JP2000036244A - Manufacture of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method capable of ensuring the high operation rate of a manufacturing device, and manufacturing a plasma display panel at high throughput without using a vacuum process. SOLUTION: An organic metal decomposing material as a precursor for obtaining a transparent conductive film is dissolved into a solvent for preparing a solution, and the mist of the solution is generated by use of a mist generator 15. This mist of the solution is carried to a mist transport tube 14 on a carrier gas blown from a carrier gas introduction tube 16, and sprayed to a substrate 17 from a mist spray head 13. In this case, the substrate 17 is preliminarily heated up to such a temperature level as causing the evaporation of the solvent of an MOD solution via a support bed 18 having a built-in heater and mounting the substrate 17. The solvent evaporates and dissipates concurrently with the deposition of the mist on the substrate 17, and organic metal as a precursor for metal oxide remains on the substrate 17 like a film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a plasma display panel, and more particularly to a method for forming a transparent conductive film, a dielectric layer, and a protective film.

[0002]

2. Description of the Related Art Plasma display panels (hereinafter referred to as "P
DP ") is a self-luminous display device, which has no viewing angle dependence, is easy to increase in area, and can operate at high speed. Therefore, a television receiver such as NTSC or Hi-Vision, or a VGA to EWS In recent years, it has attracted attention as a thin color display device. Since there is a high possibility that the manufacturing process of the PDP can be simplified as compared with the manufacturing process of the active TFT type liquid crystal display, the development of a sophisticated manufacturing process is becoming more and more important.

In an AC type PDP, tin oxide (SnO ₂ ) or ITO (Indium Tin Ox) is formed on a front plate serving as a display-side substrate.
ide) and a bus metal electrode wired thereon are formed, and a dielectric and a protective film made of magnesium oxide (MgO) are sequentially laminated so as to cover the transparent conductive film and the bus metal electrode. The transparent conductive film is formed on the entire surface of the front plate by a physical vacuum deposition method, and is processed into a predetermined pattern by photolithography. Next, a metal such as silver or copper serving as a bus metal electrode is formed into a film by a screen printing method or a vacuum evaporation method, and is again processed into a predetermined shape by photolithography. Subsequently, a dielectric layer such as a low-melting glass is formed on the entire surface. A screen printing method is mainly used for forming the dielectric layer. Finally, an MgO film is formed as a protective film by a vacuum deposition method.

As described above, the manufacturing process of the front plate requires at least two vacuum processes including a process of forming a transparent conductive film and a process of forming an MgO film. On the other hand, since the manufacturing process of the back plate, which is the light emitting side substrate, does not include a vacuum process, most of the P
In the DP manufacturing process, only the front plate manufacturing process requires a vacuum process.

[0005]

One of the advantages of the PDP as a large-sized display device is that its manufacturing method can be relatively easy or simple.
The need for a vacuum process has the problem of reducing its features. In addition, the thick film forming process of the dielectric is performed by printing application,
There is a problem that firing must be repeated several times, and simplification is desired. In addition, the manufacturing equipment is inevitably large because of handling large substrates. That is, there is a problem that the vacuum apparatus becomes huge including the pre- and post-deposition steps such as mounting and demounting, requires a plurality of printing and firing furnaces, and occupies a large space.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a plasma display panel in which a front panel can be manufactured with continuous compact in-line integrated equipment without using vacuum equipment.

[0007]

In order to solve the above-mentioned problems, a method of manufacturing a plasma display panel according to the present invention is directed to a method of forming a transparent conductive film by dissolving a metal oxide precursor organic metal in an organic solvent in a mist. In this method, the transparent conductive film is formed by patterning and heating the coated metal oxide precursor organic metal on a substrate.

In addition, a solution obtained by dissolving a metal oxide precursor organic metal for forming a dielectric layer in an organic solvent is applied in the form of a mist on the substrate on which the transparent conductive film is formed. The dielectric layer is formed by heating the metal oxide precursor organic metal for forming the dielectric layer.

Further, a solution obtained by dissolving a metal oxide precursor organic metal for forming a protective film in an organic solvent is applied in the form of a mist on the dielectric layer, and the applied metal oxide for forming the protective film is formed. The protective film is formed by heating the organic metal precursor.

According to these manufacturing methods, desired transparent conductive films, dielectric layers and protective films can be obtained without using a vacuum process. In addition, since the thin film precursor solution coating, drying, exposure, patterning, baking, and annealing are repeated several times in series in the air, the front plate of the PDP is manufactured in-line without any substrate stagnation. be able to.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 12 is a partially cutaway perspective view of an AC type PDP manufactured by the manufacturing method of the present invention. FIG.
As shown in FIG. 1, on the front plate 1, linear scanning electrodes 2 made of a transparent conductive film and sustain electrodes 3 are alternately spaced,
A plurality are arranged in parallel. A bus metal electrode 4 is provided on scan electrode 2 and sustain electrode 3, respectively, and a dielectric layer 5 and a protective film 6 are sequentially formed to cover scan electrode 2, sustain electrode 3 and bus metal electrode 4. On the back plate 7, linear data electrodes 8 are provided in parallel with each other at intervals, and a linear partition 9 is provided between the data electrodes 8. Further, a phosphor 10 is formed from above the data electrode 8 to the side surface of the partition wall 9. Front plate 1 and back plate 7 are arranged opposite to each other via discharge space 11 such that scan electrode 2 and sustain electrode 3 and data electrode 8 are orthogonal to each other, and a rare gas such as neon or xenon is provided in discharge space 11. Are enclosed to form an AC type PDP 12.

Next, a method of manufacturing the AC type PDP will be described with reference to FIGS.

FIG. 1 is a view for explaining a mist spray coating process for forming a transparent conductive film on a substrate. As shown in FIG. 1, the mist spraying device includes a mist spraying head 13, a mist transport pipe 14, a mist generator 15, and a carrier gas introduction pipe 16. Decomposition of organic metal, which is a precursor for obtaining a transparent conductive film (Metal Organic
Decomposition (MOD) The material is dissolved in a solvent to form a solution (hereinafter referred to as “MOD solution”), and a mist of the MOD solution is generated by a mist generator 15 such as an ultrasonic atomizer. The mist of the MOD solution is carried into the mist transport pipe 14 by the carrier gas blown from the carrier gas introduction pipe 16, and is transferred from the head 13 to the glass substrate 1.
7 is sprayed. The head 13 has a linear shape parallel to the surface of the substrate 17 and perpendicular to the arrow A, and the MOD solution is applied on the substrate 17 in a line. At this time, the substrate 17 passes under the head 13 at a constant speed as shown by an arrow A, and the MOD solution is applied over the entire surface of the substrate 17. The temperature of the substrate 17 is controlled by the support base 18 with a built-in heater on which the substrate 17 is placed.
It is preheated to a temperature at which the solvent of the D solution evaporates.
The solvent evaporates and disperses at the same time that the mist adheres to the substrate 17, and the metal oxide precursor organometallic forms a film to the substrate 17.
Remain on top.

Next, a mask light exposure process for linearly patterning the metal oxide precursor organic metal formed on the entire surface of the substrate 17 will be described with reference to FIG.

As shown in FIG. 2, when the metal oxide precursor organic metal 19 has photosensitivity, it is enlarged or equalized by a UV light source composed of a reflector 21 and a UV lamp 22 through a pattern mask 20. Double exposure is performed. Subsequently, the pattern mask 20 is removed and the organic solvent is mist-sprayed, so that the exposed portion remains and the non-exposed portion is dissolved and removed.

Next, a heating step for obtaining a metal oxide thin film will be described with reference to FIG. As shown in FIG.
The substrate 17 having the patterned metal oxide precursor organic metal 19 is transported to an infrared heating device including a light collector 23 and an infrared lamp 24. By transporting the substrate under the infrared lamp 24 at a constant speed, the metal oxide precursor organic metal 19 is baked and decomposed to be transformed into a metal oxide,
Further, it is annealed to obtain a dense metal oxide thin film.

In the above description, the case where a transparent conductive film is formed on a substrate has been described. However, a similar method can be used for forming a dielectric layer and a protective film by appropriately selecting materials. 1 and 3 illustrate the example in which the substrate is transported, the head 13, the light collector 23, and the infrared lamp 24 may be moved.

Next, an AC type PD is manufactured by using the manufacturing method of the present invention.
A specific example in which P is manufactured will be described. In order to obtain a SnO ₂ transparent conductive film, tin 2-ethyl 2-hexanoate in which one of the σ bonds in the main chain was converted to a π bond was used as a precursor.
Antimony oxide (SbO) as mole and N-type dopant
Antimony 2-ethylhexanoate, which is a precursor of 0.0
03 mol was dissolved in xylene to obtain a MOD solution.

As shown in FIG. 1, a mist of a MOD solution is generated by a mist generator 15, and a nitrogen gas is used as a carrier gas to pass through a mist transport pipe 14 from a head 13 to a glass substrate 17 serving as the front plate 1. Spray. Substrate 1
7 is installed on a support base 18 with a built-in heater,
Moves at a speed of 10 cm / min along the surface of the substrate 17. In the present embodiment, the substrate 17 heated to 160 ° C.
Spray the raw material solution at a spray rate of 0.1 cc / min,
By reciprocating the head 13 eight times over the entire surface of the substrate, a substrate 26 having a metal oxide precursor organic metal deposited film 25 formed on the substrate 17 as shown in FIG. 4 was obtained.
The substrate 17 had a size of 120 × 70 cm.

Next, the substrate 26 was exposed using the ultraviolet lamp 22 and the pattern mask 20. Exposure width 150
Exposure was performed to form a stripe structure having a width of 100 μm and a non-exposed portion of 100 μm. Subsequently, the xylene solvent is sprayed again on the substrate 26 using a mist sprayer, and the film is run until the unexposed portion is dissolved in xylene and completely removed. In the present embodiment, one reciprocation was performed at a spraying speed of 0.5 cc / min and a running speed of 1 cm / min, and a substrate 27 having a deposited film 25 patterned on the substrate 17 as shown in FIG. 5 was obtained.

Thereafter, the substrate 27 is transferred to an infrared heating device. Infrared rays are focused so that the width at the focal plane is 1 cm. The substrate 27 is heated from the back to about 200 ° C. by the support 18 with a built-in heater, and the temperature of the deposited film is increased to 450 ° C. by irradiating infrared rays. The infrared lamp 24 was transported along the substrate surface at a speed of 0.3 cm / min, and this was repeated three times. As a result, the width 150μ
m ± 10 μm, film thickness 0.2 μm, sheet resistance 2 kΩ /
□, a substrate 29 having a SnO ₂ transparent conductive film 28 with a visible light transmittance of 91% was obtained (see FIG. 6).

Subsequently, as shown in FIG. 7, a substrate 31 in which a striped bus metal electrode 30 having a width of 35 μm and a thickness of 4 μm is formed on a SnO ₂ transparent conductive film 28 by using an silver paste by using an offset printing method. I got

Further, 0.3 mol of aluminum 2-ethylhexanoate, which is one of aluminum carboxylates, was dissolved in xylene to obtain a MOD solution. The mist of the MOD solution is generated by the mist generator 15, and the mist is sprayed from the head 13 onto the substrate 31 via the mist transport pipe 14 using the nitrogen gas as a carrier gas. The substrate 31 is placed on a support base 18 with a built-in heater, and moves the head 13 along the surface of the substrate 31 at a speed of 10 cm / min. In the present embodiment, the MOD solution is sprayed onto the substrate 31 heated to 160 ° C. at a rate of 0.1 cc / min, and the head 13 is reciprocated 25 times over the entire surface of the substrate 31, as shown in FIG. , Busbar metal electrode 3
Thus, a substrate 33 was obtained in which the deposited film 32 was formed so as to cover the O and SnO ₂ transparent conductive films 28. Here, a silicon carboxylate such as silicon 2-ethylhexanoic acid may be used instead of the aluminum carboxylate.

Thereafter, the substrate 33 is transferred to an infrared heating device. Infrared rays are focused so that the width at the focal plane is 1 cm. The substrate 33 is mounted on the support base 1 with a built-in heater from the back.
8, the deposited film 32 is heated to 500 ° C. by being irradiated with infrared rays. The infrared lamp 24 was transported along the substrate surface at a speed of 0.3 cm / min, and this was repeated three times. as a result,
As shown in FIG. 9, a substrate 35 on which an Al ₂ O ₃ film 34 having a thickness of 20 μm was formed was obtained. This Al ₂ O ₃ film 34 becomes the dielectric layer 5 shown in FIG.

Next, 0.4 g of magnesium 2-ethylhexanoate, which is one of magnesium carboxylates, is used.
A mole was dissolved in xylene to obtain a MOD solution. The mist of the MOD solution is generated by the mist generator 15, and the mist is sprayed onto the substrate 35 from the head 13 via the mist transport pipe 14 using nitrogen gas as a carrier gas. The substrate 35 is set on a support base 18 with a built-in heater, and moves the head 13 along the surface of the substrate 35 at a speed of 10 cm / min. In the present embodiment, the solution is sprayed onto the substrate 35 heated to 160 ° C. at a rate of 0.1 cc / min.
By reciprocating four times over the entire surface, a substrate 37 having the deposited film 36 formed on the Al ₂ O ₃ film 34 was obtained as shown in FIG.

Subsequently, the substrate 37 is transferred to an infrared heating device. Infrared rays are focused so that the width at the focal plane is 1 cm. The substrate 37 is heated from the back to about 200 ° C. by a support base with a built-in heater, and the temperature of the deposited film 36 is raised to 500 ° C. by irradiation with infrared rays. The infrared lamp 24 was transported along the substrate surface at a speed of 0.3 cm / min, and this was repeated three times. As a result, as shown in FIG. 11, a substrate 39 having a 0.5 μm-thick MgO film 38 was obtained. This MgO film 38 becomes the protective film 6 shown in FIG.

The number of side chain alkyl groups of metal carboxylate such as magnesium carboxylate, silicon carboxylate or aluminum carboxylate used in the above-mentioned production process is preferably 8 or less. That is, when the number of side chain alkyl groups of the metal carboxylate is larger than 8, the solubility of the metal carboxylate in the solvent becomes poor, and precipitation in the solution becomes remarkable. In addition, the wettability of the MOD solution to the substrate is deteriorated, and the shelf life becomes 2 days or less, making the MOD solution unsuitable for practical use.

Through the series of continuous steps described above, the front panel of the PDP is completed. After that, the back plate is manufactured by the usual method,
The front plate and the rear plate are arranged to face each other and hermetically sealed, and a discharge gas is sealed therein to complete a PDP.

In the conventional method of manufacturing a PDP, a vacuum deposition method is used for forming a transparent conductive film such as SnO ₂ and an MgO film, and screen printing is used for forming a thick dielectric film.
The transparent conductive film such as SnO ₂ and the MgO film have been baked for 1 hour or more.

On the other hand, according to the manufacturing method of the present invention, Sn is formed by an atmospheric process without using a vacuum deposition method.
A transparent conductive film such as O ₂ and an MgO film can be formed, and the printing step of the dielectric is a mist spray coating step and a lamp heating step, thereby achieving a significant improvement in production efficiency. That is, the production method of the present invention was able to improve the facility operation rate by 15% and the production volume per unit time by 50% as compared with the conventional production method.

[0032]

As described above, according to the method for manufacturing a plasma display panel of the present invention, a desired transparent conductive film, dielectric layer and protective film can be obtained without using a vacuum process, Even when a substrate is handled, the front panel of the PDP can be manufactured with compact in-line integrated equipment without stagnation of the substrate.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view for explaining a mist spray coating step in a plasma display panel manufacturing method of the present invention.

FIG. 2 is a partial cross-sectional view for explaining a mask light exposure step in the method for manufacturing a plasma display panel of the present invention.

FIG. 3 is a partial cross-sectional view for explaining a heating step in the method for manufacturing a plasma display panel of the present invention.

FIG. 4 is a front view for explaining one embodiment of a method for manufacturing a plasma display panel of the present invention.

FIG. 5 is a front view of the same.

FIG. 6 is a front view of the same.

FIG. 7 is a front view of the same.

FIG. 8 is a front view of the same.

FIG. 9 is a front view of the same.

FIG. 10 is a front view of the same.

FIG. 11 is a front view of the same.

FIG. 12 is a partially cutaway perspective view of a plasma display panel manufactured by the manufacturing method of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Front plate 2 Scanning electrode 3 Sustain electrode 4 Bus bar metal electrode 5 Dielectric layer 6 Protective film 12 AC type PDP 13 Head for mist dispersion 14 Mist transport pipe 15 Mist generator 16 Carrier gas introduction pipe 17 Substrate 18 Support base 20 Pattern mask 21 reflection plate 22 ultraviolet lamp 23 light collecting plate 24 infrared lamps 25,32,36 deposited film 26,27,29,31,33,35,37,39 substrate 28 SnO ₂ transparent conductive film 30 bus metal electrodes 34 Al ₂ O ₃ film 38 MgO film

Claims (11)

[Claims] 1. A solution in which a metal oxide precursor organic metal for forming a transparent conductive film is dissolved in an organic solvent is applied in a mist form on a substrate, and the applied metal oxide precursor organic metal is patterned. A method for manufacturing a plasma display panel in which a transparent conductive film is formed by heating the substrate. 2. A method in which a solution obtained by dissolving a metal oxide precursor organic metal for forming a dielectric layer in an organic solvent is applied in the form of a mist on the substrate on which the transparent conductive film is formed. The method for manufacturing a plasma display panel according to claim 1, wherein the dielectric layer is formed by heating the metal oxide precursor organometallic for forming the dielectric layer. 3. A solution in which an organic metal, a metal oxide precursor for forming a protective film is dissolved in an organic solvent, is applied in the form of a mist onto the dielectric layer, and the applied metal oxide for forming the protective film is applied. 3. The method according to claim 2, wherein the protective film is formed by heating the precursor metal. 4. The method for manufacturing a plasma display panel according to claim 1, wherein the heating of the metal oxide precursor organic metal is performed by infrared rays. 5. The substrate on which the metal oxide precursor organometallic for forming the transparent conductive film is formed is irradiated with ultraviolet light through a mask, and an organic solvent is mist-dispersed. The plasma according to any one of claims 1 to 4, wherein the metal oxide precursor organic metal for forming the transparent conductive film is patterned by eluting the metal oxide precursor organic metal in a portion where ultraviolet rays are shielded. Display panel manufacturing method. 6. The method of manufacturing a plasma display panel according to claim 3, wherein the metal oxide precursor organic metal for forming the protective film is magnesium carboxylate. 7. The method of manufacturing a plasma display panel according to claim 2, wherein the metal oxide precursor organic metal for forming the dielectric layer is silicon carboxylate or aluminum carboxylate. 8. The method of manufacturing a plasma display panel according to claim 1, wherein the metal oxide precursor organic metal for forming the transparent conductive film is tin 2-ethyl 2-hexanoate. 9. The method of manufacturing a plasma display panel according to claim 6, wherein the number of side chain alkyl groups of said magnesium carboxylate is 8 or less. 10. The method of manufacturing a plasma display panel according to claim 7, wherein the number of side chain alkyl groups of the silicon carboxylate or the aluminum carboxylate is 8 or less. 11. The method according to claim 8, wherein the number of the side chain alkyl groups of the tin 2-ethyl 2-hexanoate is 8 or less.