JP2000058632A - Material and method for packaging wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the identification marks of wafers confirmable, while the wafers are housed in a container in a packed state and to make the wafers easy to take out of the container, and at the same time, to facilitate wafer packaging materials to be separated one by one. SOLUTION: A wafer packaging material composed of a main body having nearly the same area and shape as those of one surface of a wafer and tags (extended pieces) provided in a state that the tags are extended outward from the peripheral edge of the main body is used. In a container 10, plural wafers and wafer packing materials are arranged alternately, with the wafers being arranged in horizontal states. At the time of arranging the wafers and wafer packing materials in the container 10, the numbers P of the wafers are marked on the front end sides of the tags of wafer packing materials, and the tags are arranged upward along the internal surface of the container 10 in such a way that the tags do not overlap each other. Then a cushioning material 11 is put on the uppermost wafer with one wafer packing material in between, and thereafter, the front end sides of the tags of the wafer packing materials are arranged on the upper surface of the cushioning material 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer packing material and a wafer packing method, and more particularly to a wafer packing material and a wafer packing method used for packing a wafer for storing or transporting a semiconductor substrate wafer. .

[0002]

2. Description of the Related Art Conventionally, for example, the following method is known as a method of packing a wafer for storing or transporting the wafer during a semiconductor device manufacturing process. First, as shown in FIG. 4, two kinds of cushioning materials 31 and 32 are provided in the lower portion of a hollow cylindrical container 30 having an open upper surface in a state of being stacked in this order. Next, the plurality of wafers 20 are stored on the cushioning material 32 in a horizontal state, that is, in a state in which both surfaces thereof are oriented vertically. At this time, in order to prevent the worker from directly touching both sides of each wafer 20 and to prevent dust from adhering to the wafer 20 due to static electricity or the like, the area of the wafer 20 is substantially equal to one side of the wafer 20 using tweezers. A thin packing material (not shown) made of paraffin paper having a predetermined shape is alternately arranged with the wafer 20.

[0003] Subsequently, two types of cushioning materials 32 and 31 are sequentially stacked on the uppermost wafer 20 via a packing material, and the container 30 is finally covered with a lid. finish. Conventionally, at the time of packing, for example, wafers 20 are stored in order of smaller or larger wafer number in one lot.

In such a packing method, since only a thin packing material is interposed between the wafers 20, the volume of the container 30 for storing the wafers 20, that is, the volume of the packing may be small.
Moreover, cushioning materials 31 provided above and below the plurality of wafers 20,
32 has the advantage that a plurality of wafers 20 can be stored and transported while protecting them.

[0005]

However, in the conventional wafer packing method, the wafer numbers are not described on each wafer to be stored in the container, and the wafers are stored in the container in ascending or descending order as described above. It is only stored. For this reason, as is clear from the plan view of FIG. 5 showing the state where the lid 33 has been removed from the container 30, even after removing the lid, the wafer number cannot be confirmed even after the wafer is completely packed. There is a problem that it is not possible to check if each piece is taken out and counted.

[0006] Further, since the wafers and the packing material housed in the container are all the same shape, there is a problem that it is difficult to take out the wafers housed in the container one by one, and it is not possible to carry out the work efficiently. Further, for the same reason, when taking out the wafer, it may not be possible to reliably hold the wafer with tweezers, and the wafer may be broken or chipped by mistake.

Further, since the conventional packaging material for a wafer is formed in the same shape with substantially the same area as the wafer, all surfaces of the packaging material come into contact with the wafer. Therefore,
As mentioned above, the handling of the packing material is always performed with tweezers. However, the paraffin paper used for packing materials is
Since several sheets are brought into close contact with each other during processing, they must be separated one by one and placed in a container. On the other hand, paraffin paper is obtained by applying or impregnating a paraffin liquid to thin translucent paper having a smooth surface to impart water resistance, and the surface is slippery. Therefore, when separating paraffin papers one by one using tweezers, it is difficult to separate them by slipping or the like, and there is also a disadvantage that it takes time to alternately arrange wafers and packing materials. ing.

[0008]

In order to solve the above-mentioned problems, a wafer packing material according to the present invention includes a packing material body having an area and a shape substantially equal to one side of a wafer, and is provided in a container having an open upper surface. When storing a plurality of wafers in a horizontal state, the packing material body is made of paraffin paper alternately arranged with each wafer, and the packing material body includes
An extended piece for providing an identification code of the wafer is provided in a state of extending outward from the peripheral edge.

Further, in the wafer packing method according to the present invention, each of a plurality of wafers is placed in a container having an open upper surface in a horizontal state and alternately arranged with a wafer packing material, and then the uppermost wafer is stored. A method of providing a buffer material having an area and a shape substantially equal to one side of a wafer via a wafer packaging material in a plan view upward, using the wafer packaging material of the above invention as the wafer packaging material, and providing a plurality of wafers in a container. When arranging each of the wafers alternately with the wafer packing material, the identification code of the wafer is given to the tip side of the extension piece of each wafer packaging material, and the position of the extension piece is not overlapped with each other. After the extension pieces are directed upward and along the inner surface of the container, and the cushioning material is provided on the uppermost wafer, the tip side of the extension piece of each wafer packing material is arranged on the upper surface of the cushioning material. It has become.

In the wafer packing material of the present invention, since the extension piece that does not come into contact with the wafer is provided on the packaging material body that is arranged alternately with the wafer and comes into contact with the wafer, the worker may touch the extension piece. It is possible. Therefore, even if several wafer packing materials are in close contact with each other, the work can be easily performed because the worker can touch the extended pieces to separate them one by one. Further, since the extension piece can be touched by an operator, a place, means, and the like for assigning a wafer identification code such as a wafer number to the extension piece are not limited.

Further, in the wafer packing material of the present invention, a plurality of wafers are provided on the uppermost wafer with a cushioning material having an area and a shape substantially equal to one surface of the wafer in a plan view via the packing material main body. It is to be stored in the container in the state of being extended, when the extension piece, a plurality of wafers are alternately arranged and stored in the container and the cushioning material is provided in the container,
If the peripheral edge of the wafer reaches the peripheral edge of the buffer material and the tip side is formed to have a length arranged on the upper surface of the buffer material,
When the wafer, the packing material main body, and the cushioning material are housed in the container as described above, it is possible to arrange the distal end side of the extension piece of each wafer packing material on the upper surface of the cushioning material. Therefore, the identification code of the wafer is given to the tip end side of the extension piece, and the extension pieces are provided so as not to overlap with each other. If the lid is provided on the container, the lid is removed and the extension piece is stored in the container. It is possible to immediately confirm the identification code of the wafer that has been set. Also, when taking out the wafer from the container, if the extension piece arranged on the upper surface of the cushioning material is slightly lifted, a gap is formed between the wafer and the lower layer, so that the wafer is easily taken out, and tweezers of the wafer are used. Grasping can be performed reliably.

In the wafer packing method of the present invention, since the wafer packing material of the above invention is used, when each of the plurality of wafers is alternately stored in the container with the wafer packing material, several wafer packing materials that are in close contact with each other are packed. Even if there is an operation for separating individual sheets, the operation can be performed very easily. When alternately arranging wafers and wafer packing materials in the container, a sign for wafer identification is given to the tip side of the extension piece of each wafer packaging material, and the positions of the extension pieces do not overlap each other. Done to
After providing the cushioning material on the uppermost wafer, the tip side of the extension piece of each wafer packing material is arranged on the upper surface of the cushioning material, so that the tip side of each extension piece is radially aligned with the upper surface of the cushioning material. Will be in the state provided. Therefore, when the lid is provided on the container and the lid is removed, the identification code of the wafer stored in the container can be immediately confirmed. Further, when taking out the wafer from the container, it is easy to take out the wafer by slightly lifting the extension piece disposed on the upper surface of the cushioning material, and it is possible to securely grip the wafer with tweezers.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing one embodiment of a wafer packing material according to the present invention, and FIG. 2 is an explanatory diagram of one embodiment of a wafer packing method according to the present invention. FIG. 3 is a plan view of a container in which wafers are stored by the method of the embodiment, and shows a state where a lid is removed from the container.

As shown in FIG. 1, a wafer packing material (hereinafter simply referred to as a packing material) 1 of the present embodiment includes a packing material main body 2 having an area substantially equal to one surface of a wafer and a substantially circular shape, and a packing material main body. 2 and a slender extension piece (hereinafter, referred to as a tag) 3 provided in a state of extending outward from the peripheral edge of the paper 2 and is formed of paraffin paper. As described above, paraffin paper is water resistant and extremely thin,
The structure of the packing material 1 such as protecting the wafer without increasing the volume of the finally obtained packing, and allowing the tag 3 to be placed along the container in an extremely thin gap between the wafer and the container as described later. It is a very suitable material.

As shown in FIG. 2, the packing material body 2 is arranged alternately with the wafers 20 when a plurality of wafers 20 are stored in a horizontal state in a container 10 having an open upper surface.
Both surfaces or one surface thereof is in direct contact with one surface of the wafer 20.

The tag 3 is for giving, for example, an identification code (symbol, number, etc.) of the wafer to the tip end side thereof, and two pieces are provided on the periphery of the packaging material body 2 at intervals. As will be described later, the length of the tag 3 is set such that when a plurality of wafers 20 are stored in the container 10 and the cushioning material 11 is provided on the uppermost wafer 20 via the packaging material body 2,
0 to the peripheral edge of the cushioning material 11, and the leading end side is formed to have a length arranged on the upper surface of the cushioning material 11. Further, the tag 3 is formed to have such a width that a strength that does not easily break even when the tag 3 disposed on the upper surface of the cushioning material 11 is lifted is obtained.

Next, an embodiment of the wafer packing method according to the present invention will be described based on the above-described packing method of the wafer 20 using the packing material 1. In the wafer packing method of the present embodiment,
First, the hollow cylindrical container 10 is facilitated. Container 10
As in the prior art, it is formed of a hollow cylindrical shape having an open upper surface, and has an inner diameter slightly larger than the diameter of the wafer 20 in order to prevent the wafer 20 stored in the container 10 from moving in the container 10. Has become.

First, a different kind of first cushioning material 11a having a predetermined thickness and substantially the same area and shape as the wafer 20 in a plan view is provided in such a container 10 as in the prior art. The cushioning member 11 including the second cushioning member 11b is provided. The cushioning material 11 is for alleviating various impacts such as vibration applied to the container 10 from above and below during transportation of the container 10 and the like. In the present embodiment, for example, the first cushioning material 11a made of
The second cushioning member 11b made of a soft foam such as a sponge is provided on the first cushioning member 11a.
Are provided in two layers.

Next, a plurality of wafers 2
0 is stored in a horizontal position. At this time, the tag 3 of each packing material
For example, a wafer number P is assigned as an identification number of the wafer 20 to the tip end of the wafer 20, and the packing materials 1 are alternately arranged with the wafer 20. That is, the wafer 20 stored in the container 10
Is written on the tip side of the tag 3 of the packing material 1, the packing material 1 is placed on the cushioning material 11, and the wafer 20 is further placed on the packing material body 2 of the packing material 1. The process is repeated until all the wafers 20 are stored. Then, the packing material 1 is arranged on the uppermost wafer 20.

When the wafer number P is written on the tip end of the tag 3 of the packing material 1, when the tip end of the tag 3 is arranged on the upper surface of the first cushioning material 11a in a later step, the surface becomes the upper surface. However, it may be written on both sides of the tag 3. Further, when the wafers 20 and the packing materials 1 are alternately arranged in the container 10, the positions of the tags 3 of the packing materials 1 are not overlapped. Then, the tag 3 is connected to the wafer 20 and the container 1.
0 and along the inner surface of the container 10 upward.

Next, the packing material 1 is placed on the uppermost wafer 20.
Through two layers of the second buffer material 11b and two layers of the first buffer material 1
1a are provided in this order, and the tip side of the tag 3 of each packing material 1 is arranged on the upper surface of the first cushioning material 11a. Finally, although not shown, the lid of the container 10 is closed, thereby completing the packing of the wafer 20.

As described above, in the method of the present embodiment, the wafers 20 and the packing materials 1 are alternately arranged in the container 10 so that the positions of the tags 3 of the respective packing materials 1 do not overlap with each other, and the buffer is placed on the uppermost wafer. After the material 11 is provided, the tip side of the tag 3 of each packing material 1 is disposed on the upper surface of the uppermost first buffer material 11a of the cushioning material 11, so that the tip side of each tag 3 is One cushioning material 11a is provided in a state of being radially arranged on the upper surface. Therefore, the wafer 2 stored in the container 10
When using 0, when the lid provided on the container 10 is removed,
The wafer number P of the wafer 20 in the container 10 can be immediately confirmed.

When the wafer 20 is taken out of the container 10, if the tag 3 arranged on the upper surface of the first cushioning material 11a is slightly lifted, a gap for inserting tweezers can be easily formed, and the wafer 20 can be taken out with tweezers. It can be grasped reliably. Therefore, the work of taking out the wafer 20 can be efficiently performed, and the wafer 20 can be prevented from being broken or chipped by mistake, which is effective in improving the production yield of the semiconductor device.

In the packing material 1 of the present embodiment, the packing material 1
The packing material 1 to be brought into contact with the wafer 20
By providing the tag 3 that does not touch the 0,
Since the operator can directly touch the tag 3, even if several packing materials 11 are in close contact with each other, the operator can touch the tag 3 and separate them one by one. Therefore, when each of the plurality of wafers 20 is alternately stored in the container 10 with the packing material 1, the operation of separating the packing materials 1 one by one can be performed very easily. Can be stored in a shorter time than before.

Since the operator can touch the tag 3, the place and means for writing the wafer number P on the tag 3 are not limited, and the tag 3 can be freely written. Further, since two pieces of tags 3 are provided on the peripheral edge of the packing material body 2, for example, one tag 3 has a wafer number P, and the other tag 3 has a code of another information related to the wafer 20, for example, a wafer. It is also possible to add management information of the wafer 20 engraved on the orientation flat portion of the wafer 20.

In this embodiment, an example is described in which two pieces of tags are provided on the periphery of the packaging material main body. However, only one piece of tag may be provided, or three or more tags may be provided. Also, the identification code of the wafer assigned to the tag is, of course, not limited to the wafer number.

[0027]

As described above, according to the present invention, since the extension piece that can be touched by the operator is provided on the packaging material body that comes into contact with the wafer of the wafer packaging material, When arranging wafers and wafer packing materials alternately, even if several wafer packing materials are in close contact with each other, the work of separating the individual pieces by touching the extended pieces can be easily and quickly performed. Can be done in time. Also, the wafers and the wafer packing materials are alternately arranged in the container so that the positions of the extending portions of the respective wafer packing materials do not overlap, and each wafer packing material is placed on the upper surface of the cushioning material provided on the uppermost wafer. Since the leading end side of the piece is arranged, when the lid is provided on the container, if the lid is removed, the identification code of the wafer stored in the container can be immediately confirmed. When removing the wafer from the container,
If the extension piece arranged on the upper surface of the cushioning material is slightly lifted, it can be easily taken out, and the wafer can be securely gripped with tweezers. Therefore, the wafer can be taken out efficiently, and it is possible to prevent the wafer from being broken or chipped by mistake. Therefore, the present invention is effective in improving the semiconductor device manufacturing yield.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a wafer packing material according to the present invention.

FIG. 2 is an explanatory diagram of one embodiment of a wafer packing method according to the present invention.

FIG. 3 is a plan view of a container in which wafers are stored by the method of the embodiment, and shows a state where a lid is removed from the container.

FIG. 4 is a perspective view for explaining a conventional wafer packing method.

FIG. 5 is a plan view of a container in which wafers are packed by a conventional method, showing a state where a lid is removed from the container.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Packing material, 2 ... Packing material main body, 3 ... Extension piece, 10 ... Container, 11 ... Buffer material, 20 ... Wafer, P ... Wafer number

Claims (4)

[Claims] 1. A packaging material body having an area and a shape substantially equal to one surface of a wafer, wherein when packing a plurality of wafers in a horizontally opened state in a container having an open upper surface, the packaging material body is attached to each wafer. Wafer packaging material made of paraffin paper arranged alternately, wherein the packaging material main body is provided with an extension piece for giving a wafer identification code in a state of extending outward from a peripheral edge thereof. A wafer packing material characterized by being characterized in that: 2. The method according to claim 1, wherein the plurality of wafers are provided with a cushioning material having an area and a shape substantially equal to one side of the wafer in a plan view on the uppermost wafer via the packing material main body. The extension pieces are arranged such that the plurality of wafers are alternately arranged in the container and the packing material main body in the container and the buffering material is provided, 2. The wafer packaging material according to claim 1, wherein a length extending from a peripheral edge to a peripheral edge of said buffer material is formed to a length arranged on an upper surface of said buffer material. 3. The wafer packaging material according to claim 1, wherein a plurality of the extension pieces are provided at intervals on a peripheral edge of the packaging material main body. 4. A plurality of wafers are placed in a container having an open upper surface in a horizontal state and alternately arranged with a wafer packing material, and then placed in a plan view above the uppermost wafer. A method of packing a wafer, wherein a cushioning material having an area and a shape substantially equal to one surface of the wafer is provided via the wafer packing material, wherein the wafer packing material has a packing material body having an area and a shape substantially equal to one surface of the wafer, An extension piece formed in a state of extending outward from the peripheral edge of the packaging material body, using a piece formed of paraffin paper, wherein each of the plurality of wafers is placed in the container in the wafer packaging material. When alternately arranged, a code for identifying the wafer is given to the tip side of the extension piece of each wafer packaging material, and the extension pieces are positioned so that they do not overlap with each other. Said upwards After providing the cushioning material on the uppermost wafer along the inner surface of the container, the tip side of the extension piece of each wafer packaging material is arranged on the upper surface of the cushioning material. Method.