JP2000058623A - Treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a treating device which can avoid thermal adverse effects to a treating unit, etc., from an object to be treated without deteriorating the throughput. SOLUTION: In a heat-treating unit, the height of supporting pins PIN from a surface of a plate P, which is set as a datum position when the pins PIN receive a wafer W from a transfer device 22 is set at h1. In a transfer mechanism (FXT), the height of supporting pins PIN from the surface of the plate P, when the pins PIN hold the wafer W after receiving the wafer W from the device 22, is set at h2. In this case, a relation h1<h2 is established between the heights h1 and h2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for applying and developing a resist on an object to be processed such as a semiconductor wafer.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, photolithography technology is used. In the photolithography technique, a resist is applied to the surface of a semiconductor wafer (hereinafter, simply referred to as a “wafer”), the applied resist is exposed to a predetermined pattern, and further developed. Thus, a resist film having a predetermined pattern is formed on the wafer, and a circuit having a predetermined pattern is formed by performing film formation and etching.

Conventionally, a series of resist coating and developing processes include a resist solution coating unit, a developing unit, a heating unit, and a cooling unit, a transport mechanism for transferring wafers between these units, and temporarily transferring wafers for transfer. This is performed using a coating and developing apparatus in which a holding transfer mechanism and the like are integrated.

In the above-described resist liquid application unit and the development processing unit, a spin chuck that holds the wafer so as to be able to move up and down in the cup is provided. Acceptance,
The spin chuck descends into the cup to perform the processing on the wafer. Similarly, in the heating processing unit and the cooling processing unit, a plate for heat-treating the wafer is provided in the unit, and support pins are provided so as to be able to protrude and retract from the surface thereof. Is received from the transport mechanism, and the heating process and the cooling process are performed in a state where the support pins are submerged from the plate, that is, in a state where the wafer is placed on the plate. Further, the transfer mechanism is configured by erecting support pins for holding a wafer on a plate.

[0005]

Incidentally, the temperature of the wafer transferred from the transfer mechanism into the unit may be different from the temperature of the cup or the temperature of the plate. In such a case, the wafer disturbs the temperature in the cup and the plate,
This will adversely affect the processing. Therefore, in consideration of such adverse thermal effects, it is desirable that the position where the wafer is received from the transfer mechanism and the position where processing and the like are performed in the unit are separated as much as possible. However, such separation causes a problem that the throughput is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and provides a processing apparatus capable of preventing a thermal adverse effect of an object to be processed on a processing unit or the like while suppressing a decrease in throughput. It is intended to be.

[0007]

According to a first aspect of the present invention, there is provided a processing apparatus having a transport mechanism, which transports an object to and from a plurality of processing units using the transport mechanism. A processing apparatus for transferring an object to and from a single transfer mechanism, wherein the loading / unloading height position in the processing unit or the transfer height position in the transfer mechanism is set between the processing unit or the transfer mechanism. It is characterized in that there are at least two types.

According to the first aspect of the present invention, the height position of the loading / unloading in the processing unit or the height position of the delivery in the delivery mechanism is arbitrarily set for each processing unit or the delivery mechanism, thereby improving the throughput. It is possible to avoid a thermal adverse effect of the object to be processed on the processing unit and the like while suppressing the reduction. That is, in the present invention, attention is paid to the fact that the degree of the thermal adverse effect received from the object to be processed is different for each processing unit and the like. By increasing the height position for loading and unloading, thermal adverse effects are avoided, and for processing units with a small degree of adverse thermal influence from the workpiece, the height position for loading and unloading is reduced. By improving the throughput, it is possible to avoid a thermal adverse effect of the object to be processed on the processing unit and the like while suppressing a decrease in the throughput as viewed from the entire processing apparatus.

According to a second aspect of the present invention, there is provided a processing apparatus comprising:
A processing unit configured to float the workpiece from a position where the workpiece is processed to a first height and deliver the workpiece, and a holding member provided on a base to a second height higher than the first height. A transfer mechanism that holds the object to be lifted and a transport mechanism that transfers and transports the object between at least the processing unit and the delivery mechanism;

[0010] In the transfer mechanism, temperature control is not normally performed because no thermal treatment is involved. Therefore, for example, when the high-temperature object is held by the transfer mechanism, the base is heated, and then, when the cooled object is held by the transfer mechanism, the object is heated from the base. Thermally affected. On the other hand, since the temperature is usually controlled in the processing unit, the degree to which the object is thermally affected is small as described above. Therefore, in the present invention according to claim 2, by making the distance between the base and the substrate holding position in the transfer mechanism longer than the distance between the processing position of the processing target in the processing unit and the transfer position of the processing target, A thermal adverse effect of the object to be processed in the transfer mechanism is avoided, and a decrease in throughput in the processing unit is suppressed.

According to a third aspect of the present invention, there is provided a processing apparatus comprising:
A heat treatment unit having a base for heat-treating the object to be processed, and transferring the object to be processed from the base at a first height by a holding member provided so as to be able to protrude and retract from the surface of the base; And a transfer mechanism that holds the object to be processed by being held at a second height higher than the first height by a holding member provided on a base, and at least the heat treatment unit and the transfer mechanism. A transport mechanism for transporting the object to be processed.

In the transfer mechanism, the object to be processed is exposed to a normal temperature atmosphere and temperature control is not performed. Therefore, in the same manner as described above, for example, when the workpiece to be processed is held by the transfer mechanism, the base is heated, and when the cooled workpiece is held by the transfer mechanism, the workpiece is And is adversely affected by heat. On the other hand, in the heat treatment unit, since the inside of the unit is under a heating atmosphere, there is almost no possibility that the object to be processed is adversely affected by heat. Therefore, in the present invention according to claim 3, the distance between the base and the substrate holding position in the transfer mechanism is made longer than the distance between the base in the heat treatment unit and the transfer position of the object to be processed. Thermal adverse effects on the object to be processed are avoided, and a decrease in throughput in the heat treatment unit is suppressed.

According to a fourth aspect of the present invention, there is provided a processing apparatus comprising:
A heat treatment unit having a base for heat-treating the object to be processed, and transferring the object to be processed from the base at a first height by a holding member provided so as to be able to protrude and retract from the surface of the base; And a base for cooling the object to be processed, and the object to be processed is set at a second height higher than the first height by a holding member provided so as to be able to protrude and retract from the surface of the base. The cooling processing unit includes a cooling processing unit that transfers the object to be processed, and a transport mechanism that transports an object to be processed between at least the heating processing unit and the cooling processing unit.

In the cooling processing unit, it takes a considerable time until the heated base returns to the original cooling temperature when the heated object is placed on the base. On the other hand, in the heat treatment unit, the time required for the cooled base to return to the original heating temperature when the cooled base is placed on the base is short. Therefore, in the present invention according to claim 4, the distance between the base in the cooling processing unit and the transfer position of the object to be processed is made longer than the distance between the base in the heat treatment unit and the transfer position of the object to be processed. In addition, a thermal adverse effect of the object to be processed in the cooling processing unit is avoided, and a decrease in throughput in the heating processing unit is suppressed.

According to a fifth aspect of the present invention, there is provided a processing apparatus comprising:
A heat treatment unit having a base for heat-treating the object to be processed, and transferring the object to be processed from the base at a first height by a holding member provided so as to be able to protrude and retract from the surface of the base; And a vertically movable holding member for holding the substrate. The holding member is lowered to supply a resist solution to the object to be processed, and the holding member is moved to a second position higher than the first height.
A resist liquid application unit that rises to a height and transfers the object, and a transport mechanism that transports the object between at least the heat treatment unit and the resist liquid application unit.

Strict temperature control is required in the resist liquid application unit, for example, in the cup for supplying the resist as compared with the heat treatment unit. Therefore, claim 5
In the present invention according to the description, the distance between the resist supply position of the object to be processed and the transfer position of the object to be processed in the resist liquid application unit is longer than the distance between the base in the heat treatment unit and the transfer position of the object to be processed. Thus, the thermal adverse effect of the object to be processed in the resist liquid application unit is avoided, and a decrease in throughput in the heat treatment unit is suppressed.

The processing apparatus of the present invention according to claim 6 is
A heat treatment unit having a base for heat-treating the object to be processed, and transferring the object to be processed from the base at a first height by a holding member provided so as to be able to protrude and retract from the surface of the base; And a holding member that can move up and down to hold the substrate. The holding member is moved down to perform development processing on the object to be processed, and the holding member is moved to a second height higher than the first height. A development processing unit that rises and transfers the object to be processed,
And a transport mechanism for transporting the object to be processed between at least the heating processing unit and the developing processing unit.

Strict temperature control is required in a developing unit, for example, in a cup for performing a developing process, as compared with a heating unit. Therefore, in the present invention according to claim 6, the distance between the development processing position of the object to be processed in the development processing unit and the delivery position of the object to be processed is determined by the distance between the base in the heating processing unit and the delivery position of the object to be processed. By making the length longer, it is possible to avoid a thermal adverse effect on the object to be processed in the development processing unit, and to suppress a decrease in throughput in the heating processing unit.

According to a seventh aspect of the present invention, there is provided a processing apparatus comprising:
A developing member that holds the substrate and that can be moved up and down to perform a developing process on the object to be processed by lowering the holding member and to transfer the object by raising the holding member to a first height; A processing unit and a vertically movable holding member for holding the substrate, the holding member being lowered to supply a resist solution to the object to be processed, and the second holding member being higher than the first height. The apparatus includes a resist liquid application unit that rises to a height and transfers the object, and a transport mechanism that transports the object between at least the development processing unit and the resist liquid application unit.

Strict temperature control is required in the resist liquid application unit, for example, in the cup for supplying the resist liquid, as compared with in the development processing unit, for example, in the cup for performing the development processing. Therefore, in the present invention according to claim 7, the distance between the resist application position of the object to be processed in the resist liquid application unit and the transfer position of the object to be processed is determined by the development processing position of the object to be processed in the development processing unit and the object to be processed. By making the distance longer than the transfer position, the thermal adverse effect of the object to be processed in the resist liquid application unit is avoided, and a decrease in throughput in the development processing unit is suppressed.

The processing apparatus of the present invention according to claim 8 is
A first base having a base for heat-treating the object to be processed, wherein the object to be processed is lifted from the base to a first height and transferred from the base by a holding member provided so as to be able to protrude and retract from the surface of the base; A heat treatment unit, and a base for heat-treating the object to be processed. A second heat treatment unit that is transferred at a height of 2 and a transport mechanism that transports the object between at least the first heat treatment unit and the second heat treatment unit.

The heat treatment unit may be of a type requiring more strict temperature control, in addition to a normal heat treatment unit. Therefore, in the present invention according to claim 8, the distance between the base and the delivery position of the object to be processed in the heat treatment unit having strict temperature management is determined by the distance between the base and the delivery position of the object to be processed in the normal heat treatment unit. By setting the length to be longer than the distance, a thermal adverse effect of the object to be processed in the heat treatment unit having strict temperature control is avoided, and a decrease in throughput in a normal heat treatment unit is suppressed.

According to a ninth aspect of the present invention, there is provided a processing apparatus comprising:
9. The processing apparatus according to claim 4, wherein a speed at which the object is lowered from the second height is lower than a speed at which the object is lowered from the first height. 10. Is also slow.

According to the ninth aspect of the present invention, the speed at which the object is lowered from the second height is set lower than the speed at which the object is lowered from the first height. It is possible to more sufficiently avoid thermal adverse effects on the body.

According to a tenth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member in a vertically movable manner, an elevating mechanism that moves the holding member up and down, and a holding member that receives the object to be processed from the transport mechanism at a first height higher than a processing position; Control means for controlling the elevating mechanism so as to transfer the object to be processed to the transfer mechanism at a second height lower than the height of the transfer mechanism.

According to the tenth aspect of the present invention, the holding member receives the object to be processed from the transfer mechanism at the first height higher than the processing position, and the holding member receives the object at the second height lower than the first height. By transferring the processing body to the transport mechanism,
The time required for the object to be lowered to the processing position becomes longer, and the time required for the object to be processed to rise to the transfer position becomes shorter. In other words, by increasing the descent time, the processing target that has been in an environment different from the temperature environment in the processing apparatus adapts to the temperature environment in the processing apparatus, and the adverse thermal effect of the processing target can be avoided. . On the other hand, a decrease in throughput can be suppressed by shortening the rise time.

An eleventh aspect of the present invention is a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member, a lifting mechanism that moves the holding member up and down, and a holding member that has received the object to be processed from the transport device at a first speed to a processing position, where the processing is completed. The holding member for holding a body is the first member.
Control means for controlling the elevating mechanism so as to ascend at a second speed higher than the second speed and deliver the same to the transfer device.

In the eleventh aspect of the present invention, the holding member that has received the object to be processed from the transfer device is moved down to the processing position at the first speed, and the holding member that holds the object to be processed is moved to the first position. By raising the workpiece at the second speed higher than the speed of 1 and transferring it to the transfer device, the time for the workpiece to be lowered to the processing position becomes longer, and the processed workpiece is raised to the delivery position. The time to do it is shorter. In other words, by increasing the descent time, the processing target that has been in an environment different from the temperature environment in the processing apparatus adapts to the temperature environment in the processing apparatus, and the adverse thermal effect of the processing target can be avoided. . On the other hand, a decrease in throughput can be suppressed by shortening the rise time.

According to a twelfth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the member so as to be able to move up and down, an elevating mechanism that moves the holding member up and down, and the holding member that has received the object to be processed from the transfer device at the receiving position is lowered to the processing position at a first speed, and the processing ends Moving the holding member holding the processed object at a second speed higher than the first speed to a transfer position at a position lower than the receiving position and transferring the holding member to the transfer device. Control means for controlling the mechanism.

According to the twelfth aspect of the present invention, the holding member that has received the object from the transfer device at the receiving position is the first member.
The transfer device moves down to the processing position at a speed of 2, and raises the holding member holding the processed object at a second speed higher than the first speed to a transfer position lower than the receiving position at a second speed higher than the first speed. By transferring the object, the time for the object to be lowered to the processing position becomes longer, and the time for the object to be processed to rise to the transfer position becomes shorter. In other words, by making the descent time longer,
The time required for the object to be processed, which has been in an environment different from the temperature environment in the processing apparatus, to adjust to the temperature environment in the apparatus is longer, and it is possible to avoid adverse thermal effects on the object to be processed. On the other hand, a decrease in throughput can be suppressed by shortening the rise time.

According to a thirteenth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to / from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member, a lifting mechanism that moves the holding member up and down, and the holding member that has received the object to be processed from the transport device is lowered, temporarily stopped at a predetermined position, and then lowered to the processing position. And control means for controlling the elevating mechanism so as to lift the holding member holding the object to be processed and deliver it to the transfer device.

According to the thirteenth aspect of the present invention, the holding member that has received the object to be processed from the transfer device is lowered, temporarily stopped at a predetermined position, and then lowered to the processing position. By raising the holding member to be held and transferring it to the transfer device, the time for the object to be lowered to the processing position is increased, and the time for the object to be processed to be raised to the transfer position is reduced. Become. In other words, by increasing the descent time, the processing target that has been in an environment different from the temperature environment in the processing apparatus adapts to the temperature environment in the processing apparatus, and the adverse thermal effect of the processing target can be avoided. . On the other hand, a decrease in throughput can be suppressed by shortening the rise time. Further, in the present invention, since the above-described time control is performed by temporarily stopping the holding member, the control can be performed more easily.

According to a fourteenth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member, a lifting mechanism that moves the holding member up and down, and a holding member that receives the object to be processed from the transport device, descends to a processing position, and holds the object to be processed. Control means for controlling the elevating mechanism so that at least one of the descending speed and the ascending speed is changed stepwise so that the ascending time is shorter when the holding member is elevated and transferred to the transport device. Is provided.

According to the fourteenth aspect of the present invention, at least one of the descending speed and the ascending speed is changed stepwise so that the ascending time is shorter, so that the temperature is different from the temperature environment in the processing apparatus. The time required for the object to be processed to adapt to the temperature environment in the apparatus becomes longer, so that it is possible to avoid thermal adverse effects on the object to be processed, while suppressing a decrease in throughput. Further, in the present invention, since the time control as described above is performed by changing the speed stepwise, the control can be performed more easily.

[0035]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a coating and developing apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the coating and developing apparatus shown in FIG. 1, and FIG. 3 is a diagram of the coating and developing system shown in FIG. It is a rear view.

As shown in FIGS. 1 to 3, the coating and developing apparatus 1 has a configuration in which a cassette station 10, a processing station 11, and an interface unit 12 are integrally connected. At the cassette station 10,
A plurality of wafers W are loaded into the coating and developing apparatus 1 from the outside in units of cassettes C, for example, in units of 25 wafers, and are unloaded from the coating and developing apparatus 1 to the outside. Further, the wafer W is unloaded and loaded into the cassette C. In the processing station 11, various single-wafer processing units for performing a predetermined process on the wafers W one by one in the coating and developing process are arranged at predetermined positions in multiple stages. Interface section 12
Then, the wafer W is transferred to and from the exposure apparatus 13 provided adjacent to the coating and developing apparatus 1.

In the cassette station 10, as shown in FIG.
A plurality (for example, four) of cassettes C are placed in a row in the X direction (vertical direction in FIG. 1) with their respective wafer W entrances facing the processing station 11 side. This cassette C arrangement direction (X direction) and the wafer W arrangement direction of the wafers W accommodated in the cassette C (Z direction; vertical direction)
Is movable along the transfer path 21a, and selectively accesses each cassette C.

The wafer carrier 21 is configured to be rotatable in the θ direction.
The alignment unit (ALIM) and the extension unit (EXT) belonging to the multi-stage unit in the third processing unit group G3 on the side can also be accessed.

In the processing station 11, as shown in FIG. 1, a vertical transfer type transfer device 22 is provided at the center thereof, around which various processing units are multi-tiered in one or more sets. They are arranged to form a processing unit group. In the coating and developing processing apparatus 1, five processing unit groups G1, G2, G3, G4, and G5 can be arranged, and the first and second processing unit groups G1, G1,
G2 is disposed on the front side of the system, the third processing unit group G3 is disposed adjacent to the cassette station 10, and the fourth processing unit group G4 is disposed on the interface unit 1.
5, and a fifth processing unit group G5 indicated by a broken line can be arranged on the back side. The transfer device 22 is configured to be rotatable in the θ direction and movable in the Z direction, and is capable of transferring the wafer W to and from each processing unit.

In the first processing unit group G1, as shown in FIG. 2, two spinner-type processing units, for example, a resist liquid application unit (FIG. 2) for performing a predetermined processing by placing a wafer W on a spin chuck in a cup CP. COT) and the development processing unit (DEV) are stacked in two stages from the bottom. And like the first processing unit group G1, the second
Also in the processing unit group G2, two spinner type processing units, for example, a resist liquid application unit (COT)
And a development processing unit (DEV) are stacked in two stages from the bottom.

As shown in FIG. 2, a high-performance filter 23 such as an ULPA filter is provided above the coating and developing apparatus 1 in the three zones (cassette station 10, processing station 11, interface section 1).
2) It is provided for each. When the air supplied from the upstream side of the high-performance filter 23 passes through the high-performance filter 23, particles and organic components are collected and removed. Therefore, through this high-performance filter 23,
The above-mentioned cassette mounting table 20, the transfer path 21a of the wafer transfer body 21, the first and second processing unit groups G1 and G2, and the third to fifth processing unit groups G3, G4 and G5 and the interface unit 12 described later. In the figure, a downflow of clean air from above is supplied in the direction of the solid arrow or the dotted arrow in FIG.

In the third processing unit group G3, as shown in FIG. 3, an oven-type processing unit for performing a predetermined processing by placing the wafer W on the mounting table, for example, a cooling processing unit (COL) for performing a cooling processing, An adhesion unit (AD) for performing a so-called hydrophobizing process for improving the fixability of a resist, and an alignment unit (A) for performing positioning.
LIM), an extension unit (EXT) as a transfer mechanism, and a pre-baking unit (PREBA) as a heat processing unit for performing heat processing before exposure processing.
KE) and post-baking unit (POBAKE)
Are stacked in order from the bottom, for example, in eight stages.

Similarly, in the fourth processing unit group G4,
As shown in FIG. 3, an oven-type processing unit that performs a predetermined process by placing the wafer W on a mounting table, for example, a cooling process unit (COL) that performs a cooling process, and an extension / cooling process unit (EXTCOL) that also serves as a cooling process ),
Extension unit (EX
T), an adhesion unit (AD), a pre-baking unit (PREBAKE), and a post-baking unit (POBAKE) are stacked, for example, in eight stages from the bottom.

As described above, the cooling processing unit (COL) and the extension / cooling processing unit (EXTCOL) having the low processing temperature are arranged in the lower stage, and the pre-baking unit (PREBAKE), the post-baking unit (POBAKE) and the ad- By arranging the fusion unit (AD) in the upper stage, thermal mutual interference between the units can be reduced.

As shown in FIG. 1, the interface section 12 has the same dimensions in the depth direction (X direction) as the processing station 11, but has a smaller size in the width direction. As shown in FIGS. 1 and 2, a portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages on the front side of the interface unit 12, and the peripheral exposure device 24 is arranged on the rear side. Are arranged.

At the center of the interface section 12, a wafer carrier 25 is provided. Wafer carrier 25
Are moved in the X direction and the Z direction (vertical direction) to access the cassettes CR and BR and the peripheral exposure device 24. The wafer transfer body 25 is configured to be rotatable also in the θ direction.
Extension unit (EXT) belonging to the fourth processing unit group G4 on the side, and furthermore, the adjacent exposure apparatus 1
The wafer delivery table (not shown) on the third side can also be accessed.

FIG. 4 shows the heat treatment unit (PREB)
AKE, POBAKE) and cooling processing unit (CO
It is a front view which shows the structure of L). As shown in FIG. 4, a plate P is disposed substantially at the center of the unit.
This plate P is a heat treatment unit (PREBAKE,
In the case of POBAKE, for example, a pipe through which a thermal solvent circulates is embedded, and functions as a hot plate for heating the wafer W. If the plate P is a cooling processing unit (COL), for example, a pipe through which a cooling solvent circulates is embedded, and functions as a cooling plate for cooling the wafer W.

On the surface of the plate P, a plurality of, for example, three, support pins PIN as a holding member for supporting the wafer W are provided so as to be able to come and go. And the support pin P
With the IN protruding from the plate surface, the wafer W is transferred to and from the transfer device 22 through the opening 30. Further, the wafer W is transferred from the transfer device 22 to the support pins PIN.
When the support pin PIN is placed on the plate P, the support pin PIN descends to be immersed below the surface of the plate P. Thereby, the wafer W
Is placed on a plate P, and a heating process or a cooling process is performed.

By providing a jetting means for jetting a heating gas or a cooling gas around the plate P, it is possible to enhance the heating effect and the cooling effect. In addition, since the down-flow clean air flows in the unit, the cooling effect can be enhanced by the down-flow clean air especially in the cooling unit.

FIG. 5 is a front view showing the structure of the above-mentioned transfer mechanism (EXT). As shown in FIG. 5, a plate P is disposed substantially at the center of the unit. On the surface of the plate P, a plurality of, for example, three support pins PIN as standing members are erected. Then, the wafer W is transferred to and from the cassette station 10 by the wafer transfer body 21 through the first opening 31 and the second transfer is performed.
The transfer of the wafer W to / from the transfer device 22 in the processing station 11 is performed through the opening 32 of the wafer W.

FIG. 6 shows the above resist solution applying unit (C)
FIG. 2 is a front view illustrating the configuration of an OT) and a development processing unit (DEV). As shown in FIG. 6, a cup CP is arranged substantially at the center of the unit. In the cup CP, the wafer W is moved by, for example, a vacuum suction mechanism (not shown).
Is disposed. The spin chuck SP is moved up and down and rotated by a driving unit 41. Also, the spin chuck S
Above P, there is arranged a nozzle 41 for supplying a resist liquid in the case of a resist liquid application unit, and for supplying a developer in the case of a development processing unit. Then, with the spin chuck SP protruding from the upper opening of the cup CP, the wafer W is transferred to and from the transfer device 22 through the opening 43. Further, when the wafer W is placed on the spin chuck SP by the transfer device 22, the spin chuck SP descends and is accommodated in the cup CP,
The supply of the resist solution or the developing solution is performed while rotating the wafer W in the cup CP.

FIG. 7 shows the heat treatment unit (POBA)
FIG. 9 is a diagram showing a relationship between KE) and a delivery mechanism (EXT). As shown in FIG. 7A, the heat treatment unit (PO
BAKE), when the surface of the plate P is set to the reference position (height 0), the height of the position where the support pins PIN receive the wafer W from the transfer device 22 is h1, as shown in FIG. In the transfer mechanism (EXT), if the height of the position where the support pins PIN receive and hold the wafer W from the transfer device 22 is h2 when the surface of the plate P is at the reference position (height 0), h1 < h2.

In the present embodiment, the above relationship makes it possible to avoid adverse thermal effects on the wafer W in the transfer mechanism (EXT). That is, even when the heated wafer W is held in the transfer mechanism (EXT), the distance h2 between the plate P and the wafer W is sufficiently maintained, so that the plate P is heated. There is no. Therefore, even if the cooled wafer W is held in the transfer mechanism (EXT), the plate P does not adversely affect the wafer W thermally. On the other hand, the heat treatment unit (POBA
In KE), a decrease in throughput can be suppressed. That is, since the distance between the position where the support pin PIN receives the wafer W from the transfer device 22 and the plate P is short, the time for lowering the wafer W to the plate P can be shortened, and the support pin PIN transfers the wafer W from the transfer device 22. Substantial heating will be performed from the receiving position. Therefore, the time required for the heat treatment is reduced.

FIG. 8 shows the heat treatment unit (POBA)
FIG. 3 is a diagram showing a relationship between the KE) and the cooling processing unit (COL). As shown in FIG. 8A, in the heat treatment unit (POBAKE), when the surface of the plate P is at a reference position (height 0), the support pins PIN
The height of the position at which the sheet is received from the transfer device 22 is h1, and FIG.
As shown in (B), in the cooling processing unit (COL), when the surface of the plate P is set to the reference position (height 0), the height of the position at which the support pins PIN receive the wafer W from the transfer device 22 is determined. Assuming that h3, h1 <h3.

In this embodiment, the above-described relationship can avoid the adverse thermal effect of the wafer W in the cooling processing unit (COL). That is, even when the heated wafer W is held in the cooling processing unit (COL), since the distance h3 between the plate P and the wafer W is sufficiently maintained, the plate P is overheated. There is nothing. Moreover, since the wafer W is exposed to the cooling gas or the down-flow clean air until the wafer W reaches the plate P, by taking this distance h3 sufficiently, the wafer W can reach the plate P. The wafer W is cooled, and its effect is enhanced. on the other hand,
A decrease in throughput in the heat treatment unit (POBAKE) can be suppressed. That is, the support pin PIN
Since the distance between the position where the wafer W is received from the transfer device 22 and the plate P is short, the time for lowering the wafer W to the plate P can be shortened, and the support pins PIN substantially move from the position where the wafer W is received from the transfer device 22. Heating will be performed. Therefore, the time required for the heat treatment is reduced.

FIG. 9 shows the heat treatment unit (POBA)
FIG. 4 is a diagram showing a relationship between KE) and a resist liquid application unit (COT). As shown in FIG. 9A, in the heat treatment unit (POBAKE), when the surface of the plate P is at the reference position (height 0), the height of the position at which the support pins PIN receive the wafer W from the transfer device 22 is increased. As shown in FIG. 9B, the resist liquid application unit (CO
In T), when the position at which the spin chuck SP moves down into the cup CP and the resist solution is applied is set as the reference position (height 0), the spin chuck SP moves up and receives the wafer W from the transfer device 22. Assuming that the height of the position is h4, a relationship of h1 <h4 is established.

In this embodiment, the above-described relationship can avoid adverse thermal effects on the wafer W in the resist liquid application unit (COT). That is, since there is a sufficient distance h4 between the spin chuck SP receiving the wafer from the transfer device 22 and the supply position in the cup CP, the wafer W adapts to the temperature atmosphere in the resist liquid coating unit (COT) during this time. become. Therefore, the wafer W accommodated in the cup CP does not disturb the temperature environment in the cup CP. On the other hand, it is possible to suppress a decrease in throughput in the heat treatment unit (POBAKE). That is, since the distance between the position where the support pin PIN receives the wafer W from the transfer device 22 and the plate P is short, the time for lowering the wafer W to the plate P can be shortened, and the support pin PIN transfers the wafer W to the transfer device 2.
Substantial heating will be performed from the position received from Step 2. Therefore, the time required for the heat treatment is reduced.

FIG. 10 shows the heat treatment unit (POB)
FIG. 3 is a diagram illustrating a relationship between AKE) and a development processing unit (DEV). As shown in FIG. 10A, in the heat treatment unit (POBAKE), when the surface of the plate P is at the reference position (height 0), the height of the position where the support pins PIN receive the wafer W from the transfer device 22 is increased. H1 and FIG.
As shown in (B), in the development processing unit (DEV), when the position where the spin chuck SP is lowered into the cup CP and the developer is supplied is set to the reference position (height 0), the spin chuck SP Rises and the height of the position for receiving the wafer W from the transfer device 22 is h5, h1 <h
The relationship is 5.

In this embodiment, the above-described relationship makes it possible to avoid adverse thermal effects on the wafer W in the developing unit (DEV). That is, since there is a sufficient distance h5 between the spin chuck SP receiving the wafer from the transfer device 22 and the supply position in the cup CP, the wafer W adapts to the temperature atmosphere in the development processing unit (DEV) during this time. Become. Therefore, cup CP
The wafer W accommodated therein does not disturb the temperature environment in the cup CP. On the other hand, the heat treatment unit (POBAK
The decrease in throughput in E) can be suppressed. That is, since the distance between the position where the support pin PIN receives the wafer W from the transfer device 22 and the plate P is short, the time for lowering the wafer W to the plate P can be shortened, and the support pin PIN transfers the wafer W from the transfer device 22. Substantial heating will be performed from the receiving position. Therefore, the time required for the heat treatment is reduced.

FIG. 11 shows the development processing unit (DE
FIG. 5 is a diagram showing a relationship between V) and a resist liquid application unit (COT). As shown in FIG. 11A, in the development processing unit (DEV), when the position where the spin chuck SP is lowered into the cup CP and the developing solution is supplied is set as the reference position (height 0), The height of the position at which the chuck SP is raised to receive the wafer W from the transfer device 22 is h
5. As shown in FIG. 11B, in the resist liquid application unit (COT), the spin chuck SP
When the position at which the resist liquid is applied by descending into P is set as the reference position (height 0), the height of the position at which the spin chuck SP rises and receives the wafer W from the transfer device 22 is h.
Assuming that 4, h5 <h4.

In this embodiment, in the resist liquid application unit (COT), there is a sufficient distance h4 from the time when the spin chuck SP receives the wafer from the transfer device 22 to the supply position in the cup CP. (CP) in resist solution coating unit (COT) that requires stricter temperature control compared to (DEV)
It will not disturb the temperature environment inside. On the other hand, a decrease in throughput in the development processing unit (DEV) can be suppressed.

FIG. 12 is a diagram showing the relationship between a chilling heat treatment unit as a first heat treatment unit and a normal heat treatment unit (POBAKE) as a second heat treatment unit. The chilling heat treatment unit has a heat treatment unit and a cooling treatment unit provided side by side, and requires stricter temperature management than an ordinary heat treatment unit.

As shown in FIG. 12 (A), when the surface of the plate P is set at the reference position (height 0) in the ordinary heat treatment unit (POBAKE), the support pins PIN
Is the height of the position at which the wafer W is received from the transfer device 22 by h
1. As shown in FIG. 12 (B), in the chilling heat treatment unit, the surface of the plate P is set at the reference position (height 0).
The support pins PIN transfer the wafer W to the transfer device 2
Assuming that the height of the position received from 2 is h6, h1 <h6
The relationship has been.

In this embodiment, the above-described relationship can avoid adverse thermal effects on the wafer W in the chilling heat treatment unit. On the other hand, it is possible to suppress a decrease in throughput in a normal heat treatment unit (POBAKE). In addition, POBAKE and PR
Between EBAKE and chilling heat treatment unit and PRE
A similar relationship can be provided with BAKE.

The present invention can be modified and implemented as follows. That is, in the cooling processing unit (COL), the speed at which the support pins PIN descend on the plate after receiving the wafer W from the transfer device 22 is determined by the rate at which the support pins PIN transfer the wafer W to the transfer device 22 in the heating processing unit (POBAKE). Slower than the speed of falling on the plate after receiving. This makes it possible to more sufficiently avoid adverse thermal effects in the cooling processing unit (COL), and the heating processing unit (POBAK).
In E), a decrease in throughput can be further suppressed. Such a modification is also possible between other processing units.

Next, another embodiment of the present invention will be described. FIG. 13 is a front view showing a configuration of a cooling processing unit (COL) according to another embodiment of the present invention. In FIG. 13, reference numeral 51 denotes an elevating mechanism for elevating and lowering the support pin PIN, and reference numeral 52 denotes a control unit for controlling the elevating mechanism 51 so as to satisfy the following relationship. That is, in the cooling processing unit (COL),
When the surface of the plate P is at the reference position (height 0),
Assuming that the height of the position where the support pin PIN receives the wafer W from the transfer device 22 is h7 and the height of the position where the support pin PIN transfers the wafer W from the transfer device 22 is h8, h7>
h8.

In this embodiment, the above relationship reduces the time for which the wafer W is lowered to the cooling plate P, and shortens the time for which the processed wafer W is raised to the transfer position. As a result, it is possible to avoid adverse thermal effects on the wafer W and suppress a decrease in throughput.

Incidentally, as shown in FIG.
The support pins PIN, which has received the wafer W, are lowered to the plate P at a low speed (first speed), and the support pins PIN holding the processed wafer W are raised at a high speed (second speed).
The same effect can be obtained even if the transfer speed is increased to the transfer speed and transferred to the transport device 22.

As shown in FIG. 15, the above-described height control and speed control may be combined.

Further, as shown in FIG.
The support pins PIN receiving the wafer W from 2 are lowered, temporarily stopped at a predetermined position, and then lowered to the plate P to hold the processed wafer W.
The same effect can be obtained even if is raised and transferred to the transport device 22 without stopping. Further, control can be performed more easily than in the above example.

Further, at least one of the descending speed and the ascending speed may be varied stepwise so that the ascending time is shorter.

The present invention can be applied not only to the cooling processing unit but also to a heating processing unit, a developing processing unit, a resist liquid applying unit and the like.

The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the processing station 11 is provided with the vertical transfer type transfer device 2 at the center thereof.
Although it was a vertical type having two, as shown in FIG.
The present invention is also applicable to a processing station 50 in which each processing unit is arranged on both sides of the transport path 51. In this case, a transport device 52 that can also move in the Y direction is disposed on the transport path 51, and transfer mechanisms 53 and 54 are disposed at both ends of the transport path 51. Further, the present invention is applicable not only to a processing apparatus for processing a wafer W, but also to another substrate, for example, an LC.
Naturally, the present invention can also be applied to a processing apparatus for processing a D substrate or the like.

[0075]

As described above, according to the processing apparatus of the first aspect of the present invention, the processing apparatus has a transfer mechanism, and the transfer mechanism loads and unloads an object to and from a plurality of processing units. And a processing device for transferring the object to be processed to at least one delivery mechanism, wherein the loading / unloading height position in the processing unit or the delivery height position in the delivery mechanism is the processing unit or the delivery mechanism. Since there are at least two types between the above, it is possible to avoid a thermal adverse effect of the object to be processed on the processing unit and the like while suppressing a decrease in throughput.

According to the processing apparatus of the present invention, the processing unit is provided on the base, and the processing unit is configured to transfer the object to be processed by floating the object at the first height from the position for processing the object. The second height higher than the first height by the holding member.
A transfer mechanism that holds the object to be processed while floating at a height of
Since at least the processing unit and the transfer mechanism are configured to include a transport mechanism that transfers and transports the target object between the processing unit and the transfer mechanism, it is possible to avoid a thermal adverse effect of the target object in the transfer mechanism, A decrease in throughput can be suppressed.

According to the processing apparatus of the present invention, there is provided a base for heating the object to be processed, and the processing member is provided with a holding member provided so as to be able to protrude and retract from the surface of the base. A heat treatment unit for transferring the body from the base to a first height and transferring the body to a second height higher than the first height by a holding member provided on the base; The transfer mechanism for holding and the transport mechanism for transporting the workpiece between at least the heat treatment unit and the delivery mechanism are configured to avoid adverse thermal effects of the workpiece in the delivery mechanism. In addition, a decrease in throughput in the heat treatment unit can be suppressed.

According to the processing apparatus of the present invention, there is provided a base for heating the object to be processed, and the processing member is provided by a holding member provided so as to be able to protrude and retract from the surface of the base. A heat treatment unit for transferring the body from the base to the first height, and a base for cooling the body to be processed, and a holding member provided so as to be able to protrude and retract from the surface of the base. A cooling unit that floats and transfers the object to be processed at a second height higher than the first height, and a transport mechanism that transports the object between at least the heating unit and the cooling unit. Therefore, it is possible to avoid a thermal adverse effect of the object to be processed in the cooling processing unit, and to suppress a decrease in throughput in the heating processing unit.

According to the processing apparatus of the present invention, there is provided a base for heating the object to be processed, and the processing member is provided by a holding member provided so as to be able to protrude and retract from the surface of the base. A heat treatment unit that lifts the body from the base to a first height and transfers the body, and a holding member that holds the substrate that can be moved up and down. The holding member is raised to a second height higher than the first height to transfer the object to be processed, and at least the heat treatment unit and the resist liquid applying unit to transfer the object to be processed. Since the apparatus is provided with the transport mechanism for transporting the processing object, it is possible to avoid a thermal adverse effect on the processing object in the resist liquid application unit and suppress a decrease in throughput in the heat processing unit.

According to the processing apparatus of the present invention, there is provided a base for heating the object to be processed, and the processing member is provided by a holding member provided so as to be able to protrude and retract from the surface of the base. A heating processing unit for transferring the body from the base to the first height and transferring the body, and a holding member for holding the substrate, which can be moved up and down, and performing a developing process on the object by lowering the holding member; The holding member is moved to a second position higher than the first height.
Since it is configured to include a development processing unit that rises to a height and transfers the object to be processed, and a transport mechanism that transports the object to be processed between at least the heating processing unit and the development processing unit, It is possible to avoid a thermal adverse effect on the object to be processed in the development processing unit, and to suppress a decrease in throughput in the heating processing unit.

According to the processing apparatus of the present invention, there is provided a holding member which holds the substrate and which can be moved up and down.
A developing unit that raises the holding member to a first height and transfers the object to be processed, and a holding member that can move up and down to hold the substrate; And a resist liquid application unit that raises the holding member to a second height higher than the first height and transfers the object to be processed, and at least the developing unit and the resist liquid application unit. Since the apparatus is provided with a transport mechanism for transporting the object to be processed therebetween, thermal adverse effects of the object to be processed in the resist liquid application unit can be avoided, and a decrease in throughput in the development processing unit can be suppressed.

According to the eighth aspect of the present invention, there is provided a base for heating the object to be processed, and the object to be processed is held by a holding member provided so as to be able to protrude and retract from the surface of the base. A first heat treatment unit that is transferred from the base to the first height and transferred, and a base for heat-treating the object to be processed,
A second heat treatment unit for transferring the object to be processed from the base to a second height higher than the first height by a holding member provided to be able to protrude and retract from the surface of the base; And a transport mechanism for transporting the target object between the first heat processing unit and the second heat processing unit. An adverse effect can be avoided, and a decrease in throughput in a normal heat treatment unit can be suppressed.

According to the ninth aspect of the present invention, there is provided the processing apparatus according to any one of the fourth to eighth aspects, wherein the speed at which the object to be processed is lowered from the second height is adjusted. Since the object to be processed is configured to be slower than the speed at which the object is lowered from the first height, it is possible to sufficiently avoid the adverse thermal effect of the object to be processed.

According to the tenth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member, a lifting mechanism that moves the holding member up and down, and a holding member that receives the object to be processed from the transport mechanism at a first height higher than a processing position; Control means for controlling the elevating mechanism so as to transfer the object to be processed to the transfer mechanism at a second height lower than the height, thereby avoiding thermal adverse effects on the object to be processed. And a reduction in throughput can be suppressed.

According to the eleventh aspect of the present invention, there is provided a processing apparatus for transferring an object to and from a transport mechanism and performing a predetermined process on the object to be processed. A holding member that holds the holding member, an elevating mechanism that moves the holding member up and down, and a processing object that has lowered the holding member that has received the processing object from the transport device to a processing position at a first speed and has completed processing. Control means for controlling the elevating mechanism so as to raise the holding member for holding at a second speed higher than the first speed and transfer the holding member to the transfer device. It is possible to avoid a thermal adverse effect on the object to be processed and suppress a decrease in throughput.

According to the twelfth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member, an elevating mechanism that moves the holding member up and down, and the holding member that has received the object to be processed from the transport device at the receiving position is lowered to the processing position at a first speed, and the processing is completed. The elevating mechanism moves the holding member holding the object to be processed at a second speed higher than the first speed to a transfer position that is lower than the receiving position and transfers the holding member to the transfer device. And a control unit for controlling the temperature of the object to be processed, it is possible to further avoid the adverse thermal effect of the object to be processed and to further suppress the decrease in throughput. .

According to the thirteenth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece, wherein the processing apparatus raises and lowers the workpiece. A holding member that holds the holding member, an elevating mechanism that moves the holding member up and down, and lowers the holding member that has received the object to be processed from the transport device, temporarily stops at a predetermined position, and then descends to the processing position, Control means for controlling the elevating mechanism so that the holding member holding the processed object is lifted and delivered to the transfer device. Adverse effects can be avoided,
In addition, a decrease in throughput can be suppressed. Also,
Control can be performed more easily.

According to the fourteenth aspect of the present invention, there is provided a processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece. A holding member that holds the holding member, an elevating mechanism that moves the holding member up and down, and the holding member that lowers the holding member that has received the object to be processed from the transport device to a processing position and holds the processed object that has been processed When raising the member and transferring it to the transfer device, at least one of the descending speed and the ascending speed is changed stepwise so that the ascending time is shorter,
Since the apparatus is provided with the control means for controlling the elevating mechanism, it is possible to avoid a thermal adverse effect on the object to be processed and suppress a decrease in throughput. Further, control can be performed more easily.

[Brief description of the drawings]

FIG. 1 is a plan view of a coating and developing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the coating and developing apparatus shown in FIG.

FIG. 3 is a rear view of the coating and developing apparatus shown in FIG. 1;

4 is a heating processing unit (PREBAKE, POBAKE) in the coating and developing processing apparatus shown in FIGS.
FIG. 2 is a front view illustrating a configuration of a cooling processing unit (COL).

FIG. 5 is a front view showing a configuration of a delivery mechanism (EXT) in the coating and developing apparatus shown in FIGS.

FIG. 6 is a front view showing a configuration of a resist liquid application unit (COT) and a development processing unit (DEV) in the coating and developing apparatus shown in FIGS.

FIG. 7 is a diagram showing a relationship between a heat treatment unit (POBAKE) and a delivery mechanism (EXT).

FIG. 8 is a diagram showing a relationship between a heating processing unit (POBAKE) and a cooling processing unit (COL).

FIG. 9 is a diagram showing a relationship between a heat treatment unit (POBAKE) and a resist liquid application unit (COT).

FIG. 10 is a diagram showing a relationship between a heating processing unit (POBAKE) and a developing processing unit (DEV).

FIG. 11 is a diagram showing a relationship between a development processing unit (DEV) and a resist liquid application unit (COT).

FIG. 12 is a diagram showing a relationship between a chilling heat treatment unit as a first heat treatment unit and a normal heat treatment unit (POBAKE) as a second heat treatment unit.

FIG. 13 is a front view illustrating a configuration of a cooling processing unit (COL) according to another embodiment of the present invention.

FIG. 14 is a front view showing a configuration of a cooling processing unit (COL) according to another embodiment of the present invention.

FIG. 15 is a front view showing a configuration of a cooling processing unit (COL) according to still another embodiment of the present invention.

FIG. 16 is a front view showing a configuration of a cooling processing unit (COL) according to a further embodiment of the present invention.

FIG. 17 is a plan view of another coating and developing apparatus to which the present invention is applied.

[Explanation of symbols]

 22 Conveyor COL Cooling unit COT Resist liquid applying unit DEV Developing unit EXT Transfer mechanism P plate PIN Support pin POBAKE Heating unit SP Spin chuck W Wafer

Claims (14)

[Claims] 1. A processing apparatus having a transport mechanism, wherein the transport mechanism loads and unloads an object to and from a plurality of processing units, and transfers the object to at least one transfer mechanism. A processing apparatus, wherein there are at least two types of loading / unloading height positions in the processing unit or delivery height positions in the delivery mechanism between the processing unit and the delivery mechanism. 2. A processing unit for transferring an object to be processed by floating the object at a first height from a position where the object to be processed is transferred, and a processing unit which is higher than the first height by a holding member provided on a base. 2. A processing apparatus, comprising: a delivery mechanism that holds a workpiece while floating at a height of 2; and a transport mechanism that delivers and transports the workpiece between at least the processing unit and the delivery mechanism. . 3. A base for heat-treating an object to be processed, wherein the object to be processed is lifted from the base to a first height by a holding member provided so as to protrude and retract from the surface of the base. A heat treatment unit to be transferred, a transfer mechanism that holds the object to be processed by being held at a second height higher than the first height by a holding member provided on a base, and at least the heat processing unit and the transfer And a transport mechanism for transporting the object to and from the mechanism. 4. A base for heat-treating an object to be processed, wherein the object to be processed is lifted from the base to a first height by a holding member provided so as to be able to protrude and retract from the surface of the base. A heat treatment unit to be delivered and received, a base for cooling the object to be processed, and a holding member provided so as to be able to protrude and retract from the surface of the base to move the object to be processed higher than the first height. 2. A processing apparatus, comprising: a cooling processing unit that is transferred at a height of 2 and a transport mechanism that transports an object between at least the heating processing unit and the cooling processing unit. 5. A base for heat-treating an object to be processed, wherein the object to be processed is lifted from the base to a first height by a holding member provided so as to be able to protrude and retract from the surface of the base. A heat treatment unit to be delivered and received, and a holding member that can move up and down to hold the substrate.
A resist liquid application unit that raises the holding member to a second height higher than the first height and transfers the object to be processed, and at least a heat treatment unit and a resist liquid application unit that transfer the object to be processed. A processing apparatus comprising: a transport mechanism configured to transport a body. 6. A base for heat-treating an object to be processed, wherein the object to be processed is lifted from the base to a first height by a holding member provided so as to protrude and retract from the surface of the base. A heat treatment unit to be delivered and received, a holding member capable of moving up and down for holding the substrate, the holding member being lowered to perform a developing process on the object to be processed, and the holding member having a height higher than the first height. And a transfer mechanism for transferring the object between at least the heat processing unit and the developing unit. Processing equipment. 7. A processing apparatus comprising a holding member for holding a substrate, the holding member being movable up and down, the holding member being lowered to perform a developing process on an object to be processed, and the holding member being raised to a first height to be processed. A development processing unit that transfers the body, and a vertically movable holding member that holds the substrate. The holding member is lowered to supply a resist liquid to the object to be processed,
A resist liquid application unit that raises the holding member to a second height higher than the first height and transfers the object; and at least the object to be processed between the development processing unit and the resist liquid application unit. And a transport mechanism for transporting the wafer. 8. A base for heat-treating the object to be processed, wherein the object to be processed is lifted from the base to a first height by a holding member provided so as to be able to protrude and retract from the surface of the base. A first heat treatment unit to be transferred and a base for heat-treating the object to be processed; a holding member provided so as to be able to protrude and retract from the surface of the base; A second heat treatment unit which is transferred to and floated at a second height higher than the height, and a transport mechanism which transports the object between at least the first heat treatment unit and the second heat treatment unit A processing device comprising: 9. The method according to claim 4, wherein
3. The processing apparatus according to claim 1, wherein a speed at which the object is lowered from the second height is lower than a speed at which the object is lowered from the first height. 10. A processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece, wherein the holding member holds the workpiece so as to be able to move up and down; An elevating mechanism for elevating and lowering a holding member, wherein the holding member receives an object to be processed from the transport mechanism at a first height higher than a processing position;
A processing unit for controlling the elevating mechanism so as to transfer the object to be processed to the transport mechanism at a second height lower than the height of the processing device. 11. A processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece, comprising: a holding member configured to hold the workpiece so as to be able to move up and down; An elevating mechanism for elevating and lowering the holding member, the holding member receiving the object from the transport device, moving down the holding member at a first speed to a processing position, and holding the object to be processed, Control means for controlling the elevating mechanism so as to ascend at a second speed higher than the first speed and transfer the same to the transport device. 12. A processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece, comprising: a holding member configured to hold the workpiece so as to be able to move up and down; An elevating mechanism for elevating and lowering a holding member; and a holding member for lowering the holding member having received the object to be processed from the transport device at a receiving position to a processing position at a first speed, and holding the object to be processed. The first
Control means for controlling the elevating mechanism so as to ascend to a transfer position located at a position lower than the receiving position at a second speed higher than the transfer speed and transfer the transfer device to the transfer device. Processing equipment. 13. A processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece, comprising: a holding member that holds the workpiece so as to be able to move up and down; An elevating mechanism for elevating and lowering the holding member; and lowering the holding member that has received the object to be processed from the transport device, temporarily stopping at a predetermined position, and then lowering to the processing position, and holding the object to be processed. And a control means for controlling the elevating mechanism so as to raise the holding member to be transferred to the transfer device. 14. A processing apparatus for transferring a workpiece to and from a transport mechanism and performing a predetermined process on the workpiece, comprising: a holding member that holds the workpiece so as to be able to move up and down; An elevating mechanism for elevating and lowering a holding member; and lowering the holding member that has received the object to be processed from the transfer device to a processing position, and raising the holding member that holds the object to be processed to the transfer device. A processing unit for controlling the elevating mechanism so that at least one of the descending speed and the ascending speed is stepwise varied at the time of delivery so that the ascending time is shorter. .