JP2000044803A - Thermosetting composition, and equipment used at cryogenic temperature - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prepare a thermosetting composition retaining its high adhesive strength and insulation performance even at a cryogenic temperature by including an organopolysiloxane (or organohydrogenpolysiloxane) and an organic peroxide. SOLUTION: This thermosetting composition is prepared by including (A) 100 pts.wt. organopolysiloxane (or organohydrogenpolysiloxane) and (B) 1-15 pts.wt. (pref. 1-10 pts.wt. and more pref. 1-5 pts.wt.) organic peroxide used as a crosslinking agent producing radicals and accelerating the rosslinking reaction of silicones and, optionally, (C) 0.01-0.5 pts.wt. (pref. 0.03-0.1 pts.wt.) naphthenate (e.g. cobalt naphthenate) used as a hardening accelerator quickening the cure rate of the composition. It is pref. that the ingredient A is dimetylsilicone oil, metylphenylsilicone oil, or the like and that the ingredient B is dialkyl peroxide- based.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a silicone-based thermosetting composition, and a superconducting wire, a layer between superconducting wires, or a superconducting wire in which a bobbin and a winding are fixed using the thermosetting composition. The present invention relates to a conduction coil and a cryogenic device using the superconducting coil.

[0002]

2. Description of the Related Art A superconducting coil has many advantages as compared with a normal coil, such as a high magnetic field, a high magnetic field accuracy, a compact size, and a reduction in power consumption due to Joule loss. It is applied to various devices.

[0003] With current technology, superconducting coils need to operate at cryogenic temperatures. At cryogenic temperatures, superconductivity destruction (quenching) even with slight heat input due to various disturbances
May occur. For example, quenching is likely to occur due to frictional heat generated by the movement of a superconducting wire or a winding due to a strong electromagnetic force at the time of energization.

In order to improve the performance of a superconducting device, it is necessary to firmly fix a superconducting wire, a winding, etc., to prevent heat input due to such movement, and to improve the stability of the superconducting coil. There is.

[0005] In order to securely fix and insulate a superconducting wire or a winding without impairing the cooling characteristics of the superconducting conductor, a synthetic resin mainly composed of an epoxy resin has been conventionally used.

However, the epoxy resin has a large shrinkage from room temperature to a low temperature, and has a glass transition temperature higher than room temperature.
Large heat distortion. Therefore, when an electromagnetic force is applied at an extremely low temperature, cracks and peeling of the bonded portion are likely to occur, which may cause quench. In addition, it took a long time to cure the resin, and the production time was long.

[0007]

As described above, when a conventional synthetic resin mainly composed of epoxy resin is used for fixing and insulating superconducting wires and windings of a superconducting coil, cracks and peeling may occur. And quenching is likely to occur. Also, it takes time to cure the resin,
There was a problem that the manufacturing time was long.

[0008] An object of the present invention is to provide a thermosetting composition having high adhesive strength and insulating performance even at extremely low temperatures.

It is another object of the present invention to provide a thermosetting composition which can be cured at a relatively low temperature in a short time.

[0010] Another object of the present invention is to provide such a thermosetting composition without enormous capital investment.

Another object of the present invention is to provide a superconducting coil to which a superconducting wire, a winding and the like are fixed by using such a thermosetting composition.

Another object of the present invention is to provide a cryogenic device using such a superconducting coil.

[0013]

In order to achieve the above object, a thermosetting composition according to claim 1 of the present invention comprises an organopolysiloxane or 100 parts by weight of an organohydrogenpolysiloxane and an organic peroxide. 1 to 15 parts by weight.

[0014] The thermosetting composition according to the second aspect is the first aspect.
The thermosetting composition according to the above, wherein the naphthenate salt 0.01 to 0.01
It is characterized by containing 0.5 parts by weight.

[0015] The thermosetting composition according to claim 3 comprises 100 parts by weight of vinyl silicone having a terminal functional group being a vinyl group;
1 to 15 parts by weight of an organic peroxide.

The thermosetting composition according to the fourth aspect is the third aspect.
The thermosetting composition according to the above, wherein the naphthenate salt 0.01 to 0.01
It is characterized by containing 0.5 parts by weight.

A thermosetting composition according to a fifth aspect of the present invention comprises a mixture of an organopolysiloxane or an organohydrogenpolysiloxane, 100 parts by weight of a vinyl silicone having a terminal functional group of a vinyl group, and 1 to 15 parts of an organic peroxide.
Parts by weight.

The thermosetting composition according to the sixth aspect is the fifth aspect.
The thermosetting composition according to the above, wherein the naphthenate salt 0.01 to 0.01
It is characterized by containing 0.5 parts by weight.

The thermosetting composition according to claim 7 is characterized in that an organopolysiloxane or an organohydrogenpolysiloxane, a vinyl silicone whose terminal functional group is a vinyl group, or an organopolysiloxane or an organohydrogenpolysiloxane and a terminal functional group. It is characterized by containing 100 parts by weight of a mixture with vinyl silicone which is a vinyl group, 1 to 15 parts by weight of an organic peroxide, and 5 to 400 parts by weight of an inorganic filler.

[0020] The thermosetting composition according to the eighth aspect is the seventh aspect.
The thermosetting composition according to the above, wherein the naphthenate salt 0.01 to 0.01
It is characterized by containing 0.5 parts by weight.

The thermosetting composition according to the ninth aspect is the first aspect.
Alternatively, in the thermosetting composition according to any one of 2 to 5 to 8, the organopolysiloxane or organohydrogenpolysiloxane is linear and has a high degree of polymerization.

A superconducting coil according to a tenth aspect is characterized in that the superconducting wire is fixed to the thermosetting composition according to any one of the first to ninth aspects.

A superconducting coil according to claim 11 is characterized in that the layers of the superconducting wire are fixed with the thermosetting composition according to any one of claims 1 to 9.

According to a twelfth aspect of the present invention, there is provided a superconducting coil, wherein a winding frame and a winding are fixed with the thermosetting composition according to any one of the first to ninth aspects.

A cryogenic device according to a thirteenth aspect of the present invention uses the superconducting coil according to any one of the tenth to twelfth aspects.

As the organopolysiloxane, dimethyl silicone oil, methyl phenyl silicone oil, higher fatty acid modified silicone oil, methyl chlorinated phenyl silicone oil, alkyl-modified silicone oil, amino-modified silicone oil, special methyl-based oil, etc. may be used. As the organohydrogenpolysiloxane, for example, methyl hydrogen silicone oil can be used. Among them, dimethyl silicone oil and methyl phenyl silicone oil are preferably used from the viewpoint of insulating properties.

As the linear organopolysiloxane or organohydrogenpolysiloxane having a high degree of polymerization, a linear one having a degree of polymerization of about 5,000 to 10,000 is preferably used. Among them, dimethyl silicone oil and methyl phenyl silicone oil are preferably used.

Examples of the vinyl silicone having a terminal functional group as a vinyl group include tetramethyldivinyldisiloxane.

Embedded image Vinyl-terminated polydimethylsiloxane

Embedded image Are preferably used.

Since the siloxane bond is very stable thermally, silicone has various advantages such as excellent heat resistance and cold resistance, high insulation, little change in viscosity with temperature, and low glass transition temperature. have. Also, because it is chemically inert, it does not corrode other materials such as metals.

The organopolysiloxane or organohydrogenpolysiloxane and vinyl silicone may be used as a mixture. The mixing ratio of both is not particularly limited, but is preferably 4: 1 to 1: 4, and 2: 1 to 1:
2 is more preferred.

As the organic peroxide, peroxy ketals, hydroperoxides, dialkyl peroxides and the like can be used. Among them, dialkyl peroxides are preferably used.

Such an organic peroxide is used as a crosslinking agent which generates a radical to accelerate a crosslinking reaction of silicones. Since the radical generation temperature varies depending on the type of the organic peroxide, there is an advantage that a type suitable for the production conditions can be appropriately selected. In addition, the crosslinking reaction by radicals has an advantage that curing is completed in a short time.

The content of the organic peroxide is 1 part by weight with respect to 100 parts by weight of the organopolysiloxane, the organohydrogenpolysiloxane, the vinyl silicone, or the mixture of the organopolysiloxane or the organohydrogenpolysiloxane and the vinyl silicone. If it is less than 15, the thermosetting composition does not gel, and if it is more than 15 parts by weight, the thermosetting composition has a large shrinkage during curing,
Desirably, the amount is 1 to 15 parts by weight. Preferably 1 to
It is 10 parts by weight, more preferably 1 to 5 parts by weight.

As the naphthenate, cobalt naphthenate, manganese naphthenate, zinc naphthenate and the like can be used. Such a naphthenate is used as a curing accelerator for accelerating the curing reaction of the thermosetting composition.

The naphthenate is used in an amount of 0.01 to 0.1 parts by weight based on 100 parts by weight of the organopolysiloxane or organohydrogenpolysiloxane, vinyl silicone or the mixture of organopolysiloxane or organohydrogenpolysiloxane and vinyl silicone.
5 parts by weight, preferably 0.03-0.1 parts by weight is used.

As the inorganic filler, for example, fused silica powder, crushed silica powder, short glass fiber, spherical glass beads, alumina powder and the like can be used. Preferably, fused silica or alumina powder is used. When these inorganic fillers are added, the coefficient of linear expansion decreases, and the shrinkage of the thermosetting composition at a low temperature decreases, so that the stress due to shrinkage can be reduced.

The inorganic filler is used in an amount of 5 to 400 parts by weight, preferably 100 parts by weight, based on 100 parts by weight of the organopolysiloxane or organohydrogenpolysiloxane, vinyl silicone or the mixture of organopolysiloxane or organohydrogenpolysiloxane and vinyl silicone. Is used in an amount of 10 to 300 parts by weight, more preferably 50 to 150 parts by weight.

To fix the superconducting wire of the superconducting coil,
For example, a superconducting wire is impregnated with the thermosetting composition of the present invention, integrated, and heated to cure and fix the thermosetting composition. Instead of impregnation, the thermosetting composition of the present invention may be applied to a superconducting wire, integrated, and then heated to cure the thermosetting composition.

To fix the layers of the superconducting wire, for example,
An interlayer prepreg impregnated with a film such as glass cloth of the thermosetting composition of the present invention is sandwiched between the layers of the superconducting wire, and heated to cure the thermosetting composition to fix the layers.

Instead of impregnation, the thermosetting composition of the present invention may be applied to a film such as a glass cloth and then sandwiched between layers. Alternatively, the thermosetting composition of the present invention may be directly applied to layers without using a film such as a glass cloth.

In order to fix the winding of the superconducting coil to the winding, for example, the thermosetting composition of the present invention is applied to the winding and the winding, and then the winding is wound around the winding and heated. To cure the thermosetting composition of the present invention to fix the winding and the bobbin.

Instead of applying directly to the bobbin and the winding, the thermosetting composition of the present invention is applied or impregnated to a film such as a glass cloth, and then formed as a bobbin / wound prepreg between the bobbin and the winding. May be interposed.

The thermosetting composition of the present invention has a higher adhesive strength at a lower temperature and a smaller shrinkage strain than a conventional epoxy resin. Also, it has excellent insulation properties. Therefore, with such a thermosetting composition, the superconducting wire of the superconducting coil, the interlayer,
Alternatively, if the winding and the bobbin are adhered to each other, even if an electromagnetic force or the like is applied at an extremely low temperature, cracks and peeling of the bonded portion are unlikely to occur, so that excellent coil stability and insulation can be obtained.

[0044]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail.

(Example 1) 100 parts by weight of TSF451-1000 (high-viscosity dimethyl silicone oil, manufactured by Toshiba Silicone) as an organopolysiloxane and Parkmill D (dicumyl peroxide, manufactured by NOF Corporation) as an organic peroxide 3 parts by weight were mixed and stirred at room temperature for 5 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive are as follows:
2 hours at 0 ° C.

Regarding the tensile shear adhesive strength, JIS
It was evaluated at both room temperature and liquid nitrogen temperature according to the K 6850 tensile shear bond strength test method. SUS304 was used as an adherend. (Example 2) 100 parts by weight of TSF451-1000
And 3 parts by weight of Park Mill D and 0.05 parts by weight of cobalt naphthenate as a curing accelerator were mixed and stirred at room temperature for 5 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were set at a curing temperature of 8
One hour at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

Example 3 T as Vinyl Silicone
100 parts by weight of SE3070 (A) (tetramethyldivinyldisiloxane, manufactured by Toshiba Silicone) and Park Mill D
3 parts by weight and stirred at room temperature for 5 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were set at a curing temperature of 8
2 hours at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

(Embodiment 4) TSE3070 (A) 100
By weight, 3 parts by weight of Park Mill D and 0.05 part by weight of cobalt naphthenate were mixed and stirred at room temperature for 5 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were set at a curing temperature of 8
One hour at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

(Example 5) TSF451-1000 1
00 parts by weight, 100 parts by weight of TSE3070 (A),
The mixture was mixed with 6 parts by weight of Park Mill D and stirred at room temperature for 5 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were as follows:
2 hours at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

(Example 6) TSF451-1000 1
00 parts by weight, 100 parts by weight of TSE3070 (A),
6 parts by weight of Park Mill D and cobalt naphthenate
1 part by weight and stirred at room temperature for 5 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were as follows:
One hour at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

(Example 7) TSF451-1000 1
00 parts by weight, 100 parts by weight of TSE3070 (A),
6 parts by weight of Park Mill D and SO-
The mixture was mixed with 200 parts by weight of C5 (manufactured by Tatsumori) and stirred at room temperature for 30 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were set at a curing temperature of 8
2 hours at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

(Example 8) 100 parts by weight of TSF-1000, 100 parts by weight of TSE3070 (A), 6 parts by weight of Parkmill D, 0.1 part by weight of cobalt naphthenate, and 200 parts by weight of SO-C5 The mixture was mixed and stirred at room temperature for 30 minutes to prepare an adhesive.

The bonding conditions of the obtained adhesive were set at a curing temperature of 8
One hour at 0 ° C. The tensile shear bond strength was evaluated in the same manner as in Example 1.

(Comparative Example) Epoxy resin C manufactured by Ciba-Geigy
100 parts by weight of Y205 and 1 part of HY905 hardener
00 parts by weight, 20 parts by weight of a plasticizer, and an amine-based curing accelerator were mixed.

The bonding conditions of the obtained epoxy adhesive are as follows:
The curing temperature was 120 ° C. for 10 hours. The tensile shear bond strength was evaluated in the same manner as in Example 1.

Table 1 shows the composition, curing conditions and properties of the adhesives obtained in Examples 1 to 8 and Comparative Example.

[0064]

[Table 1] The adhesive of Example 1 has a significantly shorter curing time and a lower curing temperature than the epoxy-based adhesive of Comparative Example, and has about 3
It shows twice the tensile shear bond strength (under liquid nitrogen temperature).

As in the adhesive of Example 1, the adhesive of Example 2 had a significantly shorter curing time and a lower curing temperature than the epoxy adhesive of Comparative Example, and had about three times the tensile strength of the Comparative Example. It shows the shear bond strength (under liquid nitrogen temperature). Due to the configuration to which naphthenate is added, the curing time is 80 ° C. × 1
h, it is further reduced to half as compared with the first embodiment. The tensile shear bond strength at room temperature is 13
(MPa), which is significantly improved as compared with 0.1 (MPa) in Example 1, and is comparable to the epoxy adhesive of Comparative Example.

The adhesive of Example 3 has a configuration in which vinyl silicone is used in place of the organopolysiloxane of Example 1. However, as in Example 1, the adhesive has a low curing temperature and a short curing time. Excellent tensile shear bond strength is shown at liquid nitrogen temperature. Further, the tensile shear bond strength at room temperature was 20 (MPa).
The values are much higher than those of Comparative Examples 2 and Comparative Examples.

The adhesive of Example 4 was used in the same manner as in Example 3.
The tensile shear bond strength at liquid nitrogen temperature and room temperature is improved. Because of the configuration to which naphthenate is added,
The curing reaction of the resin proceeds quickly, and the curing condition is 80 ° C x 1h
Thus, it is further improved as compared with the third embodiment.

The adhesive of Example 5 has a structure in which an organopolysiloxane and vinyl silicone are mixed, but at the same curing temperature and curing time as in Example 3, and is each higher by 5 (MPa) than that of Example 3. 2 shows the tensile shear bond strength at room temperature and liquid nitrogen temperature. It can be seen that the performance as an adhesive is further improved.

The adhesive of Example 6 has significantly improved tensile shear adhesive strength at room temperature and liquid nitrogen temperature as in Example 5. Because of the configuration in which the naphthenate is added, the curing condition is 80 ° C. × 1 h, which is even better than that of Example 5.

The adhesives of Examples 7 and 8 exhibit the same tensile shear strength at liquid nitrogen temperature at the same curing temperature and curing time as those of Examples 3 and 4. Tensile shear bond strength at liquid nitrogen temperature is greater than Examples 3 and 4. Since the inorganic fillers were added to the adhesives of Examples 7 and 8, shrinkage upon curing was very small. Compared to about 1.2% in a general epoxy, in Examples 7 and 8, it was 0.1%.
It was about 5 to 1.0%.

The adhesives according to Examples 1 to 8 could be easily prepared without requiring large-scale equipment, expensive materials, complicated steps, and the like.

(Example 9) A superconducting wire of a cryogenic superconducting coil was fixed and insulated with the adhesive prepared in Example 8 to produce a small cryogenic superconducting coil for testing. FIG.
FIG. 2 shows a cross-sectional view of the superconducting coil. Superconducting coil 1
Has a configuration in which the winding 2 is wound around a winding frame 3.

As shown in FIG. 2, the superconducting wire 4 was impregnated with the adhesive 5 prepared in Example 8 and integrated. Instead of impregnation, the adhesive 5 may be applied to the superconducting wire 4 and integrated. Thereafter, the adhesive was cured by heating to fix the superconducting wire 4.

For comparison, a superconducting wire was impregnated with the epoxy resin used in the comparative example and integrated to produce a small superconducting coil for testing.

The superconducting properties of the obtained superconducting coil were evaluated. The initial quench current was 60% of the critical current, which was higher than when an epoxy-based adhesive was used.

The adhesive 5 has a strong adhesive strength at a low temperature and a small shrinkage strain. Even when an electromagnetic force is applied at an extremely low temperature, cracks between the adhesive and the superconducting wire and peeling of the bonded portion hardly occur. . Therefore, the superconducting wires are firmly fixed to each other, the coil stability is improved, and quench hardly occurs.

Further, the time required for curing the adhesive during the production was short, and the production efficiency was improved. Furthermore, since the curing temperature is low, the energy required for heating was reduced, and the cost was reduced.

Example 10 A superconducting wire 4 of a cryogenic superconducting coil was fixed and insulated with an interlayer prepreg to produce a small cryogenic superconducting coil for testing. FIG. 1 shows a cross-sectional view of the superconducting coil.

As shown in FIG. 3, an interlayer prepreg 6 obtained by impregnating a film such as a glass cloth with the adhesive 5 prepared in Example 8 is sandwiched between the layers of the superconducting wire 4 and heated. The adhesive 5 was cured to fix and insulate the layers.

Instead of impregnation, the adhesive 5 may be applied to a film such as a glass cloth and then sandwiched between layers.
Alternatively, the adhesive 5 may be applied directly to the layers without using a film such as a glass cloth.

When the superconducting characteristics of the obtained superconducting coil were evaluated in the same manner as in Example 9, the initial quench current was 60% of the critical current. The value was higher than that of the case of fixing and insulating.

Since the adhesive 5 has a high adhesive strength at a low temperature and a small shrinkage strain, even if an electromagnetic force is applied at an extremely low temperature, cracks and peeling of the bonded portion between the layers of the winding of the superconducting coil occur. It is unlikely to occur. Therefore, the coil stability was improved and quenching was less likely to occur.

Further, since the time required for curing the adhesive during the production can be shortened, the production efficiency can be improved.

Since the curing temperature is low, the energy required for heating can be reduced, which can contribute to cost reduction. For example, since only the bonded portion can be heated and cured by a drier, there is no need to heat the entire coil, which contributes to an improvement in manufacturing efficiency and a reduction in cost.

(Example 11) The winding frame and the winding of the superconducting coil for a cryogenic device were fixed and insulated with the adhesive 5 prepared in Example 8 to provide a small cryogenic superconducting coil for testing. Produced. FIG. 1 shows a cross-sectional view of the superconducting coil.

After applying the adhesive 5 to the winding frame 3 and the winding 2 of the superconducting coil, the winding 2 is wound around the winding frame 3 and heated to cure the adhesive 5. The winding frame 3 was fixed and insulated.

Instead of directly applying the adhesive 5 to the reel 3 and the winding 2, the adhesive 5 is applied or impregnated to a film such as a glass cloth, and then the reel 3 is wound as a reel / winding prepreg 7. And the winding 2.

When the superconducting characteristics of the obtained superconducting coil were evaluated in the same manner as in Example 9, the initial quench current was 60% of the critical current, which was higher than when the epoxy adhesive was used. , Showed a high value.

The adhesive 5 has a high adhesive strength at a low temperature and a small shrinkage strain. Therefore, even if an electromagnetic force is applied at an extremely low temperature, cracks or adhesive Partial peeling is unlikely to occur. Therefore, the coil stability was improved and quenching was less likely to occur.

Since the time required for curing the adhesive during the production can be shortened, the production efficiency can be improved.

Since the curing temperature is low, the energy required for heating can be reduced, which can contribute to cost reduction. For example, since only the bonded portion can be heated and cured by a drier, there is no need to heat the entire coil, which contributes to an improvement in manufacturing efficiency and a reduction in cost.

[0092]

As described above, according to the thermosetting composition of the present invention, high adhesiveness and insulating properties can be obtained not only at room temperature but also at low temperature as compared with conventional epoxy resin-based resins. The contraction strain at the time is also small. Therefore, by applying the thermosetting composition of the present invention to the adhesion and insulation between superconducting wires of superconducting equipment, between layers, and between a bobbin and a winding, superconducting wires, between layers, and bobbin And the wire can be firmly fixed and insulated, thereby greatly improving the stability of the coil.
In addition, since the thermosetting composition of the present invention has a short curing time and a low curing temperature, the production efficiency can be improved and the cost required for heating can be reduced.

Therefore, if a superconducting coil fixed with such a thermosetting composition is used for a superconducting device, the performance of the superconducting device can be improved. Manufacturing costs can also be reduced.

The thermosetting composition of the present invention can be applied to devices other than superconducting equipment. Since it does not corrode other materials such as metal and has high chemical stability, it can be applied to various fields. In particular, it is preferably used for equipment used at low temperatures.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a superconducting coil according to the present invention.

FIG. 2 is a cross-sectional view of a superconducting wire integrated with an adhesive in Example 9.

FIG. 3 is a partial cross-sectional view of a superconducting wire in which layers are fixed and insulated by an adhesive in Example 10.

FIG. 4 is a view of a superconducting coil in which a winding and a bobbin are fixed and insulated by an adhesive in Example 11;

[Explanation of symbols]

REFERENCE SIGNS LIST 1 superconducting coil, 2 winding, 3 winding frame, 4 superconducting wire, 5 adhesive, 6 interlayer prepreg, 7 winding frame / winding prepreg

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 83/07 C08L 83/07 C09J 183/04 C09J 183/04 183/05 183/05 183/07 183 / 07 H01F 6/06 ZAA H01F 5/08 ZAAE F-term (reference) 4J002 CP03W CP04W CP05W CP08W CP09W CP12W CP12X DE149 DJ019 DL009 EG048 EK016 EK036 EK067 EX036 FA049 FA089 HA089 FD147 FD158 GQ00 GQ01 EK041040 HD30 JB02 KA03 KA04 KA42 LA01 LA09 MB01 MB06

Claims (13)

[Claims] 1. A thermosetting composition comprising 100 parts by weight of an organopolysiloxane or an organohydrogenpolysiloxane, and 1 to 15 parts by weight of an organic peroxide. 2. The thermosetting composition according to claim 1, which contains 0.01 to 0.5 parts by weight of a naphthenate. 3. A thermosetting composition comprising 100 parts by weight of a vinyl silicone having a terminal functional group being a vinyl group, and 1 to 15 parts by weight of an organic peroxide. 4. The thermosetting composition according to claim 3, comprising 0.01 to 0.5 parts by weight of a naphthenate. 5. A composition comprising 100 parts by weight of a mixture of an organopolysiloxane or an organohydrogenpolysiloxane, a vinyl silicone having a terminal functional group as a vinyl group, and 1 to 15 parts by weight of an organic peroxide. Thermosetting composition. 6. The thermosetting composition according to claim 5, comprising 0.01 to 0.5 parts by weight of a naphthenate. 7. An organopolysiloxane or an organohydrogenpolysiloxane, a vinyl silicone having a terminal functional group of a vinyl group, or a mixture of an organopolysiloxane or an organohydrogen polysiloxane and a vinyl silicone having a terminal functional group of a vinyl group A thermosetting composition comprising 100 parts by weight, 1 to 15 parts by weight of an organic peroxide, and 5 to 400 parts by weight of an inorganic filler. 8. The thermosetting composition according to claim 7, which contains 0.01 to 0.5 parts by weight of a naphthenate. 9. The method according to claim 1, wherein said organopolysiloxane or organohydrogenpolysiloxane is linear and has a high degree of polymerization.
9. The thermosetting composition according to any one of claims 1 to 8. 10. A superconducting coil, wherein a superconducting wire is fixed with the thermosetting composition according to any one of claims 1 to 9. 11. A superconducting coil, wherein a layer of a superconducting wire is fixed with the thermosetting composition according to claim 1. Description: 12. A superconducting coil, wherein a winding frame and a winding are fixed with the thermosetting composition according to claim 1. Description: 13. A cryogenic device using the superconducting coil according to any one of claims 10 to 12.