem that they are not suitable for high-density component mounting.

That is, in order to mount components at a high density, it is required that an optical connector be surface mountable.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical connector which can be easily mounted on a member to be mounted and which can be surface-mounted, and a method of mounting the same. Aim.

[0009]

According to a first aspect of the present invention, there is provided an optical connector in which a photoelectric element can be housed and arranged, and at least a portion covering the photoelectric element is made of a conductive resin. An optical connector in which a mounting portion for grounding a portion formed of a conductive resin of the housing to the housing and fixing the housing is formed on the housing formed by the optical connector. An electrode portion for directly soldering to a predetermined grounding wiring pattern formed on the mounting surface side of the mounting member to which the connector is mounted is embedded.

According to a second aspect of the present invention, the mounting portion and the electrode portion may have a solder injection hole for supplying solder to a contact portion between the electrode portion and the wiring pattern.

Further, as set forth in claim 3, the electrode portion may be exposed to the outer periphery of the mounting portion.

According to a fourth aspect of the present invention, there is provided a method for mounting an optical connector, comprising: a housing in which a photoelectric element can be housed and arranged and at least a portion covering the photoelectric element is formed of a conductive resin; A mounting portion for grounding the portion formed by the resin and fixing the housing is formed, and a predetermined wiring pattern for grounding ground formed on the mounting surface side of the member to be mounted is formed on the mounting portion. An optical connector mounting method in which an electrode portion for direct soldering is embedded, wherein a step of applying paste solder on the wiring pattern in advance, and positioning the electrode portion with the wiring pattern,
Mounting the optical connector on the mounting surface of the mounting member, and heating the contact portion between the electrode portion and the wiring pattern to melt the paste solder therebetween and thereby form the electrode portion; Soldering the wiring pattern.

According to a fifth aspect of the present invention, there is provided the optical connector mounting method, wherein the photoelectric element can be accommodated and disposed inside the housing, and at least a portion covering the photoelectric element is formed of a conductive resin. A mounting portion for grounding the portion formed by the resin and fixing the housing is formed, and a predetermined wiring pattern for grounding ground formed on the mounting surface side of the member to be mounted is formed on the mounting portion. An electrode portion for direct soldering is buried, and the electrode portion is exposed to the outer periphery of the mounting portion, and further, on the mounting portion and the electrode portion, at a contact portion between the electrode portion and the wiring pattern. A method for mounting an optical connector having a solder injection hole for supplying paste solder, wherein the electrode portion is aligned with the wiring pattern. Placing the optical connector on the mounting surface of the mounting member, injecting paste solder into the solder injection hole, and supplying paste solder to a contact portion between the electrode portion and the wiring pattern. The process of
A step of contacting heating means with a portion of the electrode portion exposed around the mounting portion to melt the supplied paste solder and solder the electrode portion and the wiring pattern.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical connector according to an embodiment of the present invention will be described below.

This optical connector 1 has, as shown in FIG.
It is configured to be attached to a printed wiring board P as a member to be attached.

As shown in FIGS. 1 to 4, the optical connector 1 has a housing 2 in which photoelectric elements such as a light emitting element and a light receiving element are housed, and projects outward on both side surfaces of the housing 2. The housing 2 and the mounting portion 10 are both formed of a conductive resin.

The housing 2 is a housing in which a housing portion 3 for housing a photoelectric element is formed. The housing 2 has a front opening and a connection port 4 formed therein. This connection port 4 is
A mating connector (not shown) holding the optical fiber is configured to be insertable, and an engaging portion (not shown) formed on the mating connector at an upper portion and a lower portion of the connection port 4. Are formed with engagement holes 4a and 4b which can be engaged. Then, the mating connector is inserted into and connected to the connection port portion 4 and the engaging portion is engaged with the engaging holes 4a and 4b, whereby the photoelectric element housed and arranged in the housing 2 and the mating connector are connected. It is configured so that optical coupling with the optical fiber held by the optical fiber is performed.

As shown by a two-dot chain line in FIG. 3, a lead b of the photoelectric element housed and disposed inside the housing 2 is drawn out from the rear surface of the housing 2. Then, in a state where the optical connector 1 is attached to the printed wiring board P,
The leads b are directly soldered to a predetermined wiring pattern (not shown) formed on the mounting surface Pa, which is the upper surface of the printed wiring board P, by reflow soldering or the like, whereby predetermined wiring of the photoelectric element is performed. Configuration.

Each of the mounting portions 10 is a thick plate-like member formed so as to protrude outward from the lower rear of both side surfaces of the housing 2, and the lower surface thereof is flush with the lower surface of the housing 2. Is formed continuously.

Each mounting portion 10 has an electrode portion 11 for directly soldering to a predetermined grounding wiring pattern 50 formed on the mounting surface Pa side of the printed wiring board P on which the optical connector 1 is mounted. Are respectively buried.

Each of the electrode portions 11 is a long plate-shaped metal member thinner than the mounting portion 10, and is buried in a lower portion of each of the mounting portions 10 from a substantially central portion in a plan view to a rear portion thereof. .

Each of the electrode portions 11 is buried in such a manner that the lower surface thereof is aligned with the lower surface of the mounting portion 10 and is exposed on the lower surface of the mounting portion 10. When mounted on the printed circuit board P, each of the electrode portions 11 is in surface contact with a predetermined wiring pattern 50 formed on the mounting surface Pa of the printed wiring board P.

The rear end of each electrode portion 11 projects rearward of each mounting portion 10, and the entirety of each electrode portion 11, particularly the lower surface portion, is heated through this exposed portion as described later. It is configured as follows.

Furthermore, each mounting portion 10 has a substantially central portion in plan view,
That is, a solder injection hole 10a penetrating vertically is formed in a portion where the mounting portion 10 and the electrode portion 11 are stacked and arranged. Then, in a state where the optical connector 1 is placed on the printed wiring board P, paste solder or the like is injected from above the solder injection hole 10a to form a predetermined wiring pattern that is in surface contact with the lower surface of the electrode portion 11. It is configured such that the paste solder or the like is supplied to a contact portion with the upper surface.

The optical connector 1 is configured as described above, and a method of attaching the optical connector 1 to the printed wiring board P will be described below.

First, as shown in FIGS. 1 and 4, the printed wiring board P is provided with a grounding ground at a mounting surface Pa, which is the upper surface thereof, at a position corresponding to each electrode portion 11 of the optical connector 1. Is formed beforehand.

A predetermined wiring pattern for directly soldering the lead b led out from the back of the optical connector 1 is also formed on the mounting surface Pa of the printed wiring board P (not shown). .

Then, as shown in FIG. 5 and FIG. 6, each electrode portion 11 of the optical connector 1 is aligned with the wiring pattern 50 on the printed wiring board P, and the optical connector 1 is placed on the printed wiring board P. Place on.

In this state, as shown in FIG. 7, the lower surface of each electrode portion 11 is in surface contact with the upper surface of the wiring pattern 50. As shown by an arrow A in FIG. A paste solder is injected into the inside of 10a from above.

Next, as shown by an arrow B in FIG. 8, a heated soldering iron or the like is brought into contact with the exposed portion of each electrode portion 11 protruding from the rear portion of each mounting portion 10. As a result, heat is transmitted through the inside of the electrode portion 11, and the lower surface of the electrode portion 11 and the inner surface of the electrode portion 11 of the solder injection hole 10a are heated, so that the paste solder Sa injected into the solder injection hole 10a is melted. . Thereafter, when the soldering iron 11 is removed from the electrode portion 11, the solder Sa flowing between the lower surface of the electrode portion 11 and the wiring pattern 50 is cooled and solidified, and soldering between the two is performed.

The lead b led out from the back surface of the optical connector 1 is directly soldered to a predetermined wiring pattern separately formed on the printed wiring board P by reflow soldering or the like.

According to the optical connector 1 configured as described above, the grounding portion formed on the mounting surface Pa side of the printed wiring board P on which the optical connector 1 is mounted is mounted on the mounting portion 10 formed on the housing 2. Since the electrode portion 11 for directly soldering to the predetermined wiring pattern 50 is embedded, the optical connector 1 can be surface-mounted on the printed wiring board P.

Then, only by soldering the electrode portion 11 and the wiring pattern 50, both the fixing of the optical connector 1 to the printed wiring board P and the grounding are performed.
The mounting operation can be easily performed as compared with a conventional configuration using screwing.

Further, since the mounting portion 10 and the electrode portion 11 are formed with a solder injection hole 10a for supplying solder to a contact portion between the electrode portion 10 and the wiring pattern 50, the electrode portion 10 can be reliably and easily formed. The solder Sa can be supplied between a contact portion between the wiring pattern 10 and the wiring pattern 50, that is, between the lower surface of the electrode portion 10 and the upper surface of the wiring pattern 50.
Soldering between them can be performed more reliably.

Furthermore, since the rear end of each electrode section 11 is projected to the rear of each mounting section 10, a soldering iron or the like may be brought into contact with the exposed portion of the rear end of each electrode section 11. Is used to reliably heat each of the electrode portions 11 so that the solder Sa
Can be melted, so that soldering between the electrode portion 10 and the wiring pattern 50 can be performed reliably and easily.

As described above, after the electrode portion 10 and the wiring pattern 11 have been soldered, as shown in FIG.
And soldering (solder S in FIG. 9)
b), the soldering between the two is more reliably performed, and the mounting of the optical connector 1 is strengthened.

The housing 2 is made of a conductive resin because the photoelectric element inside the housing 2 is electromagnetically shielded. Therefore, it is not always necessary to form the housing 2 entirely with the conductive resin. What is necessary is just to be formed with a conductive resin. Further, the outer peripheral side of the housing 2 may be covered by another insulating resin housing.

The optical connector 1 is connected to the printed wiring board P
When mounting the optical connector 1 on the printed wiring board P, paste solder is applied on the wiring pattern 50 of the printed wiring board P in advance, and the respective electrode portions 10 are aligned on the wiring patterns 50. The paste may be melted by mounting each of the electrode portions 11 and then heating the respective electrode portions 11 with a soldering iron or the like, and the respective electrode portions 11 and the respective wiring patterns 50 may be soldered.

In this case, it is not always necessary to form the solder injection hole 10a.

The optical connector according to the above embodiment was actually manufactured.

In this case, the shielding effect was as follows.

First, in a transceiver test of 144 MHz and 1.2 GHz (a test of whether or not the function of an optical transmitting / receiving element is not impaired by using an amateur radio transceiver in the latest), in the case of a conventional optical connector by screwing, The same shielding effect as was obtained.

Then, even when the electromagnetic wave resistance test is performed by the TEM cell test, from 10 MHz to 500 MHz,
The same shielding effect as that of the above-described conventional case was obtained.

When the minimum receiving sensitivity was measured, it was -28.5 to -32.0 dBm (the number of samples n = 20) in the conventional case, and -2 in the mounting structure of the present embodiment.
8.5 to -32.0 dBm (the number of samples n = 20), which proved to be the same minimum receiving sensitivity.

[0045]

As described above, according to the optical connector of the first aspect of the present invention, the earth formed on the mounting surface side of the member on which the optical connector is mounted is mounted on the mounting portion formed on the housing. Since the electrode portion for directly soldering to a predetermined grounding wiring pattern is embedded, the optical connector can be surface-mounted on a printed wiring board. Further, since the optical connector can be mounted on the member to be mounted by soldering the electrode portion to the wiring pattern of the printed wiring board, the mounting operation is easy.

Further, when a solder injection hole for supplying solder to a contact portion between the electrode portion and the wiring pattern is formed in the mounting portion and the electrode portion, the electrode portion and the wiring pattern can be formed. Since a sufficient amount of solder is supplied to the contact portions, soldering of both can be performed more easily and reliably.

Further, when the electrode portion is exposed to the outer periphery of the mounting portion, the entire electrode portion, particularly, the contact portion with the wiring pattern is heated through the exposed portion of the electrode portion. Therefore, the soldering can be performed more reliably and easily.

According to the optical connector mounting method of the fourth aspect of the present invention, the step of applying paste solder on the wiring pattern of the printed wiring board in advance and the step of aligning the electrode portion with the wiring pattern are performed. Placing the optical connector on the mounting surface of the member to be mounted, and heating the contact portion between the electrode portion and the wiring pattern to melt the paste solder therebetween, thereby forming the electrode portion and the wiring pattern. Since the method includes the step of soldering, the optical connector can be surface-mounted on a printed wiring board. Further, since the optical connector can be mounted on the member to be mounted by soldering the electrode portion to the wiring pattern of the printed wiring board, the mounting operation is easy.

Further, according to the method for mounting an optical connector according to the fifth aspect of the present invention, the step of mounting the optical connector on the mounting surface of the mounting member so that the electrode portion is aligned with the wiring pattern. Supplying the paste solder to the contact portion between the electrode portion and the wiring pattern by injecting the paste solder into the solder injection hole; and supplying the paste solder to a portion exposed around the mounting portion of the electrode portion by supplying heating means. Melting the paste solder and soldering the electrode portion and the wiring pattern, so that the optical connector can be surface-mounted on a printed wiring board.
Further, since the optical connector can be mounted on the member to be mounted by soldering the electrode portion to the wiring pattern of the printed wiring board, the mounting operation is easy.

[Brief description of the drawings]

FIG. 1 is a front view showing a state where an optical connector according to an embodiment of the present invention is mounted on a printed wiring board.

FIG. 2A is a plan view of an optical connector, and FIG.
FIG. 2C is a front view of the optical connector, FIG. 2C is a bottom view of the optical connector, and FIG. 2D is a side view of the optical connector.

FIG. 3 is a perspective view of the optical connector.

FIG. 4 is an exploded perspective view of the mounting structure of the optical connector.

FIG. 5 is a front view showing a step of attaching the optical connector to a printed wiring board.

FIG. 6 is a front view showing another step of attaching the optical connector to the printed wiring board.

FIG. 7 is an enlarged sectional view of a main part of a mounting portion in one mounting process of the optical connector.

FIG. 8 is an enlarged sectional view of a main part of a mounting portion in another mounting process of the optical connector.

FIG. 9 is an enlarged cross-sectional view of a main part of a mounting part in which a rear end side of an electrode part is also soldered.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical connector 2 Housing 10 Mounting part 10a Solder injection hole 50 Wiring pattern P Printed wiring board

Claims (5)

[Claims] 1. A housing in which a photoelectric element can be accommodated and arranged therein and at least a portion covering the photoelectric element is formed by a conductive resin. A portion formed by the conductive resin of the housing is grounded and grounded. An optical connector provided with a mounting portion for fixing a housing, wherein a predetermined wiring pattern for grounding ground formed on a mounting surface side of a mounting member to which the optical connector is mounted on the mounting portion. Optical connector with embedded electrodes for direct soldering to the 2. The optical connector according to claim 1, wherein the mounting portion and the electrode portion are formed with a solder injection hole for supplying paste solder to a contact portion between the electrode portion and the wiring pattern. 3. The optical connector according to claim 2, wherein said electrode portion is exposed to an outer periphery of said mounting portion. 4. A housing in which a photoelectric element can be accommodated and arranged therein and at least a portion covering the photoelectric element is formed of a conductive resin, and a portion formed of the conductive resin of the housing is grounded to ground. A mounting portion for fixing the housing was formed, and an electrode portion for directly soldering to a predetermined grounding wiring pattern formed on the mounting surface side of the mounted member was embedded in the mounting portion. A method for mounting an optical connector, comprising: a step of applying paste solder on the wiring pattern in advance; and positioning the electrode portion with the wiring pattern so that the optical connector is mounted on the mounting surface of the mounting member. Placing on the, and heating the contact portion between the electrode portion and the wiring pattern to melt the paste solder between them Soldering the electrode portion and the wiring pattern. 5. A housing in which a photoelectric element can be accommodated and arranged therein and at least a portion covering the photoelectric element is formed of a conductive resin, and a portion formed of the conductive resin of the housing is grounded to ground. A mounting portion for fixing the housing is formed, and an electrode portion for directly soldering to a predetermined grounding wiring pattern formed on the mounting surface side of the mounted member is embedded in the mounting portion. At the same time, the electrode portion is exposed to the outer periphery of the mounting portion, and further, a solder injection hole for supplying paste solder to a contact portion between the electrode portion and the wiring pattern is formed in the mounting portion and the electrode portion. A method for mounting an optical connector, comprising: positioning the electrode portion with the wiring pattern; Placing the paste on the surface, injecting the paste solder into the solder injection hole and supplying the paste solder to a contact portion between the electrode portion and the wiring pattern, exposing the electrode portion around the mounting portion. And melting the supplied paste solder by bringing a heating unit into contact with the heated portion and soldering the electrode portion and the wiring pattern.