JP2000031196A - Capillary-mounting structure of wire-bonding device - Google Patents

Capillary-mounting structure of wire-bonding device

Info

Publication number
JP2000031196A
JP2000031196A JP10199926A JP19992698A JP2000031196A JP 2000031196 A JP2000031196 A JP 2000031196A JP 10199926 A JP10199926 A JP 10199926A JP 19992698 A JP19992698 A JP 19992698A JP 2000031196 A JP2000031196 A JP 2000031196A
Authority
JP
Japan
Prior art keywords
capillary
mounting hole
ultrasonic horn
horn
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10199926A
Other languages
Japanese (ja)
Inventor
Takeshi Takemoto
剛 竹本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP10199926A priority Critical patent/JP2000031196A/en
Publication of JP2000031196A publication Critical patent/JP2000031196A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To mount a capillary to an ultrasonic horn, without making the structure complex and to efficiently transfer ultrasonic vibrations to the capillary. SOLUTION: A mounting hole Hb is formed at the tip part of an ultrasonic horn H, while being fed vertically through the tip part, and at the same time a screw hole Hc that is opened on the peripheral surface of the mounting hole Hb from the tip end is formed. Then, a capillary C is inserted to a base edge side in the mounting hole Hb, and a stiffening member A is inserted between the peripheral surface and the capillary C at the tip side. Also, a bolt B with hexagonal hole is crewed into a screw hole Hc, thus enabling the tip of the bolt B with a hexagonal hole to press against the capillary C via the stiffening plate A and unifying the capillary C into one piece with the ultrasonic horn H in the longitudinal direction of the horn.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、ワイヤボンディ
ング装置のキャピラリィ取付構造、詳しくは、構造を複
雑化させることなく超音波の伝達性を改善したキャピラ
リィ取付構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capillary mounting structure for a wire bonding apparatus, and more particularly to a capillary mounting structure having improved ultrasonic transmission without complicating the structure.

【０００２】[0002]

【従来の技術】ワイヤボンディング装置は、超音波ホー
ンの先端にキャピラリィを取り付けてキャピラリィにワ
イヤを挿通する。このワイヤボンディング装置は、ボン
ディングに際しては、ワークをヒータにより加熱し、ま
た、超音波ホーンからキャピラリィに超音波を印加し、
キャピラリィによりワイヤをワークに押し付けて圧着す
る。2. Description of the Related Art In a wire bonding apparatus, a capillary is attached to the tip of an ultrasonic horn and a wire is inserted through the capillary. This wire bonding apparatus heats a workpiece with a heater and applies ultrasonic waves from an ultrasonic horn to a capillary during bonding.
The wire is pressed against the workpiece by the capillary and pressed.

【０００３】そして、従来のワイヤボンディング装置
は、図４に示すような取付構造を採用してキャピラリィ
Ｃを超音波ホーンＨに取り付けている。すなわち、この
取付構造は、超音波ホーンＨに先端面に開口するスリッ
トＨａを長手方向所定の範囲に上下に形成するととも
に、スリットＨａの基端側を水平に貫通するねじ孔を形
成する。そして、スリットＨａ内にキャピラリィＣを挟
持し、ねじ孔に六角穴付きボルトＢを挿通してナットＮ
と螺着させ、キャピラリィＣをスリットＨａ内に挟着す
る。[0003] In the conventional wire bonding apparatus, the capillary C is mounted on the ultrasonic horn H by using a mounting structure as shown in FIG. That is, in this mounting structure, the ultrasonic horn H has slits Ha opened on the distal end surface formed vertically in a predetermined range in the longitudinal direction, and also has a screw hole passing horizontally through the base end side of the slit Ha. Then, the capillary C is sandwiched in the slit Ha, and a hexagon socket head cap screw B is inserted into the screw hole so that the nut N
And the capillary C is clamped in the slit Ha.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来のワイヤボンディング装置のキャピラリィ取付構
造にあっては、超音波ホーンＨのスリットＨａがホーン
長手方向、すなわち、振動方向に延在するため、スリッ
トＨａ内面とキャピラリィＣとの間に滑りが避けられ
ず、超音波振動が減衰され、伝達効率の低下が避けられ
ないという問題があった。この発明は、上記問題に鑑み
てなされたもので、超音波振動を超音波ホーンからキャ
ピラリィに効率的に伝達できるキャピラリィ取付構造を
提供することを目的とする。However, in the above-described capillary mounting structure of the conventional wire bonding apparatus, the slit Ha of the ultrasonic horn H extends in the longitudinal direction of the horn, that is, in the vibration direction. There is a problem that slippage is inevitable between the inner surface of Ha and the capillary C, ultrasonic vibration is attenuated, and a reduction in transmission efficiency is inevitable. The present invention has been made in view of the above problems, and has as its object to provide a capillary mounting structure capable of efficiently transmitting ultrasonic vibrations from an ultrasonic horn to a capillary.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するた
め、この発明は、超音波ホーンの先端にキャピラリィを
取り付けるワイヤボンディング装置のキャピラリィ取付
構造において、前記超音波ホーンに長手方向と直交する
方向に取付孔を形成して該取付孔に前記キャピラリィを
嵌挿するとともに、該キャピラリィを前記超音波ホーン
の長手方向に拘束する拘束部材を前記取付孔に設けた。In order to achieve the above object, the present invention relates to a capillary mounting structure for a wire bonding apparatus for mounting a capillary at the tip of an ultrasonic horn, wherein the capillary is mounted on the ultrasonic horn in a direction perpendicular to the longitudinal direction. A mounting hole is formed, the capillary is inserted into the mounting hole, and a restraining member for restraining the capillary in the longitudinal direction of the ultrasonic horn is provided in the mounting hole.

【０００６】そして、この発明にかかるキャピラリィ取
付構造は、前記拘束部材として前記超音波ホーンの先端
面から前記取付孔内に突出可能に螺合するねじを用いる
態様（請求項２）に構成でき、また、請求項２記載の発
明にかかるキャピラリィ取付構造は、前記取付孔内に前
記超音波ホーン先端側位置で当て部材を挿入し、該当て
部材を前記ねじと前記キャピラリィとの間に介在させる
態様（請求項３、４）に構成することができる。Further, the capillary mounting structure according to the present invention can be configured in a mode (claim 2) in which a screw is screwed so as to protrude into the mounting hole from the distal end surface of the ultrasonic horn as the restraining member. According to a second aspect of the present invention, in the capillary mounting structure, a contact member is inserted into the mounting hole at a position on the distal end side of the ultrasonic horn, and the member is interposed between the screw and the capillary. (Claims 3 and 4).

【０００７】[0007]

【作用】この発明にかかるワイヤボンディング装置のキ
ャピラリィ取付構造は、超音波ホーンに取付孔を形成
し、この取付孔内にキャピラリィを嵌装し、また、取付
孔内面とキャピラリィとの間に少なくともホーン長手方
向位置で拘束部材を嵌挿する。このため、超音波振動方
向に超音波ホーンとキャピラリィを一体化でき、超音波
振動の伝達に優れた効率が得られる。According to the capillary mounting structure of the wire bonding apparatus according to the present invention, a mounting hole is formed in the ultrasonic horn, the capillary is fitted in the mounting hole, and at least the horn is provided between the inner surface of the mounting hole and the capillary. The restraining member is inserted at the longitudinal position. For this reason, the ultrasonic horn and the capillary can be integrated in the ultrasonic vibration direction, and an excellent transmission efficiency of the ultrasonic vibration can be obtained.

【０００８】[0008]

【実施の形態】以下、この発明の実施の形態を図面を参
照して説明する。図１および図２はこの発明の一の実施
の形態にかかるワイヤボンディング装置のキャピラリィ
取付構造を示し、図１が要部の斜視図、図２が同要部の
分解斜視図である。なお、前述した図４と対応する部分
には同一の番号を付して説明する。Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a capillary mounting structure of a wire bonding apparatus according to an embodiment of the present invention. FIG. 1 is a perspective view of a main part, and FIG. 2 is an exploded perspective view of the main part. Parts corresponding to those in FIG. 4 described above are denoted by the same reference numerals and described.

【０００９】図において、Ｈは超音波ホーンであり、超
音波ホーンＨは基端側が図外の超音波トランスデューサ
に連結され超音波振動を印加される。この超音波ホーン
Ｈには、先端側に取付孔Ｈｂが上下に貫通形成され、ま
た、この取付孔Ｈｂに先端面から貫通するねじ孔Ｈｃが
形成される。取付孔Ｈｂは、内部に基端側位置でキャピ
ラリィＣが、先端側位置で当て板（当て部材）Ａが挿入
され、基端側内周面がキャピラリィＣ外周面と略一致す
る円筒面、先端側内周面が平面のＵ字状断面を有する。In the figure, H denotes an ultrasonic horn, and the ultrasonic horn H is connected at its base end to an ultrasonic transducer (not shown) to apply ultrasonic vibration. In the ultrasonic horn H, a mounting hole Hb is vertically formed on the distal end side, and a screw hole Hc penetrating from the distal end surface is formed in the mounting hole Hb. In the mounting hole Hb, a capillary C is inserted at the base end position, and a contact plate (contact member) A is inserted at the distal end position, and a cylindrical surface whose front end inner peripheral surface substantially coincides with the outer peripheral surface of the capillary C. The side inner peripheral surface has a flat U-shaped cross section.

【００１０】キャピラリィＣは、周知のように、先端が
円錐形状に先鋭化した中空筒状であって、内部にワイヤ
（図示せず）が挿通される。当て板Ａは、上縁に抜け止
め部Ａａを有する矩形板状部材であって、後述する六角
穴付きボルトの先端とキャピラリィＣとの間に位置して
キャピラリィＣの傷付きを防止する。As is well known, the capillary C has a hollow cylindrical shape whose tip is sharpened into a conical shape, and a wire (not shown) is inserted therein. The backing plate A is a rectangular plate-like member having a retaining portion Aa at the upper edge, and is located between a tip of a hexagon socket head cap screw described later and the capillary C to prevent the capillary C from being damaged.

【００１１】超音波ホーンＨのねじ孔Ｈｃには六角穴付
きボルト（拘束部材、ねじ）Ｂが螺合する。六角穴付き
ボルトＢは、超音波ホーンＨ先端面から螺合して先端が
取付孔Ｈｂ内に突出し、キャピラリィＣを当て板Ａを介
し基端側に押し付けてキャピラリィＣを超音波ホーンＨ
と長手方向に一体化させる。A hexagon socket head bolt (restraint member, screw) B is screwed into the screw hole Hc of the ultrasonic horn H. The hexagon socket head cap screw B is screwed into the ultrasonic horn H from the distal end surface, the distal end protrudes into the mounting hole Hb, and the capillary C is pressed to the base end side via the contact plate A to push the capillary C to the ultrasonic horn H
And in the longitudinal direction.

【００１２】なお、上述した六角穴付きボルトＢは、複
数を用いて１つをロック用とすることも可能であり、ま
た、六角穴付きボルトに限らず十字穴付きねじ等の周知
のねじを用いることも可能である。It is to be noted that a plurality of the above hexagon socket head bolts B can be used for locking one of them. Further, not only hexagon socket head bolts but also known screws such as cross-head socket screws can be used. It is also possible to use.

【００１３】この実施の形態にあっては、超音波ホーン
Ｈの先端部分に上下に貫通する取付孔Ｈｂを形成し、こ
の取付孔Ｈｂ内にキャピラリィＣを嵌挿するとともに、
取付孔Ｈｂ内にキャピラリィＣよりホーン先端側位置で
当て板Ａを嵌挿する。そして、超音波ホーンＨの先端側
からねじ孔Ｈｃに六角穴付きボルトＢを螺合させ、この
六角穴付きボルトＢの先端で当て板Ａを介しキャピラリ
ィＣをホーン基端側に向けて押圧する。In this embodiment, a mounting hole Hb penetrating vertically is formed at the tip of the ultrasonic horn H, and a capillary C is inserted into the mounting hole Hb.
The abutment plate A is inserted into the mounting hole Hb at a position closer to the horn tip than the capillary C. Then, a hexagonal socket bolt B is screwed into the screw hole Hc from the distal end side of the ultrasonic horn H, and the capillary C is pressed toward the horn base end side via the backing plate A at the distal end of the hexagonal socket bolt B. .

【００１４】このため、キャピラリィＣは、取付孔Ｈｂ
内にその基端側周面と当て板Ａとの間で挟着され、超音
波ホーンＨとホーン長手方向、すなわち、超音波振動方
向に一体化する。したがって、ホーン長手方向にキャピ
ラリィＣと超音波ホーンＨとの間に滑り、換言すれば、
相対変位が生じることが無く、キャピラリィＣに超音波
振動を効率的に伝達できる。For this reason, the capillary C is provided with the mounting hole Hb.
The ultrasonic horn H and the horn are integrated in the longitudinal direction of the horn, that is, in the ultrasonic vibration direction. Therefore, the horn slides between the capillary C and the ultrasonic horn H in the longitudinal direction of the horn, in other words,
Ultrasonic vibration can be efficiently transmitted to the capillary C without causing relative displacement.

【００１５】そして、上述した実施の形態は、六角穴付
きボルトＢとキャピラリィＣとの間に当て板Ａを介在さ
せるため、キャピラリィＣにボルトＢの先端が直接に当
接することがなく、キャピラリィＣの損傷が防止され
る。すなわち、ボルトＢはキャピラリィＣの抜けを防止
するために相当の接触圧で当接させなければならず、ボ
ルトＢをキャピラリィＣに直接に当接させるとキャピラ
リィＣの傷付きが避けられないが、当て板Ａを介装する
ことでキャピラリィＣを保護できる。In the above-described embodiment, since the contact plate A is interposed between the hexagon socket head cap screw B and the capillary C, the tip of the bolt B does not directly contact the capillary C. Damage is prevented. That is, the bolt B must be brought into contact with a considerable contact pressure in order to prevent the capillary C from coming off, and if the bolt B is brought into direct contact with the capillary C, the capillary C is unavoidably damaged. By interposing the backing plate A, the capillary C can be protected.

【００１６】上記の実施の形態では、当て部材Ａを取付
孔Ｈｂの上方から内部に嵌挿したが、他の実施の形態と
して、図３に示すように、超音波ホーンＨの横面に取付
孔Ｈｂと直交する当て部材挿入孔Ｄを設けて、そこから
当て部材Ａを嵌挿するように構成してもよい。In the above embodiment, the contact member A is inserted into the inside from above the mounting hole Hb. However, as another embodiment, as shown in FIG. The contact member insertion hole D orthogonal to the hole Hb may be provided, and the contact member A may be inserted therefrom.

【００１７】[0017]

【発明の効果】以上説明したように、この発明にかかる
ワイヤボンディング装置のキャピラリィ取付構造によれ
ば、超音波ホーンの先端部分に取付孔を形成し、この取
付孔内にキャピラリィを嵌装するとともに、少なくとも
取付孔の内周面の少なくともホーン長手方向の先端側あ
るいは基端側とキャピラリィとの間に拘束部材を設け、
キャピラリィを超音波ホーンとその長手方向（超音波振
動方向）に一体化するため、キャピラリィに高い効率で
超音波を伝達できる。As described above, according to the capillary mounting structure of the wire bonding apparatus according to the present invention, a mounting hole is formed at the tip of the ultrasonic horn, and the capillary is fitted into the mounting hole. A restraining member is provided between the capillary and at least the distal side or the proximal side in the longitudinal direction of the horn at least on the inner peripheral surface of the mounting hole,
Since the capillary is integrated with the ultrasonic horn in the longitudinal direction (ultrasonic vibration direction), ultrasonic waves can be transmitted to the capillary with high efficiency.

【図面の簡単な説明】[Brief description of the drawings]

【図１】この発明の一の実施の形態にかかるワイヤボン
ディング装置のキャピラリィ取付構造の要部を示す斜視
図である。FIG. 1 is a perspective view showing a main part of a capillary mounting structure of a wire bonding apparatus according to one embodiment of the present invention.

【図２】同要部の分解斜視図である。FIG. 2 is an exploded perspective view of the main part.

【図３】この発明の他の実施の形態を示す図である。FIG. 3 is a diagram showing another embodiment of the present invention.

【図４】従来のワイヤボンディング装置のキャピラリィ
取付構造の要部を示す斜視図である。FIG. 4 is a perspective view showing a main part of a capillary mounting structure of a conventional wire bonding apparatus.

【符号の説明】[Explanation of symbols]

Ａ 当て板（当て部材） Ｂ 六角穴付きボルト（拘束部材、ねじ） Ｃ キャピラリィ Ｄ 当て部材挿入孔 Ｈ 超音波ホーン Ｈｂ 取付孔 Ｈｃ ねじ孔 A Backing plate (Backing member) B Hexagon socket head cap screw (Restriction member, screw) C Capillary D Backing member insertion hole H Ultrasonic horn Hb Mounting hole Hc Screw hole

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 超音波ホーンの先端にキャピラリィを取
り付けるワイヤボンディング装置のキャピラリィ取付構
造において、 前記超音波ホーンに長手方向と直交する方向に取付孔を
形成して該取付孔に前記キャピラリィを嵌挿するととも
に、該キャピラリィを前記超音波ホーンの長手方向に拘
束する拘束部材を前記取付孔に設けたことを特徴とする
ワイヤボンディング装置のキャピラリィ取付構造。1. A capillary mounting structure for a wire bonding apparatus for mounting a capillary at a tip of an ultrasonic horn, wherein a mounting hole is formed in the ultrasonic horn in a direction orthogonal to a longitudinal direction, and the capillary is inserted into the mounting hole. And a restricting member for restricting the capillary in a longitudinal direction of the ultrasonic horn is provided in the mounting hole. 【請求項２】 前記拘束部材が、前記超音波ホーンの先
端面から前記取付孔内に突出可能に螺合するねじである
請求項１記載のワイヤボンディング装置のキャピラリィ
取付構造。2. A capillary mounting structure for a wire bonding apparatus according to claim 1, wherein said restraining member is a screw which is screwably engaged with said ultrasonic horn so as to protrude into said mounting hole from a distal end surface thereof. 【請求項３】 前記拘束部材が、前記超音波ホーンの先
端面から前記取付孔内に突出可能に螺合するねじと、前
記取付孔内に配置され前記ねじと前記キャピラリィとの
間に介在する当て部材である請求項１記載のワイヤボン
ディング装置のキャピラリィ取付構造。3. The captive member according to claim 3, wherein the restraining member is disposed between the screw and the capillary and is disposed in the mounting hole. The capillary mounting structure for a wire bonding apparatus according to claim 1, which is a contact member. 【請求項４】 前記当て部材を、前記取付孔と直交する
超音波ホーンの横面に設けられた当て部材挿入孔から挿
入するようにした請求項３に記載のワイヤボンディング
装置のキャピラリィ取付構造。4. The capillary mounting structure of a wire bonding apparatus according to claim 3, wherein said contact member is inserted from a contact member insertion hole provided on a lateral surface of an ultrasonic horn orthogonal to said mounting hole.
JP10199926A 1998-07-15 1998-07-15 Capillary-mounting structure of wire-bonding device Pending JP2000031196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10199926A JP2000031196A (en) 1998-07-15 1998-07-15 Capillary-mounting structure of wire-bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10199926A JP2000031196A (en) 1998-07-15 1998-07-15 Capillary-mounting structure of wire-bonding device

Publications (1)

Publication Number Publication Date
JP2000031196A true JP2000031196A (en) 2000-01-28

Family

ID=16415902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10199926A Pending JP2000031196A (en) 1998-07-15 1998-07-15 Capillary-mounting structure of wire-bonding device

Country Status (1)

Country Link
JP (1) JP2000031196A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230343742A1 (en) * 2021-06-14 2023-10-26 Shinkawa Ltd. Ultrasonic horn and manufacturing apparatus of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230343742A1 (en) * 2021-06-14 2023-10-26 Shinkawa Ltd. Ultrasonic horn and manufacturing apparatus of semiconductor device

Similar Documents

Publication Publication Date Title
US5486733A (en) Bonding apparatus
KR890012736A (en) Ultrasonic Vibration Cutting Machine
US6578753B1 (en) Ultrasonic transducer for a bonding apparatus and method for manufacturing the same
US8104660B2 (en) Transducer and method for mounting the same
CA2206412A1 (en) Ultrasonic vibration bonding resonator with removable workpiece-engagingportions
US5368216A (en) Capillary-retaining structure for an ultrasonic horn
US8056794B2 (en) Combination wedge bonding and ball bonding transducer
KR980000732A (en) Ultrasonic Vibration Soldering Equipment and Resonator
JP2000031196A (en) Capillary-mounting structure of wire-bonding device
US6131875A (en) Cone-shaped shock absorbing structure for an optical scanner
US7100812B2 (en) Capillary holder
JPH0763886B2 (en) Ultrasonic saw
KR100629271B1 (en) Ultrasonic transducer for wire bonding
US6918528B2 (en) Transducer tool holder
US5904286A (en) Capillary holding structure for an ultrasonic horn
US7537148B2 (en) Bonding apparatus comprising improved oscillation amplification device
JPH1151034A (en) Fastening parts and combined spacer using these parts
JP2752699B2 (en) Wire bonding equipment
JPH0574877A (en) Ultrasonic processing device
JP2003051685A5 (en)
KR200157358Y1 (en) Yoke supporting plug for steering gear box
KR970063597A (en) Ultrasonic Horn Capillary Holding Structure
JP2552259Y2 (en) Capillary holding structure of ultrasonic horn
JPH07124899A (en) Ultrasonic cutter
JP2006049466A (en) Mounting structure of electronic parts