JP2000022069A - Tape feed mechanism and method of tape pasting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape feeding mechanism and a method related to a tape pasting device, wherein a tape is stably fed without being deformed and producing looseness, prevented from sticking to the device even if the tape is high in adhesion, and improved in use efficiency. SOLUTION: In a tape pasting device, a unit equipped with tape clamping mechanisms 2 (2') and 3 (3') for clamping or unclamping a synthetic resin tape 5 and tape guides 21 and 22 used for separating the tape 5 is provided at the tape inlet side and tape outlet side of a die 1 on a tape transfer path respectively, movable clamps 3 and 3' each located in the units are linked together with a connecting shaft 34 and furthermore equipped with a moving means 29 which move them back and forth by a prescribed distance along the transfer direction of the synthetic resin tape 5 making them synchronizing with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape feeding mechanism of a tape sticking apparatus and a method for sticking a tape to a metal frame while stably supplying the tape intermittently.

[0002]

2. Description of the Related Art In general, a semiconductor IC manufacturing process includes a process of attaching an annular synthetic resin tape to a lead end portion of a lead frame to eliminate an upper and lower step, and a process of TAB (Tap).
e Automated Bonding) -BGA
(A ball grid array) stiffener for attaching an annular synthetic resin tape to the stiffener, and a TAB tape punching and attaching process to the stiffener. The conventional method for intermittently automatic feeding of the synthetic resin tape when cutting and pasting the synthetic resin tape in the mold in these processes is performed by driving the tape on the tape transport path on the tape exit side of the mold. A roller and a nip roller are provided, and a tape tension mechanism that applies a predetermined amount of tension to the tape is provided on the tape transport path on the tape entrance side of the mold, and the synthetic resin tape is sandwiched between the two rollers. A method in which a driving roller is rotated by a motor and pulled out from a mold while controlling the amount of rotation (JP-A-56187).
Publication). Further, as another conventional method, when the synthetic resin tape is a TAB tape, a sprocket hole is formed in advance at the end of the TAB tape, and a driving roller having a roller-shaped sprocket is provided, and a roller-shaped sprocket is provided. There is a method in which a drive roller is rotated by a motor while fitting a sprocket into a sprocket hole of a TAB tape, and the tape is fed while controlling the amount of rotation.

[0003]

FIG. 6 shows a tape feeding mechanism of a type in which the driving roller and the nip roller pull the tape to feed the tape, among the tape feeding mechanisms used in the above-described conventional tape feeding method. The tape 51 is set in a tape guide 53 of a mold 52, and is guided by the tape guide 53 in a predetermined transport direction. A drive roller 54 and a nip roller 55 are provided at a position where the tape 51 can be sandwiched on the tape transport path on the tape exit side (on the front side in the drawing) of the mold 52. The drive roller 54 is connected to a motor 56 shown in a simplified manner.
Is driven to rotate in a predetermined direction. The tape entrance side of the mold 52 (the side opposite to the tape exit side)
Is provided with a tension applying mechanism (not shown) for applying a predetermined amount of tension to the tape, and the tension applying mechanism is provided from the tape entrance side of the mold 52 so that the tape 51 is not loosened. A predetermined amount of tension is applied in the direction of arrow W. The tape 51 sent near the tape exit side of the mold 52 is punched out of the center by a punch (not shown) provided in the mold 52 and has a ladder-like shape. In this feeding method, the remaining portion of the tape 51 punched in the mold is sandwiched by upper and lower rollers 54 and 55 provided on the tape transport path on the tape exit side of the mold 52, and the motor 56
Is driven to rotate the drive roller 54 and the nip roller 55 to feed the tape 51 in a direction opposite to the direction in which the tension is applied.

However, in such a conventional tape feeding method, a predetermined amount of tension is applied to the tape from one direction, and then the tape is pulled in the opposite direction. Will increase. For this reason, excessive tension is applied to the tape 51 being conveyed, and the tape 51 bends in a predetermined direction (upward in the figure) in the tape guide 53 as shown in FIG. And so on. In addition, since the center of the tape is punched inside the mold, the ratio of tension applied to the entire tape being transported changes, and the deflection of the tape is especially near the tape exit after the die tape is punched. becomes terrible.
In addition, since the shape of the tape piece cut in the mold depends on the tension state of the tape 51 being conveyed, when the tape 51 is cut in a state in which flaking is generated, the deflection generated in the tape piece is large. There is a problem that the quality of the manufactured IC is adversely affected.
Generally, a rubber-based material such as urethane rubber is used as a surface material of a roller such as the rollers 54 and 55 for sandwiching and feeding a tape. In such a roller, the feed amount of the tape is apt to vary greatly depending on the outer diameter accuracy of the urethane rubber. For this reason, if a roller is used as in the conventional tape feeding method, the tape feeding becomes unstable for each feeding mechanism depending on the outer diameter accuracy of the roller, and a plurality of tapes are simultaneously transferred to manufacture an IC. In such a case, it was easy to cause inconvenience. In addition, when a highly adhesive tape such as a TAB tape is fed, there is a possibility that a problem may occur in which the tape is stuck on the roller itself and gets caught in the roller, which hinders the tape feeding.

On the other hand, in a tape feeding method in which a tape is fed by using a sprocket instead of sandwiching the tape with a roller, it is necessary to replace the sprocket according to the position and size of a sprocket hole formed in the TAB tape. . For this reason, it takes time to replace sprockets every time the type of tape is changed, and it is necessary to prepare a plurality of sprockets, which complicates the work and increases production costs. was there. Moreover, if the sprocket hole portion of the TAB tape is damaged, the tape cannot be fed accurately. For this reason, a good TAB tape having no problem in the manufacture of ICs other than the sprocket hole portion cannot be used as long as it cannot be set on the sprocket. was there.

According to the present invention, the tape can be fed stably without deforming the shape of the tape and without loosening.
It is an object of the present invention to provide a tape feeding mechanism and a method of a tape applying device capable of preventing sticking of a tape even when a highly adhesive tape is fed and improving the use efficiency of the tape. .

[0007]

In order to solve the above-mentioned problems, a tape feeding mechanism of a tape sticking device according to the present invention comprises:
A mold for attaching the synthetic resin tape to the lead part of the lead frame, attaching the tape to the stiffener part, attaching a TAB tape to the heat spreader, and automatically sending the tape to the mold In the tape applying apparatus having the mechanism of (1), a unit composed of a tape clamp mechanism for clamping and releasing the tape and a tape peeling mechanism for peeling the tape is mounted on the tape transport path on the tape entrance side and the exit side of the mold. And moving means for reciprocating at least one tape clamp mechanism in each unit by a predetermined amount while synchronizing with each other in the tape transport direction.

In the present invention, preferably, the tape peeling mechanism has a surface formed of a member having a property that the tape does not stick, and the tape peeling mechanism has a tape width on the tape conveying path on the tape entrance side or the exit side of the die. A tape clamp mechanism having a width occupying a central portion and extending to a length corresponding to a moving distance of a tape clamp mechanism which is reciprocated a predetermined amount while being synchronized is provided for restricting the vertical movement of the tape. It is characterized by comprising a vertical guide and a part of each tape clamp mechanism for clamping and releasing a portion of the tape which is not guided by the vertical guide.

Further, in the tape feeding method of the tape applying device according to the present invention, a synthetic resin tape is attached to a lead portion of a lead frame, a tape is attached to a stiffener portion, or a TAB tape is attached to a heat spreader. A tape application device having a mold for automatically feeding a tape to the mold, wherein the surface is composed of a member having a property that the tape does not adhere, and the tape of the mold is provided. It was provided to extend a predetermined amount of length at the center on the tape transport path on the entrance side and the exit side, respectively,
Pass the tape through the gap between the vertical guides to regulate the vertical movement of the tape, and apply a predetermined amount of tension to the tape. (2) Place the tape on the tape transport path on the tape entrance and exit sides of the mold. Using a tape clamp mechanism provided for clamping the tape, a portion of the tape to which a predetermined amount of tension has been applied, which is not guided by the vertical guide, is clamped. (3) A predetermined amount of tension applied to the tape The tape clamp mechanism on the tape entrance side and the exit side of the mold is moved by a predetermined amount while synchronizing in the tape transport direction so that is maintained constant. (4) Thereafter, the tape entrance side and the exit side of the mold Release the tape clamp by the tape clamp mechanism on the side, and (5) Return each tape clamp mechanism moved a predetermined amount to the initial position. It is characterized in that it is made to be.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a tape feeding mechanism used in a tape feeding method of a tape sticking apparatus according to the present invention will be described below with reference to the drawings. First, a schematic configuration of the present invention will be described. FIG. 1 is a conceptual diagram showing one embodiment of a tape feeding mechanism of a tape sticking device according to the present invention. Although the detailed internal configuration is not shown,
In the mold 1 of the present invention, a synthetic resin tape is attached to a lead portion of a lead frame, a synthetic resin tape is attached to a stiffener portion, and TAB is attached to a heat spreader.
As a member for attaching a tape or the like, an insert block for punching a synthetic resin tape fixed to a die plate, a punch guide, a punch, and the like are provided. On the opposite side of the punch and the metal material (such as a lead frame and a stiffener for TAB tape), a heating plate slidable with respect to the metal material is provided. The mold 1 of the present invention punches out a synthetic resin tape passing through a tape guide groove (not shown) provided between the insert block and the punch guide with a punch. Is sandwiched between a punch and a heating plate, and a synthetic resin tape is attached to a metal material.

The tape feeding mechanism of the present embodiment comprises fixed clamps 2 and 2 'and movable clamps 3 and 3' on the tape entrance side and the tape exit side of the mold 1 on the transport path of the synthetic resin tape 5, respectively. Tape clamp mechanism,
And tension applying mechanisms 4 and 4 '. The movable clamps 3 and 3 'are connected to each other, and can reciprocate a predetermined amount synchronously along the transport path of the synthetic resin tape 5. One of the movable clamps 3 and 3 'is connected to a power means (omitted in FIG. 1) for enabling reciprocation by a predetermined amount. The tension mechanism 4, 4 ′ does not cause the synthetic resin tape 5 conveyed into the mold 1 to undergo deformation such as dimensional change or minute surface undulation, and does not cause the synthetic resin tape 5 to loosen. So that the minimum tension is applied to the synthetic resin tape 5 in the direction of the arrow X.
Is pulling. And the tension mechanisms 4, 4 '
Are designed so that the tension applied to the synthetic resin tape 5 can be adjusted so that the directions thereof are exactly opposite and substantially the same in the vicinity of the tape entrance and the exit of the mold 1.

By the way, if the surface of the synthetic resin tape on which the glue is applied is left unattended, it tends to stick to a metal member or the like located near the transport path. If the synthetic resin tape adheres to a metal member or the like located in the vicinity of the conveyance path on the conveyance path of the synthetic resin tape, this becomes a frictional resistance when the synthetic resin tape is fed, which hinders the tape feeding. Therefore, in the tape feeding mechanism of the present embodiment, a portion including the surface on the side where the adhesive of the synthetic resin tape is applied is provided at the center of the synthetic resin tape 5 on the tape entrance side and the tape exit side of the mold 1 on the conveyance path. Tape guides (omitted in FIG. 1) are provided above and below. The upper and lower tape guides have a slippery member such as a Teflon tape stuck on the surface thereof to prevent the tape 5 from sticking.
Is not stuck. The upper and lower tape guides extend on the tape entrance side and the tape exit side of the mold 1 by a length corresponding to the locations where the fixed clamps 2 and 2 'and the movable clamps 3 and 3' are provided. . In addition, fixed clamps 2, 2 ', movable clamps 3,
3 'is provided so that the synthetic resin tape 5 can be clamped from both sides of the upper and lower tape guides provided at the center of the synthetic resin tape 5 on the conveyance path.

When the synthetic resin tape 5 is fed using the tape feeding mechanism having such a configuration, first, the synthetic resin tape 5 in a state where a predetermined amount of tension is applied to the synthetic resin tape 5 is transferred to the tape entrance side of the mold 1. And clamp with the moving clamps 3, 3 'on the tape exit side. Then, the movable clamps 3 and 3 'are moved by a predetermined amount in the tape transport direction, and the clamped synthetic resin tape 5 is sent to a predetermined position in the mold 1 (for example, a tape punching position).
At this time, the moving clamps 3 and 3 'are connected to each other and therefore move at the same time. Therefore, the moving clamp 3,
Mold 1 without deforming synthetic resin tape 5 between 3 '
It is sent to a predetermined position within. In addition, moving clamp 3,
When the tape is fed while the synthetic resin tape 5 is clamped at 3 ′, the upper and lower tape guides regulate the vertical movement of the synthetic resin tape 5, so that the synthetic resin tape 5 escapes upward and downward and the transport path It can be prevented from being caught by a member located in the vicinity.

After the feeding of the synthetic resin tape 5 into the mold 1 is completed, the synthetic resin tape 5 is clamped by the fixed clamps 2 and 2 ', and the synthetic resin tape 5 is clamped by the movable clamps 3 and 3'. Release and return the moving clamps 3, 3 'to the initial position. Here fixed clamp 2,
2 ', When the clamps of the synthetic resin tape 5 by the moving clamps 3 and 3' are released, the upper and lower tape guides are pulled in a direction in which the upper and lower tape guides are stuck to the respective tape clamp mechanisms (either upward or downward). Since the movement of the synthetic resin tape 5 is regulated, the synthetic resin tape 5 is easily peeled off from the tape clamping mechanism.

Next, the tape feeding mechanism of the present embodiment will be described in more detail. FIG. 2 is a cross-sectional view showing a tape clamp mechanism of the tape feeding mechanism of the present embodiment, and FIG. 3 is a cross-sectional view of a main part of the tape clamp mechanism of FIG. FIG.
Is a front view showing a feed unit of the tape feed mechanism of the present embodiment, and FIG. 5 is a plan view showing a feed unit of the tape feed mechanism of the present embodiment.

The tape clamp mechanism (fixed clamps 2, 2 ', movable clamps 3, 3') of the tape feed mechanism is shown in FIG.
As shown in FIG.
Air cylinder 1 located above and below
1 and 12, clamp release members 13 and 14, and clamp plates 15 and 16. Air cylinder 11,
Numerals 12 are attached to the upper and lower portions of the clamp unit main body 10, respectively, and the respective tips 11a and 12a are in contact with the clamp plates 15 and 16, respectively. When the air cylinders 11 and 12 are actuated in a direction approaching the synthetic resin tape 5, the respective distal ends 11a and 12a are extended, and the clamp plates 15 and 16 are moved in a direction approaching the synthetic resin tape 5 (FIGS. 2 and 3). In FIG. 3, it can be pushed downward and upward respectively. The clamp release members 13 and 14 are provided on both sides of the air cylinders 11 and 12, respectively. Then, the clamp releasing members 13 and 14 are connected to the pin-shaped member 1.
7 and 18 and a spring member 19.20.

The pin-shaped members 17 and 18 are connected to the body 17a,
18a slidably pass through radial bearings 10c provided in holes 10a and 10b formed in upper and lower portions of the clamp portion main body 10, respectively.
5 and 16 are fixed. Also, the pin-like members 17 and 18
Are formed with flanges 17b and 18b on the head thereof. The spring members 19 and 20 are formed of coil springs, and the clamp plates 15 and 16 and the pin-shaped member 1 are inserted in the state where the body portions 17a and 18a of the pin-shaped members 17 and 18 are inserted therethrough.
7 and 18 are sandwiched between the flanges 17b and 18b.
The spring members 19 and 20 are connected to the air cylinders 11 and 1.
2 is operated in a direction away from the synthetic resin tape 5 direction, the clamp plate 1 is moved to a position as shown in FIG.
It has elasticity enough to return 5,16.

As shown in FIGS. 2 and 3, the clamp plates 15 and 16 are
a, 16a so that the synthetic resin tape 5 can be sandwiched therebetween. The surface 15 on the side of the synthetic resin tape 5
Grooves 15b and 16b are formed in a and 16a in accordance with the shapes of the upper and lower tape guides 21 and 22. The grooves 15b and 16b prevent the surfaces 15a and 16a on the synthetic resin tape 5 side from colliding with the tape guides 21 and 22 to prevent the clamping when the clamp plates 15 and 16 clamp the synthetic resin tape 5. In. In addition, as shown in FIG.
The upper part 23 and the lower part 24 are fixed by a pin member 25. The clamp mechanism in FIG. 2 shows the movable clamps 3 and 3 '. A rail member 26 is attached to the movable clamps 3 and 3 ′ on the lower surface of the lower side 24 of the clamp unit main body 10. The rail member 25 is fitted on a guide rail 28 provided on a support plate 27 of the tape feeding mechanism main body. As a result, the movable clamps 3 and 3 'can be moved in a direction perpendicular to the paper surface. On the other hand, as shown in FIGS. 4 and 5, the fixed clamps 2 and 2 '
The lower surface of the lower portion 24 of the clamp body 10 is fixed to the support plate 27 without the intervention of the guide rails 28 and 6.

In this embodiment, a fixed clamp and a movable clamp (fixed clamp 2 and movable clamp 3, fixed clamp 2 'and movable clamp 3') are provided in a set of tape clamp mechanisms. I have.

The tape guides 21 and 22 are located on the conveying path of the synthetic resin tape 5 so as to have a width occupying the central portion of the tape width as shown in FIG. 2, and as shown in FIGS. The tape 5 is fixedly disposed near both the upper and lower surfaces. In addition, the tape guides 21 and 22
4 and 5 extend a predetermined length in accordance with the movement distance of the tape clamp mechanism, so that the vertical movement of the synthetic resin tape 5 can be restricted. On the surfaces of the tape guides 21 and 22, a member having a slippery property, such as a Teflon tape, for example, which can prevent sticking of the synthetic resin tape 5, is attached, and the synthetic resin tape 5 is attached to the tape guides 21 and 22. It does not stick. And the tape guide 21,
22 is a fixed clamp 2, 2 ', a movable clamp 3, 3'
When the clamp of the synthetic resin tape 5 is released, the movement of the synthetic resin tape 5 in the direction in which the synthetic resin tape 5 is pulled toward the side (either up or down) adhered to each of the tape clamp mechanisms is regulated. The tape 5 can be peeled off from the tape clamp mechanism. Therefore, in this embodiment, the tape guides 21 and 22 and the clamp release members 13 and 1 of the clamp mechanism are used.
4 constitute a tape peeling mechanism. The tape guides 21 and 22 of the present embodiment shown in FIG.
Is divided into three linear guide portions 21a and 22a, but the shape of the guide portions 21a and 22a is not particularly limited, and regulates the vertical movement of the synthetic resin tape 5. Any form may be used as long as it is possible. The tape guides 21 and 22 are not limited to the Teflon processing as in the present embodiment, and may have any configuration as long as the surfaces of the tape guides 21 and 22 can prevent sticking of the synthetic resin tape 5. . In this embodiment, one unit is constituted by one set of tape clamp mechanism and one set of upper and lower tape guides.

As shown in FIGS. 4 and 5, the tape feed mechanism has a structure in which the above-described one unit component is provided on each of the tape inlet side and the tape outlet side of the die 1 of the tape feed mechanism main body. A movable clamp moving means 29 is provided on the tape entrance side 3 of the tape feeding mechanism main body. The movable clamp moving means 29 includes a motor 30, a gear member (not shown) connected to the motor 30, a pulley 31, a drive belt 32, and the like. 5 can be made to travel in both reciprocating directions along the transport direction. Connecting arms 33, 33 'are respectively attached to the movable clamps 3, 3' in each unit, and the connecting arms 33, 33 'are connected to each other by a connecting shaft. Also, the connecting arm 33 of the movable clamp 3
Are connected to the drive belt 32 by connecting means (not shown). Therefore, the movable clamps 3, 3 'can reciprocate a predetermined amount in synchronization with the rotation of the motor 30 on the tape feeding mechanism main body along the transport direction of the synthetic resin tape 5. The movable clamps 3 and 3 'can adjust the amount of movement by controlling the amount of rotation of the motor 30 via control means such as a microcomputer (not shown).

In addition, fixed clamps 2 in each unit
2 ′ is located near the tape entrance and exit of the mold 1. In addition, upper and lower tape guides 21 and 22 in each unit.
2 has both ends 21b and 22b fixed to the feed mechanism main body via a support member 35. A synthetic resin tape 5 is provided outside each unit of the tape feeding mechanism body.
Guide rollers 36 for stabilizing the traveling of the vehicle are respectively attached. Further, tension mechanisms 4 and 4 ′ as shown in FIG. 1 are provided outside the guide roller 36. The timing of clamping the tapes of the movable clamps 2 and 2 'and the fixed clamps 3 and 3' in each unit is synchronous or asynchronous depending on the degree of tension applied to the synthetic resin tape 5 by the tension mechanisms 4 and 4 '. Any configuration may be used. In this case, when the synthetic resin tape 5 is clamped on both sides of the mold 1, the synthetic resin tape 5 during the clamp is provided with an optimal tension which maintains the flatness without causing a dimensional deviation or surface undulation. The clamp timing is controlled by a microcomputer or the like (not shown) so as to be in the state of being engaged.

Next, the tape feeding by the tape feeding mechanism of the present embodiment will be described. The synthetic resin tape 5 is passed between the upper and lower tape guides 21 and 22 as shown in FIG. Further, a predetermined amount of tension is applied to the synthetic resin tape 5 as described above. From this state, in each of the movable clamps 3 and 3 ', the air cylinders 11 and 12 shown in FIG. 2 are actuated in the direction approaching the synthetic resin tape 5, and the clamp plates 15 are moved through the respective tips 11a and 12a. , 16 downward and upward respectively. Then, the clamp plates 15 and 16 of the movable clamps 3 and 3 'approach each other against the elastic force of the spring members 19 and 20 and substantially abut each other to clamp the synthetic resin tape 5. At this time, the synthetic resin tape 5 while being clamped is in an optimal tension state in which the flatness is maintained without causing dimensional deviation or surface undulation.

Next, the motor 30 shown in FIG.
, The movable clamp 3 is moved in the arrow Y direction by a predetermined amount along the transport direction of the synthetic resin tape 5, and the synthetic resin tape 5 clamped by the movable clamp 3 is transported. At this time, the movable clamp 3 ′ is connected to the movable clamp 3 via the connection arm 33 ′ and the connection shaft 34, and thus moves together with the movable clamp 3. For this reason, while the synthetic resin tape 5 clamped by the movable clamp 3 and the movable clamp 3 'is transported, the tension of the synthetic resin tape 5 between the movable clamps 3 and 3' is kept constant. Further, the synthetic resin tape 5 passes between the tape guides 21 and 22 during conveyance,
Since a Teflon tape or the like is stuck on the surface of 2, the tape does not stick to the tape guides 21 and 22. After transporting the synthetic resin tape 5 by a predetermined amount, the forward rotation of the motor 30 is stopped, and the synthetic resin tape 5 is stopped at a predetermined position.

Next, in each of the fixed clamps 2 and 2 ′, the air cylinders 11 and 12 are
Are operated in a direction approaching the
The clamp plates 15 and 16 are pushed downward and upward, respectively, via 12a. Then, the clamp plates 15 and 16 of the fixed clamps 2 and 2 ′ are
The synthetic resin tapes 5 approach each other against the elastic forces 9 and 20, and substantially abut each other to clamp the synthetic resin tape 5. At this time, the state where the optimum tension is applied to the synthetic resin tape 5 while being clamped is maintained in the same manner as when the synthetic resin tape 5 is clamped by the movable clamps 3 and 3 '.

After the synthetic resin tape 5 is clamped by the fixed clamps 2 and 2 ′, the air cylinders 11 and 12 are operated in the movable clamps 3 and 3 ′ in a direction away from the synthetic resin tape 5, respectively. Release the clamp of the tape 5. Then, the clamp plates 15 and 16 of the movable clamps 3 and 3 'are separated from each other by the elastic force of the spring members 19 and 20.

Here, in the case of a synthetic resin tape such as a TAB tape, when the synthetic resin tape 5 is clamped, the surface of the synthetic resin tape 5 to which the glue is attached is the movable clamp 3, 3 '.
May be stuck on either side of the clamp plate 15 or 16. Then, the synthetic resin tape 5 stuck to one of the surfaces of the clamp plate 15 or 16 is pulled in a direction (vertical direction) where the clamp plate 15 or 16 is separated from each other. However, according to the present embodiment, the vertical movement of the synthetic resin tape 5 is regulated by the upper and lower tape guides 21 and 22 having the property that the surface does not stick to the synthetic resin tape 5. Therefore, the tape 5 stuck on the clamp plate 15 or 16 is moved away from the clamp plate 15 or 1 as the clamp plate 15 or 16 moves away.
It is peeled off from 6.

After the clamp of the synthetic resin tape 5 by the movable clamps 3 and 3 'is released, the motor 30 is rotated in the reverse direction to move the movable clamp 3 in the direction of arrow Z, and FIG.
Return to the initial position as shown in (1). Also at this time, since the movable clamps 3 and 3 'are connected to each other via the connection arms 32 and 32' and the connection shaft 33, they move simultaneously.

Next, of the synthetic resin tapes 5 conveyed by a predetermined amount, the synthetic resin tapes 5 conveyed into the mold 1 are:
A predetermined member (not shown) in the mold 1 performs a predetermined process such as punching out a tape and attaching a punched tape piece to a metal plate (such as a lead frame or stiffener).

After the predetermined processing is completed in the mold 1, the movable clamps 3, 3 'are operated in the direction approaching the synthetic resin tape 5 to clamp the synthetic resin tape 5 with the movable clamps 3, 3'. Next, in each of the fixed clamps 2 and 2 ′, the air cylinders 11 and 12 are operated in a direction away from the synthetic resin tape 5 to release the clamp of the synthetic resin tape 5. Then, the clamp plates 15 and 16 of the fixed clamps 2 and 2 ′ are separated from each other by the elastic force of the spring members 19 and 10. At this time, the tape 5 attached to the clamp plate 15 or 16 is restricted by the upper and lower tape guides 21 and 22 from moving in the vertical direction in the same manner as when the movable clamps 3 and 3 'are released. As the clamp plates 15 and 16 move away, they are peeled off from the clamp plates 15 or 16.

Thus, one cycle of the transport of the synthetic resin tape 5 by the tape feeding mechanism is completed. Since then
The movable clamps 3, 3 'are moved in the same manner as described above, and the unpunched synthetic resin tape 5 is conveyed into the mold 1, and at the same time, the punched synthetic resin tape 5 is moved out of the mold 1. Send out. After the synthetic resin tape 5 is clamped by operating the fixed clamps 2 and 2 ', the clamp of the synthetic resin tape 5 by the movable clamps 3 and 3' is released, and the movable clamps 3 and 3 'are returned to the initial positions. .
After a predetermined tape punching and sticking process is completed in the mold 1, the movable clamps 3 and 3 'are operated to clamp the synthetic resin tape 5 and the fixed clamps 2 and 3'.
The clamp of the synthetic resin tape 5 by 2 'is released. Then, these steps are repeated.

Therefore, according to the tape feeding mechanism and the method of the present embodiment, the tension applied to the tape before and after the punching process is performed in the mold without causing deformation of the tape and reducing slack in the tape. The tape can be transported while maintaining an optimum state that does not occur.

Further, according to the tape feeding mechanism and the method of the present embodiment, even a tape such as a TAB tape which is easily stuck to other members is transported while preventing sticking to members other than the clamp. Can be performed stably. Even when the tape is stuck to the clamp, the tape can be reliably peeled off when the clamp is released.

[0034]

As described above, according to the present invention, it is possible to cut with a punch while suppressing the tape deformation while maintaining the tension state in a predetermined preferable state, thereby preventing the deformation of the tape piece. . Even if an adhesive tape is used, it can be stably transported without sticking to members other than the clamp, and even if it is attached to the clamp, the tape can be easily peeled off from the clamp. Therefore, as in the conventional tape feed mechanism, the tape is not over-tensioned, and the tape, which is punched by a punch, etc., is not deformed and does not affect the quality of the product. Can be kept. Further, unlike the conventional tape feeding mechanism, the tape can be used effectively without depending on the sprocket portion of the tape, and the economy is further improved.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing one embodiment of a tape feeding method using a tape feeding mechanism according to the present invention.

FIG. 2 is a sectional view of a tape clamp mechanism showing in detail one embodiment of a tape feed mechanism according to the present invention.

FIG. 3 is a cross-sectional view of a main part along line AA in FIG. 2;

FIG. 4 is a plan view of the tape feeding mechanism of the embodiment.

FIG. 5 is a front view of the tape feeding mechanism of the embodiment.

FIG. 6 is a conceptual diagram of a conventional tape feed mechanism.

[Explanation of symbols]

 1,52 Mold 2,2 'Fixed clamp 3,3' Moving clamp 4,4 'Tension mechanism 5,51 Synthetic resin tape 6 Air cylinder 10 Clamp part 10a, 10b hole 10c Radial bearing 11,12 Air cylinder 11a, 12a Tip portion 13,14 Clamp release member 15,16 Clamp plate 15a, 16a Surface of synthetic resin tape 5 side 15b, 16b Groove 17,18 Pin-shaped member 17a, 18a Body portion 17b, 18b Flange portion 19.20 Spring member 21 , 22 Upper and lower tape guides 23 (clamp part main body) Upper part 24 (clamp part main body) lower part 25 Pin member 26 Rail part 27 Support plate 28 Guide rail 29 Movable clamp moving means 30, 56 Motor 31 Pulley 32 Drive belt 33, 33 'connection arm 34 connection DOO 35 supporting member 36 guide rollers 53 the tape guides 54 driving rollers 55 nip roller

Claims (3)

[Claims] 1. A mold for attaching a synthetic resin tape to a lead portion of a lead frame, attaching a tape to a stiffener portion, and attaching a TAB tape to a heat spreader, and a tape attached to the mold. A tape adhering device having a mechanism for automatically feeding the tape, a unit comprising a tape clamping mechanism for clamping and unclamping the tape and a tape peeling mechanism for peeling off the tape, the tape entrance of the mold On the tape transport path on the side and the exit side, respectively,
A tape feeding mechanism comprising a moving means for reciprocating at least one tape clamping mechanism in each of said units by a predetermined amount while synchronizing with each other along a tape conveying direction. 2. The tape peeling mechanism has a surface formed of a member having a property that a tape does not stick, and occupies a central portion of a tape width on a tape transport path on a tape entrance side or an exit side of the die. An upper and lower guide for restricting the vertical movement of the tape, each having a width and extending to a length corresponding to the moving distance of the tape clamp mechanism which is reciprocated a predetermined amount while being synchronized with the tape clamp mechanism; 2. The tape feeding mechanism according to claim 1, further comprising a part of each of said tape clamping mechanisms for clamping and unclamping a portion of the tape that is not guided by said vertical guide. 3. A mold for attaching a synthetic resin tape to a lead portion of a lead frame, attaching a tape to a stiffener portion, or attaching a TAB tape to a heat spreader, and a tape attached to the mold. A tape attaching device having a mechanism for automatically feeding the tape, wherein the surface is formed of a member having a property that the tape does not stick, and the tape is located at the center on the tape conveying path on the tape entrance side and the exit side of the mold. A predetermined amount of tension is applied to the tape while passing the tape through gaps between upper and lower guides for restricting vertical movement of the tape, each of which is provided so as to extend to a predetermined length. A predetermined amount of tension is applied using the tape clamp mechanisms for clamping the tape, which are provided on the tape transport paths on the tape entrance side and the exit side, respectively. Tape clamping mechanisms on the tape entrance and exit sides of the mold so as to clamp a portion of the tape which is not guided by the upper and lower guides and maintain a predetermined amount of tension applied to the tape. The tape is moved by a predetermined amount while synchronizing the tape along the tape transport direction. Thereafter, the tape clamps by the tape clamp mechanisms on the tape entrance side and the exit side of the mold are released. A method for feeding a tape, wherein a clamp mechanism is returned to an initial position.