JP2000063675A - Silicon resin composition and molded item - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a silicon resin compsn. which can give a molded item excellent in corrosion resistance and durability even in air at high temps. by treating a mixture of a polysilane an unsatd. carbon compd. at a specified temp. or higher. SOLUTION: This resin compsn. is obtd. by thermally treating a mixture of 1 pt.wt. polysilane and 0.05-100 pts.wt. usatd. carbon compd. at a temp. 220 deg.C or higher, at which Si-Si bonds in the polysilane are cleaved and C atoms of side chains are inserted between Si atoms of the main chain to form Si-C-Si bonds. The polysilane is a linear or cyclic polysilane of the formula: (R12Si)m or a network polymer having an Si-Si backbone represented by the formula: (R2Si)n or (R32Si)x(R3Si)ySiz, [R1 and R2 are each H, alkyl, alkenyl, hydroxyl, or the like; R3 is H, alkyl, alkenyl or the like; (m) is 2-10,000; (n) is 4-10,000; and x+y+z is 5-10,000]. This compsn. can give a molded item excellent esp. in heat cycle characteristics.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a silicon-based resin composition containing polysilane and a compound containing a carbon-based unsaturated bond.

[0002]

2. Description of the Related Art In recent years, heat-resistant resins having heat resistance at high temperatures in the fields of electronic materials, electrical insulating materials, general industrial equipment, automobiles, energy conversion equipment, aerospace equipment, etc. Is required, and active research and development is being conducted.

As the high temperature heat resistant resin, heat resistant resins such as fluorine resin, silicone resin, polyimide, polyphenylene sulfide and polyether sulfone are used.

However, in general, these heat resistant resins cannot be expected to have durability because they are easily thermally deformed and easily oxidized in air (in an oxidizing atmosphere) at high temperature.

An object of the present invention is to provide a resin composition capable of forming a molded article having excellent corrosion resistance and durability, and particularly excellent heat cycle resistance even in air (in an oxidizing atmosphere) at high temperature. It is in.

[0006]

As a result of intensive studies, the present inventors have found that a resin composition containing a polysilane and a compound containing a carbon-based unsaturated bond can solve the above problems, and completed the present invention. Came to do.

That is, the present invention provides a resin composition and a molded article thereof shown below.

1. A resin composition obtained by heat-treating a mixture containing polysilane and a compound containing a carbon-based unsaturated bond at a temperature not lower than the temperature at which the Si-Si bond of polysilane is cleaved.

2. When a mixture containing polysilane and a compound containing a carbon-based unsaturated bond is introduced into the Si-Si bond of the main chain, carbon of the side chain of the Si-Si bond of polysilane is inserted into the Si-Si bond.
A resin composition obtained by performing a heat treatment at a temperature of forming a -C-Si bond or higher.

3. Item 3. The resin composition according to Item 1 or 2, wherein the polysilane is a polysilane having a network structure.

4. Item 4. The resin composition according to any one of Items 1 to 3, which is obtained by performing heat treatment at a temperature of 220 ° C or higher.

5. Polysilane and a compound containing a carbon-based unsaturated bond are mixed, and the resulting mixture is mixed with Si of polysilane.
A method for producing a resin composition, which comprises performing a heat treatment at a temperature at which the -Si bond is split or higher.

6. A molded article of a resin composition comprising the polysilane according to any one of items 1 to 4 and a compound containing a carbon-based unsaturated bond.

7. Item 6 wherein the form of the molded article is a coating film
The molded article according to.

8. A mixture containing a polysilane and a carbon-based unsaturated bond-containing compound is applied to the surface of a base material, and the coating film is cured by heat treatment at a temperature at which the Si-Si bond of polysilane is decomposed or higher. A method of manufacturing a product or an article having a coating film.

9. A product or article having a cured coating film obtained by the method according to item 8.

As used herein, "alkyl group", "alkenyl group", "aryl group" and "composition" shall have the meanings defined below.

The "alkyl group" refers to a monovalent linear, cyclic or branched aliphatic hydrocarbon group having 1 to 14 carbon atoms.

The "alkenyl group" refers to a monovalent linear, cyclic or branched aliphatic hydrocarbon group having 1 to 14 carbon atoms having at least one carbon-carbon double bond.

The "aryl group" refers to an aromatic hydrocarbon group having at least one substituent or having no substituent.

The term "composition" refers to a substance or material in which a chemical bond exists in a part or all of two or more compounds.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION In the production of the resin composition of the present invention, polysilane and a compound containing a carbon-based unsaturated bond are used.

The polysilane is not particularly limited as long as it is a linear, cyclic or branched compound having a Si--Si bond. In addition, Si-C bond, Si-O bond,
Si-N bond, Si-OM bond (M = Ti, Zr),
It may have a Si-B bond.

Here, polysilane has a chemical structure mainly composed of a skeleton structure represented by the general formula (R ¹ ₂ Si) _m (1) (wherein R ¹ is the same or different and is a hydrogen atom or an alkyl group). Group, an alkenyl group, an arylalkyl group, an aryl group, an alkoxy group, a hydroxyl group, a phenolic hydroxyl group, an amino group or a silyl group, m is 2 to 10000). General formula (R ² Si) _n (2) (In the formula, R ² is the same or different and is a hydrogen atom, an alkyl group, an alkenyl group, an arylalkyl group, an aryl group, an alkoxy group, a hydroxyl group, a phenolic hydroxyl group, It represents an amino group or a silyl group, n is 4 to 10000), and a silicon network polymer represented by the general formula (R ³ ₂ Si) _x (R ³ Si) _y Si _z (3) (In the formula, R ³ represents a hydrogen atom, an alkyl group, an alkenyl group, an arylalkyl group, an aryl group, an alkoxy group,
Represents a phenolic hydroxyl group, an amino group or a silyl group.
R ^3's may all be the same or two or more may be different. The sum of x, y and z is 5 to 10000. ) At least one kind of polymer selected from the group consisting of network polymers having a Si—Si bond as a skeleton (reticulated polymer).

Of these, polysilane having a network structure is preferable because of its high heat resistance and corrosion resistance.

These polymers can be produced by the following method using monomers having respective structural units as raw materials. That is, a method of dehalogenating polycondensation of halosilanes in the presence of an alkali metal (“kipping method” J. Am. Chem. Soc., 110, 124 (1988), Macromolecule
s, 23,3423 (1990)), a method for dehalogenating condensation polymerization of halosilanes by electrode reduction (J. Chem. Soc., Chem. Commu
n., 1161 (1990), J.Chem.Soc., Chem.Commun., 897 (199
2)), a method of dehydrogenative condensation polymerization of hydrosilanes in the presence of a metal catalyst (JP-A-4-334551), a method of anionic polymerization of disylene crosslinked with biphenyl, etc. (Macromolecules, 23, 4494 (1990)). ), A method by ring-opening polymerization of cyclic silanes, and the like.

It is also possible to use a silicon-based polymer containing a Si--Si bond obtained by heat-treating the above polysilane in an atmosphere of an inert gas such as nitrogen or argon or in the air at 300 ° C. or higher.

The compound containing a carbon-based unsaturated bond used in the production of the resin composition of the present invention includes a straight-chain compound having at least one carbon-based unsaturated bond in its chemical structure,
There is no particular limitation as long as it is a cyclic or branched compound.

Examples of the carbon-based unsaturated bond include a carbon-carbon double bond and a carbon-carbon triple bond, and one carbon-based unsaturated bond-containing compound may contain both of them.

Examples of the carbon-based unsaturated bond-containing compound include styrene, para-methylstyrene, para-t-butoxystyrene, para-chlorostyrene, para-iodostyrene, para-bromostyrene, para-cyanostyrene and para-styrene. -Nitrostyrene, divinylbenzene, methyl methacrylate, methyl acrylate, ethyl methacrylate, butyl methacrylate, lauryl methacrylate, tridecyl methacrylate, stearyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, glycidyl methacrylate, tetrahydrofurfuryl methacrylate, ethylene glycol dimethacrylate Lumpur, triethylene glycol dimethacrylate, dimethacrylate tetraethylene glycol dimethacrylate, 1,3-butylene glycol, trimethylolpropane trimethacrylate, 1-hexyne,
1-heptin, 1-octyne, 1-decine, 2-pentyne, 2-hexyne, 3-hexyne, 4-octyne, 5-
Examples thereof include decine and bis (phenylethynyl) benzene.

In the production of the resin composition of the present invention, the compounding ratio of the polysilane and the carbon-based unsaturated bond-containing compound in the mixture is usually 0.01 to 100 parts by weight of the carbon-based unsaturated bond-containing compound with respect to 1 part by weight of the polysilane. About 100 parts by weight,
The amount is preferably about 0.05 to 20 parts by weight, more preferably about 0.1 to 10 parts by weight.

The temperature of the heat treatment of the above mixture in the production of the resin composition of the present invention may be higher than the temperature at which the Si-Si bond of polysilane is cleaved, and is usually 40 to 450 ° C.
Degree, preferably about 100 to 400 ° C, more preferably about 220 to 350 ° C. In addition, S of polysilane
When the heat treatment is performed at a temperature at which the side chain carbon of the i-Si bond is inserted into the Si-Si bond of the main chain to form the Si-C-Si bond, the heat resistance of the resin composition is further improved, Three
It is particularly preferable to heat-treat at about 00 to 350 ° C.
The time for holding the above mixture at the heating temperature is about 1 minute to 48 hours, preferably about 3 minutes to 24 hours, more preferably about 5 minutes to 18 hours. The temperature rising rate is not particularly limited, but is preferably about 0.1 to 10 ° C./minute. The heating can be performed in an atmosphere of an inert gas such as nitrogen or argon or in an atmosphere containing oxygen (for example, in air).

By heat-treating a mixture of polysilane and a compound containing a carbon-based unsaturated bond, S of polysilane is reduced.
Since the i-Si bond is cleaved to form a bond with the carbon-based unsaturated bond-containing compound, the heat resistance of the resin composition is improved.
In addition, if the side chain carbon of the Si-Si bond of polysilane is inserted into the Si-Si bond of the main chain and heat-treated at a temperature higher than the temperature at which the Si-C-Si bond is formed, the formation of the Si-C-Si bond is formed. Thereby, the heat resistance of the resin composition is further improved. In this case, a methyl group is preferable as the side chain of the Si-Si bond to be inserted.

A curing accelerator may be added to the above mixture in the production of the resin composition of the present invention. Examples of the curing accelerator to be blended include silicon compounds such as polyalkoxysilanes such as 1,2-disilylethane, ethyl silicate and methyl silicate; titanium compounds such as tetraalkoxy titanium; boron compounds such as phenyldichloroborane; benzoyl peroxide; Compounds that generate radicals such as tert-butyl peroxide and azoisobutyronitrile; organoaluminum compounds such as trismethoxyaluminum and trisphenoxyaluminum; triethylamine, pyridine, diethylenetriamine, triethylenetetramine, metaxylenediamine,
Amine compounds such as diaminodiphenylmethane, tris (dimethylaminomethyl) phenol, 2-ethyl-4-methylimidazole; amide compounds such as dimer acid polyamide; phthalic anhydride, tetrahydromethylphthalic anhydride, hexahydrophthalic anhydride, trimellitic anhydride Acids, acid anhydrides such as methyl nadic acid anhydride; phenols such as phenol novolac; mercaptan compounds such as polysulfide; Lewis acid complex compounds such as boron trifluoride / ethylamine complex; halides such as chloroform, dichloromethane, trichloromethane; Examples thereof include basic compounds such as sodium ethoxide.

The amount of the curing accelerator used is polysilane 100.
It is usually about 0.01 to 50 parts by weight with respect to parts by weight,
It is preferably about 0.1 to 20 parts by weight.

In the present invention, the mixture may be irradiated with light together with the heat treatment of the mixture, or before or after the heat treatment. Light irradiation is usually 50
~ 300 mJ / cm ² , preferably 80-200 m
It can be performed by irradiating the above mixture with light of about J / cm ² . As the light source, an ordinary ultraviolet lamp or the like can be used.

In the resin composition of the present invention, if necessary,
One kind or two or more kinds of fillers can be blended.
Examples of the filler include fine powders of oxide-based inorganic materials such as silica, alumina, zirconia, and mica, or non-oxide-based inorganic materials such as silicon carbide and silicon nitride. Further, depending on the application, it is also possible to use a metal powder such as aluminum, zinc or copper.

Further, examples of the filler will be described in detail. Silica type such as silica sand, quartz, novaculite and diatomaceous earth; silica type such as synthetic amorphous silica; kaolinite;
Silicates such as mica, talc, wollastonite, asbestos, calcium silicate, aluminum silicate; glass bodies such as glass powder, glass spheres, hollow glass spheres, glass flakes, foam glass spheres; boron nitride, boron carbide , Non-oxide type inorganic substances such as aluminum nitride, aluminum carbide, silicon nitride, silicon carbide, titanium boride, titanium nitride and titanium carbide; calcium carbonate; metals such as zinc oxide, alumina, magnesia, zirconia, titanium oxide and beryllium oxide. Oxides: barium sulfate, molybdenum disulfide, tungsten disulfide, fluorocarbons and other inorganic substances;
Metal powders such as aluminum, bronze, lead, stainless steel, and zinc; carbon bodies such as carbon black, coke, graphite, pyrolytic carbon, and hollow carbon spheres.

These fillers may be used in the form of fibers, needles (including whiskers), granules, scales, etc., alone or in admixture of two or more.

In the resin composition of the present invention, if necessary,
Flame retardant aids such as antimony trioxide; release agents for natural waxes, synthetic waxes, linear fatty acids and their metal salts, acid amides, esters, paraffins; pigments such as carbon black, titanium dioxide; Plasticizers such as esters, polyols, polysulfides, urethane prepolymers; liquid rubbers such as carboxyl group-terminated butadiene-acrylonitrile copolymer rubbers, ethylene-vinyl acetate copolymers; surfaces of silane coupling agents, titanium coupling agents, etc. Modifying agent: A low-stressing agent such as silicone oil, silicone rubber, various plastic powders, various engineering plastic powders, ABS resin and MBS resin powders can be added as appropriate.

Further, the resin composition of the present invention may be blended with a flow regulator, a leveling agent, an antifoaming agent, an antistatic agent, an ultraviolet absorber, a dispersant and the like, if necessary.

The molded product obtained by using the resin composition of the present invention is not particularly limited, and may have any shape or form such as a sheet, a film, a pellet, a coating film, a lump, and a powder. it can.

According to the present invention, a mixture containing polysilane and a carbon-based unsaturated bond-containing compound is applied to the surface of the substrate.
It is applied by a known method such as a spray coating method, a bar coating method, a flow coating method, a dipping method or a casting method, or compression molding, cast molding, transfer molding, a porous substrate (ceramic fiber, glass fiber, carbon). A molded product can be obtained by performing a heat treatment after impregnating the fibers).

The application of the mixture onto the surface of the base material can be carried out by adding an organic solvent. Such an organic solvent is not particularly limited as long as it can coat the mixture, but tetrahydrofuran, toluene, xylene, benzene, acetone, methyl cellosolve, butyl cellosolve,
Examples thereof include ethylene glycol, ethanol, isopropyl alcohol, and the like, and mixed solvents thereof. The amount of the organic solvent to be added is not particularly limited,
The solvent is usually about 0.5 to 100 parts by weight, preferably about 0.5 to 10 parts by weight, based on 1 part by weight of the mixture.

The base material is not particularly limited as long as it is a material that can withstand a predetermined heat treatment condition, and metals, ceramics, glass, plastics and the like can be used.

The resin composition and molded article according to the present invention are
Paints, insulating materials for electric devices, wire covering materials, sealing materials for electronic devices, interlayer insulating films for printed wiring boards, wiring insulating films, surface protective films, sliding members, automotive parts materials, aerospace materials, It is extremely useful in many applications such as heat resistance and corrosion resistance such as ink, adhesives and adhesives.

[0047]

EXAMPLES Examples will be shown below to further clarify the features of the present invention.

Example 1 A mixture of 0.5 g of methylphenylpolysilane (average degree of polymerization: 40) synthesized by electrode reaction and 0.5 g of styrene was placed in a stainless steel cylindrical container and placed in an argon atmosphere.
Raise the temperature from room temperature to 300 ° C at a rate of 10 ° C / min, and
After reaching 00 ° C, the mixture was cooled to room temperature to obtain pellets.

The structure of the obtained pellet was subjected to IR analysis and NMR analysis. From the IR analysis, it was observed that the absorption near 1640 cm ⁻¹ attributed to the styrene double bond was decreased after the heat treatment. ²⁹ Si-NM
From the results of R analysis, peaks were found at -40 ppm, -20 ppm and 0 ppm.

Using the obtained pellets, a heat resistance test,
An acid resistance test, an alkali resistance test and a heat cycle resistance test were performed.

The heat resistance test was carried out by leaving the pellets in an electric furnace at 450 ° C. for 1 hour in an air atmosphere. When the surface condition of the pellet was visually observed and observed with an electron microscope (SEM), no crack was observed and the heat resistance was good.

In the acid resistance test, the pellets were immersed in a 5% aqueous solution of nitric acid for 2 hours, and then the surface condition of the pellets was visually observed. Also in this case, no crack was observed and the acid resistance was good.

In the alkali resistance test, 5% NaO
After immersing the pellet in the H aqueous solution for 2 hours, the surface state of the pellet was visually observed. Also in this case, no crack was observed and the alkali resistance was good.

In the heat cycle resistance test, a cycle of "holding at set temperature (400 ° C) for 2 hours and then holding at room temperature for 2 hours" was repeated 10 times to subject the pellets to thermal shock. After the test, visual observation of the surface condition of the pellets revealed that no cracks were found and the heat cycle resistance was good.

Example 2 0.5 g of methylphenylpolysilane (average degree of polymerization: 40) synthesized by electrode reaction and 0.5 g of styrene were dissolved and mixed in 10 g of tetrahydrofuran at room temperature.
The obtained mixture was flow-coated on a stainless steel plate (SUS-304) and a copper plate (C-1100) which had been previously sanded with sandpaper (# 500).

The coated stainless steel plate and copper plate were heated from room temperature to 300 ° C. at a rate of 10 ° C./min in an air atmosphere, and when the temperature reached 300 ° C., the sample was taken out to room temperature to obtain a sample with a cured coating film. It was The thickness of the obtained coating film is 20
was μm.

Using this sample, a coating film was subjected to a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test.

The heat resistance test was carried out by leaving the coating film forming sample in an electric furnace at 450 ° C. in an air atmosphere for 1 hour. The surface condition of the coating film is visually inspected and electron microscope (S
Observation by EM) showed no occurrence of cracks, voids, peeling, etc., indicating good heat resistance.

In the acid resistance test, the cured coating film-forming sample was dipped in a 5% nitric acid aqueous solution for 2 hours, and then the surface condition of the coating film was visually observed. Also in this case, no cracks, voids, peeling, etc. were observed, and the acid resistance was good.

In the alkali resistance test, 5% NaO
After the cured coating film-forming sample was dipped in the H aqueous solution for 2 hours, the surface state of the coating film was visually observed. Again, cracks,
No occurrence of voids or peeling was observed, and the alkali resistance was good.

In the heat cycle resistance test, a cycle of "holding at set temperature (400 ° C) for 2 hours and then holding at room temperature for 2 hours" was repeated 10 times to subject the cured coating film forming sample to thermal shock. . The cured coating film forming sample,
After confirming that each temperature was reached, a thermal shock was applied. After the test, the surface condition of the coating film was visually observed, and no cracks, voids, peeling, or the like were found, and the heat cycle resistance was good.

Example 3 0.8 g of methylphenylpolysilane and 0.
A coating film was formed in the same manner as in Example 2 except that the amount was 2 g, and the obtained sample was subjected to a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test, and then the coating film. The surface condition was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 4 A coating film was formed in the same manner as in Example 2 except that the heat treatment temperature was 250 ° C., and the obtained sample was used for a heat resistance test, an acid resistance test, an alkali resistance test and a heat resistance test. After conducting the cycleability test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 5 A coating film was formed in the same manner as in Example 2 except that the atmosphere during the heat treatment was changed to the air atmosphere and the atmosphere was argon atmosphere.
After performing heat resistance test, acid resistance test, alkali resistance test and heat cycle resistance test using the obtained sample,
The surface condition of the coating film was observed. In any test,
In the surface condition of the coating film, cracks, voids, peeling, etc. were not observed, and good results were obtained.

Example 6 A coating film was formed in the same manner as in Example 2 except that methylphenylpolysilane having an average degree of polymerization of 200 was used instead of methylphenylpolysilane having an average degree of polymerization of 40, and the obtained sample was used. After conducting a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 7 A coating film was formed in the same manner as in Example 2 except that methylphenylpolysilane having an average degree of polymerization of 40 was used in place of methylphenylpolysilane having an average degree of polymerization of 40, and the obtained sample was used. After conducting a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 8 A coating film was formed in the same manner as in Example 2 except that cyclic methylphenylpolysilane (average degree of polymerization 6) was used as polysilane instead of methylphenylpolysilane (average degree of polymerization 40). A heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test were conducted using the obtained sample, and then the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 9 A coating film was obtained in the same manner as in Example 2 except that phenyl network polysilane (average degree of polymerization 40) was used instead of methylphenylpolysilane (average degree of polymerization 40) as the polysilane. Heat resistance test using the sample
After performing an acid resistance test, an alkali resistance test and a heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 10 A coating film was obtained in the same manner as in Example 2 except that phenyl network polysilane (average degree of polymerization: 10) was used instead of methylphenylpolysilane (average degree of polymerization: 40) as the polysilane. Heat resistance test using the sample
After performing an acid resistance test, an alkali resistance test and a heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 11 As polysilane, 0.25 g of methylphenyl polysilane (average degree of polymerization 40) and 0.25 g of phenyl network polysilane (average degree of polymerization 10) were used instead of 0.5 g of methylphenyl polysilane (average degree of polymerization 40). A coating film was formed in the same manner as in Example 2 except that the heat resistance test, the acid resistance test, the alkali resistance test and the heat cycle resistance test were performed using the obtained sample, and then the surface of the coating film The condition was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 12 A coating film was formed in the same manner as in Example 2 except that 0.5 g of divinylbenzene was used instead of 0.5 g of styrene, and the obtained sample was used for heat resistance test and acid resistance test. After conducting the test, the alkali resistance test and the heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 13 Methyl methacrylate 0.5 instead of styrene 0.5 g
A coating film was formed in the same manner as in Example 2 except that g was used, and the obtained sample was used for heat resistance test, acid resistance test,
After performing the alkali resistance test and the heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 14 A coating film was formed in the same manner as in Example 2 except that 0.5 g of 4-octyne was used in place of 0.5 g of styrene, and the obtained sample was used for a heat resistance test and an acid resistance test. After conducting the resistance test, the alkali resistance test and the heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Example 15 A coating film was formed in the same manner as in Example 2 except that 0.5 g of bis (phenylethynyl) benzene was used instead of 0.5 g of styrene, and a heat resistance was obtained using the obtained sample. test,
After performing an acid resistance test, an alkali resistance test and a heat cycle resistance test, the surface condition of the coating film was observed. In all the tests, cracks, voids, peeling, etc. were not observed on the surface condition of the coating film, and good results were obtained.

Comparative Example 1 A stainless steel plate (SUS-3) prepared by dissolving only 1 g of styrene in 10 g of tetrahydrofuran at room temperature and polishing the obtained solution with sandpaper (# 500) in advance.
04) was flow coated. Then, the coated stainless steel plate was heated in air from room temperature to 300 ° C. at a rate of 10 ° C./min, and when the temperature reached 300 ° C., the sample was taken out to room temperature to obtain a coating film forming sample.

After performing a heat resistance test and a heat cycle resistance test using the obtained sample, the surface condition of the coating film was observed. In all the tests, voids and peeling were observed on the surface condition of the coating film, and neither heat resistance nor heat cycle resistance was good.

[0077]

The resin composition according to the present invention and the molded article obtained by using the resin composition have heat resistance, heat cycle resistance, acid resistance, alkali resistance, organic solvent resistance, water resistance, moisture resistance,
It has excellent flame retardancy, water repellency, insulation, and film forming properties.

The article or product having a coating film formed from the resin composition of the present invention on a substrate has heat resistance, heat cycle resistance, acid resistance, alkali resistance, and organic solvent resistance even under various severe environmental conditions. It exhibits excellent properties such as water resistance, water resistance, moisture resistance, flame retardancy, water repellency, insulation and coating adhesion.

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 4J002 CP011 CP211 EA016 EA036                       EA046 EB106 EB126 EB136                       ED056 EH076 EL036 EN096                       ES006 ET006 FD010 FD020                       FD030 FD040 FD090 FD130                       FD150 FD160 GJ01 GM00                       GN00 GQ00 GQ01                 4J035 JA01 JA02 JB01 JB05 LA03                       LB01                 4J038 DL001 GA15

Claims (9)

[Claims] 1. A resin composition obtained by heat-treating a mixture containing polysilane and a compound containing a carbon-based unsaturated bond at a temperature not lower than the temperature at which the Si—Si bond of polysilane is cleaved. 2. A mixture of polysilane and a compound containing a carbon-based unsaturated bond is used to form a Si-Si bond by inserting carbon in the side chain of the Si-Si bond of polysilane into the Si-Si bond of the main chain.
A resin composition obtained by heat treatment at a temperature of forming a C-Si bond or higher. 3. The resin composition according to claim 1, wherein the polysilane is a polysilane having a network structure. 4. The resin composition according to claim 1, which is obtained by performing heat treatment at a temperature of 220 ° C. or higher. 5. Polysilane and a carbon-based unsaturated bond-containing compound are mixed, and the resulting mixture is mixed with Si-containing polysilane.
A method for producing a resin composition, which comprises performing a heat treatment at a temperature not lower than the temperature at which Si bonds are broken. 6. A molded article of a resin composition comprising the polysilane according to any one of claims 1 to 4 and a carbon-based unsaturated bond-containing compound. 7. The molding according to claim 6, wherein the shape of the molding is a coating film. 8. A coating film is cured by applying a mixture containing polysilane and a compound containing a carbon-based unsaturated bond to the surface of a substrate and heat-treating at a temperature above the temperature at which the Si—Si bond of polysilane is cleaved. A method of manufacturing a product or article having a coating film, which comprises: 9. A product or article having a cured coating film obtained by the method according to claim 8.