JP2000061842A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To wash a chuck surface plate for slurry to be removed therefrom without leaving the slurry on the chuck surface plate. SOLUTION: A polishing device includes a chuck surface plate 30 for rotating a wafer held on the upper face, a polishing plate 70 having a polishing cloth mounted on the lower face and movable vertically and on a horizontal plane, a guide ring 50 mounted in a demountable manner on the outer periphery edge of the chuck surface plate 30 and externally fitted to the wafer for positioning the wafer, a guide ring mounting/demounting means for mounting/demounting the guide ring 50 on/from the chuck surface plate 30 and a chuck surface plate washing means for washing the chuck surface plate 30 on its upper face while supplying washing liquid onto the chuck surface plate, whereby the chuck surface plate 30 is washed in the condition of removing the guide ring 50.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing a wafer, and more particularly to a polishing apparatus having a cleaning function so as to cleanly remove a slurry attached to a chuck surface plate for holding a wafer.

[0002]

2. Description of the Related Art Chemicals used in semiconductor manufacturing processes
A polishing apparatus used for polishing a wafer by mechanical polishing has a chuck surface plate for holding the wafer and a polishing surface plate to which a polishing cloth is attached.

In recent years, the diameter of wafers used for chemical mechanical polishing has been increasing, and along with this, a chuck surface plate is arranged on the lower side so that a polishing cloth having a diameter smaller than that of the wafer can be used. A polishing apparatus in which the attached polishing platen is arranged above the chuck platen is used. Therefore, a conventional polishing apparatus of this type is shown in FIG.
Shown in 1.

In FIG. 11, reference numeral 10 indicates a polishing surface plate, and 12 indicates a chuck surface plate. A polishing cloth 14 having a diameter smaller than that of the wafer 11 is attached to the lower surface of the polishing platen 10. The rotation shaft of the polishing platen 10 is driven by a motor (not shown). The polishing platen 10 is attached to an arm (not shown) so that it can rotate and move up and down.

A circular concave surface is formed on the upper surface of the chuck surface plate 12, and this concave surface serves as a suction surface for holding the wafer 11, and a plurality of vacuum holes 16 are opened. The rotary shaft 17 of the chuck surface plate 12 has a vacuum hole 16
A through hole 18 for vacuuming is formed which communicates with the. Usually, the wafer 11 is vacuum-sucked through the backing pad 15.

With such a chuck surface plate 12, the wafer 1
When polishing No. 1, chuck surface plate 12 and polishing surface plate 1
While rotating 0 in the same direction, an abrasive (hereinafter, referred to as slurry) is supplied at the same time. An outer peripheral portion of the upper surface of the chuck surface plate 12 is provided with an orbiting bank portion 19 which is lower than the surface to be polished which is the upper surface of the wafer 11 sucked and held by the chuck surface plate 12. The bank portion 19 prevents the wafer 11 from being displaced or popping out during polishing.

When the polishing of the wafer 11 is continued, the slurry enters into the gap between the inner peripheral surface of the bank portion 19 and the outer peripheral surface of the wafer 11. In FIG. 11, 20 is the slurry that has entered this gap.

[0008]

When the polishing of the wafer 11 is completed, it is necessary to take out the wafer 11 from the chuck surface plate 12 and remove the slurry 20 before the next polishing. However, if this slurry 20 accumulates in the corners of the inner peripheral surface of the bank portion 19 and the outer peripheral edge portion of the packing pad 15, it is difficult to completely remove it by washing with water. It was the actual situation. Moreover, the slurry that cannot be removed and remains partially is the wafer 1 to be polished next.
When it is below 1, the wafer 11 does not adhere to the backing pad 15 and causes a decrease in polishing accuracy.

Further, as the wafers 11 are polished one after another, the residual slurry accumulates each time, and it becomes more difficult to remove the slurry. Therefore, the object of the present invention is to solve the problems of the prior art. SUMMARY OF THE INVENTION It is an object of the present invention to provide a polishing apparatus capable of easily and easily removing the slurry from the chuck surface plate by cleaning the slurry without leaving the slurry, and contributing to the improvement of the polishing accuracy of the wafer.

[0010]

In order to achieve the above-mentioned object, the present invention is to press the polishing cloth against the wafer while rotating the wafer and the polishing cloth, and polish the wafer with the polishing cloth while supplying the polishing agent. In the polishing apparatus, a chuck surface plate that holds and rotates a wafer on the upper surface, a polishing surface plate that has the polishing cloth attached to the lower surface and moves in the up-down direction and on a horizontal plane, and is attached to and detached from the outer peripheral edge portion of the chuck surface plate. A guide ring that is freely attached and fits over the wafer to position the wafer, a guide ring attaching / detaching means that holds the guide ring and attaches and detaches it to and from the chuck surface plate, and a cleaning liquid on the chuck surface plate. Chuck surface plate cleaning means for cleaning the upper surface of the chuck surface plate while supplying
It is characterized by including.

The guide ring attaching / detaching means has a pair of claw members that engage with the guide ring, and a gripping mechanism for detachably gripping the guide ring by opening / closing the claw members, and the gripping mechanism in the vertical direction. And a moving mechanism for moving in a horizontal direction.

The cleaning means includes an arm that moves in a plane parallel to the chuck surface plate and in an up-and-down direction, and a brush head that is rotatably attached to the arm and supplies a cleaning liquid and has a built-in brush actuator. ,
A brush mounting base rotatably mounted on the brush head, and a brush for cleaning the chuck surface plate provided on the lower surface of the brush mounting base.

The second aspect of the present invention is a polishing apparatus for pressing a polishing cloth against a wafer while rotating the wafer and the polishing cloth, and polishing the wafer with the polishing cloth while supplying a polishing agent. And a rotating chuck surface plate,
A polishing platen attached to the lower surface of the polishing platen, which moves vertically and in a horizontal plane; and a guide ring which is detachably attached to the outer peripheral edge of the chuck platen and which is fitted onto the wafer to position the wafer. A guide ring attaching / detaching means for gripping the guide ring and attaching / detaching to / from the chuck surface plate, and a guide for cleaning while holding the guide ring detached from the chuck surface plate by the guide ring attaching / detaching means. And a ring cleaning means. According to the present invention, by removing the slurry attached to the guide ring by the guide ring cleaning means, the cleaned guide ring can be reliably attached to the chuck surface plate.

Further, the third aspect of the present invention enables cleaning of the chuck surface plate and cleaning of the guide ring at a time, and is characterized in that the chuck surface plate holds a wafer on its upper surface and rotates. And a polishing platen attached to the lower surface of the polishing cloth and moving in the vertical direction and on a horizontal plane,
A guide ring removably attached to the outer peripheral edge of the chuck surface plate for externally fitting the wafer and positioning the wafer, and a guide ring for gripping the guide ring and attaching to and detaching from the chuck surface plate. And a cleaning means for cleaning the upper surface of the chuck surface plate from which the guide ring has been removed while supplying a cleaning liquid to the chuck surface plate, and for cleaning the guide ring removed by the guide ring attachment / detachment means. It is in.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a polishing apparatus according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a plan view of a polishing apparatus according to this embodiment, FIG. 2 is a side view of the polishing apparatus, and FIG. 3 is a sectional view of a chuck surface plate of the polishing apparatus.

In these drawings, reference numeral 30 indicates a chuck surface plate. This chuck surface plate 30 prevents the slurry from scattering to the outside during polishing.
The periphery is covered with a shatterproof cover 31 having a short cylindrical shape. The chuck surface plate 30 is rotatably supported on a horizontal plane, and is rotationally driven by a servo motor (not shown). In addition, by controlling the servo motor, the rotation angle position can be determined and the rotation angle position can be positioned at an arbitrary angle.

As shown in FIG. 3, the upper surface of the chuck surface plate 30 is a suction surface for holding the wafer 11. The wafer 11 is usually vacuum-sucked on the upper surface of the chuck surface plate 30 via the backing pad 32. A plurality of vacuum holes 33 are opened on the suction surface of the chuck surface plate 30, and a rotation shaft 34 of the chuck surface plate 30 is formed with a passage 35 for vacuuming the wafer which communicates with the vacuum hole 33.
The wafer vacuum evacuation path 35 is a wafer vacuum line 36.
It is connected to the. The wafer vacuum line 36 is branched into two parts, one of which is connected to a vacuum source via a valve 37 and the other of which is connected to a pure water supply source via a valve 39. A guide ring vacuum passage 41 is formed in the chuck surface plate 30 in a system different from that of the wafer evacuation passage 35. This guide ring vacuum passage 41 has a conduit 42.
Is connected, and this pipe line 42 branches into two hands, one of which is
The valve 43 is connected to a vacuum source 44, and the other is connected to a pure water supply source via a valve 45. The guide ring vacuum passage 41 opens around a step portion 47 formed on the outer peripheral portion of the chuck surface plate 30, and the guide ring 50 is mounted on the step portion 47.

The guide ring 50 is positioned so that the position of the wafer 11 attracted to the chuck surface plate 30 is not displaced, and the inner diameter of the guide ring 50 is substantially the same as the outer diameter of the wafer. , The wafers 11 are fitted together. Also, this guide ring 50
Is detachably attached to the step portion 47 at the outer edge of the chuck surface plate 30. Therefore, a means for attaching and detaching the guide ring 50 will be described. The guide ring attaching / detaching means includes a guide ring gripping mechanism and a guide ring moving mechanism.

Guide Ring Gripping Mechanism In FIGS. 1 and 2, the guide ring 50 is gripped by a pair of left and right claw members 52a and 52b forming a chuck. Grooves 53 extending in the length direction are formed inside the claw members 52a and 52b. Corresponding to the groove 53, a circumferential protruding strip 54 is formed on the outer peripheral portion of the guide ring 50, and by engaging the protruding strip 54 with the groove 53, the claw members 52a, 52b guide the guide ring 50. The guide ring 50 is designed not to fall off when gripping.

The claw members 52a and 52b are attached to the tips of the bent arms 55a and 55b, respectively.
The arms 55a and 55b are opened and closed by a pawl opening / closing mechanism 56.

The guide ring moving mechanism pawl opening / closing mechanism 56 is connected to the swivel portion 58. The turning axis of the turning portion 58 is parallel to the horizontal plane. The swivel unit 58 is supported by the elevating unit 60 via a bracket 59, and the elevating unit 60 can raise and lower the entire guide ring gripping mechanism described above. In addition, the lifting unit 60
Is fixed to the horizontal moving unit 62, and the horizontal moving unit 62
Can move linearly on the frame 64.

Next, in FIG. 1, 70 is a polishing platen. A polishing cloth (not shown) having a diameter smaller than that of the wafer is attached to the lower surface of the polishing platen 70. The polishing platen 70 is rotatably supported and vertically movable by a polishing head (not shown) incorporating a motor.
The polishing platen 70 is attached to the tip of the turning arm 72, and the other end of the turning arm 72 is connected to the column 74. By the pivotal movement of the pivot arm 72, the polishing platen 70 can move on a pivoting path passing through the center of the chuck platen 30.

Means for Cleaning Chuck Surface Plate Next, means for cleaning the chuck surface plate 30 will be described. In FIG. 1, reference numeral 80 indicates a chuck surface plate 30.
Shows a brush head brushing to remove slurry from the top surface of the. The brush head 80 is attached to the tip of the swivel arm 82. The swivel arm 82 is horizontally supported by the column 84, and can move the brush head 80 on a horizontal plane along a swirl locus passing through the center of the chuck surface plate 30, and also moves the brush head 80 up and down. Is configured to be able to.

FIG. 4 shows the brush head 80. A brush mount 86 is rotatably mounted on the brush head 80, and a brush 88 is planted on the lower surface of the brush mount 86. In this case, the brush head 80 has a built-in actuator for rotating the brush mount 86, and also has a cleaning liquid passage 90 for sending the cleaning liquid to the brush 88. This cleaning liquid passage 90
Are divided into a plurality of cleaning liquid holes inside the brush mount 86.

Next, the operation of this embodiment when cleaning the chuck surface plate 30 after polishing the wafer 11 will be described.

As shown in FIG. 1, before cleaning the chuck surface plate 30, the revolving arm 72 revolves to retract the polishing surface plate 70 to a standby position away from the chuck surface plate 30. At this time, the brush head 80 stands by at the standby position A so as not to interfere with the removal of the guide ring 50. Further, a loader device (not shown) has already taken out the wafer 11 for which polishing has been completed from the chuck surface plate 30.

FIG. 5 is a diagram sequentially showing a series of operations from the removal of the guide ring 50 from the chuck surface plate 30 to the cleaning of the chuck surface plate 30. Hereinafter, description will be given with reference to FIGS. 2 and 5. Removal of Guide Ring 50 First, during the polishing process, the claw member 52 is
The arms 55a and 55b holding a and 52b are standing vertically with respect to the upper surface of the chuck surface plate 30, as shown in FIG.
As shown in (a), the swivel portion 58 of the pawl opening / closing mechanism 56 is actuated so that the pawl members 52a, 52b are at the same height as the guide ring 50 on the chuck surface plate 30, and the arm 55a,
Turn 55b.

Next, as shown in FIG. 5B, the claw opening / closing mechanism 56 closes the claw members 52a and 52b. At this time, since the groove 53 of the claw members 52a and 52b engages with the ridge 54 on the outer periphery of the guide ring 50, the guide ring 50 can be firmly gripped.

Thus, the guide ring 50 is attached to the claw member 52.
Lifting device 60 while being held by a and 52b
Raises the claw members 52a and 52b (FIG. 5 (c)).
As a result, the guide ring 50 is removed from the chuck surface plate 30. Then, the horizontal moving unit 62 operates,
To avoid interference with the brush head 80, the guide ring 50 is moved to the left side in the drawing near the brush head. After that, the guide ring 50 is used for the chuck surface plate 3 described below.
Retract to this position during a 0 wash.

Cleaning of the chuck surface plate 30 In FIG. 1, the brush head 80, which was in the standby position A while the guide ring 50 was removed, was rotated from the standby position A to the center position C of the chuck surface plate 30 by the rotation of the arm 82.
Move up to. FIG. 5D shows the brush head 80 pivoted to the position C.

After that, the chuck surface plate 30 rotates. In addition, the brush head 80 includes the brush mount 8
Rotate 6. The cleaning liquid is supplied to the brush 88 through the cleaning liquid passage 90 of the brush head 80. Then, the brush head 80 descends to a position where the brush 88 contacts the backing pad 32 on the chuck surface plate 30, and thereafter, the brush 88 cleans the backing pad 32.

During this cleaning, the brush head 80 is shown in FIG.
From position C shown in Fig. 2 to position B which is the outer edge of the chuck surface plate 30
Turn to. When the cleaning is insufficient in one swiveling operation, the brush head 80 moves up to the position B, swivels back to the position C, and performs the cleaning operation again.

In this way, the above operation is repeated until the slurry is removed from the chuck surface plate 30 and cleaned thoroughly. Guide ring 50 to chuck surface plate 3
By removing it from 0, there are no dents or corners where the slurry is likely to remain, so that it is possible to clean the surface of the chuck surface plate 30 without leaving the slurry by brushing while flowing the cleaning liquid.

During washing, in FIG. 3, valves 37, 4
3 is closed and the valves 39 and 45 are opened, and pure water is allowed to flow through the wafer vacuum passage 35 and the guide ring vacuum passage 41, the wafer vacuum passage 35 and the guide ring vacuum passage 41 are contaminated and clogged by the slurry. Can be prevented in advance.

The above is the description of the cleaning after the wafer 11 is adsorbed on the chuck surface plate 30 through the backing pad 32 and polished, but without using the backing pad 32 for the wafer 11. It may be directly adsorbed on the chuck surface plate 30. In that case, the cleaning operation by the brush 88 may not be sufficient. That is, without the backing pad 32, the slurry may float and remain on the upper surface of the chuck surface plate 30.

In this case, after the cleaning by brushing is completed, the brush head 80 is raised, and the cleaning liquid is sprayed from the brush head 80 while rotating the brush head 80 between the positions B and C to remove the floating slurry. Just wash it off. As a result, in the polishing process performed after cleaning, it is possible to prevent inconvenience that the thickness of the wafer becomes apparently thick and the machining accuracy is deteriorated due to the remaining slurry. Attachment of the guide ring 50 As described above, the chuck surface plate 30 is cleaned. When is finished, the brush head 80 turns back to the standby position A in FIG. Thereafter, in order to attach the guide ring 50 to the chuck surface plate 30, the guide ring 50 is attached to the chuck surface plate 30 in the order of FIG. 5 (d) → FIG. 5 (c) → FIG. 5 (b) → FIG. 5 (a). It is attached. After the guide ring 50 is placed on the chuck surface plate 30, the guide ring vacuum passage 41 is evacuated to prevent the guide ring 50 from rising. After attaching the guide ring 50, the revolving unit 58 revolves the arms 55a and 55b so as to be perpendicular to the upper surface of the chuck surface plate 30, and the claw members 52a and 52b do not interfere with the polishing surface plate 70. To evacuate.

Second Embodiment Next, another embodiment of the polishing apparatus according to the present invention will be described. FIG. 6 is a plan view of the polishing apparatus according to the second embodiment of the present invention. In FIG. 6, components designated by the same reference numerals as in the first embodiment indicate the same components. In the second embodiment, the inner circumference of the guide ring 50 removed from the chuck surface plate 30. It is an embodiment including means for cleaning a surface.

Four rollers 92 are rotatably attached to each of a pair of left and right claw members 90a and 90b forming a chuck for holding the guide ring 50. As shown in FIG. 7, these rollers 92 are provided with a claw member 90.
They are arranged along the inner edges of the curved portions a and 90b.

As shown in FIG. 8, the roller 92 is rotatably attached to the claw members 90a and 90b via roller pins 94. The roller 92 preferably has a concave portion 95 formed by constricting the central portion thereof. This recess 9
5 is adapted to engage with a ridge 54 formed on the outer peripheral portion of the guide ring 50.

Here, FIG. 9 shows a brush mount 100 mounted on the brush head 80 in FIG. In this brush mount 100, in addition to the first brush 88 for cleaning the chuck surface plate 30 on the lower surface thereof, a second brush 102 for cleaning the inner peripheral surface of the guide ring 50 has a brush mount 100. It is planted on the outer peripheral surface of the main body. The bristles of this second brush 102 are
It is planted in the radial direction of 0. The width of the second brush 102 to be planted is preferably larger than the thickness of the guide ring 50, as shown in FIG.

Further, inside the brush mount 100, cleaning liquid supply paths 104 and 106 for supplying the cleaning liquid to the first brush 88 and the second brush 102 are formed.
The cleaning liquid supply passage 104 is opened at a plurality of positions on the lower surface of the brush mounting base 100, and the other cleaning liquid supply passage 106 is opened at a plurality of positions on the outer peripheral surface of the brush mounting base 100. The cleaning liquid passage 104 and the cleaning liquid 106 are communicated with each other via the passage 105, and the cleaning liquid is supplied to the first brush 88 and the second brush 102 at the same time.

Next, a series of operations from removal to cleaning of the guide ring 50 according to the second embodiment configured as described above will be described. The operation of removing the guide ring 50 in the second embodiment is similar to that of the first embodiment, and the operation of cleaning the chuck surface plate 30 after removing the guide ring 50 is also similar. As with the embodiment, the chuck surface plate 30 is used without leaving slurry.
Can be washed. As soon as the cleaning of the chuck surface plate 30 is completed, the inner peripheral portion of the guide ring 50 is cleaned as follows.

As shown in FIG. 5C, the height of the brush head 80 is adjusted to the position of the guide ring 50 while the position of the removed guide ring 50 is maintained at a predetermined height. Then, in FIG. 6, the arm 82 pivots and the brush head 80 moves from the center C of the chuck surface plate to the position B. As shown in FIG. 9, at this position B, the second head provided on the outer peripheral portion of the brush mounting base 100 of the brush head 80.
The brush 102 contacts the entire width of the inner peripheral portion of the guide ring 50. Upon contact, the brush head 80 rotates the brush mount 100 and supplies the cleaning liquid from the cleaning liquid supply passage 106.

The rotating second brush 102 transmits the rotating force to the guide ring 50 by contact friction, and the claw member 90a,
Since the roller 92 of 90b rolls, the guide ring 50
Can rotate. The second brush 102 is capable of cleaning the inner peripheral portion of the guide ring 50 over the entire circumference while rotating the guide ring 50, and removing the attached slurry without leaving any residue.

After the cleaning of the inner peripheral portion of the guide ring 50 is completed in this way, the brush head 80 is moved to the center C of the chuck surface plate 30.
Then, the rotation of the brush head 80 and the supply of the cleaning liquid are stopped. The attachment of the chuck plate 30 of the guide ring 50 thereafter is similar to that of the first embodiment as shown in FIG.
The guide ring 50 is attached to the chuck surface plate 30 in the order of (c) → FIG. 5 (b) → FIG. 5 (a). When mounting the guide ring 50, since the slurry residue is removed from the inner peripheral portion of the guide ring 50 by cleaning,
It can be performed smoothly and reliably.

In the second embodiment, as shown in FIG. 10, the chuck surface plate 30 and the inner peripheral portion of the guide ring 50 can be simultaneously cleaned. Chuck surface plate 3
The guide ring 50 removed from 0 is the chuck surface plate 3
If the brush head 80 is swung between the position C and the position B in FIG. 6 while slightly floating at the position of 0 concentricity, the chuck surface plate 30 and the guide ring 50 are washed at once. can do. At this time, the chuck surface plate 30 and the brush mounting base 100 of the brush head 80 are rotated, and the cleaning liquid is supplied through the cleaning liquid supply paths 104 and 106 of the brush mounting base 100 to the first brush 88,
It may be supplied to the second brush 102.

[0047]

As is apparent from the above description, according to the present invention, the guide ring can be removed to clean the chuck surface plate, so that the slurry can be easily and easily removed from the chuck surface plate without leaving the slurry. It can be completely removed, and it is possible to contribute to the improvement of polishing accuracy such that the wafer outer periphery can be processed with high accuracy.

Further, since the removed guide ring can be washed to completely remove the attached slurry, the guide ring can be securely and smoothly attached after washing.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a polishing apparatus according to the present invention.

FIG. 2 is a side view showing an embodiment of a polishing apparatus according to the present invention.

FIG. 3 is a sectional view of a chuck surface plate provided in the polishing apparatus according to the same embodiment.

FIG. 4 is a side view showing a brush head for cleaning the chuck surface plate.

FIG. 5 is a diagram showing a series of operations for cleaning the chuck surface plate by removing the guide ring from the chuck surface plate.

FIG. 6 is a plan view showing another embodiment of the polishing apparatus according to the present invention.

FIG. 7 is a view showing a claw member that holds a guide ring in the embodiment of FIG.

8 is a view showing a cross section of the claw member of FIG.

9 is a cross-sectional view showing the brush mount of the brush head in the embodiment of FIG.

FIG. 10 is a view showing a cleaning operation of the chuck surface plate and the guide ring in the embodiment of FIG.

FIG. 11 is a cross-sectional view showing a conventional chuck surface plate and polishing surface plate.

[Explanation of symbols]

30 chuck surface plate 32 backing pad 34 rotation axis 50 guide ring 52a, 52b claw members 56 Claw open / close mechanism 58 Revolving part 60 Lifting part 80 brush head 86 brush mount 88 First Brush 92 Laura 102 second brush

Claims (9)

[Claims] 1. A polishing apparatus for pressing a polishing cloth against a wafer while rotating the wafer and the polishing cloth and polishing the wafer with the polishing cloth while supplying a polishing agent, and a chuck surface plate which holds the wafer on an upper surface and rotates. A polishing platen attached to the lower surface of the polishing platen, which moves vertically and in a horizontal plane, and a guide ring which is detachably attached to the outer peripheral edge of the chuck platen and externally fitted to the wafer to position the wafer. And a guide ring attaching / detaching means for gripping the guide ring and attaching / detaching to / from the chuck surface plate, and a chuck surface plate cleaning means for cleaning an upper surface of the chuck surface plate while supplying a cleaning liquid to the chuck surface plate. And a polishing apparatus comprising: 2. The guide ring attachment / detachment means has a pair of claw members that engage with the guide ring, and a gripping mechanism that opens and closes the claw members to detachably grip the guide ring; The polishing apparatus according to claim 1, further comprising: a moving mechanism that moves in a horizontal direction and a horizontal direction. 3. The chuck surface plate cleaning means includes an arm that moves on a plane parallel to the chuck surface plate and in an up-and-down direction, and is rotatably attached to the arm and supplies a cleaning liquid and an actuator for a brush. A brush head built-in, a brush mounting base rotatably mounted on the brush head, and a brush for cleaning a chuck surface plate provided on a lower surface of the brush mounting base. The polishing apparatus according to. 4. A polishing apparatus for pressing a polishing cloth against a wafer while rotating the wafer and the polishing cloth and polishing the wafer with the polishing cloth while supplying a polishing agent, and a chuck surface plate which holds the wafer on an upper surface and rotates. A polishing platen attached to the lower surface of the polishing platen, which moves vertically and in a horizontal plane, and a guide ring which is detachably attached to the outer peripheral edge of the chuck platen and externally fitted to the wafer to position the wafer. And a guide ring attaching / detaching means for gripping the guide ring and attaching / detaching the guide ring to / from the chuck surface plate, and a guide ring detached from the chuck surface plate is washed while being held by the guide ring attaching / detaching means. And a guide ring cleaning means. 5. A polishing apparatus for pressing a polishing cloth against a wafer while rotating the wafer and the polishing cloth, and polishing the wafer with the polishing cloth while supplying a polishing agent, and a chuck surface plate which holds the wafer on an upper surface and rotates. A polishing platen attached to the lower surface of the polishing platen, which moves vertically and in a horizontal plane, and a guide ring which is detachably attached to the outer peripheral edge of the chuck platen and externally fitted to the wafer to position the wafer. And a guide ring attaching / detaching means for gripping the guide ring, attaching and detaching the guide ring to / from the chuck surface plate, and cleaning the upper surface of the chuck surface plate from which the guide ring is removed while supplying a cleaning liquid to the chuck surface plate. And a cleaning means for cleaning the guide ring removed by the guide ring attaching / detaching means. . 6. The guide ring has a convex portion that circulates on an outer peripheral portion thereof, and a claw portion of a gripping mechanism of the guide ring attaching / detaching means is engaged with the convex portion to rotate the guide ring. The polishing apparatus according to claim 4 or 5, further comprising a roller for holding the roller. 7. The guide ring attaching / detaching means has a pair of openable / closable claw members engaging with the guide ring, and the claw members attach / detach the guide ring with a roller for rotatably holding the guide ring. The polishing apparatus according to claim 4, further comprising: a gripping mechanism that grips the gripping mechanism and a moving mechanism that moves the gripping mechanism in a vertical direction and a horizontal direction. 8. The guide ring cleaning means includes an arm that moves on a plane parallel to the chuck surface plate and in an up-and-down direction, and is rotatably attached to the arm, supplies a cleaning liquid, and has a built-in brush actuator. A brush head that is rotatably attached to the brush head; and a brush that is provided on a side surface of the brush mount and that cleans the inner peripheral portion of the guide ring. Item 4. The polishing apparatus according to Item 4. 9. The brush, wherein the cleaning means is an arm that moves in a plane parallel to the chuck surface plate and in an up-down direction, and is rotatably attached to the arm, supplies a cleaning liquid, and has a brush actuator built therein. A head, a brush mount rotatably mounted on the brush head, a first brush for chuck surface plate cleaning provided on the lower surface of the brush mount, and a side face of the brush mount. A second brush for cleaning the inner peripheral portion of the guide ring is provided, and the polishing apparatus according to claim 5.