JP2000036683A - High frequency signal processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency signal processor which can be easily manufactured and can be reliably shielded. SOLUTION: A high frequency printed circuit board 6 is provided within a easing 2. A coaxial connector 12 for input and output of a high frequency is mounted to the board 6. A high frequency input/output part is provided in the vicinity of the connector 12 of the board 6 to be electrically connected to the connector 12. The high frequency input/output part is shielded by a shied part 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency signal processing apparatus, for example, a trunk amplifier, a distribution amplifier, a trunk branch amplifier, an optical repeater, etc. used in a common receiving facility.
In particular, it relates to the shield structure.

[0002]

2. Description of the Related Art Conventionally, high-frequency signal processing devices such as those described above, for example, bidirectional branch amplifiers, have input / output terminals for high-frequency signals mounted on the outer surface of a conductive housing and a printed circuit board inside the housing. Are located. On this substrate, an input / output circuit unit, a downstream signal amplifier, a downstream signal branching amplifier, an upstream signal amplifier, a power transmission / reception unit, a power supply unit, and the like are configured. Note that the input / output unit is electrically connected to the input / output terminal and includes a matching circuit and the like. The power transmission / reception circuit supplies AC power superimposed on any of the coaxial cables connected to the input / output terminals to the power supply unit,
AC power is supplied to an input / output terminal connected to another high-frequency signal processing device via a coaxial cable connected to the input / output terminal of the housing to operate the device.

[0003]

However, in such a bidirectional branch amplifier, since various circuits are formed on one substrate, it is difficult to obtain isolation between the circuits, and disturbances in frequency characteristics and the like are caused. In order to prevent oscillation and the like, it was necessary to provide a shield plate for each circuit.

Further, since the power supply unit and the circuit for processing each high-frequency signal share a common ground, noise generated in the power supply unit tends to adversely affect the high-frequency signal processing circuit.

As a method for solving these problems, it is conceivable to configure each circuit in a separate unit and to store each unit in a shield case. But,
Such a method is cumbersome to manufacture.

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-frequency signal processing device which can be easily manufactured and can be reliably shielded.

[0007]

According to one aspect of the present invention, there is provided a conductive chassis including a housing, a peripheral wall provided in the housing, and a base provided inside the peripheral wall. High-frequency signal processing means provided on one surface side of the base in the chassis for processing high-frequency signals; and low-frequency signal processing provided on the other surface side of the base in the chassis for processing low-frequency signals Means.

According to this aspect, the high-frequency signal processing means and the low-frequency signal processing means are located on both sides of the base of the chassis, and the periphery of each is covered by the peripheral wall of the chassis. Therefore, both are reliably shielded, and even if the low-frequency signal processing means generates relatively noise, the high-frequency signal processing means is hardly affected by this noise.

The high-frequency signal processing means may have an input / output section for a high-frequency signal, and the input / output section for the high-frequency signal may be shielded.

In this case, the high-frequency signal input / output from the high-frequency signal processing device is less likely to be affected by noise.

Further, a shielded power transmitting / receiving unit may be provided in contact with the high frequency signal input / output unit.

In this case, the power transmission / reception unit transmits and receives power from the high-frequency signal input / output terminal common to the high-frequency signal input / output unit. At this time, noise is likely to occur. In addition, since the high-frequency signal input / output unit is provided in the vicinity thereof, noise is more likely to occur. However, since the power transmission / reception unit is shielded, the high-frequency signal input / output unit is not easily affected by noise.

Another aspect of the present invention is a housing, a high-frequency signal input / output terminal mounted on a high-frequency printed circuit board provided inside the housing, and a high-frequency signal input / output terminal on the high-frequency printed circuit board. A high frequency input / output unit is provided in the vicinity and is electrically connected to the high frequency signal input / output terminal, and a shield unit for shielding the high frequency input / output unit.

According to this aspect, the input / output terminal of the high-frequency signal and the high-frequency input / output section are formed on the printed circuit board, and these are shielded by the shield section. During transmission of the high-frequency signal to the input / output unit, the high-frequency signal is not affected by noise.

In this aspect, it is possible to further include a power supply unit provided on the power supply printed circuit board disposed in the housing, and a shield unit for shielding the power supply unit.

In this case, the power supply printed board and the high-frequency printed board are completely different printed boards, so that the ground is not common, and noise from the ground line does not get on the circuit on the high-frequency printed board. Further, since the power supply unit is shielded, no noise is generated.

The high-frequency printed circuit board is disposed in a conductive chassis, and the shield portion of the high-frequency input / output section is formed by the chassis and a shield member provided on the high-frequency printed circuit board. it can.

The high-frequency printed circuit board and the power supply printed circuit board are mounted on a conductive chassis provided in the housing, and the shield of the power supply unit is
The power supply apparatus may further include the chassis and a shield member provided on the chassis so as to surround the power supply printed circuit board.

In these cases, since the shield portion is formed by using the conductive chassis, the shield can be manufactured more easily than when a shield is separately manufactured and attached.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A high-frequency signal processing apparatus according to an embodiment of the present invention is a bidirectional one used for a trunk amplifier, a trunk branch amplifier, a distribution amplifier, or the like used in a common reception facility. This high frequency signal processing device
As shown in FIG. 1, there is provided a conductive case, for example, a case 2 made of aluminum die-cast. The housing 2 is formed in a substantially rectangular parallelepiped shape, has one side opened, and has a hollow interior. The housing 2 is covered with an aluminum die-cast lid (not shown), and is screwed together with bolts and nuts (not shown), and hung on a messenger wire (not shown).

A chassis 4 is arranged in the housing 2. As shown in FIGS. 1 and 2, the chassis 4 has end walls 4a, 4a parallel to each other, and side walls 4b, 4b orthogonal to each other and parallel to each other. For example, it has a square frame-like body, inside which a rectangular base 4c is formed in parallel with the upper and lower openings. This chassis is naturally made of conductive metal.

As shown in FIGS. 2, 3 and 4, a printed circuit board 6 is disposed above the base 4c. A high-frequency signal processing circuit is formed on the printed board 6. For example, the input downstream signal is amplified by a downstream signal amplifier, a part of the input signal is branched to a branch amplifier, and the branch signal is distributed from the branch amplifier to a plurality of branch terminals which are a kind of output terminal.
The downstream signal is output from the main line output terminal. Also,
The upstream signal supplied from the output terminal or the branch terminal is amplified by the upstream amplifier and output from the input terminal to the center device side.

As shown in FIGS. 1 and 2, shield plates 8 a and 8 b are provided near both ends of the printed circuit board 6 in parallel with the end walls 4 a and 4 a of the frame of the chassis 4 at a predetermined interval. It is attached to a printed circuit board 6. These end walls 4
A plurality of shield plates 10a and 10b are attached to the printed circuit board 6 between the first and second shield plates 8a and 8b at intervals from each other in parallel with the side wall 4b. Further, as shown in FIGS. 2 and 5, conductive lid members 11a and 11b are attached to these upper portions. Thus, in this embodiment, a total of six shield chambers 13 are formed.

The printed circuit board 6 in these shield chambers 13
A high frequency signal input / output circuit, for example, an input circuit and an output circuit is formed thereon. An input circuit for a high-frequency signal has a relatively low signal level and is easily affected by noise and the like. However, the effect of noise and the like can be reduced by shielding. In addition, the signal level of the output circuit is relatively high and easily affects other circuits. However, by shielding, the influence on other circuits can be reduced.

As shown in FIGS. 3 and 4, in order to input a high-frequency signal to the high-frequency signal processing means via these input circuits, or to output (branch or distribute) the high-frequency signal processed by the high-frequency signal processing means. To include)
Each coaxial connector 12 is arranged on the lower surface side of each shield room, and its center contact is directly attached to the printed circuit board 6. Since the center contact is directly connected to the input / output circuit in this manner, there is no need to provide a wiring between the center contact and the input / output circuit, and noise or signal leakage from such a wiring may occur. Can be prevented.

The outer shell of each coaxial connector 12 is attached to the base 4c, and the shield plates 8a, 8b, 10a,
Shield plates 14a, 14b, 16a, 1 similar to 10b
6b. Furthermore, since each coaxial connector 12 is shielded, it is possible to prevent noise pickup and signal leakage.

The center conductor of each coaxial connector 12 is
The center conductor of the coaxial connector 15 provided in the housing 2 is connected via the connection pin 17, and the outer conductor (outer shell) of each coaxial connector 12 is connected to the outer conductor of the coaxial connector 15 via the housing 2. ing.

A predetermined plurality of shield chambers 13 are provided with a coaxial connector 100 for monitoring on the chassis 4.
Are provided so as to protrude toward the housing 2 from the end walls 4a, 4a. These coaxial connectors 100 are connected to a connector with a coaxial cable (not shown) inserted by opening the monitor terminal blind cover 102 provided in the housing 2. This connector with a coaxial cable is connected to a monitor device (not shown).

A shield plate 18 is attached to the printed circuit board 6 at a position biased to one side wall of the chassis 4 so as to straddle between the shield plates 8a and 8b. by this,
Two shield chambers 20, 22 are formed. Further, a shield plate 24 is attached to the printed circuit board 6 on the shield room 22 side of the shield plate 18 in a state of being in contact with the shield plate 18. These shield plates 18 and 24
Thereby, a shield chamber 26 is formed.

In each of the shield chambers 20, 22, and 26, each circuit of the high-frequency signal processing means, for example, each circuit of a down amplifier is formed. Therefore, the circuits in each shielded room do not affect other circuits or are not affected by other circuits. In particular, the shield room 26 is
Inside, it is double shielded. Therefore, it is desirable to house a circuit in which leakage of a high-frequency signal, such as an oscillating unit or a detecting unit, is likely to occur in the shield room 26.

A conductive plate plate 28 is disposed so as to cover these shield chambers 20, 22, 26 and the lid members 11a, 11b. The plate plate 28 is in direct contact with the shield plates 8a, 8b, 18, and 24 at portions corresponding to the shield chambers 20, 22, and 26, but partially contacts the cover members 11a and 11b. , The others are separated by a predetermined distance. Thereby, the shield chambers 20, 2
2 and 26 are more strongly shielded, and new shield chambers 30a and 30 are provided above the lid members 11a and 11b.
b is formed.

An operating voltage supplied to one of the coaxial connectors 12 from another high frequency signal processing device via a coaxial cable is supplied to the shield chambers 30a and 30b.
Take in to activate this high frequency processing means,
Alternatively, power transmission / reception circuits 32a and 32b for transmitting power from one of the coaxial connectors 12 to another high-frequency processing device via a coaxial cable are attached.

The shield chambers 30a and 30b are formed in contact with the upper part of the shield chamber 13 where the high frequency input / output circuit is provided. Therefore, wiring for receiving the operation voltage from the coaxial connector 12 below the shield chamber 13 and outputting the operation voltage to the high-frequency input / output circuit can be easily performed.

In the shield room 22, the shield room 2
2 is a circuit related to the circuit provided in the shield room 22, but is likely to cause interference with the circuit provided in the shield chamber 22, such as a printed circuit board 34 provided with an up / down demultiplexing circuit, or an up amplifier. The circuit unit 36 is mounted perpendicular to the printed circuit board 6 to prevent interference. By attaching in this way at the same time,
Space saving is achieved.

As described above, the high frequency input / output circuits are provided on both sides of the printed circuit board 6, and a high frequency signal processing circuit for processing the high frequency signal input from the high frequency input / output circuit and outputting the high frequency signal from the high frequency input / output circuit is provided between them. Since the circuit is provided, the circuit can be arranged along the flow of the high-frequency signal, and since the power transmission / reception unit is provided above the input / output circuit, the circuit can be arranged along the flow of the operating voltage. In addition, the high-frequency input / output circuit and the power transmission / reception unit are shielded, and the high-frequency signal processing unit is also shielded for each circuit. No radiation. In order to obtain such a shielding effect, it is not necessary to form a unit in which each circuit is housed in a shielding case, so that manufacturing is easy.

As shown in FIGS. 2 and 4, a shield plate 38 is attached to the side wall 4b of the chassis 4.
A shield chamber 40 is formed by the shield plate 38, the side wall 4b, and the plate plate 28. In the shield room 40, a printed circuit board 42 different from the printed circuit board 6 is provided.
Is attached. The printed circuit board 42 converts the operating voltage supplied from the power transmission / reception circuit described above into a voltage of a value required in each circuit of the high-frequency signal processing device, or supplies a constant voltage to a power supply unit. An input / output circuit is provided. The ground line of the printed board 42 is different from the ground line of the printed board 6. The power supply unit is provided on a lid for the casing 2 (not shown). When power is supplied to the power supply unit from outside without passing through a coaxial cable, the power supply unit shown in FIGS. It is performed from the mouth 104.

Since the input / output circuit to the power supply unit is shielded and formed on a substrate 42 separate from the printed circuit board 6 on which the high-frequency signal processing circuit is formed, noise from the power supply unit is reduced. Hardly affects the high-frequency signal processing circuit. Further, since the ground lines of the two substrates are separated, the noise from the power supply unit does not affect the high frequency signal processing circuit.

As shown in FIGS. 3 and 4, the back of the base 4c of the chassis 4, the back of the back cover 48, and the shield plate 14
The space surrounded by a and 14b constitutes a shield chamber 44, in which a circuit for processing low-frequency signals, which includes relatively low-frequency noise, for example, a status monitor control circuit is provided. Printed circuit board 4 configured
6 are arranged. Since the status monitor control circuit is arranged in such a shield room 44, noise generated by the status monitor control circuit does not affect the high-frequency signal processing circuit formed on the printed circuit board 6. Absent. Moreover, since the printed circuit board 46 is disposed on the opposite side of the printed circuit board 6 on which the high frequency signal processing circuit is provided with the base 4c interposed therebetween, the circuit on the printed circuit board 6 suitable for the flow of processing of the high frequency signal The arrangement is not disturbed by the status monitor control circuit.

In the above-described embodiment, the plate plate 28 is provided to more reliably obtain the shielding effect.
In some cases, the plate 28 can be removed. Further, in the above embodiment, a total of six shield chambers for the high-frequency input / output circuit are provided, but the number thereof can be arbitrarily changed in some cases. Further, the shield plates 18 and 24 may be removed depending on the contents of the high-frequency signal processing circuit formed on the printed circuit board 6. Although the status monitor control circuit is provided in the above embodiment, another low frequency processing circuit may be provided instead.

[0040]

As described above, according to the present invention, a circuit for processing a high-frequency signal and a low-frequency circuit for generating noise can be reliably shielded. Since there is no need to house the circuit in a shield case and unitize it, manufacturing is easy.

[Brief description of the drawings]

FIG. 1 is a plan view of a high-frequency signal processing device according to an embodiment of the present invention with a cover removed.

FIG. 2 is an assembly diagram of the high-frequency signal processing device of FIG. 1;

FIG. 3 is a longitudinal sectional view taken along a line passing through a shield room 26 of the high-frequency signal processing device of FIG.

4 is a longitudinal sectional view taken along a line passing through a shield room 40 of the high-frequency signal processing device of FIG.

FIG. 5 is a plan view of the high-frequency signal processing device of FIG. 1 in a state where a shield chamber for a high-frequency input / output circuit is covered.

[Explanation of symbols]

 2 Housing 4 Conductive chassis 6 Printed circuit board (high frequency signal processing means) 42 Printed circuit board (low frequency signal processing means) 11a 11b High frequency input / output circuit (high frequency input / output section) 13 Shield room (shield section) 32a 32b Power transmission / reception Part 40 Shield room (Shield part) 42 Printed circuit board (Printed circuit board for power supply)

Claims (7)

[Claims] A conductive chassis having a housing, a peripheral wall provided in the housing, and a base provided inside the peripheral wall; and a conductive surface provided on one surface side of the base in the chassis. A high-frequency signal processing device, comprising: a high-frequency signal processing unit provided for processing a high-frequency signal; and a low-frequency signal processing unit provided on the other surface side of the base in the chassis and processing a low-frequency signal. 2. The high-frequency signal processing apparatus according to claim 1, wherein said high-frequency signal processing means has an input / output section for a high-frequency signal, and said input / output section for said high-frequency signal is shielded. 3. The high-frequency signal processing device according to claim 2, wherein a shielded power transmission / reception unit is provided in contact with said high-frequency signal input / output unit. A housing, a high-frequency signal input / output terminal attached to a high-frequency printed circuit board provided inside the housing, and a high-frequency signal input / output terminal provided on the high-frequency printed circuit board near the high-frequency signal input / output terminal; A high-frequency signal processing device comprising: a high-frequency input / output unit electrically connected to a high-frequency signal input / output terminal; and a shield unit for shielding the high-frequency input / output unit. 5. The high-frequency signal processing device according to claim 4, further comprising: a power supply unit provided on a power supply printed circuit board disposed in the housing; and a shield unit for shielding the power supply unit. . 6. The high-frequency signal processing device according to claim 4, wherein the high-frequency printed circuit board is disposed in a conductive chassis, and a shield part of the high-frequency input / output unit includes the chassis;
A high-frequency signal processing device formed by a shield member provided on the high-frequency printed circuit board. 7. The high-frequency signal processing device according to claim 5, wherein the high-frequency printed circuit board and the power supply printed circuit board are attached to a conductive chassis provided in the housing, and a shield section of the power supply section. A high-frequency signal processing apparatus comprising: the chassis; and a shield member provided on the chassis so as to surround the power supply printed circuit board together with the chassis.