JP2000047493A - Separating claw for electrophotographic device - Google Patents

Separating claw for electrophotographic device

Info

Publication number
JP2000047493A
JP2000047493A JP21600098A JP21600098A JP2000047493A JP 2000047493 A JP2000047493 A JP 2000047493A JP 21600098 A JP21600098 A JP 21600098A JP 21600098 A JP21600098 A JP 21600098A JP 2000047493 A JP2000047493 A JP 2000047493A
Authority
JP
Japan
Prior art keywords
resin powder
separation
separation claw
weight
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21600098A
Other languages
Japanese (ja)
Inventor
E George Daniel
イー. ジョージ ダニエル
Akira Yokoyama
晃 横山
Shinichi Nakagawa
伸一 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Priority to JP21600098A priority Critical patent/JP2000047493A/en
Priority to PCT/US1999/017333 priority patent/WO2000007074A1/en
Priority to CNB998090611A priority patent/CN1146759C/en
Priority to US09/743,330 priority patent/US6844051B1/en
Priority to EP99937676A priority patent/EP1101152B1/en
Priority to CA002337523A priority patent/CA2337523C/en
Priority to DE69915489T priority patent/DE69915489T2/en
Publication of JP2000047493A publication Critical patent/JP2000047493A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/65Apparatus which relate to the handling of copy material
    • G03G15/6532Removing a copy sheet form a xerographic drum, band or plate
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • G03G15/20Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • G03G15/2017Structural details of the fixing unit in general, e.g. cooling means, heat shielding means
    • G03G15/2028Structural details of the fixing unit in general, e.g. cooling means, heat shielding means with means for handling the copy material in the fixing nip, e.g. introduction guides, stripping means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Fixing For Electrophotography (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Cleaning In Electrography (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a separating claw for electrophotographic device with sharp tip improved in wear resistance, non-adhesive property to toner and durability. SOLUTION: A mixture obtained by mixing polyimide resin powder with polytetrafluoroethylene resin powder having a weight average molecular weight of 500,000-1,000,000 and an average grain size of 5-20 μm in a ratio of 70:30-95:5 on the basis of weight is compression molded and baked to form this separating claw.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、複写機、レーザー
ビームプリンタ等の電子写真装置において使用される分
離爪に関し、詳しくは、先端が鋭利であり、トナーの融
着等によるぺーパージャムの発生を長期にわたって防止
できる、耐久性が著しく改良された分離爪に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a separation claw used in an electrophotographic apparatus such as a copying machine and a laser beam printer, and more particularly, to a paper jam having a sharp tip and fusing toner. The present invention relates to a separation claw which has a significantly improved durability and can prevent the separation claw for a long time.

【0002】[0002]

【従来の技術】従来よりトナーの融着等によるぺーパー
ジャムの発生を防止する分離爪の開発が行われている。
2. Description of the Related Art Conventionally, there has been developed a separation claw for preventing the occurrence of paper jam due to fusing of toner or the like.

【0003】ポリイミド樹脂から成形された分離爪先端
の少なくとも複写紙が当たる部分をテトラフルオロエチ
レン−パーフルオロアルキルビニルエーテル共重量体に
より被覆した分離爪(特開平1−72182号)や、フ
ッ素樹脂のプライマー層およびトップ層からなる多層構
造の塗膜を有するポリアミドイミド樹脂やポリフェニレ
ンサルファイド樹脂などから成形された分離爪などがあ
る。
[0003] Separation claws in which at least a portion of the tip of the separation claw formed of a polyimide resin, which is in contact with the copy paper, is coated with a tetrafluoroethylene-perfluoroalkylvinyl ether co-weight (JP-A-1-72182), a fluororesin primer There is a separation claw molded from a polyamide-imide resin or a polyphenylene sulfide resin having a multilayer coating film composed of a layer and a top layer.

【0004】また、分離爪の表面にフッ素樹脂をコーテ
ィングする技術だけでなく、ポリイミド樹脂40〜90
重量%およびポリテトラフルオロエチレン樹脂などのフ
ッ素系樹脂60〜10重量%の配合物を圧縮成形および
焼成して得られた複写機用分離爪(特開平4−1028
83号)や、ポリイミド樹脂30〜90重量%およびテ
トラフルオロエチレン−パーフルオロアルキルビニルエ
ーテル共重量体70〜10重量%の配合物を圧縮成形し
て、爪の先端の内接円直径が70μm以下である形状の
分離爪圧粉体を作り、次いで焼成してなる分離爪(特開
平6−19360号)なども開発されている。
[0004] In addition to the technique of coating the surface of the separation claw with a fluororesin, polyimide resins 40 to 90
Separation claws for copiers obtained by compression molding and baking a blend of 60 to 10% by weight of a fluorine-based resin such as a polytetrafluoroethylene resin.
No. 83) or a mixture of 30 to 90% by weight of a polyimide resin and 70 to 10% by weight of a tetrafluoroethylene-perfluoroalkylvinyl ether co-weight, and the inscribed circle diameter at the tip of the nail is 70 μm or less. A separation claw (JP-A-6-19360) formed by forming a separation claw green compact having a certain shape and then firing the same has been developed.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、複写機
等の電子写真装置の高品質化、高寿命化に伴ない、さら
に再生紙を使用する近年の傾向により、分離爪において
は、トナーに対する非粘着性の向上、トナーや紙粉によ
る摺擦に耐えうるような耐摩耗性の改良、および分離爪
先端径の最小化が望まれている。
However, as the quality and life of electrophotographic devices such as copiers and the like have been improved, and the recent tendency to use recycled paper, the separation claw has no adhesion to toner. It is desired to improve the resilience, the abrasion resistance to withstand rubbing by toner or paper dust, and minimize the diameter of the separation claw tip.

【0006】そこで、本発明は上記問題点を解決し、耐
摩耗性、トナーに対する非粘着性、および耐久性を改良
した先端が鋭利な電子写真装置用分離爪を提供すること
を目的とする。
Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a separation claw for an electrophotographic apparatus having a sharp tip with improved abrasion resistance, non-adhesion to toner, and durability.

【0007】[0007]

【課題を解決するための手段】本発明者は、このような
課題を解決するために鋭意研究を重ねた結果、重量平均
分子量および平均粒径が一定範囲内にあるポリテトラフ
ルオロエチレン樹脂の粉末と、ポリイミド樹脂粉末との
配合物を用いることにより改良された耐摩耗性およびト
ナーに対する非粘着性を有する分離爪を提供できること
を見出した。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve such problems, and as a result, have found that powders of polytetrafluoroethylene resin having a weight-average molecular weight and an average particle size within a certain range are obtained. It has been found that a separation claw having improved abrasion resistance and non-adhesiveness to toner can be provided by using a blend with the polyimide resin powder.

【0008】上記課題を解決するために、本発明の電子
写真装置用分離爪は、ポリイミド樹脂粉末と、重量平均
分子量500,000〜1,000,000、平均粒径
5〜20μmのポリテトラフルオロエチレン樹脂粉末と
を、重量に基づいて70:30〜90:5の割合で配合
して得られた配合物を圧縮成形し、次いで焼成して得ら
れたことを特徴とする。
In order to solve the above-mentioned problems, a separation claw for an electrophotographic apparatus according to the present invention comprises a polyimide resin powder and a polytetrafluorocarbon having a weight average molecular weight of 500,000 to 1,000,000 and an average particle diameter of 5 to 20 μm. It is characterized by being obtained by compression-molding a blend obtained by blending ethylene resin powder at a ratio of 70:30 to 90: 5 based on weight, and then firing.

【0009】また、他の本発明による分離爪は、上記の
分離爪であって、該分離爪の先端直径が50μm以下で
あることを特徴とする。
[0009] Another separation claw according to the present invention is the separation claw described above, wherein the tip diameter of the separation claw is 50 µm or less.

【0010】さらにまた、他の本発明による分離爪は、
上記いずれかの分離爪であって、該分離爪表面の撥水角
は100度以上であり、分離爪表面が50μmまで摩耗
しても、該表面の撥水角は90度以上であることを特徴
とする。
[0010] Still another separation claw according to the present invention is:
Any of the above separation nails, wherein the water repellent angle of the surface of the separation nail is 100 degrees or more, and the water repellency angle of the surface is 90 degrees or more even if the surface of the separation nail is worn down to 50 μm. Features.

【0011】[0011]

【発明の実施の形態】本発明において使用されるポリイ
ミド樹脂粉末は、ピロメリット酸二無水物、3,3′,
4,4′−ビフェニルテトラカルボン酸二無水物、およ
び3,3′,4,4′−ベンゾフェノンテトラカルポン
酸二無水物から成る群から選択される1種以上の酸と、
4,4′−ジアミノジフェニルエーテル、1,3−フェ
ニレンジアミン、および1,4−フェニレンジアミンか
ら成る群から選択される1種以上のジアミンとの重縮合
物あるいは共重合物などである。熱変形温度が340℃
以上と非常に高く、強度と伸びとのバランスが良いこと
から4,4′−ジアミノジフェニルエーテルとピロメリ
ット酸二無水物との重縮合物および3,3′,4,4′
−ビフェニルテトラカルボン酸二無水物と1,3−フェ
ニレンジアミンと1,4−フェニレンジアミンとの共重
合物であるポリイミド樹脂粉末が好ましく、4,4′−
ジアミノジフェニルエーテルとピロメリット酸二無水物
との重縮合物が特に好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION The polyimide resin powder used in the present invention comprises pyromellitic dianhydride, 3,3 ',
One or more acids selected from the group consisting of 4,4'-biphenyltetracarboxylic dianhydride and 3,3 ', 4,4'-benzophenonetetracarponic dianhydride;
And polycondensates or copolymers with one or more diamines selected from the group consisting of 4,4'-diaminodiphenyl ether, 1,3-phenylenediamine, and 1,4-phenylenediamine. Heat deformation temperature is 340 ℃
Since the above is very high and the balance between strength and elongation is good, a polycondensate of 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and 3,3 ', 4,4'
Polyimide resin powder which is a copolymer of -biphenyltetracarboxylic dianhydride, 1,3-phenylenediamine and 1,4-phenylenediamine is preferred, and 4,4'-
Polycondensates of diaminodiphenyl ether and pyromellitic dianhydride are particularly preferred.

【0012】本発明で使用するポリテトラフルオロエチ
レン樹脂粉末は、重量平均分子量が500,000〜
1,000,000であり、平均粒径が5〜20μmで
ある。ポリテトラフルオロエチレン樹脂は融点が高いた
め、上記のいずれのポリイミド樹脂粉末の焼成温度にも
十分耐え得るが、従来公知の他のフッ素樹脂ではポリイ
ミド樹脂粉末の焼成により分解してしまうという問題が
ある。
The polytetrafluoroethylene resin powder used in the present invention has a weight average molecular weight of 500,000 to 500,000.
1,000,000 and an average particle size of 5 to 20 μm. Since polytetrafluoroethylene resin has a high melting point, it can sufficiently withstand the firing temperature of any of the above polyimide resin powders, but there is a problem that other conventionally known fluororesins are decomposed by firing the polyimide resin powder. .

【0013】ポリテトラフルオロエチレン樹脂粉末の重
量平均分子量は、600,000〜800,000が好
ましく、600,000〜700,000がさらに好ま
しい。平均粒径は5〜15μmが好ましく、7〜12μ
mがさらに好ましい。重量平均分子量が500,000
より小さいと、ポリイミド樹脂の焼成温度で熱分解し、
分離爪の表面に凹凸が発生してしまう。一方、重量平均
分子量が1,000,000より大きいと、溶融温度が
非常に高く、ポリイミド樹脂の焼成温度で溶融した場
合、流れにくくなるために分離爪の表面への広がりが不
足してしまう。また、平均粒径が5μmより小さくて
も、20μmより大きくても、分散性が悪く、良好な表
面を有する分離爪が得られない。
The weight average molecular weight of the polytetrafluoroethylene resin powder is preferably from 600,000 to 800,000, more preferably from 600,000 to 700,000. The average particle size is preferably 5 to 15 μm, and 7 to 12 μm.
m is more preferred. 500,000 weight average molecular weight
If it is smaller, it will thermally decompose at the firing temperature of the polyimide resin,
Unevenness occurs on the surface of the separation claw. On the other hand, if the weight average molecular weight is more than 1,000,000, the melting temperature is extremely high, and when the polyimide resin is melted at the sintering temperature, it becomes difficult to flow, so that the spread of the separation nail to the surface is insufficient. Also, if the average particle size is smaller than 5 μm or larger than 20 μm, the dispersibility is poor and a separation nail having a good surface cannot be obtained.

【0014】ポリイミド樹脂粉末とポリテトラフルオロ
エチレン樹脂粉末との配合比は、重量に基づいて70:
30〜95:5である。好ましくは、80:20〜9
0:10であり、さらに好ましくは、85:15であ
る。ポリテトラフルオロエチレン樹脂粉末の配合割合が
5より少ないと、トナーに対する非粘着性が不十分であ
り、一方、配合割合が30より多いと、分離爪の先端強
度が低下しすぎてしまう。
The compounding ratio of the polyimide resin powder and the polytetrafluoroethylene resin powder is 70:
30-95: 5. Preferably, 80: 20-9
0:10, and more preferably 85:15. If the blending ratio of the polytetrafluoroethylene resin powder is less than 5, the non-adhesiveness to the toner is insufficient, while if the blending ratio is more than 30, the tip strength of the separation claw is too low.

【0015】本発明においては、分離爪の性能に影響を
及ぼさない範囲で、ポリイミド樹脂粉末に、ポリテトラ
フルオロエチレン樹脂粉末とともにグラファイトを配合
してもよい。
In the present invention, graphite may be added to the polyimide resin powder together with the polytetrafluoroethylene resin powder as long as the performance of the separation nail is not affected.

【0016】本発明の分離爪は、ポリイミド樹脂粉末
と、重量平均分子量500,000〜1,000,00
0、平均粒径5〜20μmのポリテトラフルオロエチレ
ン樹脂粉末とを、重量に基づいて70:30〜95:5
の割合て配合して得られた配合物を圧縮成形し、次いで
焼成することにより得ることができる。ポリイミド樹脂
粉末とポリテトラフルオロエチレン樹脂粉末との配合
は、ドライブレンドである。ポリイミド樹脂粉末に過度
の負荷がかからない条件下で配合されなければならな
い。圧縮成形は、通常、圧縮面圧40,000psi以
上で行われ、焼成は、通常、380℃から500℃の温
度で4時間以上行われ、ポリマーからポリイミドへの実
質的に完全な変換を生じさせる。焼成後に洗浄し、バレ
ル研磨を行うことにより、分離爪の表面をより平滑にす
ることが好ましい。
The separation nail of the present invention comprises a polyimide resin powder and a weight average molecular weight of 500,000 to 1,000,000.
0, a polytetrafluoroethylene resin powder having an average particle diameter of 5 to 20 μm, and 70:30 to 95: 5 based on weight.
And compression-molding the resulting mixture, followed by firing. The blend of the polyimide resin powder and the polytetrafluoroethylene resin powder is a dry blend. It must be compounded under conditions that do not place an excessive load on the polyimide resin powder. The compression molding is usually performed at a compression surface pressure of 40,000 psi or more, and the calcination is usually performed at a temperature of 380 ° C. to 500 ° C. for 4 hours or more, resulting in substantially complete conversion of the polymer to polyimide. . It is preferable that the surface of the separation nail is made smoother by washing after baking and barrel polishing.

【0017】本発明の分離爪は、先端直径が50μm以
下であることが好ましく、さらに好ましくは先端直径は
30μm以下である。ポリイミド樹脂からなる分離爪に
フッ素樹脂コーティングを行った場合には、分離爪の先
端直径を50μm以下にすることはたいへん難しいが、
本発明では、コーティングを行わないため、成形品の精
度を出しやすい。
The separation claw of the present invention preferably has a tip diameter of 50 μm or less, more preferably 30 μm or less. If the separation claw made of polyimide resin is coated with fluororesin, it is very difficult to reduce the tip diameter of the separation claw to 50 μm or less,
In the present invention, since no coating is performed, the accuracy of the molded product is easily obtained.

【0018】本発明においては、分離爪表面のトナーに
対する非粘着性を表す指標として、分離爪表面の撥水角
を用いた。撥水角は、分離爪の表面に、注射針で蒸留水
約0.4μlを滴下させ、画像処理式接触角計(協和界
面科学株式会社製CA−X150型)を使用して、その
接触角を測定して得られた値である。
In the present invention, the water repellency angle of the surface of the separation nail is used as an index indicating the non-adhesion of the surface of the separation nail to the toner. The water repellency angle was determined by dropping about 0.4 μl of distilled water on the surface of the separation nail with an injection needle and using an image processing contact angle meter (CA-X150, manufactured by Kyowa Interface Science Co., Ltd.). Is a value obtained by measuring.

【0019】ポリイミド樹脂粉末と、重量平均分子量5
00,000〜1,000,000、平均粒径5〜20
μmのポリテトラフルオロエチレン樹脂粉末とを、重量
に基づいて70:30〜95:5の割合で配合して得ら
れた配合物を圧縮成形し、次いで焼成することにより得
られた分離爪の表面の撥水角は100度以上であり、分
離爪表面が50μmまで摩耗しても、表面の撥水角は9
0度以上に維持されている。分離爪の表面にフッ素樹脂
コーティングを施した場合には、その膜厚は30〜50
μmである。これに対し、本発明の分離爪においては、
コーティングを行うことなく、分離爪表面がトナーに対
する非粘着性を有するだけでなく、さらに表層が摩耗し
てもトナーに対する非粘着性を維持でき、コーティング
を施した分離爪よりも耐久性に優れている。
Polyimide resin powder and weight average molecular weight 5
00,000-1,000,000, average particle size 5-20
The surface of the separation nail obtained by compression-molding a compound obtained by mixing a polytetrafluoroethylene resin powder with a μm polytetrafluoroethylene resin powder in a ratio of 70:30 to 95: 5 based on the weight, and then firing. Has a water repellent angle of 100 degrees or more, and even if the separation nail surface is worn down to 50 μm, the water repellent angle of the surface is 9 degrees.
It is maintained at 0 degrees or more. When the surface of the separation nail is coated with a fluororesin, its film thickness is 30 to 50.
μm. On the other hand, in the separation nail of the present invention,
Without coating, not only does the separation nail surface have non-adhesiveness to the toner, it can also maintain non-adhesion to the toner even if the surface layer is worn, and it is more durable than the coated separation nail. I have.

【0020】[0020]

【実施例】本発明を実施例を挙げて説明するが、本発明
は本実施例にのみ限定されるものではない。
EXAMPLES The present invention will be described with reference to examples, but the present invention is not limited to these examples.

【0021】(実施例1〜2、比較例1〜4、対照例
1)4,4′−ジアミノジフェニルエーテルとピロメリ
ット酸二無水物との重縮合物であるポリイミド樹脂粉末
(デュポン社製ベスペル(登録商標)SP−1)と、表
1に示す重量平均分子量および平均粒径を有するポリテ
トラフルオロエチレン樹脂粉末とを、重量に基づき9
0:10の割合でドライブレンドし、分離爪用の金型に
充填し、圧縮面圧40,000psi以上で圧縮し、温
度380℃〜500℃で4時間以上にわたり焼成した。
焼成後、洗浄し、バレル研磨を行い、先端直径約30μ
mの分離爪を作成した。
(Examples 1-2, Comparative Examples 1-4, Control Example 1) Polyimide resin powder which is a polycondensate of 4,4'-diaminodiphenyl ether and pyromellitic dianhydride (Vespel (DuPont) (Registered trademark) SP-1) and a polytetrafluoroethylene resin powder having a weight-average molecular weight and an average particle size shown in Table 1 based on a weight of 9
The mixture was dry-blended at a ratio of 0:10, filled in a mold for a separation nail, compressed at a compression surface pressure of 40,000 psi or more, and baked at a temperature of 380 to 500 ° C. for 4 hours or more.
After firing, cleaning, barrel polishing, tip diameter about 30μ
m separation nails were prepared.

【0022】また、対照例1として、同一のポリイミド
樹脂粉末のみを使用して、同一の製造条件にて分離爪を
作成した。
Further, as Comparative Example 1, separation nails were prepared using only the same polyimide resin powder under the same manufacturing conditions.

【0023】得られた分離爪の表面を目視観察した。結
果を表1に示す。
The surface of the obtained separation nail was visually observed. Table 1 shows the results.

【0024】[0024]

【表1】 [Table 1]

【0025】実施例1〜2と比較例1とを比べると、ポ
リテトラフルオロエチレン粉末の重量平均分子量および
平均粒径が本発明の範囲から外れると、平滑な表面を有
する分離爪を得ることができないことがわかる。
When Examples 1 and 2 are compared with Comparative Example 1, if the weight average molecular weight and the average particle size of the polytetrafluoroethylene powder are out of the range of the present invention, it is possible to obtain a separation nail having a smooth surface. It turns out that you can't.

【0026】また、実施例1〜2と比較例2〜4とを比
較すると、ポリテトラフルオロエチレン粉末の平均粒径
が本発明の範囲内であっても、重量平均分子量が本発明
の範囲から外れると、ポリテトラフルオロエチレン樹脂
粉末の分散性が悪く平滑な表面を有する分離爪を得るこ
とができないことがわかる。
When Examples 1-2 and Comparative Examples 2-4 are compared, even if the average particle size of the polytetrafluoroethylene powder is within the range of the present invention, the weight-average molecular weight is out of the range of the present invention. If it is off, it can be seen that the dispersibility of the polytetrafluoroethylene resin powder is poor and a separation nail having a smooth surface cannot be obtained.

【0027】(実施例3〜6)4,4′−ジアミノジフ
ェニルエーテルとピロメリット酸二無水物との重縮合物
であるポリイミド樹脂粉末(デュポン社製ベスペル(登
録商標)SP−1)と、重量平均分子量600,000
〜700,000、平均粒径7〜12μmのポリテトラ
フルオロエチレン樹脂粉末とを、表2に示す重量に基づ
く配合比でドライブレンドし、分離爪用の金型に充填
し、圧縮面圧40,000psi以上で圧縮し、温度3
80℃〜500℃で4時間以上にわたり焼成した。焼成
後、洗浄し、バレル研磨を行い、先端直径約30μmの
分離爪を作成した。得られた分離爪および対照例1の分
離爪の先端強度を測定した。具体的には、分離爪を通紙
面が圧縮試験機の基台と垂直になるように基台に固定
し、鉛直上方より平板で爪先端に加重していき、先端破
壊が起きた時の荷重を測定し、先端強度とした。結果を
表2に示す。
(Examples 3 to 6) A polyimide resin powder (Vespel (registered trademark) SP-1 manufactured by DuPont), which is a polycondensate of 4,4'-diaminodiphenyl ether and pyromellitic dianhydride, and a weight Average molecular weight 600,000
700700,000 and polytetrafluoroethylene resin powder having an average particle size of 7 to 12 μm were dry blended at a blending ratio based on the weight shown in Table 2 and filled in a mold for a separation claw. Compress at 000 psi or higher, temperature 3
It was calcined at 80 ° C to 500 ° C for 4 hours or more. After baking, it was washed and barrel polished to form a separation claw having a tip diameter of about 30 μm. The tip strength of the obtained separation nail and the separation nail of Comparative Example 1 was measured. Specifically, the separation claw is fixed to the base so that the paper passing surface is perpendicular to the base of the compression tester, and a load is applied to the claw tip with a flat plate from above vertically, and when the tip breakage occurs Was measured to determine the tip strength. Table 2 shows the results.

【0028】[0028]

【表2】 [Table 2]

【0029】実施例3〜6と対照例1とを比較すると、
ポリテトラフルオロエチレン樹脂粉末の配合量が多い
程、常温でも高温雰囲気でも、先端強度が低下すること
がわかる。
When Examples 3 to 6 and Comparative Example 1 are compared,
It can be seen that the greater the blending amount of the polytetrafluoroethylene resin powder, the lower the tip strength both at room temperature and in a high-temperature atmosphere.

【0030】(実施例7、比較例5〜6)4,4′−ジ
アミノジフェニルエーテルとピロメリット酸二無水物と
の重縮合物であるポリイミド樹脂粉末(デュポン社製ベ
スペル(登録商標)SP−1)と、重量平均分子量60
0,000〜700,000、平均粒径7〜12μmの
ポリテトラフルオロエチレン樹脂粉末とを、85:15
の配合比でドライブレンドし、分離爪用の金型に充填
し、圧縮面圧40,000psi以上で圧縮し、温度3
80℃〜500℃で4時間以上にわたり焼成した。焼成
後、洗浄し、バレル研磨を行い、先端直径約30μmの
分離爪を作成し、実施例7とした。得られた分離爪の表
面に、注射針で蒸留水約0.4mlを滴下させ、画像処
理式接触角計(協和界面科学株式会社製CA−X150
型)を使用して、その接触角を測定し、撥水角とした。
さらに、1000メッシュの耐水研磨紙で表面を50μ
m研磨した後、同様に水との接触角を測定し、撥水角と
した。
(Example 7, Comparative Examples 5 to 6) Polyimide resin powder which is a polycondensate of 4,4'-diaminodiphenyl ether and pyromellitic dianhydride (Vespel (registered trademark) SP-1 manufactured by DuPont) ) And a weight average molecular weight of 60
A polytetrafluoroethylene resin powder having an average particle diameter of 7 to 12 μm and
Dry blending at a compounding ratio of ??, filling in a mold for a separation nail, and compressing at a compression surface pressure of 40,000 psi or more, at a temperature of 3
It was calcined at 80 ° C to 500 ° C for 4 hours or more. After baking, washing and barrel polishing were performed to form a separation claw having a tip diameter of about 30 μm. About 0.4 ml of distilled water was dropped on the surface of the obtained separation nail with an injection needle, and an image processing contact angle meter (CA-X150 manufactured by Kyowa Interface Science Co., Ltd.) was used.
The contact angle was measured using a mold) to determine the water-repellent angle.
Further, the surface is 50 μm with a 1000 mesh water-resistant abrasive paper.
After polishing, the contact angle with water was measured in the same manner to determine the water repellent angle.

【0031】また、4,4′−ジアミノジフェニルエー
テルとロメリット酸二無水物との重縮合物であるポリイ
ミド樹脂粉末(デュポン社製ベスペル(登録商標)SP
−1)を、分離爪の金型に充填し、圧縮面圧40,00
0psi以上で圧縮し、温度380℃〜500℃で4時
間以上にわたり焼成した。焼成後、洗浄し、バレル研磨
を行った。得られた分離爪表面の撥水角を同様に測定し
比較例5とした。
A polyimide resin powder (Vespel (registered trademark) SP manufactured by DuPont), which is a polycondensate of 4,4'-diaminodiphenyl ether and romellitic dianhydride, is also available.
-1) was charged into a mold of a separation claw, and the compression surface pressure was 40,00.
Compressed at 0 psi or more and fired at a temperature of 380 ° C. to 500 ° C. for 4 hours or more. After baking, it was washed and barrel polished. The water repellent angle on the surface of the obtained separation nail was measured in the same manner as Comparative Example 5.

【0032】比較例5と同様に作成した分離爪の表面
に、テトラフルオロエチレン/パーフルオロアルキルビ
ニルエーテル共重合体のプライマーを塗布乾燥し、さら
に、テトラフルオロエチレン/パーフルオロアルキルビ
ニルエーテル共重合体のトップコート分散液(平均粒径
0.2〜0.4μm)をスプレー塗装した後、焼成し、
プライマー層の平均膜厚10μm、トップ層の平均膜厚
20μmのコーティング層を形成し、比較例6とした。
A primer of a tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer was applied to the surface of the separation nail prepared in the same manner as in Comparative Example 5 and dried, and the top of the tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer was further dried. After spray-coating a coat dispersion (average particle size 0.2 to 0.4 μm), baking,
A coating layer having an average thickness of the primer layer of 10 μm and an average thickness of the top layer of 20 μm was formed.

【0033】得られた分離爪表面の撥水角を同様に測定
した。さらに、実施例7と同様に、1000メッシュの
耐水研磨紙で表面を50μm研磨した後、撥水角を測定
した。
The water repellent angle on the surface of the obtained separation nail was measured in the same manner. Further, in the same manner as in Example 7, the surface was polished with a 1000-mesh water-resistant abrasive paper by 50 μm, and then the water repellency angle was measured.

【0034】撥水角の測定はそれぞれ3回行い、その平
均を求めた。結果を表3に示す。
The water repellency angle was measured three times, and the average was determined. Table 3 shows the results.

【0035】[0035]

【表3】 [Table 3]

【0036】実施例7と比較例5とを比較すると、ポリ
テトラフルオロエチレン樹脂粉末を配合することによ
り、分離爪の表面の撥水性が高まることがわかる。この
ことから、トナーに対する非粘着性が改良されていると
考えることができる。
Comparing Example 7 with Comparative Example 5, it can be seen that the water repellency of the surface of the separation nail is increased by blending the polytetrafluoroethylene resin powder. From this, it can be considered that the non-adhesiveness to the toner is improved.

【0037】実施例7と比較例6とを比較すると、本発
明の分離爪の表面は、フッ素樹脂をコーティングした場
合と同等のトナーに対する非粘着性を有することがわか
る。また、表面を50μm研磨した場合でも、本発明の
分離爪は、優れた非粘着性を維持できるが、フッ素樹脂
をコーティングした分離爪の場合には、どんなに厚塗り
しても膜厚はたかだか50μm程度であるため、非粘着
性が低下してしまうことがわかる。
Comparing Example 7 with Comparative Example 6, it can be seen that the surface of the separation claw of the present invention has the same non-adhesiveness to the toner as when coated with a fluororesin. Even when the surface is polished to 50 μm, the separation claw of the present invention can maintain excellent non-adhesiveness. However, in the case of a separation claw coated with a fluororesin, no matter how thick the coating is, the film thickness is no more than 50 μm. It can be seen that the degree of non-adhesion is reduced because of the degree.

【0038】(実施例8)実施例1の分離爪を市販の中
速複写機に取り付けて、30枚/分の速度でA4判コピ
ー用紙の通紙テストを実施したところ、通紙10万枚後
でも分離爪のトナー付着および先端摩耗等の不良が起き
なかった。また、当接する定着ロール部への傷つけも起
こらなかった。
(Embodiment 8) The separation claw of Embodiment 1 was attached to a commercially available medium-speed copying machine, and a paper passing test of A4 size copy paper was performed at a speed of 30 sheets / min. Defects such as toner adhesion and tip abrasion did not occur even after separation. Further, no damage was caused to the fixing roll portion to be brought into contact.

【0039】[0039]

【発明の効果】以上のように、本発明により、耐摩耗性
およびトナーに対する非粘着性を改良した先端が鋭利な
電子写真装置用分離爪を、フッ素樹脂のコーティングを
行うことなく、製造することができる。さらに、本発明
の分離爪は、表面が摩耗しても非粘着性を維持すること
ができる耐久性に優れた分離爪である。
As described above, according to the present invention, it is possible to manufacture a separation claw for an electrophotographic apparatus having a sharp tip with improved abrasion resistance and non-adhesion to toner without coating with a fluororesin. Can be. Further, the separation claw of the present invention is a separation claw excellent in durability that can maintain non-adhesiveness even when its surface is worn.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 横山 晃 栃木県宇都宮市清原工業団地19番地2 デ ュポン株式会社 中央技術研究所内 (72)発明者 中川 伸一 栃木県宇都宮市清原工業団地19番地2 デ ュポン株式会社 中央技術研究所内 Fターム(参考) 2H032 DA12 DA17 2H033 AA16 AA23 BA16 BA19 BA20 4J002 BD152 CM041 GP00 GT00 HA09  ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akira Yokoyama 19-2 Kiyohara Industrial Park in Utsunomiya City, Tochigi Prefecture Dupont Co., Ltd. (72) Inventor Shinichi Nakagawa 19-2 Kiyohara Industrial Park in Utsunomiya City, Tochigi Prefecture F-term in Central Technology Research Laboratories, Inc. (Reference) 2H032 DA12 DA17 2H033 AA16 AA23 BA16 BA19 BA20 4J002 BD152 CM041 GP00 GT00 HA09

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ポリイミド樹脂粉末とポリテトラフルオ
ロエチレン樹脂粉末との配合物を圧縮成形し、次いで焼
成して得られた電子写真装置用分離爪において、前記ポ
リイミド樹脂粉末とポリテトラフルオロエチレン樹脂粉
末との重量に基づく配合比は、70:30〜95:5で
あり、前記ポリテトラフルオロエチレン樹脂粉末は、重
量平均分子量500,000〜1,000,000、平
均粒径5〜20μmであることを特徴とする分離爪。
1. A separation claw for an electrophotographic apparatus obtained by compression-molding a mixture of a polyimide resin powder and a polytetrafluoroethylene resin powder and then firing the mixture, wherein the polyimide resin powder and the polytetrafluoroethylene resin powder Is 70:30 to 95: 5, and the polytetrafluoroethylene resin powder has a weight average molecular weight of 500,000 to 1,000,000 and an average particle size of 5 to 20 μm. The separation claw characterized by the above.
【請求項2】 前記分離爪の先端直径が50μm以下で
あることを特徴とする請求項1に記載の分離爪。
2. The separation claw according to claim 1, wherein a tip diameter of the separation claw is 50 μm or less.
【請求項3】 前記分離爪表面の撥水角は100度以上
であり、前記分離爪表面が50μmまで摩耗しても、該
表面の撥水角は90度以上であることを特徴とする請求
項1または2に記載の分離爪。
3. The water repellent angle of the surface of the separation claw is 100 degrees or more, and even if the surface of the separation claw is worn down to 50 μm, the water repellency angle of the surface is 90 degrees or more. Item 3. The separation nail according to Item 1 or 2.
JP21600098A 1998-07-30 1998-07-30 Separating claw for electrophotographic device Pending JP2000047493A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP21600098A JP2000047493A (en) 1998-07-30 1998-07-30 Separating claw for electrophotographic device
PCT/US1999/017333 WO2000007074A1 (en) 1998-07-30 1999-07-29 Separation fingers for electro photographic devices
CNB998090611A CN1146759C (en) 1998-07-30 1999-07-29 Separation finger for electro photographic devices
US09/743,330 US6844051B1 (en) 1998-07-30 1999-07-29 Separation fingers for electro photographic devices
EP99937676A EP1101152B1 (en) 1998-07-30 1999-07-29 Separation fingers for electro photographic devices
CA002337523A CA2337523C (en) 1998-07-30 1999-07-29 Separation fingers for electro photographic devices
DE69915489T DE69915489T2 (en) 1998-07-30 1999-07-29 TRENNFINGER FOR ELECTRO-PHOTOGRAPHIC EQUIPMENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21600098A JP2000047493A (en) 1998-07-30 1998-07-30 Separating claw for electrophotographic device

Publications (1)

Publication Number Publication Date
JP2000047493A true JP2000047493A (en) 2000-02-18

Family

ID=16681744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21600098A Pending JP2000047493A (en) 1998-07-30 1998-07-30 Separating claw for electrophotographic device

Country Status (6)

Country Link
EP (1) EP1101152B1 (en)
JP (1) JP2000047493A (en)
CN (1) CN1146759C (en)
CA (1) CA2337523C (en)
DE (1) DE69915489T2 (en)
WO (1) WO2000007074A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007514834A (en) * 2003-12-19 2007-06-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Heat-resistant resin blend suitable for secondary processing using powder metal or compression molding technology
JPWO2023080175A1 (en) * 2021-11-05 2023-05-11

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101805819B1 (en) * 2011-02-11 2017-12-07 에스프린팅솔루션 주식회사 Fusing device and eletrophotographic image forming apparatus using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0642113B2 (en) * 1985-04-12 1994-06-01 エヌティエヌ株式会社 Separation claw for copier
JPH04102883A (en) * 1990-08-22 1992-04-03 Toray Ind Inc Separating pawl for copying machine
JPH0619360A (en) * 1992-06-30 1994-01-28 Toray Ind Inc Separating pawl
JP2724306B2 (en) * 1996-08-26 1998-03-09 エヌティエヌ株式会社 Method of manufacturing separation claw for copying machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007514834A (en) * 2003-12-19 2007-06-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Heat-resistant resin blend suitable for secondary processing using powder metal or compression molding technology
KR101136616B1 (en) * 2003-12-19 2012-04-18 이 아이 듀폰 디 네모아 앤드 캄파니 Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
JPWO2023080175A1 (en) * 2021-11-05 2023-05-11
WO2023080175A1 (en) * 2021-11-05 2023-05-11 ジャパンマテックス株式会社 Powder composition containing polyimide and method for producing molded article formed from powder composition
JP7374541B2 (en) 2021-11-05 2023-11-07 ジャパンマテックス株式会社 Powder composition containing polyimide, method for producing molded product made from the powder composition

Also Published As

Publication number Publication date
DE69915489D1 (en) 2004-04-15
CN1146759C (en) 2004-04-21
CA2337523A1 (en) 2000-02-10
CN1311874A (en) 2001-09-05
WO2000007074A1 (en) 2000-02-10
EP1101152B1 (en) 2004-03-10
CA2337523C (en) 2007-12-04
DE69915489T2 (en) 2005-03-03
EP1101152A1 (en) 2001-05-23

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