JP2000040684A5 - Cleaning equipment and cleaning method - Google Patents
Cleaning equipment and cleaning method Download PDFInfo
- Publication number
- JP2000040684A5 JP2000040684A5 JP1998223588A JP22358898A JP2000040684A5 JP 2000040684 A5 JP2000040684 A5 JP 2000040684A5 JP 1998223588 A JP1998223588 A JP 1998223588A JP 22358898 A JP22358898 A JP 22358898A JP 2000040684 A5 JP2000040684 A5 JP 2000040684A5
- Authority
- JP
- Japan
- Prior art keywords
- cleaned
- cleaning
- scrubbing
- polishing
- supplying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims description 57
- 238000005201 scrubbing Methods 0.000 claims description 18
- 238000005498 polishing Methods 0.000 claims description 13
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N HF Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 6
- 239000000243 solution Substances 0.000 claims 6
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 239000002253 acid Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atoms Chemical group 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
【０００１】
【発明の属する技術分野】
本発明は、半導体ウエハ等の被洗浄物を清浄にする洗浄装置および洗浄方法に関する。
[0001]
[Technical field to which the invention belongs]
The present invention relates to a cleaning device and a cleaning method for cleaning an object to be cleaned such as a semiconductor wafer.
本発明は上述した事情に鑑み、比較的簡略なスクラビング洗浄を主体として、ウエハ等の被洗浄材を、例えば検出限度（５×１０９〜１０atom／cm２）以下の十分な洗浄度に洗浄できるようにした洗浄装置および洗浄方法を提供することを目的とする。 In view of the above circumstances, the present invention mainly performs relatively simple scrubbing cleaning, and cleans a material to be cleaned such as a wafer with a sufficient cleaning degree of , for example, a detection limit (5 × 10 9 to 10 atom / cm 2) or less. It is an object of the present invention to provide a cleaning device and a cleaning method made possible.
【０００８】
【課題を解決するための手段】
上記課題を解決するため本発明の洗浄装置では、被洗浄物にアンモニア過酸化水素加熱溶液を供給しながら行う第１のスクラビング洗浄装置と、被洗浄物に希ふっ酸溶液を供給しながら行う第２のスクラビング洗浄装置とを含むことを特徴とする。
0008
[Means for solving problems]
In order to solve the above problems, in the cleaning apparatus of the present invention, a first scrubbing cleaning apparatus is performed while supplying an ammonia hydrogen peroxide heating solution to the object to be cleaned, and a first scrubbing cleaning device is performed while supplying a dilute dilute acid solution to the object to be cleaned. It is characterized by including 2 scrubbing cleaning devices.
ここに、第１、第２のスクラビング洗浄装置の後段に、超音波の振動エネルギーを与えた純水をウエハ表面に噴射したり、キャビテーションを有する高圧水をウエハに噴射して洗浄する液噴射による洗浄装置を設けることが好ましく、これにより、例えば希ふっ酸溶液によって生じた活性表面による二次汚染を防止することができる。
本発明の研磨装置では、被研磨物を研磨する研磨手段と、上述の洗浄装置とを有し、研磨後の被洗浄物を前記洗浄装置で洗浄することを特徴とする。
本発明の洗浄方法では、被洗浄物にアンモニア過酸化水素加熱溶液を供給しながら行う第１のスクラビング洗浄工程と、前記被洗浄物に希ふっ酸溶液を供給しながら行う第２のスクラビング洗浄工程とを含むことを特徴とする。
本発明の研磨方法では、被研磨物を研磨する研磨工程と、研磨後の被洗浄物にアンモニア過酸化水素加熱溶液を供給しながら行う第１のスクラビング洗浄工程と、前記研磨後の被洗浄物に希ふっ酸溶液を供給しながら行う第２のスクラビング洗浄工程とを含むことを特徴とする。
Here, after the first and second scrubbing cleaning devices, pure water to which ultrasonic vibration energy is applied is sprayed onto the wafer surface, or high-pressure water having cavitation is sprayed onto the wafer to clean the wafer. It is preferable to provide a cleaning device, which can prevent secondary contamination by the active surface caused by, for example, a dilute dilute acid solution.
The polishing apparatus of the present invention has a polishing means for polishing an object to be polished and the above-mentioned cleaning apparatus, and is characterized in that the object to be cleaned after polishing is cleaned by the cleaning apparatus.
In the cleaning method of the present invention, a first scrubbing cleaning step performed while supplying an ammonia hydrogen peroxide heating solution to the object to be cleaned and a second scrubbing cleaning step performed while supplying a dilute dilute acid solution to the object to be cleaned. It is characterized by including and.
In the polishing method of the present invention, a polishing step of polishing the object to be polished, a first scrubbing cleaning step performed while supplying an ammonia hydrogen peroxide heating solution to the object to be polished after polishing, and the object to be polished after polishing. It is characterized by including a second scrubbing cleaning step performed while supplying a dilute dilute acid solution.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10223588A JP2000040684A (en) | 1998-07-23 | 1998-07-23 | Cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10223588A JP2000040684A (en) | 1998-07-23 | 1998-07-23 | Cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000040684A JP2000040684A (en) | 2000-02-08 |
| JP2000040684A5 true JP2000040684A5 (en) | 2005-07-21 |
Family
ID=16800528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10223588A Pending JP2000040684A (en) | 1998-07-23 | 1998-07-23 | Cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000040684A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4660494B2 (en) * | 2007-02-15 | 2011-03-30 | 株式会社荏原製作所 | Polishing cartridge |
| KR20130092217A (en) * | 2012-02-10 | 2013-08-20 | 주식회사 엠엠테크 | Wet treating apparatus |
| JP6312534B2 (en) | 2014-06-10 | 2018-04-18 | 株式会社荏原製作所 | Substrate cleaning device |
| JP6183720B2 (en) * | 2015-04-10 | 2017-08-23 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and substrate processing method |
| JP7347986B2 (en) * | 2019-08-06 | 2023-09-20 | 株式会社ディスコ | edge trimming device |
| JP7433709B2 (en) | 2020-02-20 | 2024-02-20 | 株式会社ディスコ | Cleaning equipment and cleaning method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3326642B2 (en) * | 1993-11-09 | 2002-09-24 | ソニー株式会社 | Substrate post-polishing treatment method and polishing apparatus used therefor |
| FR2722511B1 (en) * | 1994-07-15 | 1999-04-02 | Ontrak Systems Inc | PROCESS FOR REMOVING METALS FROM A SCOURING DEVICE |
| JPH1092781A (en) * | 1996-06-04 | 1998-04-10 | Ebara Corp | Method and equipment for carrying substrate |
| JPH10180198A (en) * | 1996-10-21 | 1998-07-07 | Ebara Corp | Cleaning device |
-
1998
- 1998-07-23 JP JP10223588A patent/JP2000040684A/en active Pending
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