JP2000052105A - Surface coated silicon nitride ceramics throwaway type cutting tip excellent in chipping resistance - Google Patents

Surface coated silicon nitride ceramics throwaway type cutting tip excellent in chipping resistance

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Publication number
JP2000052105A
JP2000052105A JP10221449A JP22144998A JP2000052105A JP 2000052105 A JP2000052105 A JP 2000052105A JP 10221449 A JP10221449 A JP 10221449A JP 22144998 A JP22144998 A JP 22144998A JP 2000052105 A JP2000052105 A JP 2000052105A
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JP
Japan
Prior art keywords
layer
phase
silicon nitride
cutting
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10221449A
Other languages
Japanese (ja)
Inventor
Takashi Koyama
孝 小山
Bunichi Imada
文一 今田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
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Filing date
Publication date
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Priority to JP10221449A priority Critical patent/JP2000052105A/en
Publication of JP2000052105A publication Critical patent/JP2000052105A/en
Withdrawn legal-status Critical Current

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  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a surface coated Si3N4 ceramics throwaway type cutting tip excellent in chipping resistance. SOLUTION: A ceramics substrate is formed of Si3N4 ceramics having a Si3N4 phase: 85-95%, a (Zr, R) O2 phase: 0.5-5%, and a ZrN phase: 0.1-5%, if required, all of which form dispersed phases, and having a remaining impurity composition with a combined phase formed of R-Mg-Si-Zr-O-N phase (R is rare earth metal). A soft layer having an organization with the rate of the Si3N4 phase to the (Zr, R)O2 phase being 20-60% is formed ranging from the surface of the substrate to its depth of 1-5 μm. Further, a hard coating layer is formed of one or two type of a Ti compound layer consisting of a TiC layer, a TiN layer, a TiCN layer, a TiCO layer, a TiNO layer and a TiCNO layer and a hard coating layer consisting of Al2O3 layer, with its average layer thickness being 1-10 μm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、すぐれた耐チッ
ピング性を有し、特に鋳鉄の断続切削を高送りや高切り
込みなどの重切削条件で行った場合に切刃にチッピング
(微小欠け)の発生なく、すぐれた切削性能を長期に亘
って発揮する表面被覆窒化けい素系セラミックス製スロ
ーアウェイ型切削チップ(以下、被覆切削チップと云
う)に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has excellent chipping resistance, and is particularly effective in preventing chipping (small chipping) of a cutting edge when performing intermittent cutting of cast iron under heavy cutting conditions such as high feed and high cutting. The present invention relates to a throw-away type cutting tip (hereinafter, referred to as a coated cutting tip) made of surface-coated silicon nitride ceramics which exhibits excellent cutting performance for a long time without generation.

【0002】[0002]

【従来の技術】従来、一般に窒化けい素系セラミックス
基体(以下、セラミックス基体と云う)の表面に硬質被
覆層を化学蒸着してなる被覆切削チップが数多く提案さ
れ、特に鋳鉄などの連続切削や断続切削に用いられてい
ることは良く知られるところである。
2. Description of the Related Art Conventionally, a large number of coated cutting tips have been proposed in which a hard coating layer is chemically vapor-deposited on the surface of a silicon nitride-based ceramic substrate (hereinafter, referred to as a ceramic substrate). It is well known that it is used for cutting.

【0003】[0003]

【発明が解決しようとする課題】一方、近年の切削加工
の省力化および省エネ化に対する要求は強く、これに伴
い、切削加工は高速化し、かつ高送りおよび高切り込み
などの重切削化の傾向にあるが、従来被覆切削チップに
おいては、特にこれを鋳鉄の断続切削を重切削条件で行
う場合に用いると、切刃にチッピングが発生し易く、こ
れが原因で比較的短時間で使用寿命に至るのが現状であ
る。
On the other hand, in recent years, there has been a strong demand for labor saving and energy saving of cutting work, and with this, cutting work has been speeding up and heavy cutting such as high feed and high cutting has been performed. However, in the case of conventional coated cutting inserts, chipping tends to occur in the cutting edge, especially when it is used in heavy cutting conditions for interrupted cutting of cast iron, which leads to a relatively short service life. Is the current situation.

【0004】[0004]

【課題を解決するための手段】そこで、本発明者等は、
上述のような観点から、耐チッピング性にすぐれた被覆
切削チップを開発すべく研究を行った結果、 (a)セラミックス基体を、原料粉末として、窒化けい
素(以下、Si3 4で示す)粉末、希土類元素酸化物
(以下、R23 で示す)粉末、酸化けい素(以下、S
iO2 で示す)粉末、酸化マグネシウム(以下、MgO
で示す)粉末、および窒化ジルコニウム(以下、ZrN
で示す)粉末を用い、これら原料粉末を所定の配合組成
に配合し、ボールミルにてエチルアルコールを用いて湿
式混合した後、成形バインダーを加え、スプレードライ
ーで乾燥して顆粒とし、これを一軸プレスにて所定の切
削チップ形状をもった圧粉体にプレス成形し、この圧粉
体を、まず圧力:0.2〜10MPa(2〜100kg
f/cm2 )の加圧窒素雰囲気中、1700〜1900
℃の温度に所定時間保持の条件で一次焼結し、ついで圧
力を上げて圧力:50〜200MPa(500〜200
0kgf/cm2 )とし、温度はほぼ同一の1750〜
1900℃の温度に所定時間保持後冷却の条件で二次焼
結することにより製造され、かつ走査型電子顕微鏡によ
る組織観察で、Si3 4 相:85〜95%、Yを含む
希土類元素(以下、Rで示す)のうちの1種以上がジル
コニア(以下、ZrO2 で示す)に固溶してなる安定化
ジルコニア[以下、(Zr,R)O2で示す]相:0.
5〜5%、必要に応じてZrN相:0.1〜5%、の割
合を示し、これらはいずれも分散相を構成し、残りが上
記希土類元素とMgとSiとZrの複合酸窒化物固溶体
(以下、R−Mg−Si−Zr−O−Nで示す)相で構
成された結合相と不可避不純物からなる組成(以上面積
%、以下%の表示はいずれも面積%を示す)を有するS
3 4 系セラミックスに特定すること。 (b)上記(a)のセラミックス基体の製造に際して、
上記二次焼結の冷却過程で、温度が1500〜1600
℃に降下した時点で、この温度に30分から2時間保持
すると、表面部に任意深さに亘って、表面の走査型電子
顕微鏡による組織観察で、Si3 4 相と(Zr,R)
2 相からなり、かつ前記(Zr,R)O2 相の割合が
基体内部に比して相対的に高い表面層を形成することが
でき、この表面層は、前記(Zr,R)O2 相の含有割
合がきわめて高いので著しく軟質であること。 (c)一般に切刃のチッピング発生は、切刃逃げ面部に
軟質層を形成することによって抑制するすることがで
き、一方切刃すくい面部の軟質層はすくい面部の局部的
摩耗進行の原因となることから、切刃すくい面部の表面
層(軟質層)は研磨除去し、セラミックス基体の切刃逃
げ面部のみに前記軟質層が存在する状態にすると、特に
鋳鉄の断続切削を重切削条件で行ってもすぐれた耐チッ
ピング性を発揮するようになること。 (d)上記(a)〜(c)で形成されたセラミックス基
体の切刃すくい面部および切刃逃げ面部の軟質層に対し
ては、Tiの炭化物(以下、TiCで示す)層、窒化物
(以下、同じくTiNで示す)層、炭窒化物(以下、T
iCNで示す)層、炭酸化物(以下、TiCOで示す)
層、窒酸化物(以下、TiNOで示す)層、および炭窒
酸化物(以下、TiCNOで示す)層からなるTi化合
物層からなる硬質被覆層が高い密着性を示すこと。以上
(a)〜(d)に示される研究結果を得たのである。
Means for Solving the Problems Accordingly, the present inventors have
From the above-mentioned viewpoints, as a result of researching to develop a coated cutting tip having excellent chipping resistance, (a) silicon nitride (hereinafter, referred to as Si 3 N 4 ) using a ceramic substrate as a raw material powder Powder, rare earth element oxide (hereinafter referred to as R 2 O 3 ) powder, silicon oxide (hereinafter referred to as S
iO 2 ) powder, magnesium oxide (hereinafter referred to as MgO)
) And zirconium nitride (hereinafter ZrN).
The raw material powders are mixed into a prescribed composition using powders, wet-mixed with ethyl alcohol in a ball mill, a molding binder is added, and the mixture is dried by spray drying to obtain granules. It is press-formed into a green compact having a predetermined cutting tip shape by a press, and this green compact is first subjected to a pressure of 0.2 to 10 MPa (2 to 100 kg).
f / cm 2 ) in a pressurized nitrogen atmosphere, 1700 to 1900
Primary sintering under the condition of maintaining the temperature at a predetermined temperature for a predetermined time, and then increasing the pressure to a pressure of 50 to 200 MPa (500 to 200
0 kgf / cm 2 ), and the temperature is approximately
It is manufactured by holding at a temperature of 1900 ° C. for a predetermined time and then performing secondary sintering under cooling conditions, and by microscopic observation with a scanning electron microscope, a Si 3 N 4 phase: 85 to 95%, a rare earth element containing Y ( (Hereinafter, represented by R) is a stabilized zirconia [hereinafter, represented by (Zr, R) O 2 ] phase formed by solid solution in zirconia (hereinafter, represented by ZrO 2 ): 0.
5 to 5%, and if necessary, a ZrN phase: 0.1 to 5%, each of which constitutes a dispersed phase, and the remainder is a composite oxynitride of the rare earth element, Mg, Si, and Zr. It has a composition consisting of a binder phase composed of a solid solution (hereinafter, referred to as R-Mg-Si-Zr-ON) phase and unavoidable impurities (all area%, and the following% each indicate area%). S
Specific to i 3 N 4 ceramics. (B) In producing the ceramic substrate of (a),
In the cooling process of the secondary sintering, the temperature is 1500 to 1600.
When the temperature was lowered to 30 ° C., the temperature was maintained at this temperature for 30 minutes to 2 hours. The surface of the surface was observed at an arbitrary depth by scanning electron microscopy to observe the structure of the Si 3 N 4 phase and (Zr, R).
It consists O 2 phase, and the (Zr, R) ratio of O 2 phase can form a relatively high surface layers than the inner substrate, the surface layer, the (Zr, R) O Extremely soft because the content of two phases is extremely high. (C) In general, the occurrence of chipping of the cutting blade can be suppressed by forming a soft layer on the flank of the cutting blade, while the soft layer on the rake surface of the cutting blade causes local wear of the rake surface. Therefore, when the surface layer (soft layer) of the rake face of the cutting edge is polished and removed so that the soft layer exists only on the flank face of the cutting edge of the ceramic base, intermittent cutting of cast iron is particularly performed under heavy cutting conditions. To exhibit excellent chipping resistance. (D) For the soft layers on the rake face and the flank face of the cutting edge of the ceramic base formed in the above (a) to (c), a carbide (TiC) layer of Ti, a nitride ( Hereinafter, a TiN layer and a carbonitride (hereinafter referred to as T
iCN) layer, carbonate (hereinafter referred to as TiCO)
A hard coating layer composed of a Ti compound layer consisting of a layer, a nitrided oxide (hereinafter referred to as TiNO) layer, and a carbonitrided oxide (hereinafter referred to as TiCNO) layer exhibits high adhesion. The research results shown in (a) to (d) above were obtained.

【0005】この発明は、上記の研究結果に基づいてな
されたものであって、セラミックス基体の表面に硬質被
覆層を化学蒸着してなる被覆切削チップにおいて、上記
セラミックス基体を、走査型電子顕微鏡による組織観察
で、Si3 4 相:85〜95%、(Zr,R)O
2 相:0.5〜5%、必要に応じてZrN相:0.1〜
5%、の割合を示し、これらはいずれも分散相を構成
し、残りがR−Mg−Si−Zr−O−N相で構成され
た結合相と不可避不純物からなる組成を有するSi3
4系セラミックスで構成すると共に、上記基体の切刃逃
げ面部に、同じく走査型電子顕微鏡による組織観察で、
基体表面から1〜5μmの深さに亘って、実質的に上記
Si3 4 相と上記(Zr,R)O2 相からなり、かつ
前記切刃逃げ面部表面の測定で、前記(Zr,R)O 2
相の割合が20〜60面積%を占める軟質層を形成し、
さらに上記硬質被覆層を、TiC層、TiN層、TiC
N層、TiCO層、TiNO層、およびTiCNO層か
らなるTi化合物層のうちの1種または2種以上と、A
2 3 層からなる硬質被覆層で構成し、かつその平均
層厚を1〜10μmとしてなる、耐チッピング性にすぐ
れた被覆切削チップに特徴を有するものである。
The present invention has been made based on the above research results.
And a hard coating on the surface of the ceramic substrate.
In the coated cutting tip formed by chemical vapor deposition of the covering layer,
Structure observation of the ceramic substrate with a scanning electron microscope
And SiThreeNFourPhase: 85-95%, (Zr, R) O
TwoPhase: 0.5-5%, ZrN phase as required: 0.1-
5%, each of which constitutes a dispersed phase
And the rest is composed of the R-Mg-Si-Zr-ON phase.
Having composition consisting of bonded phase and unavoidable impuritiesThreeN
FourThe cutting edge of the base
On the beveled part, also by microscopic observation with a scanning electron microscope,
Substantially over the depth of 1 to 5 μm from the surface of the substrate,
SiThreeNFourPhase and (Zr, R) OTwoConsisting of phases and
In the measurement of the flank surface of the cutting edge, the (Zr, R) O Two
Forming a soft layer in which the proportion of the phase occupies 20 to 60 area%,
Further, the hard coating layer is made of a TiC layer, a TiN layer, a TiC layer.
N layer, TiCO layer, TiNO layer and TiCNO layer
One or more of the Ti compound layers
lTwoOThreeConsisting of a hard coating layer consisting of
Immediate chipping resistance with a layer thickness of 1 to 10 µm
The characteristic feature is that the coated cutting tip is featured.

【0006】つぎに、この発明の被覆切削チップにおい
て、これを構成するセラミックス基体の組成、軟質層の
(Zr,R)O2 相の割合および形成深さ、並びに硬質
被覆層の平均層厚を上記の通りに限定した理由を説明す
る。 (a)セラミックス基体のSi3 4 相の割合 Si3 4 相は、β型結晶構造を有し、硬質な針状結晶
として存在するので、前記針状結晶によって強度が確保
され、かつ耐摩耗性向上に寄与するが、その割合が85
%未満では、相対的に結合相の割合が多くなり過ぎて所
望の耐摩耗性を確保することができず、一方その割合が
95%を越えると、反対に結合相が少なくなり過ぎ、こ
の結果焼結性が著しく低下し、強度低下が起って、切刃
に欠損が発生し易くなることから、その割合を85〜9
5%と定めた。
[0006] Next, in the coated cutting tip of the present invention, the composition of the ceramic base, the ratio and formation depth of the (Zr, R) O 2 phase of the soft layer, and the average layer thickness of the hard coating layer are described. The reason for limiting as described above will be described. (A) Proportion of Si 3 N 4 Phase of Ceramic Substrate Since the Si 3 N 4 phase has a β-type crystal structure and exists as hard needle-like crystals, the strength is secured by the needle-like crystals, and the resistance is high. It contributes to the improvement of abrasion, but the ratio is 85
If it is less than 95%, the proportion of the binder phase becomes relatively too large to secure the desired wear resistance. On the other hand, if the proportion exceeds 95%, on the contrary, the binder phase becomes too small, and as a result, Since the sinterability is remarkably reduced, the strength is reduced and the cutting edge is apt to be chipped, the ratio is 85 to 9
It was determined to be 5%.

【0007】(b)セラミックス基体の(Zr,R)O
2 相の割合 (Zr,R)O2 相の割合は、軟質層における(Zr,
R)O2 相の割合を20〜50%にするために定めたも
のであって、その割合が0.5%未満では軟質層の(Z
r,R)O2 相の割合が20%未満になってしまい、所
望のすぐれた耐チッピング性を発揮するのに十分な軟化
効果が得られず、一方その割合が5%を越えると、Si
3 4 相によってもたらされる高強度が損なわれるよう
になるばかりでなく、軟質層の(Zr,R)O2 相の割
合も60%を越えて高くなってしまい、前記軟質層に塑
性変形が生じ易くなり、偏摩耗発生の原因となることか
ら、その割合を0.5〜5%と定めた。
(B) (Zr, R) O of ceramic substrate
Ratio of two phases The ratio of (Zr, R) O 2 phase is determined by
R) The ratio of the O 2 phase is determined to be 20 to 50%, and if the ratio is less than 0.5%, the (Z) of the soft layer
When the proportion of the (r, R) O 2 phase is less than 20%, a sufficient softening effect to exhibit the desired excellent chipping resistance cannot be obtained. On the other hand, when the proportion exceeds 5%, Si
Not only so high strength is impaired provided by 3 N 4 phase, the soft layer (Zr, R) ratio of O 2 phases also becomes higher than 60% plastic deformation in the soft layer The ratio is determined to be 0.5 to 5%, since it tends to occur and causes uneven wear.

【0008】(c)セラミックス基体のZrN相の割合 ZrN相には耐摩耗性を向上させる作用があるので、必
要に応じて存在させるが、その割合が0.1%未満では
所望の耐摩耗性向上効果が得られず、一方その割合が5
%を越えると、靭性が低下し、切刃に欠けやチッピング
が発生するようになることから、その割合を0.1〜5
%と定めた。
(C) Proportion of ZrN phase in ceramic substrate Since the ZrN phase has an effect of improving abrasion resistance, it may be present if necessary. If the proportion is less than 0.1%, a desired abrasion resistance is obtained. No improvement effect is obtained, while the ratio is 5
%, The toughness is reduced, and chipping or chipping occurs on the cutting edge.
%.

【0009】(d)切刃逃げ面部の軟質層の(Zr,
R)O2 相の割合 上記の通り(Zr,R)O2 相は、Si3 4 相との共
存において、セラミックス基体の切刃逃げ面部に軟質層
を形成し、特に鋳鉄の断続切削を重切削条件でも切刃に
チッピングが発生するのを抑制する作用があるが、その
割合が切刃逃げ面部表面の測定で、20%未満では前記
作用に所望の効果が得られず、一方その割合が同じく6
0%を越えると、耐摩耗性が急激に低下するようになる
ことから、その割合を20〜60%と定めた。
(D) The soft layer at the flank of the cutting edge (Zr,
R) O 2 phase ratio As described above, the (Zr, R) O 2 phase forms a soft layer on the flank of the cutting edge of the ceramic base when coexisting with the Si 3 N 4 phase. Although there is an effect of suppressing the occurrence of chipping on the cutting edge even under heavy cutting conditions, the ratio is less than 20% in the measurement of the surface of the flank of the cutting edge. If the ratio is less than 20%, the desired effect cannot be obtained. Is also 6
If it exceeds 0%, the abrasion resistance rapidly decreases, so the ratio is set to 20 to 60%.

【0010】(e)軟質層の深さ その深さが1μm未満では、上記軟質層による耐チッピ
ング性向上効果を十分に発揮させることができず、その
深さが5μmを越えると、塑性変形が生じ易くなり、偏
摩耗発生の原因となることから、その深さを1〜5μm
と定めた。
(E) Depth of the soft layer If the depth is less than 1 μm, the effect of improving the chipping resistance by the soft layer cannot be sufficiently exhibited. It is easy to occur and causes uneven wear.
It was decided.

【0011】(f)硬質被覆層の平均層厚 その層厚が1μmでは所望のすぐれた耐摩耗性を確保す
ることができず、一方その層厚が10μmを越えると、
切刃に欠けやチッピングが発生し易くなることから、そ
の層厚を1〜10μmと定めた。
(F) Average Layer Thickness of Hard Coating Layer If the layer thickness is 1 μm, the desired excellent wear resistance cannot be ensured. On the other hand, if the layer thickness exceeds 10 μm,
Since chipping and chipping easily occur in the cutting blade, the layer thickness is set to 1 to 10 μm.

【0012】[0012]

【発明の実施の形態】この発明の被覆切削チップを実施
例により具体的に説明する。原料粉末として、いずれも
0.1〜1μmの範囲内の所定の平均粒径を有するSi
3 4 粉末、表1に示される各種のR23 粉末、Si
2 粉末、MgO粉末、およびZrN粉末を用意し、こ
れら原料粉末を表1に示される配合組成に配合し、溶媒
としてエチルアルコールを用いてボールミルにて48時
間湿式混合した後、成形バインダーとしてポリエチレン
グリコールを加え、スプレードライーで乾燥して顆粒と
し、これを一軸プレスにて1ton/cm2 の圧力でJ
IS・SNMN120408の切削チップ形状をもった
圧粉体A〜Jを成形し、この圧粉体A〜Jのそれぞれ
を、まず0.2〜10MPa(2〜100kgf/cm
2)の範囲内の所定の圧力の加圧窒素雰囲気中、170
0〜1900℃の範囲内の所定の温度に1〜4時間の範
囲内の所定時間保持の条件で一次焼結し、ついで圧力を
上げて50〜200MPa(500〜2000kgf/
cm2 )の範囲内の所定の圧力とし、温度はほぼ同一の
1750〜1900℃の範囲内の所定の温度に保持し、
この温度に0.5〜2時間の範囲内の所定時間保持した
後冷却を開始し、この冷却過程で、冷却温度が1500
〜1600℃の範囲内の所定の温度に降下した時点で、
この温度に30分から2時間の範囲内の所定時間保持の
条件で二次焼結し、この二次焼結後の焼結体のすくい面
と逃げ面の交わる切刃稜線部にはホーニング研磨を施
し、その上下面(すくい面)にも研磨加工を施して、表
面から10μmの深さに亘って除去することにより本発
明セラミックス基体A〜Jをそれぞれ製造した。また、
比較の目的で、二次焼結後の冷却を炉冷とする以外は上
記本発明セラミックス基体A〜Jの製造条件と同一の条
件で、切刃逃げ面部に軟質層の形成がない比較セラミッ
クス基体a〜jをそれぞれ製造した。
BEST MODE FOR CARRYING OUT THE INVENTION The coated cutting tip of the present invention will be specifically described with reference to examples. As a raw material powder, any of Si having a predetermined average particle size in the range of 0.1 to 1 μm.
3 N 4 powder, various R 2 O 3 powders shown in Table 1, Si
O 2 powder, MgO powder, and ZrN powder were prepared, and these raw material powders were blended in the composition shown in Table 1, and wet-mixed for 48 hours in a ball mill using ethyl alcohol as a solvent. Glycol was added and dried by spray drying to obtain granules, which were then pressed with a uniaxial press at a pressure of 1 ton / cm 2 into a granule.
The green compacts A to J having the cutting tip shape of IS • SNMN120408 are formed, and each of the green compacts A to J is first subjected to 0.2 to 10 MPa (2 to 100 kgf / cm).
2 ) in a pressurized nitrogen atmosphere at a predetermined pressure within the range of 170)
Primary sintering is performed at a predetermined temperature in a range of 0 to 1900 ° C. for a predetermined time in a range of 1 to 4 hours, and then the pressure is increased to 50 to 200 MPa (500 to 2000 kgf /
cm 2 ), and the temperature is maintained at the same predetermined temperature in the range of 1750 to 1900 ° C.,
After maintaining the temperature at this temperature for a predetermined time within the range of 0.5 to 2 hours, cooling is started.
When the temperature drops to a predetermined temperature in the range of ~ 1600 ° C,
Secondary sintering is performed at this temperature for a predetermined time within a range of 30 minutes to 2 hours. Honing polishing is performed on the cutting edge ridge line where the rake face and flank of the sintered body after the secondary sintering intersect. Then, the upper and lower surfaces (rake face) were also polished, and removed over a depth of 10 μm from the surface, thereby producing ceramic substrates A to J of the present invention, respectively. Also,
For the purpose of comparison, a comparative ceramic substrate having no soft layer formed on the flank of the cutting edge under the same conditions as the production conditions of the ceramic substrates A to J of the present invention except that the cooling after the secondary sintering is furnace cooling. a to j were respectively manufactured.

【0013】この結果得られた各種のセラミックス基体
について、これの切刃逃げ面部表面、切刃すくい面部表
面、および内部断面をX線マイクロアナライザーと走査
型電子顕微鏡を用いて組織観察すると共に、切刃逃げ面
部断面を観察して軟質層の深さを測定した。これらの測
定結果を表2、3に示した。なお、切刃すくい面部表面
と内部断面はほとんど変わらぬ組成および組織を示した
ので、表2、3には切刃すくい面部表面の測定結果を示
した。
With respect to the various ceramic substrates obtained as a result, the surface of the flank surface of the cutting blade, the surface of the rake surface of the cutting blade, and the internal cross section are observed using an X-ray microanalyzer and a scanning electron microscope. The depth of the soft layer was measured by observing the cross section of the flank of the blade. Tables 2 and 3 show the measurement results. Since the surface and the internal cross section of the rake face of the cutting edge showed almost the same composition and structure, Tables 2 and 3 show the measurement results of the surface of the rake face of the cutting edge.

【0014】ついで、これらの各種のセラミックス基体
の表面に、通常の化学蒸着装置を用い、表4(表中の※
印は特開平6−8010号公報に記載される縦長成長結
晶組織をもつものである)に示される条件にて、表5、
6に示される組成および目標層厚のTi化合物層および
Al23 層からなる硬質被覆層を形成することにより
本発明被覆切削チップ1〜10、および比較被覆切削チ
ップ1〜10をそれぞれ製造した。
Next, the surface of each of these various ceramic substrates was coated using a conventional chemical vapor deposition apparatus, as shown in Table 4 (* in the table).
The marks have a vertically-grown crystal structure described in JP-A-6-8010) under the conditions shown in Table 5,
The coated cutting tips 1 to 10 of the present invention and the comparative coated cutting tips 1 to 10 were produced by forming a hard coating layer composed of a Ti compound layer and an Al 2 O 3 layer having the composition and target layer thickness shown in FIG. .

【0015】ついで、上記の本発明被覆切削チップ1〜
10および比較被覆切削チップ1〜10を用いて、 被削材:FC300の長さ方向等間隔4本縦溝入り丸
棒、 切削速度:600m/min、 送り:0.8mm/rev、 切り込み:2mm、 切削時間:10分、 の条件での鋳鉄の乾式高送り断続切削試験、並びに、 被削材:FC250の長さ方向等間隔4本縦溝入り丸
棒、 切削速度:500m/min、 送り:0.3mm/rev、 切り込み:5mm、 切削時間:10分、 の条件での鋳鉄の乾式高切り込み断続切削試験を行い、
いずれの切削試験でも切刃の逃げ面摩耗幅を測定した。
これらの測定結果を表7に示した。
Next, the coated cutting inserts 1 to 5 of the present invention described above.
Using 10 and comparative coated cutting tips 1 to 10, Work material: round bar with four longitudinal grooves at equal intervals in the longitudinal direction of FC300, cutting speed: 600 m / min, feed: 0.8 mm / rev, cutting depth: 2 mm , Cutting time: 10 minutes, Dry high-feed intermittent cutting test of cast iron under the following conditions; Work material: Round bar with four longitudinal grooves at regular intervals in the longitudinal direction of FC250, Cutting speed: 500 m / min, Feed: 0.3 mm / rev, depth of cut: 5 mm, cutting time: 10 min.
In each cutting test, the flank wear width of the cutting edge was measured.
Table 7 shows the results of these measurements.

【0016】[0016]

【表1】 [Table 1]

【0017】[0017]

【表2】 [Table 2]

【0018】[0018]

【表3】 [Table 3]

【0019】[0019]

【表4】 [Table 4]

【0020】[0020]

【表5】 [Table 5]

【0021】[0021]

【表6】 [Table 6]

【0022】[0022]

【表7】 [Table 7]

【0023】[0023]

【発明の効果】表1〜7に示される結果から、本発明被
覆切削チップ1〜10は、いずれもセラミックス基体の
切刃逃げ面部に存在する軟質層によって鋳鉄の断続切削
を重切削条件で行ったにもかかわらず、切刃にチッピン
グの発生なく、すぐれた耐摩耗性を発揮するのに対し
て、前記セラミックス基体の切刃逃げ面部に軟質層の形
成がない比較被覆切削チップ1〜10においては、いず
れも切刃にチッピングが発生し、これが原因で比較的短
時間で使用寿命に至ることが明らかである。上述のよう
に、この発明の被覆切削チップは、すぐれた耐チッピン
グ性を有し、通常の条件での連続切削および断続切削は
勿論のこと、特に鋳鉄の重切削条件での断続切削でも切
刃にチッピングなどの発生なく、長期に亘ってすぐれた
切削性能を発揮するものであり、切削加工の省力化およ
び省エネ化に十分満足に対応することができるものであ
る。
According to the results shown in Tables 1 to 7, all of the coated cutting tips 1 to 10 of the present invention perform intermittent cutting of cast iron under heavy cutting conditions by using a soft layer existing on the flank of the cutting edge of the ceramic substrate. Nevertheless, the comparative coated cutting tips 1 to 10 in which the cutting edge does not generate chipping and exhibit excellent wear resistance, whereas the softened layer is not formed on the flank of the cutting edge of the ceramic base. It is clear that in each case, chipping occurs on the cutting blade, which causes a short service life in a relatively short time. As described above, the coated cutting tip of the present invention has excellent chipping resistance, and can be used not only for continuous cutting and intermittent cutting under ordinary conditions, but also for intermittent cutting particularly under heavy cutting conditions for cast iron. It exhibits excellent cutting performance over a long period of time without causing chipping or the like, and can sufficiently satisfy labor-saving and energy-saving cutting operations.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C23C 16/30 C04B 35/58 102K Fターム(参考) 3C046 FF04 FF22 FF25 FF33 FF40 FF42 FF47 FF49 FF51 FF55 4G001 BA04 BA06 BA08 BA09 BA10 BA32 BA39 BA75 BA82 BB03 BB08 BB09 BB10 BB14 BB25 BB32 BB38 BB51 BB53 BB57 BB67 BC13 BC57 BC72 BC73 BD12 BD18 BE11 4K030 AA02 AA10 AA14 AA17 AA18 AA24 BA18 BA35 BA36 BA38 BA41 BA43 BB01 CA05 FA10 LA22 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C23C 16/30 C04B 35/58 102K F-term (Reference) 3C046 FF04 FF22 FF25 FF33 FF40 FF42 FF47 FF49 FF51 FF55 4G001 BA04 BA06 BA08 BA09 BA10 BA32 BA39 BA75 BA82 BB03 BB08 BB09 BB10 BB14 BB25 BB32 BB38 BB51 BB53 BB57 BB67 BC13 BC57 BC72 BC73 BD12 BD18 BE11 4K030 AA02 AA10 AA14 AA17 AA18 AA24 BA18 BA05 BA41

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 窒化けい素系セラミックス基体の表面に
硬質被覆層を化学蒸着してなる表面被覆窒化けい素系セ
ラミックス製スローアウェイ型切削チップにおいて、 上記基体を、走査型電子顕微鏡による組織観察で、 窒化けい素相:85〜95面積%、 Yを含む希土類元素のうちの1種以上がジルコニアに固
溶してなる安定化ジルコニア相:0.5〜5面積%、の
割合を示し、これらはいずれも分散相を構成し、残りが
上記希土類元素とMgとSiとZrの複合酸窒化物固溶
体相で構成された結合相と不可避不純物からなる組成を
有する窒化けい素系セラミックスで構成すると共に、 上記基体の切刃逃げ面部に、同じく走査型電子顕微鏡に
よる組織観察で、基体表面から1〜5μmの深さに亘っ
て、実質的に上記窒化けい素相と上記安定化ジルコニア
相からなり、かつ前記切刃逃げ面部表面の測定で、前記
安定化ジルコニア相の割合が20〜60面積%を占める
軟質層を形成し、 さらに上記硬質被覆層を、Tiの炭化物層、窒化物層、
炭窒化物層、炭酸化物層、窒酸化物層、および炭窒酸化
物層からなるTi化合物層のうちの1種または2種以上
と、酸化アルミニウム層で構成し、かつその平均層厚を
1〜10μmとしたことを特徴とする耐チッピング性に
すぐれた表面被覆窒化けい素系セラミックス製スローア
ウェイ型切削チップ。
1. A surface-coated silicon nitride ceramic indexable cutting tip formed by chemical vapor deposition of a hard coating layer on the surface of a silicon nitride ceramic substrate, wherein the substrate is obtained by microscopic observation with a scanning electron microscope. Silicon nitride phase: 85 to 95 area%; stabilized zirconia phase in which at least one of the rare earth elements including Y forms a solid solution in zirconia: 0.5 to 5 area%. Are all composed of a dispersed phase, the rest being composed of a silicon nitride-based ceramic having a composition consisting of a binder phase composed of the above-mentioned rare earth element, a composite oxynitride solid solution phase of Mg, Si and Zr, and an unavoidable impurity. On the flank of the cutting edge of the substrate, the above-mentioned silicon nitride phase and the above-mentioned stabilizing die were substantially observed over a depth of 1 to 5 μm from the surface of the substrate by microscopic observation with a scanning electron microscope. In the measurement of the surface of the cutting edge flank, a soft layer comprising a zirconia phase and having a ratio of the stabilized zirconia phase of 20 to 60% by area is formed. Material layer,
One or more of Ti compound layers consisting of a carbonitride layer, a carbon oxide layer, a nitrogen oxide layer, and a carbonitride layer, and an aluminum oxide layer, and the average layer thickness is 1 A throw-away type cutting tip made of surface-coated silicon nitride-based ceramics having excellent chipping resistance, characterized by having a thickness of from 10 to 10 μm.
【請求項2】 窒化けい素系セラミックス基体の表面に
硬質被覆層を化学蒸着してなる表面被覆窒化けい素系セ
ラミックス製スローアウェイ型切削チップにおいて、 上記基体を、走査型電子顕微鏡による組織観察で、 窒化けい素相:85〜95面積%、 Yを含む希土類元素のうちの1種以上がジルコニアに固
溶してなる安定化ジルコニア相:0.5〜5面積%、 窒化ジルコニウム相:0.1〜5面積%、の割合を示
し、これらはいずれも分散相を構成し、残りが上記希土
類元素とMgとSiとZrの複合酸窒化物固溶体相で構
成された結合相と不可避不純物からなる組成を有する窒
化けい素系セラミックスで構成すると共に、 上記基体の切刃逃げ面部に、同じく走査型電子顕微鏡に
よる組織観察で、基体表面から1〜5μmの深さに亘っ
て、実質的に上記窒化けい素相と上記安定化ジルコニア
相からなり、かつ前記切刃逃げ面部表面の測定で、前記
安定化ジルコニア相の割合が20〜60面積%を占める
軟質層を形成し、 さらに上記硬質被覆層を、Tiの炭化物層、窒化物層、
炭窒化物層、炭酸化物層、窒酸化物層、および炭窒酸化
物層からなるTi化合物層のうちの1種または2種以上
と、酸化アルミニウム層で構成し、かつその平均層厚を
1〜10μmとしたことを特徴とする耐チッピング性に
すぐれた表面被覆窒化けい素系セラミックス製スローア
ウェイ型切削チップ。
2. A cutting insert made of surface-coated silicon nitride-based ceramics obtained by chemical vapor deposition of a hard coating layer on the surface of a silicon nitride-based ceramics substrate, wherein the substrate is obtained by microscopic observation with a scanning electron microscope. Silicon nitride phase: 85 to 95 area%; stabilized zirconia phase in which at least one of the rare earth elements including Y is solid-dissolved in zirconia: 0.5 to 5 area%; zirconium nitride phase: 0.5 to 5 area%. 1 to 5 area%, each of which constitutes a dispersed phase, with the balance being composed of a binder phase composed of the above-mentioned rare earth element, a composite oxynitride solid solution phase of Mg, Si and Zr, and unavoidable impurities. In addition to being composed of a silicon nitride-based ceramic having a composition, on the flank of the cutting edge of the base, the structure is also observed with a scanning electron microscope over a depth of 1 to 5 μm from the surface of the base. Forming a soft layer substantially consisting of the silicon nitride phase and the stabilized zirconia phase, wherein the ratio of the stabilized zirconia phase occupies 20 to 60 area% in the measurement of the cutting edge flank surface; The hard coating layer, Ti carbide layer, nitride layer,
One or more of Ti compound layers consisting of a carbonitride layer, a carbon oxide layer, a nitrogen oxide layer, and a carbonitride layer, and an aluminum oxide layer, and the average layer thickness is 1 A throw-away type cutting tip made of surface-coated silicon nitride-based ceramics having excellent chipping resistance, characterized by having a thickness of from 10 to 10 μm.
JP10221449A 1998-08-05 1998-08-05 Surface coated silicon nitride ceramics throwaway type cutting tip excellent in chipping resistance Withdrawn JP2000052105A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10221449A JP2000052105A (en) 1998-08-05 1998-08-05 Surface coated silicon nitride ceramics throwaway type cutting tip excellent in chipping resistance

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Application Number Priority Date Filing Date Title
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Publication Number Publication Date
JP2000052105A true JP2000052105A (en) 2000-02-22

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Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009154219A (en) * 2007-12-25 2009-07-16 Kyocera Corp Cutting tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009154219A (en) * 2007-12-25 2009-07-16 Kyocera Corp Cutting tool

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