KR970063597A - Ultrasonic Horn Capillary Holding Structure - Google Patents

Ultrasonic Horn Capillary Holding Structure Download PDF

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Publication number
KR970063597A
KR970063597A KR1019960072264A KR19960072264A KR970063597A KR 970063597 A KR970063597 A KR 970063597A KR 1019960072264 A KR1019960072264 A KR 1019960072264A KR 19960072264 A KR19960072264 A KR 19960072264A KR 970063597 A KR970063597 A KR 970063597A
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KR
South Korea
Prior art keywords
capillary
ultrasonic horn
holding structure
nut
attachment hole
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Application number
KR1019960072264A
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Korean (ko)
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KR100247518B1 (en
Inventor
미노루 가와기시
미츠아키 사카쿠라
다다시 아키이케
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
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Publication of KR970063597A publication Critical patent/KR970063597A/en
Application granted granted Critical
Publication of KR100247518B1 publication Critical patent/KR100247518B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

[과제][assignment]

캐필러리의 유지성을 향상시킨다.Improved retention of capillary.

[해결수단][Resolution]

초음파혼(10)의 선단면에 수나사부(12)를 형성하고, 수나사부(12)에 너트(40)를 나사결합시켜 조여붙임에 따라, 캐필러리(30)를 부착하는 초음파혼(10)의 캐필러리 부착구멍(11)의 상방측부(14) 및 하방측부(15)를 눌러 탄성변형시키도록 구성한다.Ultrasonic horn 10 for attaching the capillary 30 as the male screw portion 12 is formed on the front end surface of the ultrasonic horn 10 and the nut 40 is screwed to the male screw portion 12. The upper side portion 14 and the lower side portion 15 of the capillary attachment hole 11 of the ()) are pressed to elastically deform.

Description

초음파혼의 캐필러리유지구조Ultrasonic Horn Capillary Holding Structure

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 초음파혼의 캐필러리유지구조의 제1의 실시의 태양을 도시한다.1 shows an aspect of the first embodiment of the capillary holding structure of the ultrasonic horn of the present invention.

제1a도는 평면도.1a is a plan view.

제1b도는 우측면도.1b is a right side view.

제1c도는 정면도.1c is a front view.

Claims (11)

초음파혼의 선단부에 형성된 캐필러리 부착구멍에 캐필러리를 유지시키는 초음파혼의 캐필러리 유지구조에 있어서, 상기 초음파혼의 선단면에 수나사부를 형성하고, 이 수나사부에 너트를 나사결합시켜 조여붙이는 것에 의해, 상기 초음파혼의 선단면과 상기 캐필러리 부착구멍 사이의 측부를 눌러 탄성변형시키도록 구성하는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.In the capillary holding structure of the ultrasonic horn, which holds the capillary in the capillary attachment hole formed at the distal end of the ultrasonic horn, a male screw portion is formed on the front end surface of the ultrasonic horn, and the nut is screwed into the male screw portion. The capillary holding structure of the ultrasonic horn is configured to press and elastically deform the side portion between the front end surface of the ultrasonic horn and the capillary attachment hole. 제1항에 있어서, 상기 너트의 조여붙임에 따른 누름에 의하여 탄성변형시켜지는 상기 측부는 상기 초음파혼의 선단면의 상하의 상방측부 및 하방측부인 것을 특징으로 하는 포음파혼의 캐필러리 유지구조.The sound absorbing horn capillary structure according to claim 1, wherein the side portion elastically deformed by pressing according to the tightening of the nut is an upper side portion and a lower side portion of the front end surface of the ultrasonic horn. 제1항에 있어서, 상기 캐필러리 부착구멍의 상기 초음파혼의 축중심에 직교하는 방향의 양측부의 상하에는, 상기 초음파혼의 선단면의 상하의 상방측부 및 하방측부가 탄성변형하기 용이하도록 홈이 형성되어 있는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.2. The grooves of claim 1, wherein upper and lower sides and upper and lower sides of the tip end surface of the ultrasonic horn are formed so as to easily elastically deform both sides of the capillary attachment hole in a direction orthogonal to the axial center of the ultrasonic horn. Capillary holding structure of the ultrasonic horn, characterized in that there is. 초음파혼의 선단부에 형성된 캐필러리 부착구멍에 캐필러리를 유지시키는 초음파혼의 캐필러리 유지구조에 있어서, 상기 초음파혼의 선단면에 수나사부를 형성하고, 상기 초음파혼의 선단면의 상하의 상방측부 및 하방측부를 제거하고 절결부를 형성하고, 상기 수나사부에 너트를 나사결합시켜 조여붙임에 의해 상기 너트가 상기 절결부를 통해서 직접 캐필러리를 유지하도록 구성하는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.In the capillary holding structure of the ultrasonic horn, which holds the capillary in the capillary attachment hole formed at the distal end of the ultrasonic horn, a male screw portion is formed on the front end surface of the ultrasonic horn, and the upper and lower sides and the upper and lower side portions of the front end surface of the ultrasonic horn. And the cutout is formed, and the capillary holding structure of the ultrasonic horn, characterized in that the nut is held to the capillary directly through the cutout by screwing the nut to the male screw portion. . 제4항에 있어서, 상기 캐필러리와 상기 너트의 사이에 스페이서를 배열설치하고, 너트를 조여붙임에 따라 스페이서를 통해 캐필러리를 유지하도록 구성하는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.5. The capillary holding structure of an ultrasonic horn according to claim 4, wherein a spacer is arranged between the capillary and the nut, and the capillary holding structure is configured to hold the capillary through the spacer as the nut is tightened. . 제5항에 있어서, 상기 스페이서는 탄성을 가지는 탄성부품으로 이루어지는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.The capillary holding structure of an ultrasonic horn according to claim 5, wherein the spacer is made of an elastic component having elasticity. 제1항, 제3항 또는 제4항에 있어서, 상기 캐필러리 부착구멍의 후방벽의 거의 중앙부분을 제거하도록 캐필러리 부착구멍에 교차하여 거의 직각방향으로 관통하는 가로 구멍을 설치하는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.5. The method according to claim 1, 3 or 4, wherein a horizontal hole intersecting the capillary attachment hole penetrates substantially perpendicular to the capillary attachment hole so as to remove almost the central portion of the rear wall of the capillary attachment hole. Ultrasonic horn capillary holding structure characterized in. 제1항, 제3항 또는 제4항에 있어서, 상기 캐필러리 부착구멍의 거의 중앙부분에 보어링 구멍을 설치하는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.5. The capillary holding structure for an ultrasonic horn according to claim 1, 3 or 4, wherein a boring hole is provided in a substantially central portion of the capillary attachment hole. 제1항, 제2항, 제4항, 또는 제5항에 있어서, 상기너트는, 상기 캐필러리 부착구멍측이 탄성을 가지도록, 외주에 슬릿을 설치하는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.The capillary capillary of claim 1, 2, 4, or 5, wherein the nut is provided with a slit on an outer circumference such that the capillary attachment hole side has elasticity. Maintenance structure. 제1항, 제2항, 제4항, 제5항, 또는 제9항에 있어서, 상기 너트는 알루미륨등의 경재료 또는 마그네늄등의 연성재료로 이루어지는 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.10. The capillary of the ultrasonic horn according to claim 1, 2, 4, 5, or 9, wherein the nut is made of a hard material such as aluminum or a soft material such as magnesium. Maintenance structure. 제10항에 있어서, 상기 너트 나사부는 동도금등의 연성재료로 표면처리된 것을 특징으로 하는 초음파혼의 캐필러리 유지구조.11. The capillary holding structure for an ultrasonic horn according to claim 10, wherein the nut screw portion is surface-treated with a soft material such as copper plating. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960072264A 1996-02-07 1996-12-26 Capillary maintaining structure of ultrasonic horn KR100247518B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8044058A JPH09213732A (en) 1996-02-07 1996-02-07 Structure of holding capillary in ultrasonic horn
JP96-44058 1996-02-07

Publications (2)

Publication Number Publication Date
KR970063597A true KR970063597A (en) 1997-09-12
KR100247518B1 KR100247518B1 (en) 2000-03-15

Family

ID=12681025

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960072264A KR100247518B1 (en) 1996-02-07 1996-12-26 Capillary maintaining structure of ultrasonic horn

Country Status (3)

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JP (1) JPH09213732A (en)
KR (1) KR100247518B1 (en)
TW (1) TW320340U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
KR102411257B1 (en) * 2019-03-18 2022-06-22 가부시키가이샤 신가와 Capillary guiding device and wire bonding device
JP2024073306A (en) * 2022-11-17 2024-05-29 株式会社新川 Horn unit, ultrasonic horn, and jig

Also Published As

Publication number Publication date
KR100247518B1 (en) 2000-03-15
JPH09213732A (en) 1997-08-15
TW320340U (en) 1997-11-11

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