JP2000031008A - X-ray mask and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an X-ray mask which is equipped with a circuit pattern for transfer, having high position precision and can be manufactured through a simplified manufacturing process and the manufacturing method for the mask. SOLUTION: This method for manufacturing an X-ray mask, having a base member 1 and an X-ray absorber 3 formed on the base member 1 and a mask layer 4, is formed on the X-ray absorber 3. A position detection member 31 including a position reference mark 8 is fixed to the base member 1. While the position reference mark 8 is used to detect the position of the mask layer 4, a mask pattern is drawn on the mask layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray mask and a method of manufacturing the same, and more particularly, to an X-ray mask having a position reference mark used for drawing a mask pattern and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in the manufacturing process of a semiconductor device,
In a process of transferring a circuit pattern such as wiring to a semiconductor substrate, a lithography technique mainly using ultraviolet rays has been used. However, as the degree of integration of semiconductor devices increases, for example, in a DRAM (Dynamic Random Access Memory), the storage capacity increases to 1 gigabit (Gbit), and as the degree of integration increases, wiring and the like increase. Is required to be further miniaturized than before.

As a technique for transferring such a fine circuit pattern, a lithography technique using X-rays is expected. In this lithography technology using X-rays,
X-ray wavelength (soft X-ray: wavelength = 5)
20 nm) is shorter than the conventionally used wavelength of ultraviolet light, so that a fine circuit pattern having higher resolution than the conventional lithography technique using ultraviolet light can be transferred.

In the lithography technique using the X-ray mask, an X-ray mask on which a circuit pattern for transfer is formed is used.

FIG. 42 is a sectional view showing a conventional X-ray mask. A conventional X-ray mask will be described with reference to FIG.

Referring to FIG. 42, a conventional X-ray mask is
The apparatus includes a substrate 101, a membrane 102, an X-ray absorber 103, and a support frame 105. The membrane 102 is an X-ray transmissive substrate, and is formed on the substrate 101. The membrane 102 has a thickness of several hundred nm to several μm, and is made of silicon carbide, silicon nitride, or the like. The X-ray absorber 103 is made of a material that blocks transmission of X-rays, such as a heavy metal such as tungsten or tantalum, and is formed on the membrane 102. A window 106 is formed in the substrate 101. The window 106 exposes the back surface of the membrane 102. In the region located on the window 106, the X-ray absorber 103 includes a transfer circuit pattern 107. A support frame 105 is provided on the lower surface of the substrate 101 via an adhesive layer 109.

Here, the transfer circuit pattern 107 of the X-ray absorber 103 is required to have high positional accuracy and dimensional accuracy.

FIGS. 43 and 44 are cross-sectional views for explaining a manufacturing process of the conventional X-ray mask shown in FIG. With reference to FIGS. 43 and 44, the manufacturing process of the conventional X-ray mask will be described below. Note that the X-ray mask can be manufactured by various methods that use different materials, different process orders, and the like. Here, a representative example will be described.

First, a membrane 102 is formed on a substrate 101 (see FIG. 43). Next, by removing a part of the substrate 101 by etching, the window 106 (FIG.
3). Next, the X-ray absorber 103 is formed on the membrane 102 by using a sputtering process or the like. A resist 104 (FIG. 43) is formed on the X-ray absorber 103.
Spin-coat). Thereafter, the resist 104 is dried in an atmosphere where the temperature is kept at 100 ° C. or higher.
Next, a support frame 105 (see FIG. 43) is provided on the lower surface of the substrate 101.
Glue. Thus, a structure as shown in FIG. 43 is obtained.

Next, a mask pattern for forming a transfer circuit pattern is formed on the resist 104 by electron beam drawing.
Thereafter, by performing a developing process, a mask pattern 110 is formed on the resist 104 as shown in FIG.

After that, etching is performed using the mask pattern 110 of the resist 104 as a mask, and a part of the X-ray absorber 103 is removed to thereby remove the X-ray absorber 1.
03, a transfer circuit pattern 107 (see FIG. 42) is formed. Thereafter, by removing the resist 104, an X-ray mask as shown in FIG. 42 can be obtained.

[0012] In addition to the above-described manufacturing process,
After forming the membrane 102, the support frame 105 is
For example, a manufacturing process in which the bonding process is performed on the resist pattern 104 and a process of forming the window 106 and bonding the support frame 105 after the electron beam drawing process of the mask pattern 110 in the resist 104 are also employed.

Here, the electron beam drawing step of the mask pattern 110 on the resist 104 specifically includes the following steps. First, a resist 1 is placed on the X-ray absorber 103.
The X-ray mask coated with 04 is mounted on a jig called a holder or a cassette. Next, the cassette is placed in a load lock chamber of the electron beam lithography apparatus (an area for preliminarily evacuating the periphery of the X-ray mask in order to load the X-ray mask into an area where electron beam lithography is performed while maintaining the vacuum state) With X
Bring in the line mask. Next, the inside of the load lock chamber is evacuated. Next, the X-ray mask is loaded together with the cassette from the load lock chamber onto the stage in the area where electron beam drawing is performed. Then, a mask pattern is drawn on the resist 104 of the X-ray mask by an electron beam. When the mask pattern is drawn using an electron beam, the electron beam is drawn while detecting and referring to the position of a position reference mark set on a cassette or a stage.

[0014]

As described above, when the mask pattern 110 is drawn, the position of the position reference mark set on the cassette or stage is detected and detected.
As mentioned, there are the following problems at this time.

First, the stage is usually set on a vibration isolation table or the like, and is designed so as not to be affected by external mechanical vibration. However, it is difficult to completely block such external mechanical vibrations, and external mechanical vibrations may be transmitted to a stage, a cassette, or the like during drawing of a mask pattern. As a result, when the mask pattern 110 is drawn on the resist 104, the relative position between the X-ray mask and the cassette or the relative position between the cassette and the stage may change due to the vibration. As a result, the relative position between the position reference mark provided on the cassette or the stage and the X-ray mask also changes, and there has been a problem that the positional accuracy of the mask pattern 110 deteriorates.

Similar problems also occur due to vibrations caused by acceleration or deceleration when moving the stage, thermal expansion accompanying changes in the temperature of the X-ray mask, cassette or stage during electron beam writing. I was

One method of manufacturing an X-ray mask for solving such a problem has been proposed in Japanese Patent Application Laid-Open No. Hei 4-297016. FIGS. 45 to 49 are cross-sectional views for explaining a manufacturing process of the X-ray mask proposed in the above publication. With reference to FIGS. 45 to 49, the manufacturing process of a conventionally proposed X-ray mask will be briefly described.

As shown in FIG. 45, membranes 102a and 102b are formed on the front and back surfaces of the substrate 101, respectively. The X-ray absorber 103 is formed on the membrane 102a.

Next, a resist pattern (not shown) is formed on the X-ray absorber 103. Using the resist pattern as a mask, a part of the X-ray absorber 103 is removed by etching. Thus, the marker pattern 108 (see FIG. 46) serving as the position reference mark is formed. Thereafter, the structure as shown in FIG. 46 is obtained by removing the resist pattern.

Next, as shown in FIG. 47, the X-ray absorber 1
A resist 104 is applied on the substrate 03. Then, while detecting the marker pattern 108 as a position reference mark, a mask pattern is drawn on the resist 104 by an electron beam. Thereafter, a mask pattern 106 is formed by performing a developing process.

As described above, since the marker pattern 108 acting as the position reference mark is formed on the X-ray absorber 103, the position reference mark and the X-ray mask are formed as in the case of forming the position reference mark on the cassette or stage. The relative position does not deviate, and the positional accuracy when drawing the mask pattern can be improved.

Next, as shown in FIG.
X-ray absorber 1 using mask pattern 106 of No. 4 as a mask.
03 is partially removed by etching. This allows
The transfer circuit pattern 107 is formed. After that, the resist 104 is removed.

Next, as shown in FIG.
02b and a part of the substrate 101 are removed by etching.

As described above, according to the method of manufacturing an X-ray mask proposed in Japanese Patent Application Laid-Open No. Hei 4-297016, the positional accuracy of the mask pattern 106 can be improved. There is such a problem.

In the method of manufacturing an X-ray mask proposed in the above publication, a step of forming a resist pattern on the X-ray absorber 103 to form the marker pattern 108, and using the resist pattern as a mask, And a step of removing the resist pattern after the etching step, and the number of steps is increased as compared with the conventional manufacturing steps. As a result, there arises a problem that the manufacturing period is prolonged and the manufacturing cost is increased.

An etching step is performed to form the marker pattern 108. In this etching step, dust and the like are likely to be generated. Therefore, resist 1
04 (see FIG. 47) before applying the X-ray absorber 10
A step of cleaning the surface of No. 3 is required, which also causes an increase in the number of steps.

If the dust generated in the above-mentioned etching step cannot be sufficiently removed, the resist 10
In some cases, coating unevenness may occur in No. 4. Such uneven coating of the resist 104 causes a defect in the mask pattern 106. When a defect occurs in the mask pattern 106, a defect also occurs in the transfer circuit pattern 107 formed in the X-ray absorber 103, and a defect of a semiconductor formed using this X-ray mask is corrected. Cause.

The present invention has been made in order to solve such problems, and one object of the present invention is to provide a transfer circuit pattern having high accuracy without increasing the number of manufacturing steps as much as possible. The purpose is to provide an X-ray mask.

Another object of the present invention is to provide an X-ray mask having a transfer circuit pattern with high precision, which makes it possible to manufacture an X-ray mask with as few steps as possible.
A method of manufacturing a line mask is provided.

[0030]

According to a first aspect of the present invention, there is provided a method of manufacturing an X-ray mask including a support member and an X-ray absorber formed on the support member. A mask layer is formed on the line absorber. For the support member,
The position detecting member including the position reference mark is fixed. A mask pattern is drawn on the mask layer while using the position reference mark for detecting the position of the mask layer.

Therefore, according to the first aspect of the present invention, X
A step of forming a resist pattern for forming the position reference mark, an etching step, a step of removing the resist pattern, and a subsequent step of forming the position reference mark on the X-ray absorber of the X-ray absorber of the X-ray absorber; It is not necessary to perform the washing step. Therefore, the manufacturing process of the X-ray mask can be simplified.

Further, since no etching step is performed to form the position reference mark, generation of dust on the X-ray mask can be prevented. Therefore, when forming the mask layer, it is possible to prevent a problem that the mask layer is locally unevenly formed due to the presence of dust or the like. Therefore, due to such a defect in the mask layer,
It is possible to prevent a defect from occurring in the mask pattern formed on the mask layer. As a result, it is possible to prevent defects from occurring in the transfer circuit pattern of the X-ray mask formed using this mask pattern.

Further, since the position reference mark of the position detecting member fixed to the support member is used for detecting the position of the mask layer at the time of drawing the mask pattern, the drawing of the mask pattern may be caused by mechanical vibration or the like. Even when the relative positional relationship between the X-ray mask and the cassette or the stage changes, a mask pattern having high positional accuracy can be drawn. As a result, an X-ray mask including a transfer circuit pattern having high positional accuracy can be manufactured.

According to a second aspect of the present invention, in the manufacturing method of the first aspect, the support member includes a substrate for supporting the X-ray absorber.

According to a third aspect of the present invention, in the method for manufacturing an X-ray mask according to the second aspect, the support member further includes a support frame portion located below the substrate.

According to a fourth aspect of the present invention, in the method of the third aspect, the method further comprises the step of installing a support frame under the substrate. Fixing the position detection member includes fixing the position detection member to the support frame.

According to a fifth aspect of the present invention, in the manufacturing method of the third aspect, the support frame is formed integrally with the substrate.

According to a sixth aspect of the present invention, in the method for manufacturing an X-ray mask according to any one of the first to fifth aspects, the step of fixing the position detecting member uses an adhesive for the position detecting member as a supporting member. Including a step of fixing.

According to a seventh aspect of the present invention, in the method for manufacturing an X-ray mask according to any one of the first to fifth aspects, the step of fixing the position detecting member comprises fixing the position detecting member to the supporting member using a screw. The step of performing

Therefore, according to the present invention, by removing the screw, the position detecting member can be removed from the supporting member after the mask pattern drawing step. As a result, when a circuit pattern is transferred to a semiconductor substrate using an X-ray mask with the position detection member fixed, there is a problem that the inclination angle of the X-ray mask is restricted by the presence of the position detection member. Can be prevented.

Further, since the position detecting member can be removed from the X-ray mask after the mask pattern drawing process,
The outer shape of the X-ray mask in a step after the mask pattern drawing step can be the same as the conventional one. Therefore, X
When a process after the mask pattern drawing process is performed in a state where the position detecting member is fixed to the line mask, the X-ray mask becomes necessary due to a difference in the outer shape from the conventional X-ray mask.
Modification of the line mask transport device and other manufacturing devices is not required. As a result, the conventional X-ray mask manufacturing apparatus can be used with little new capital investment.

According to an eighth aspect of the present invention, in the method of manufacturing an X-ray mask according to any one of the first to fifth aspects, the position detecting member includes a gripping member capable of gripping the supporting member. The step of fixing the position detection member includes fixing the position detection member to the support member by gripping the support member with the holding member.

Therefore, in the invention according to claim 8, X
There is no need to perform processing such as forming a screw hole for fixing the position detection member in the support member of the line mask. Therefore, the manufacturing process of the X-ray mask can be further simplified.

Further, since the position detecting member is fixed to the supporting member of the X-ray mask by the holding member, the position detecting member can be easily removed from the supporting member after the mask pattern drawing step. As a result, when the circuit pattern is transferred to the semiconductor substrate using the X-ray mask with the position detection member fixed to the support member, the inclination angle of the X-ray mask is restricted by the presence of the position detection member. Problems can be prevented.

Further, the outer shape of the X-ray mask in the step after the mask pattern drawing step can be made the same as that of the conventional one. Therefore, when a process after the mask pattern drawing process is performed in a state where the position detection member is fixed to the X-ray mask, the X-ray mask required due to the difference in the outer shape of the X-ray mask from the related art is required. Modification of the mask transfer device and other manufacturing devices is not required. As a result, the conventional X-ray mask manufacturing apparatus can be used with little new capital investment.

A method of manufacturing an X-ray mask according to a ninth aspect of the present invention, according to any one of the first to eighth aspects, further comprises a step of adjusting a position of the position reference mark with respect to the support member.

Therefore, according to the ninth aspect of the present invention, the height of the portion where the mask pattern is to be drawn is adjusted so that
The height of the position reference mark can be adjusted. Accordingly, it is possible to prevent the detection accuracy of the position reference mark from deteriorating due to the fact that the height of the position reference mark is different from the height of the area where the mask pattern is drawn when the mask pattern is drawn. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and obtain an X-ray mask including a transfer circuit pattern having high positional control.

Further, since the position of the position reference mark with respect to the supporting member can be adjusted, the same position detecting member can be applied to various types of X-ray masks.

According to a tenth aspect of the present invention, in the method of any one of the first to ninth aspects, the step of fixing the position detecting member comprises the step of fixing a plurality of position detecting members to the supporting member. including.

Therefore, in the invention according to claim 10,
A plurality of position reference marks can be used for detecting the position of the mask layer. This makes it possible to accurately detect the position of the mask layer even when the mask layer is displaced due to rotation or thermal expansion of the X-ray mask in the mask pattern drawing process. it can. As a result, it is possible to draw a mask pattern having high positional accuracy, thereby obtaining an X-ray mask including a transfer circuit pattern having high positional accuracy.

According to a eleventh aspect of the present invention, in the configuration of the tenth aspect, the step of fixing the plurality of position detection members to the support member includes the step of fixing the first position detection member to the support member. With respect to the center of the mask layer,
Fixing the second position detection member at a position that is point-symmetric with the position where the position detection member is fixed.

According to a twelfth aspect of the present invention, in the method for manufacturing an X-ray mask according to any one of the first to eleventh aspects, the step of drawing a mask pattern on the mask layer comprises the step of providing a cover member on a support member. And a step of drawing a mask pattern. In the cover member, a drawing opening is formed in a region located above a region where a mask pattern of the mask layer is drawn. In the cover member, a position detection opening is formed in a region located on the position reference mark.

Therefore, according to the invention of claim 12,
Since the cover member is provided on the support member, the electrons generated by the electron beam or ion beam for drawing the mask pattern are captured by the cover member so that the electrons reach the support member. Can be prevented. This can prevent the support member from being charged by the electrons. Therefore, it is possible to prevent the trajectory of the electron beam or the like for drawing the mask pattern from changing due to the charging of the support member. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and obtain an X-ray mask including a transfer circuit pattern having high positional accuracy.

According to a thirteenth aspect of the present invention, in the method of the twelfth aspect, the position detecting member further includes a pedestal portion for supporting the position reference mark. The size of the position detection opening is smaller than the size of the pedestal.

Therefore, according to the invention of claim 13,
Even if electrons originating from an electron beam for drawing a mask pattern and an electron beam for detecting a position reference mark enter the X-ray mask side from the position detection opening, the pedestal portion of the position detection member is removed. The electrons will escape to earth. This makes it possible to more effectively prevent the support member of the X-ray mask from being charged. As a result, it is possible to more effectively prevent a trajectory of an electron beam or the like for drawing a mask pattern from being changed due to charging of the support member. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and obtain an X-ray mask including a transfer circuit pattern having high positional accuracy.

According to a fourteenth aspect of the present invention, there is provided a method of manufacturing an X-ray mask according to any one of the first to thirteenth aspects, further comprising a step of removing charges from the position detecting member.

Therefore, in the invention according to claim 14,
In the step of drawing the mask pattern, even when the position reference mark of the position detecting member is irradiated with an electron beam for detecting this mark, the position detecting member can be prevented from being charged. As a result, it is possible to prevent a problem that the trajectory of the electron beam for drawing the mask pattern changes due to the charging of the position detecting member. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and obtain an X-ray mask including a transfer circuit pattern having high positional accuracy.

The X-ray mask according to claim 15 includes a support member, an X-ray absorber, and a position detecting member. The X-ray absorber is formed on a support member. The position detecting member is
It is fixed to the support member and includes a position reference mark.

Therefore, in the invention according to claim 15,
A step of forming a resist pattern for forming the position reference mark, an etching step, as compared with a case where a position reference mark is formed on the X-ray absorber of the X-ray mask;
It is not necessary to perform the step of removing the resist pattern and the subsequent step of cleaning the surface of the X-ray absorber, so that the manufacturing process of the X-ray mask can be simplified.

In order to form a position reference mark, X
Since no etching or the like is performed on the line mask, generation of dust due to this etching process can be prevented. Therefore, when applying a resist for forming a transfer circuit pattern of an X-ray mask on the X-ray absorber, it is possible to prevent the occurrence of unevenness in application of the resist due to the presence of dust as described above. it can. As a result, it is possible to prevent the occurrence of defects in the mask pattern for the transfer circuit pattern formed on the resist due to the uneven coating of the resist. Thereby, it is possible to prevent the occurrence of a defect in the transfer circuit pattern of the X-ray mask.

According to a sixteenth aspect of the present invention, in the configuration of the fifteenth aspect, the supporting member includes a substrate that supports the X-ray absorber. The position detecting member is fixed to the substrate.

According to a seventeenth aspect of the present invention, in the X-ray mask according to the fifteenth aspect, the position detecting member is fixed to the supporting member using an adhesive.

According to the eighteenth aspect of the present invention, in the configuration of the fifteenth aspect, the position detecting member is fixed to the supporting member using screws.

According to a nineteenth aspect of the present invention, in the X-ray mask according to any one of the fifteenth to eighteenth aspects, the position detecting member includes a position adjusting member for adjusting the position of the position reference mark with respect to the supporting member.

Therefore, in the invention according to claim 19,
The height of the position reference mark can be adjusted to match the height of the portion where the mask pattern for forming the transfer circuit pattern of the X-ray mask is drawn. Accordingly, it is possible to prevent the detection accuracy of the position reference mark from deteriorating due to the fact that the height of the position reference mark is different from the height of the area where the mask pattern is drawn when the mask pattern is drawn. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and obtain a transfer circuit pattern having high accuracy.

According to a twentieth aspect of the present invention, in the X-ray mask according to any one of the fifteenth to nineteenth aspects, the position detecting member includes first and second position detecting members.

Therefore, according to the invention of claim 20,
A plurality of position reference marks can be used to detect the position of a mask pattern drawing area when drawing a mask pattern for forming a transfer circuit pattern of an X-ray mask. Accordingly, even when the X-ray mask rotates or thermally expands during the drawing of the mask pattern, the displacement of the drawing area of the mask pattern occurs,
The position of the drawing area of the mask pattern can be accurately detected. As a result, a transfer circuit pattern having high positional accuracy can be obtained.

[0068]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing an X-ray mask according to Embodiment 1 of the present invention. An X-ray mask according to the first embodiment of the present invention will be described below with reference to FIG.

Referring to FIG. 1, the X-ray mask according to the first embodiment of the present invention includes a substrate 1, a membrane 2, an X-ray absorber 3, and a mark member 31. On a substrate 1, a membrane 2 is formed. An X-ray absorber 3 is formed on the membrane 2. A window 6 is formed in the substrate 1. A transfer circuit pattern 30 is formed on the X-ray absorber 3 in a region located on the window 6. A mark member 31 is fixed to a side surface of the substrate 1 by an adhesive layer 9. Mark member 31 includes pedestal portion 7 and mark portion 8. A mark 8 is formed on the pedestal 7.

As described above, the mark member 31 is provided on the X-ray mask.
Are fixed, so that in a manufacturing process described later, X
Compared to the case where a position reference mark is formed on the X-ray absorber 3 of the X-ray mask, a step of forming a resist pattern on the X-ray absorber 3, an etching step for forming the position reference mark, and removal of the resist pattern There is no need to perform a step of cleaning the surface of the X-ray absorber 3 after that. Therefore, the manufacturing process of the X-ray mask can be simplified.

Further, since etching for forming the position reference mark on the X-ray absorber 3 is not performed, dust and the like due to this etching process are not generated. For this reason, when applying a resist for forming the transfer circuit pattern 30 on the X-ray absorber 3, it is possible to prevent unevenness in application of the resist from being caused by the dust. As a result, due to the uneven coating of the resist,
The occurrence of defects in the mask pattern for forming the transfer circuit pattern 30 can be prevented. As a result, it is possible to prevent the transfer circuit pattern 30 from having a defect such as a defective pattern formation.

In the electron beam drawing step of the mask pattern for forming the transfer circuit pattern 30, the mark portion 8 of the mark member 31 thus fixed to the substrate 1
Can be used for detecting the position of a resist for drawing the mask pattern. For this reason, at the time of electron beam writing of the mask pattern, the relative positional relationship between the X-ray mask and the cassette or stage on which the X-ray mask is fixed changes due to mechanical vibration of the electron beam writing apparatus or the like. In such a case, the above-described resist and the mark portion 8 may be used.
The relative positional relationship with does not change. Thereby, a mask pattern having high positional accuracy can be drawn. As a result, the transfer circuit pattern 30 having high positional accuracy can be formed.

FIGS. 2 and 3 are a plan view and a side view for explaining the manufacturing process of the X-ray mask according to the first embodiment of the present invention shown in FIG. With reference to FIGS. 2 and 3, a manufacturing process of the X-ray mask according to the first embodiment of the present invention will be described.

As shown in FIGS. 2 and 3, first, the substrate 1
The membrane 2 is formed thereon. Next, the window 6 is formed by removing a part of the substrate 1 by etching. The X-ray absorber 3 is formed on the membrane 2. A resist 4 for forming a mask pattern used when forming a transfer circuit pattern 30 (see FIG. 1) on the X-ray absorber 3 is formed. The mark member 3 is provided on the side surface of the substrate 1.
1 is fixed by an adhesive layer 9. The mark member 31 includes a pedestal portion 7 and a mark portion 8. Then, by sequentially measuring the mark portion 8 as a position reference mark, a mask pattern is drawn in the mask pattern drawing area 10 of the resist 4 while correcting the position of the X-ray mask based on the measurement data.

As described above, since the mask pattern is drawn while using the mark portion 8 of the mark member 31 fixed to the substrate 1 as a position reference mark, a machine such as a drawing apparatus is used when drawing the mask pattern. When the relative positional relationship between the X-ray mask and the cassette or stage on which the X-ray mask is fixed changes due to mechanical vibration or the like, the position of the X-ray mask and the mark portion 8 is changed. The relationship does not change. As a result, a mask pattern having high accuracy can be drawn, and thus, an X-ray mask having a transfer circuit pattern having high positional accuracy can be easily obtained.

Further, compared with the case where the position reference mark is formed on the X-ray absorber 3, there is no need to perform a step of forming a resist pattern for forming the position reference mark. Therefore, the manufacturing process of the X-ray mask can be simplified.

Further, since no position reference mark is formed on the X-ray absorber 3, there is no need to perform an etching step for forming this position reference mark. Thus, there is no problem that dust and the like due to the etching process adhere to the surface of the X-ray absorber 3. Therefore, when the resist 4 is applied, the application unevenness of the resist 4 does not occur due to the dust.

Thereafter, the resist 4 is subjected to a development process or the like to form a mask pattern, and then a part of the X-ray absorber 3 is removed by etching using the mask pattern as a mask. Thereby, the transfer circuit pattern 30 is formed on the X-ray absorber 3. After that, the resist 4 is removed.

In this way, an X-ray mask as shown in FIG. 1 can be obtained. 4 and 5 are a plan view and a side view showing a first modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention shown in FIGS. Referring to FIGS. 4 and 5, a first modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention is basically based on the first embodiment of the present invention shown in FIGS. X
It is the same as the manufacturing process of the line mask, but the substrate of the X-ray mask is the support frame integrated type substrate 11 integrated with the support frame. The mark member 31 is fixed to the support frame portion of the support frame integrated type substrate 11 by the adhesive layer 9. The first embodiment of the present invention shown in FIGS.
According to the first modification of the manufacturing process of the X-ray mask according to the present invention, the same effect as the manufacturing process of the X-ray mask according to the first embodiment of the present invention shown in FIGS. 2 and 3 can be obtained.

FIGS. 6 and 7 are a plan view and a side view showing a second modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention. Referring to FIGS. 6 and 7, a second modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention will be described.

As shown in FIGS. 6 and 7, the second modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention is basically the same as the embodiment of the present invention shown in FIGS. This is the same as the manufacturing process of the X-ray mask according to mode 1. However, in the second modification shown in FIGS. 6 and 7, the support frame 5 is fixed below the substrate 1 of the X-ray mask by the adhesive layer 9a. The mark member 31 is fixed to the support frame 5 by the adhesive layer 9b. With such a configuration, in the second modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention shown in FIGS. 6 and 7, the first embodiment of the present invention shown in FIGS. The same effect as in the manufacturing process of the X-ray mask can be obtained.

(Embodiment 2) FIGS. 8 and 9 are a plan view and a side view for explaining a manufacturing process of an X-ray mask according to Embodiment 2 of the present invention. With reference to FIGS. 8 and 9, the manufacturing process of the X-ray mask according to the second embodiment of the present invention will be described.

As shown in FIGS. 8 and 9, the manufacturing process of the X-ray mask according to the second embodiment of the present invention is basically the same as that of the X-ray mask according to the first embodiment of the present invention shown in FIGS. Is the same as the manufacturing process. However, in the manufacturing process of the X-ray mask according to the second embodiment of the present invention shown in FIGS. 8 and 9, mark member 31 is fixed to substrate 1 with screws 12. Therefore, in the manufacturing process of the X-ray mask according to the second embodiment of the present invention, the same effect as that of the manufacturing process of the X-ray mask in the first embodiment of the present invention can be obtained, and at the same time, this mark member 31 It can be easily removed from the substrate 1 after the pattern drawing step. As a result, while the mark member 31 is fixed to the substrate 1, this X
When a circuit pattern is transferred to a semiconductor substrate or the like using a line mask, the presence of the mark member 31 can prevent a problem that the inclination angle of the X-ray mask is restricted.

Further, the outer shape of the X-ray mask in the step after the mask pattern drawing can be made similar to the conventional one.
Therefore, in the case where the steps after the mask pattern drawing step are performed while the mark member 31 is fixed to the substrate 1 of the X-ray mask, it is necessary to modify the transporting apparatus of the X-ray mask and other manufacturing apparatuses. However, such a modification of the device is no longer necessary. As a result, the conventional X-ray mask manufacturing apparatus can be used as it is.

Depending on the configuration of the apparatus for manufacturing the X-ray mask, the X-ray mask may be completed without removing the mark member 31 from the substrate 1 while the mark member 31 is installed.

FIGS. 10 and 11 are a plan view and a sectional view showing a first modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention. FIG. 11 shows a cross section taken along line 100-100 in FIG.
Referring to FIGS. 10 and 11, a first modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention will be described.

As shown in FIGS. 10 and 11, the first modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention is basically the same as that of the first embodiment shown in FIGS. This is the same as the manufacturing process of the X-ray mask according to mode 2. However, in the first modification shown in FIGS. 10 and 11,
An opening 13 formed by removing a part of the X-ray absorber 3, the membrane 2, and the substrate 1 from the mark member 31.
And fixed by screws 12a and 12b. With this configuration, the same effect as that of the first embodiment of the present invention can be obtained, and at the same time, the mark member 31
Since the outer shape of the X-ray mask after installing the X-ray mask on the X-ray mask does not change significantly, there is no need to modify the transport device of the X-ray mask after the mask pattern drawing process. Therefore, FIG.
In the manufacturing process of the X-ray mask according to the second embodiment of the present invention shown in FIGS. 9 and 10, the same effect as in the case where the mark member 31 is removed from the X-ray mask after the mask pattern drawing process can be obtained. Further, since the mark member 31 can be installed at a position closer to the mask pattern drawing area 10, the positional accuracy of the mask pattern can be further improved.

FIGS. 12 and 13 are a plan view and a side view showing a second modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention. A second modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 12 and 13, a second modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention is basically based on the second embodiment of the present invention shown in FIGS. 8 and 9. This is the same as the manufacturing process of the X-ray mask. However, in this second modification, the support frame 5 is fixed below the substrate 1 of the X-ray mask by the adhesive layer 9. Also, the mark member 31 is attached to the support frame 5 with the screw 12
a and 12b. With such a configuration, it is possible to obtain the same effects as those of the manufacturing process of the X-ray mask according to the second embodiment of the present invention shown in FIGS.

FIGS. 14 and 15 are a plan view and a side view for explaining a third modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention. Figures 14 and 15
A third modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention will be described with reference to FIG.

As shown in FIGS. 14 and 15, the third modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention is basically the same as that of the embodiment shown in FIGS. This is the same as the manufacturing process of the X-ray mask according to mode 2. However, in the third modification, the X-ray mask includes the support frame integrated type substrate 11. The mark member 31 is fixed to the support frame portion of the support frame integrated substrate 11 with screws 12a and 12b. With such a configuration, it is possible to obtain the same effects as those of the manufacturing process of the X-ray mask according to the second embodiment of the present invention shown in FIGS.

(Embodiment 3) FIGS. 16 and 17 are a plan view and a side view for explaining a manufacturing process of an X-ray mask according to Embodiment 3 of the present invention. Figures 16 and 1
The manufacturing process of the X-ray mask according to the third embodiment of the present invention will be described with reference to FIG.

As shown in FIGS. 16 and 17, the manufacturing process of the X-ray mask according to the third embodiment of the present invention is basically the same as that of the first embodiment shown in FIGS.
It is the same as the manufacturing process of the line mask. However, in the manufacturing process of the X-ray mask according to the third embodiment of the present invention, the mark member 31 fixes the X-ray mask by gripping the X-ray mask. Specifically, before the mask pattern drawing process, the fixing portion 14 grips the substrate 1 and the resist 4 of the X-ray mask,
The mark member 31 is fixed to the X-ray mask.

Therefore, it is not necessary to perform a processing step such as forming a screw hole for fixing the mark member 31 on the substrate 1 of the X-ray mask, and the manufacturing process of the X-ray mask can be further simplified. .

Further, since the mark member 31 is fixed to the X-ray mask by the fixing section 14, the mark member 31 can be easily removed from the X-ray mask after the mask pattern drawing process. As a result, the same effects as those in the manufacturing process of the X-ray mask according to the second embodiment of the present invention can be obtained.

FIGS. 18 and 19 are a plan view and a side view for describing a first modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention. 18 and 19
A first modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention will be described with reference to FIG.

As shown in FIGS. 18 and 19, the first modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention is basically the same as that of the embodiment shown in FIGS. 3 is the same as the manufacturing process of the X-ray mask of FIG. However, in the first modification, the support frame 5 is fixed below the substrate 1 of the X-ray mask by the adhesive layer 9a. The mark member 31 is fixed to the support frame 5 by the fixing part 14. The fixing portion 14 fixes the mark member 31 to the support frame 5 by gripping the support frame 5. With this configuration, it is possible to obtain the same effect as that of the manufacturing process of the X-ray mask according to the third embodiment of the present invention shown in FIGS.

FIGS. 20 and 21 are a plan view and a side view for explaining a second modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention. Figures 20 and 21
A second modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention will be described with reference to FIG.

As shown in FIGS. 20 and 21, a second modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention is basically the same as that of the embodiment shown in FIGS. 3 is the same as the manufacturing process of the X-ray mask of FIG. However, in the second modification, the X-ray mask includes the support frame integrated type substrate 11. The mark member 31 is fixed to the support frame of the support frame integrated substrate 11 by the fixing unit 14. The fixing portion 14 fixes the mark member 31 to the support frame integrated substrate 11 by gripping the support frame portion of the support frame integrated substrate 11. With this configuration, it is possible to obtain the same effect as that of the manufacturing process of the X-ray mask according to the third embodiment of the present invention shown in FIGS.

(Embodiment 4) FIGS. 22 and 23 are a plan view and a side view for explaining a manufacturing process of an X-ray mask according to Embodiment 4 of the present invention. Figures 22 and 2
The manufacturing process of the X-ray mask according to the fourth embodiment of the present invention will be described with reference to FIG.

As shown in FIGS. 22 and 23, the manufacturing process of the X-ray mask according to the fourth embodiment of the present invention is basically the same as that of the X-ray mask according to the second embodiment shown in FIGS. This is the same as the second modification of the manufacturing process. However, the manufacturing process of the X-ray mask according to the fourth embodiment of the present invention further includes a process of adjusting the height of mark portion 19 of mark member 31. Thereby, the mark portion 19
Can be adjusted to match the height of the drawing surface of the mask pattern.

Due to the difference in height between the mark portion 19 and the drawing surface on which the mask pattern is drawn,
It is possible to prevent a problem that the detection accuracy of the mark portion 19 is deteriorated. Thus, it is possible to prevent deterioration of the positional accuracy of the mask pattern and easily obtain an X-ray mask including a transfer circuit pattern having high positional accuracy.

Here, in order to adjust the height of the mark portion 19, a mark member having a structure as shown in FIG. 24 may be used. FIG. 24 is a cross-sectional view of the mark member 31 taken along line 200-200 in FIG. Referring to FIG. 24, the mark member according to the fourth embodiment of the present invention includes a pedestal portion 15 and a mark portion 19. The pedestal portion 15 has a screw hole 29a for fixing the mark member to the support frame 5 (see FIG. 22) with screws 12a and 12b (see FIG. 22).
29b and an opening 17 into which the threaded portion of the mark 19 is inserted are formed. Inside the opening 17, a thread 16 having a thread is formed. A mark portion 19 is provided on the pedestal portion 15. Mark part 1
The threaded portion 9 is inserted into the opening 17, and the height of the mark 19 can be adjusted by rotating the mark 19.

FIG. 25 is a bottom view of the mark member shown in FIG. Referring to FIG. 25, pedestal portion 1 of the mark member
5, the bottom surface 18 of the threaded portion of the mark portion 19 (see FIG. 24) is exposed. A groove is formed on the bottom surface of the threaded portion of the mark.

By using such a mark member, the height of the mark portion 19 can be adjusted according to the structure of the X-ray mask. Therefore, this mark member 31 is applied to various types of manufacturing processes of X-ray masks. be able to.

Although the mark member 31 has a function of adjusting the height of the mark portion 19 here, the mark member 31 has a function of adjusting the height of the support frame 5 (see FIG. 23) of the X-ray mask or the substrate 1 (see FIG. 23). The height of the mark portion 19 (see FIG. 23) may be adjusted by providing an adjustment mechanism and installing the mark member 31 (see FIG. 23) in that portion.

(Embodiment 5) Embodiments 1 to 5 described above
In FIG. 4, the case where only one mark member is used has been described. However, as shown in FIG. 26, when the X-ray mask is displaced so as to rotate, or as shown in FIG.
In the case where the line mask itself is deformed due to thermal expansion or the like, if there is only one mark member 31, it is difficult to accurately detect the displacement of the X-ray mask.
Here, FIG. 26 is a schematic diagram showing a case where the X-ray mask is displaced so as to rotate, and FIG. 27 is a schematic plan diagram showing a case where the X-ray mask is deformed by heat.

In such a case, as shown in FIG. 28, it is effective to install a plurality of mark members 31a and 31b on the X-ray mask. FIG. 28 is a schematic diagram for explaining a manufacturing process of the X-ray mask according to the fifth embodiment of the present invention. Referring to FIG. 28, the X-ray mask in the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention basically corresponds to the manufacturing process of the X-ray mask according to the first embodiment of the present invention shown in FIG. It has the same structure as the X-ray mask in the second modification. However, in the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention, the mask pattern drawing area 1
Before performing the step of drawing the mask pattern at 0, a step of fixing the two mark members 31a and 31b to the support frame 5 so as to be point-symmetric with respect to the center of the mask pattern drawing area 10 is provided.

As described above, the two mark members 31a, 3
1b, these mark members 31a,
31b can be used for detecting the position of the resist 4.
Thereby, in addition to the effect obtained by the first embodiment of the present invention, when the X-ray mask is displaced so as to rotate as shown in FIG. 29, or as shown in FIG. Even in the case where the resist 4 is deformed, the position of the resist 4 can be accurately detected. As a result,
A mask pattern having a high positional accuracy can be drawn, whereby an X-ray mask having a transfer circuit pattern having a high positional accuracy can be easily obtained.

Here, FIG. 29 is a schematic plan view showing a case where the X-ray mask is displaced so as to rotate, and FIG. 30 shows a case where the X-ray mask is deformed by expansion due to heat. It is a plane schematic diagram.

FIGS. 31 and 32 are a plan view and a side view showing a first modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention. Referring to FIGS. 31 and 32, a first modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention will be described.

As shown in FIGS. 31 and 32, the first modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention is basically the same as that of the first embodiment shown in FIGS. This is the same as the manufacturing process of the X-ray mask according to mode 1. However, in the first modification shown in FIGS. 31 and 32,
Two mark members 31a and 31b are provided on the substrate 1 of the X-ray mask.
Are fixed by adhesive layers 9c and 9d, respectively. With this configuration, it is possible to obtain the same effect as the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention shown in FIG.

FIGS. 33 and 34 are a plan view and a side view showing a second modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention. Referring to FIGS. 33 and 34, a second modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention will be described.

As shown in FIGS. 33 and 34, the second modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention is basically the same as that of the embodiment shown in FIGS. This is the same as the second modification of the manufacturing process of the X-ray mask according to mode 1. However, the second shown in FIGS.
In the modification, two mark members 31a and 31b are fixed to the support frame 5 of the X-ray mask by the adhesive layers 9c and 9d. With this configuration, it is possible to obtain the same effect as the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention shown in FIG.

FIGS. 35 and 36 are a plan view and a side view showing a third modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention. Referring to FIGS. 35 and 36, a third modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention will be described.

As shown in FIGS. 35 and 36, a third modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention is different from the X-ray mask according to the first embodiment of the present invention shown in FIGS. This is the same as the first modification of the line mask manufacturing process.
However, in the third modification shown in FIGS. 35 and 36, two mark members 31a and 31b are fixed to the support frame integrated type substrate 11 of the X-ray mask by the adhesive layers 9c and 9d, respectively. With such a configuration, it is possible to obtain the same effect as the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention shown in FIG.

(Embodiment 6) FIG. 37 is a plan view for describing a manufacturing process of an X-ray mask according to Embodiment 6 of the present invention. Referring to FIG. 37, the manufacturing process of the X-ray mask according to the sixth embodiment of the present invention will be described.

As shown in FIG. 37, the manufacturing process of the X-ray mask according to the sixth embodiment of the present invention is basically the same as that of manufacturing the X-ray mask according to the fifth embodiment of the present invention shown in FIGS. This is the same as the second modification of the process. However, in FIG. 37, when the mask pattern is actually drawn on the resist 4, the X-ray mask 22 is fixed to the holder 21 used for fixing the X-ray mask 22 on the stage in the drawing area. Is shown. A mask cover 2 made of a conductor such as a metal is placed on the X-ray mask 22.
0, and the mask cover 20 is provided with screws 25a to 25a.
It is fixed to the holder 21 by d. The mask cover 20 has a drawing area opening 23 formed so as to expose the mask pattern drawing area 10. Also,
Mark openings 24a and 24b are formed in the mask cover 20 so as to expose the mark members 31a and 31b.

As described above, since the mask cover 20 is placed on the X-ray mask 22 and covers the support frame 5 of the X-ray mask 22, the mask cover 20 is generated by an electron beam or an ion beam for drawing a mask pattern. The captured electrons are captured by the mask cover 20, so that the electrons can be prevented from reaching the support frame 5. Thereby, the support frame 5 can be prevented from being charged by the electrons. As a result, it is possible to prevent the trajectory of the electron beam or the like for drawing the mask pattern from changing due to the charging of the support frame 5 or the like of the X-ray mask 22. As a result, it is possible to prevent deterioration of the accuracy of the mask pattern, and it is possible to easily manufacture an X-ray mask including a transfer circuit pattern having high positional accuracy.

FIG. 38 shows a line segment 300-3 in FIG.
It is sectional drawing in 00. Referring to FIG. 38, mark member 31a includes mark portion 8a and pedestal portion 7a.
The width W1 of the mark opening 24a formed in the mask cover 20 is set to be smaller than the width W2 of the base 7a.

For this reason, even if electrons originating from an electron beam or the like for drawing a mask pattern enter the support frame 5 through the mark opening 24a, the pedestal 7a of the mark member 31a is not affected.
These electrons are escaped through earth. This makes it possible to more effectively prevent the support frame 5 of the X-ray mask from being charged. As a result, it is possible to more effectively prevent the problem that the trajectory of an electron beam or the like for drawing a mask pattern changes due to the charging of the support frame 5. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and easily obtain an X-ray mask including a transfer circuit pattern having high positional accuracy.

(Embodiment 7) FIGS. 39 and 40 are a plan view and a cross-sectional view for explaining a manufacturing process of an X-ray mask according to Embodiment 7 of the present invention. Here, FIG.
Indicates a cross section taken along line 400-400 in FIG. Referring to FIGS. 39 and 40, the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention will be described.

As shown in FIGS. 39 and 40, the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention is basically the same as that of the X-ray mask according to the first embodiment of the present invention shown in FIGS. It is the same as the manufacturing process. However, in the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention shown in FIGS. 39 and 40, the X-ray mask is fixed to holder 21 which also has a mask cover function. The holder 21 is set on the stage 26 in a drawing area for drawing a mask pattern. The holder 21 has a drawing area opening 23 and a mark opening 24 formed therein.
The holder 21 and the stage 26 are made of a conductor. The mark member 31 and the holder 21 are electrically connected by the conductive wire 27.

For this reason, in the mask pattern drawing process, even if the mark portion 8 of the mark member 31 is irradiated with the electron beam for position detection, the electrons irradiated on the mark member 31 do not accumulate in the mark member 31 without being accumulated. It can flow to the holder 21 and the stage 26 via the conductive wire 27. As a result, it is possible to prevent the mark member 31 from being charged. As a result, it is possible to prevent the problem that the trajectory of the electron beam for drawing the mask pattern changes due to the charging of the mark member 31. As a result, it is possible to prevent deterioration of the positional accuracy of the mask pattern and easily obtain an X-ray mask including a transfer circuit pattern having high positional accuracy.

FIG. 41 is a diagram showing X according to the seventh embodiment of the present invention.
It is sectional drawing which shows the modification of a manufacturing process of a line mask. FIG.
With reference to FIG. 1, a modification of the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention will be described.

As shown in FIG. 41, the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention is basically the same as that of manufacturing the X-ray mask according to the seventh embodiment of the present invention shown in FIGS. It is the same as the process. However, in the modified example shown in FIG. 41, an opening is formed in a region of the holder 21 below the mark member 31, and the mark member 31 and the stage 26 are connected by the conductive wire 28. Thereby, the electrons applied to the mark member 31 can be flown to the stage 26, and the same effects as those of the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention shown in FIGS. 39 and 40 can be obtained. .

It should be noted that the embodiments disclosed this time are examples in all respects, and should not be construed as limiting. The scope of the present invention is defined by the terms of the claims, rather than the embodiments described above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[0128]

As described above, according to the first to twelfth aspects of the present invention, a mark member having a mark portion acting as a position reference mark is provided on a substrate or a support frame of an X-ray mask. An X-ray mask including a transfer circuit pattern having high positional accuracy can be manufactured with almost no increase in manufacturing steps.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an X-ray mask according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an X according to the first embodiment of the present invention shown in FIG.
It is a top view for explaining the manufacturing process of a line mask.

FIG. 3 shows X according to the first embodiment of the present invention shown in FIG. 1;
It is a side view for explaining the manufacturing process of a line mask.

FIG. 4 is a plan view for explaining a first modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention.

FIG. 5 is a side view for describing a first modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention.

FIG. 6 is a plan view for explaining a second modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention.

FIG. 7 is a side view for explaining a second modification of the manufacturing process of the X-ray mask according to the first embodiment of the present invention.

FIG. 8 is a plan view for explaining a manufacturing step of the X-ray mask according to the second embodiment of the present invention.

FIG. 9 is a side view for explaining the manufacturing process of the X-ray mask according to the second embodiment of the present invention.

FIG. 10 is a plan view for describing a first modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention.

FIG. 11 is a sectional view taken along line 100-100 in FIG. 10;

FIG. 12 is a plan view for explaining a second modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention.

FIG. 13 is a side view for explaining a second modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention.

FIG. 14 is a plan view for describing a third modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention.

FIG. 15 is a side view for explaining a third modification of the manufacturing process of the X-ray mask according to the second embodiment of the present invention.

FIG. 16 is a plan view for explaining a manufacturing step of the X-ray mask according to the third embodiment of the present invention.

FIG. 17 is a side view for illustrating the manufacturing process of the X-ray mask according to the third embodiment of the present invention.

FIG. 18 is a plan view for describing a first modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention.

FIG. 19 is a side view for describing a first modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention.

FIG. 20 is a plan view for describing a second modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention.

FIG. 21 is a side view for explaining a second modification of the manufacturing process of the X-ray mask according to the third embodiment of the present invention.

FIG. 22 is a plan view for explaining the manufacturing process of the X-ray mask according to the fourth embodiment of the present invention.

FIG. 23 is a side view for illustrating the manufacturing process of the X-ray mask according to the fourth embodiment of the present invention.

24 is a sectional view of the mark member taken along line 200-200 in FIG.

FIG. 25 is a bottom view of the mark member shown in FIG. 24;

FIG. 26 shows a step of drawing a mask pattern;
FIG. 4 is a schematic plan view showing a case where a displacement such as rotation of an X-ray mask occurs.

FIG. 27 illustrates a step of drawing a mask pattern.
FIG. 4 is a schematic plan view showing a case where an X-ray mask is deformed by heat.

FIG. 28 is a schematic plan view for explaining the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 29 is a schematic plan view showing a case where the X-ray mask is displaced so as to rotate in the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention shown in FIG. 28;

30 is a schematic plan view showing a case where the X-ray mask is deformed by heat in the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention shown in FIG. 28.

FIG. 31 is a plan view for explaining a first modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 32 is a side view for describing a first modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 33 is a plan view for describing a second modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 34 is a side view for explaining a second modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 35 is a plan view for describing a third modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 36 is a side view for describing a third modification of the manufacturing process of the X-ray mask according to the fifth embodiment of the present invention.

FIG. 37 is a plan view for describing the manufacturing process of the X-ray mask according to the sixth embodiment of the present invention.

FIG. 38 is a sectional view taken along line 300-300 in FIG.

FIG. 39 is a plan view for describing the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention.

40 is a sectional view taken along line 400-400 in FIG. 39.

FIG. 41 is a cross-sectional view for describing a modification of the manufacturing process of the X-ray mask according to the seventh embodiment of the present invention.

FIG. 42 is a cross-sectional view showing a conventional X-ray mask.

FIG. 43 is a cross-sectional view for describing a first step of the manufacturing process of the conventional X-ray mask shown in FIG.

FIG. 44 is a cross-sectional view for describing a second step of the manufacturing process of the conventional X-ray mask shown in FIG.

FIG. 45 is a cross-sectional view for explaining a first step in a conventionally proposed manufacturing process of an X-ray mask.

FIG. 46 is a cross-sectional view for explaining a second step of the conventionally proposed manufacturing process of the X-ray mask.

FIG. 47 is a cross-sectional view for describing a third step of the conventionally proposed manufacturing process of the X-ray mask.

FIG. 48 is a cross-sectional view for describing a fourth step of the conventionally proposed manufacturing process of the X-ray mask.

FIG. 49 is a cross-sectional view for describing a fifth step of the conventionally proposed manufacturing process of the X-ray mask.

[Explanation of symbols]

Reference Signs List 1 substrate, 2 membrane, 3 X-ray absorber, 4 resist, 5 support frame, 6 windows, 7, 7a, 7b, 15 pedestal, 8, 8a, 8b, 19 mark, 9, 9a, 9
b adhesive layer, 10 mask pattern drawing area, 11 support frame integrated type substrate, 12, 12a, 12b, 25a to 25
d Screw, 13, 17 opening, 14 fixing part, 16 screw part, 18 threaded part bottom of mark part, 20 mask cover, 21 holder, 22 X-ray mask, 23 drawing area opening, 24, 24a, 24b mark Opening 2
6 stage, 27, 28 conductive wire, 29a, 29b screw hole, 30 transfer circuit pattern, 31, 31a, 31
b Mark member.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideki Yabe 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Keiko Kitamura 2-3-2 Marunouchi, Chiyoda-ku, Tokyo 3 Inside Rishi Electric Co., Ltd. (72) Inventor Kenji Marumoto 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Sanryo Electric Co., Ltd. F-term (reference) 2H095 BA10 BC08 BC28 BC30 BE03 BE08 BE09 BE10 5F046 GD04 GD12 GD15 GD17 GD19 GD20

Claims (20)

[Claims] 1. A method for manufacturing an X-ray mask comprising a support member and an X-ray absorber formed on the support member, comprising: forming a mask layer on the X-ray absorber; An X-ray mask, comprising: a step of fixing a position detection member including a position reference mark to a support member; and a step of drawing a mask pattern on the mask layer while using the position reference mark for position detection of the mask layer. Manufacturing method. 2. The method for manufacturing an X-ray mask according to claim 1, wherein the support member includes a substrate that supports the X-ray absorber. 3. The method according to claim 2, wherein the support member further includes a support frame located below the substrate. 4. The method according to claim 3, further comprising the step of installing the support frame under the substrate, wherein the step of fixing the position detection member includes the step of fixing the position detection member to the support frame. 3. The method for manufacturing an X-ray mask according to 1. 5. The method for manufacturing an X-ray mask according to claim 3, wherein said support frame portion is formed integrally with said substrate portion. 6. The X according to claim 1, wherein fixing the position detection member includes fixing the position detection member to the support member using an adhesive.
Manufacturing method of line mask. 7. The X-ray mask according to claim 1, wherein fixing the position detection member includes fixing the position detection member to the support member using a screw. Manufacturing method. 8. The method according to claim 8, wherein the position detecting member includes a gripping member capable of gripping the support member, and the step of fixing the position detecting member comprises: gripping the support member with the gripping member; 6. The method according to claim 1, further comprising a step of fixing a position detecting member to the supporting member.
The method for manufacturing an X-ray mask according to any one of the above items. 9. The method according to claim 1, further comprising adjusting a position of the position reference mark with respect to the support member.
The method for manufacturing an X-ray mask according to any one of the above items. 10. The step of fixing the position detecting member,
The method of manufacturing an X-ray mask according to claim 1, further comprising fixing a plurality of position detection members to the support member. 11. The step of fixing the plurality of position detection members to the support member includes the steps of: fixing a first position detection member to the support member; and detecting the first position with respect to the center of the mask layer. 11. The method for manufacturing an X-ray mask according to claim 10, further comprising: fixing the second position detection member at a position that is point-symmetric with the position where the member is fixed. 12. The step of drawing a mask pattern on the mask layer includes the step of drawing the mask pattern in a state where a cover member is provided on the support member. 12. The image forming apparatus according to claim 1, wherein a drawing opening is formed in a region located on a region where the mask pattern is drawn, and a position detection opening is formed in a region located on the position reference mark.
13. The method for producing an X-ray mask according to the above item. 13. The X-ray according to claim 12, wherein the position detection member further includes a pedestal portion that supports the position reference mark, and the size of the position detection opening is smaller than the size of the pedestal portion. Manufacturing method of mask. 14. The method of manufacturing an X-ray mask according to claim 1, further comprising a step of removing charges from said position detection member. 15. An X-ray mask comprising: a support member; an X-ray absorber formed on the support member; and a position detection member fixed to the support member and including a position reference mark. 16. The X-ray mask according to claim 15, wherein the support member includes a substrate that supports the X-ray absorber, and the position detection member is fixed to the substrate. 17. The X-position according to claim 15, wherein the position detection member is fixed to the support member using an adhesive.
Line mask. 18. The X-ray mask according to claim 15, wherein the position detection member is fixed to the support member using a screw. 19. The X-ray mask according to claim 15, wherein said position detecting member further includes a position adjusting member for adjusting a position of said position reference mark with respect to said support member. 20. The apparatus according to claim 20, wherein the position detecting member includes first and second positions.
20. The method according to claim 15, further comprising:
An X-ray mask according to the item.