JP2000016583A - Semiconductor wafer carrier container installation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent interference of a semiconductor wafer carrier container and an engagement rod of a semiconductor wafer carrier container installation device even in a case where a moving distance of the semiconductor wafer carrier container is long. SOLUTION: An engagement projected part 21 free to be engaged with a projected wall part 14 by projecting backward to an upper end is provided on an engagement rod 17, a first guide part 22 is provided on an intermediate part in its vertical direction, and a second guide part 23 to engage the engagement projected part 21 with the inside of the projected wall part 14 by positioning it in the inside of an opening part 13 by raising the engagement rod 17 by moving the first guide part 22 at the time when a table 16 is moved forward with a semiconductor wafer carrier container 11 on which the table 16 is placed is provided on the table 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer transfer container mounting apparatus for mounting a semiconductor wafer transfer container on a semiconductor manufacturing apparatus main body in a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus, a semiconductor wafer is transferred into a semiconductor wafer transfer container, and the semiconductor wafer transfer container is mounted on a semiconductor manufacturing apparatus body.
A type in which a semiconductor wafer is supplied from a semiconductor wafer transport container to the apparatus main body side is often used.

Conventionally, an apparatus for mounting a semiconductor wafer transfer container of this type on a semiconductor manufacturing apparatus main body is shown in FIG.
-8 are known. In these figures,
Reference numeral 1 denotes a semiconductor manufacturing apparatus main body, and 2 denotes a semiconductor wafer transfer container. A plurality of semiconductor wafers (not shown) are stored in the semiconductor wafer transfer container 2, and the semiconductor wafer transfer container 2 is mounted on the container mounting portion 1 of the semiconductor manufacturing apparatus main body 1.
a. In this case, the semiconductor wafer transfer container 2
Has its front surface in contact with the side where the latch key 3 is provided, and its lower surface side is fixed to the container mounting portion 1a.

[0004] As shown in FIG. 8, the semiconductor wafer transfer container 2 has an opening 4 on the bottom surface, and has a protruding wall 5 at the rear end of the opening 4. An engagement rod 6 is fixed to the upper surface of the container mounting portion 1a. This engagement rod 6
Is a base 6a projecting upward from the upper surface of the container mounting portion 1a.
And an engaging portion 6b projecting rearward from an upper end of the base 6a.
And an engaging end 6c formed at the tip of the engaging portion 6b.

To mount the semiconductor wafer transfer container 2, the container 2 is placed on the container mounting portion 1a. At this time, between the semiconductor wafer transfer container 2 and the semiconductor manufacturing apparatus 1,
There is a gap A as shown in FIG. Next, as shown in FIG. 7, the semiconductor wafer transfer container 2 is moved to the front surface 7 side of the semiconductor manufacturing apparatus 1, the flange 8 of the semiconductor wafer transfer container 2 is brought into close contact with the front surface 7 of the semiconductor manufacturing apparatus 1, and the latch key 3 is moved. To open the semiconductor wafer transfer container 2 and take out the semiconductor wafer inside.

In this case, the engaging rod 6 is positioned in the opening 4 of the semiconductor wafer transport container 2 and the semiconductor wafer transport container 2 is moved forward so that the engaging end 6c of the engaging rod 6 projects. The semiconductor wafer transfer container 2 is fixed to the upper surface of the container mounting portion 1a by engaging with the upper surface of the wall portion 5.

[0007]

By the way, in the above-described apparatus for mounting a semiconductor wafer transport container, the bottom opening 4 is required.
Is the size C of the engaging rod 6 of the semiconductor manufacturing apparatus 1 and the moving stroke A of the semiconductor wafer transfer container 1.
There is no problem if it is larger than the sum of
If the size B of the bottom opening 4 is equal to or smaller than the sum of the size C of the engaging rod 6 of the semiconductor manufacturing apparatus 1 and the moving stroke A of the semiconductor wafer transfer container 2, There is a problem that the semiconductor wafer transport container 2 and the engaging rod 6 interfere with each other, and the semiconductor wafer transport container 2 cannot be placed on the semiconductor manufacturing apparatus 1.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an opening and an engaging projection provided on a lower surface of a semiconductor wafer transport container, and engages an engaging rod provided on a semiconductor manufacturing apparatus main body side. In the semiconductor wafer transfer container mounting device which is configured to be fixed by engaging with the protrusion, even when the movement stroke of the semiconductor wafer transfer container is large, interference between the semiconductor wafer transfer container and the engagement rod of the semiconductor manufacturing device is reduced. It is an object of the present invention to provide a device for mounting a semiconductor wafer transport container that can prevent the problem.

[0009]

In order to solve the above-mentioned problems, the following means are adopted in the apparatus for mounting a semiconductor wafer transport container of the present invention. That is, according to the semiconductor wafer transfer container mounting device according to claim 1, a semiconductor wafer transfer container mounting device for mounting a semiconductor wafer transfer container in which a semiconductor wafer is stored in a semiconductor manufacturing apparatus main body,
The semiconductor wafer transfer container has an opening at the bottom surface and a protruding wall portion protruding forward at the rear end of the opening, and the semiconductor manufacturing apparatus main body has an upper surface formed of the semiconductor wafer transfer container. It has a table which is a mounting portion and is supported movably in the front-rear direction, and an engaging rod supported movably in the vertical direction in the vicinity of the table. An engaging portion that engages with the semiconductor wafer transport container mounted on the mounting portion when the semiconductor wafer transport container is mounted on the mounting portion and moves the semiconductor wafer transport container in the same direction is provided. An engaging projection is provided at the upper end so as to be able to engage with the projecting wall by projecting rearward.
The guide portion is provided, and the table, when the table is moved forward together with the semiconductor wafer transfer container placed above, the first guide portion is moved to move the engaging rod. And raising the engagement projection into the opening and engaging the projection with the projection wall.
Is provided.

In this semiconductor wafer transfer container mounting device, when the table on which the semiconductor wafer transfer container is mounted is at the rear, the engaging rod of the semiconductor wafer transfer container mounting device is lowered. As a result, when the semiconductor wafer transport container is placed on the table, no interference occurs between the engaging rod of the semiconductor wafer transport container mounting device and the semiconductor wafer transport container. Further, when the table on which the semiconductor wafer transport container is placed moves forward in the horizontal direction, the first guide portion is moved by the second guide portion, and the engaging rod of the semiconductor wafer transport container mounting device rises, The semiconductor wafer transfer container is fixed by positioning the engagement projection in the opening and introducing the engagement projection into the projection wall so as to be engaged with the projection wall.

According to the apparatus for mounting a semiconductor wafer transport container described in claim 2, in the apparatus for mounting a semiconductor wafer transport container described in claim 1, either one of the first and second guide portions moves the table. A roller rotatably supported about a horizontal axis perpendicular to the direction, the other of which comprises a member provided with a guide surface for rolling the roller, A biasing member for biasing the downward direction is provided.

In this semiconductor wafer transfer container mounting device, when the table on which the semiconductor wafer transfer container is mounted is at the rear, the engaging rod of the semiconductor wafer transfer container mounting device is lowered. As a result, when the semiconductor wafer transport container is placed on the table, no interference occurs between the engaging rod of the semiconductor wafer transport container mounting device and the semiconductor wafer transport container. When the table on which the semiconductor wafer transfer container is placed moves horizontally in the forward direction, the rollers roll on the guide surface to raise the engagement rod. Then, the engaging projection is positioned in the opening, and is introduced above the projecting wall so as to engage with the projecting wall, and the semiconductor wafer transport container is fixed. At that time, the urging member below the engaging rod of the semiconductor wafer transport container mounting device exerts a downward urging force on the protruding wall portion, so that the engaging projections are firmly engaged, and the semiconductor wafer transport container is engaged. Is fixed.

According to a third aspect of the present invention, there is provided the apparatus for mounting a semiconductor wafer transport container according to the first or second aspect, further comprising a drive source for moving the table in the front-rear direction. And

In the apparatus for mounting a semiconductor wafer transport container, since the drive source for moving the table forward is provided, the mounting of the semiconductor wafer transport container is automatically performed.

According to a fourth aspect of the present invention, there is provided a semiconductor wafer transfer container mounting apparatus for mounting a semiconductor wafer transfer container in which a semiconductor wafer is stored in a semiconductor manufacturing apparatus main body. The semiconductor manufacturing apparatus body has an opening on the bottom surface and a protruding wall protruding forward at the rear end of the opening, and the upper surface of the main body of the semiconductor manufacturing apparatus has a mounting portion for the semiconductor wafer transfer container. A table supported movably in the front-rear direction and an engaging rod supported movably in the vertical direction in the vicinity of the table, wherein the table has a front end when the table moves forward. An engaging portion is provided for engaging the semiconductor wafer transport container mounted on the mounting portion and moving the semiconductor wafer transport container in the same direction. An engaging projection is provided which is adapted to be engaged with the projecting wall by projecting rearward, and a rear end portion is rotatable toward the table between the table and the engaging rod. The table is connected so that the front end thereof is rotatably connected to the engaging rod, and is disposed so as to extend obliquely upward from the rear end toward the front end. A link is provided which, when moved together with the placed semiconductor wafer transport container, raises the engaging rod, positions the engaging projection in the opening, and engages the projection with the projection wall. It is characterized by being.

In this apparatus for mounting a semiconductor wafer transport container, when the table on which the semiconductor wafer transport container is mounted moves forward in the horizontal direction, the engaging rod of the semiconductor wafer transport container mounting device rises via the link, The semiconductor wafer transfer container is fixed by the engagement projection engaging the projection wall.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 3 show a first embodiment of the present invention. In these figures, reference numeral 10 denotes a semiconductor manufacturing apparatus main body, and reference numeral 11 denotes a semiconductor wafer transport container.

A plurality of semiconductor wafers are stored in a semiconductor wafer transfer container 11 and the semiconductor manufacturing apparatus main body 10
Is mounted on the container mounting portion 10a. In this case, the front surface of the semiconductor wafer transfer container 11 is brought into close contact with the latch key 3 side, and the lower surface side is mounted on the container mounting portion 10a, as in the case shown in FIGS. The semiconductor wafer transfer container 11 has an opening 13 on the bottom surface 12 thereof and a projecting wall 14 projecting forward at the rear end of the opening 13.

The main body 10 of the semiconductor manufacturing apparatus has a table 16 whose upper surface is a mounting portion 15 of the semiconductor wafer transfer container 11 and is supported so as to be movable in the front-rear direction. Supported engaging rod 1
7 are provided. That is, the semiconductor manufacturing apparatus main body 10
The table 16 is arranged above the upper plate body 18 of the above. A support cylinder 19 is fixed to the upper plate body 18, and the engaging rod 17 is supported in the support cylinder 19 so as to be vertically movable. Have been.

The table 16 is provided with an engaging portion 20 which engages with the semiconductor wafer transport container 11 placed on the mounting portion 15 to move the semiconductor wafer transport container 11 forward.

The engaging rod 17 is provided with an engaging projection 21 projecting rearward from an upper end thereof so as to be freely engageable with the projecting wall 14, and a first guide at an intermediate portion in the vertical direction. A part 22 is provided. The engaging projection 21 is provided at its tip with a roller 2 rotatable about a horizontal axis.
1a. The first guide portion 22 is a roller rotatably supported by the engagement rod 17 with a horizontal axis.

When the table 16 is moved forward together with the semiconductor wafer transfer container 11 placed above, the first guide portion 22 is moved to raise the engaging rod 17, and A second guide portion 23 is provided for positioning the collision portion 21 in the opening portion 13 and engaging it with the upper side of the projection wall portion 14. Second guide part 23
Is a member provided on the lower surface of the table 16, and has a guide surface 23a at its tip.

The lower end of the engaging rod 17 is provided with a coil spring 24 (biasing member) in a state where it is prevented from falling down.
The coil spring 24 urges the engaging rod 17 downward when the engaging projection 21 engages with the projection wall 14.

An actuator 25 is provided on the upper surface of the upper plate 18, and the actuator 2
6 is connected to an operation plate 27 fixed to the lower surface of the table 16. With this configuration, the table 16 is moved in the front-rear direction by the actuator 25.

Next, the operation of the semiconductor manufacturing apparatus having the above-described configuration when the semiconductor wafer transfer container 11 is mounted on the semiconductor manufacturing apparatus 10 will be described. FIG.
FIG. 4 is a view showing a state in which the table 16 is located rearward and before the semiconductor wafer transfer container 11 is mounted. In this state, the engagement rod 17 is in a lowered state. First, the semiconductor wafer transfer container 11 is placed on the table 1
6 is placed on the placement section 15. In this case, the semiconductor wafer transfer container 11 is engaged with the engaging portion 20 so that the semiconductor wafer transfer container 11 can move integrally with the table 16 in the front-rear direction.

Next, the apparatus is started and the actuator 25
As a result, the table 16 can be
To move forward. By this movement, the guide surface 23a of the second guide portion 23 comes into contact with the first guide portion 22,
The first guide portion 22 rises while being guided by the guide surface 23a, and the entire engaging rod 17 rises, and the engaging protrusion 21 is moved to the opening 1.
Enter into 3. Further, as the table 16 moves forward, as shown in FIG.
Roller 21a is engaged with the upper surface side of the protruding wall portion 14. In this case, when the coil spring 24 abuts on the lower surface of the upper plate body 18 and is compressed, the entire engaging rod 17 is urged downward, and the roller 21 a firmly holds the protruding wall portion 14. Thus, the semiconductor wafer transfer container 11 is mounted on the container mounting portion 10a. In this state, the front surface of the semiconductor wafer transfer container 11 is in close contact with the front surface of the semiconductor manufacturing apparatus main body 10, and the semiconductor wafer stored in the semiconductor wafer transfer container 11 is delivered and processed. Will be

According to the semiconductor wafer transfer container mounting apparatus, the semiconductor wafer transfer container 11 is connected to the container mounting section 10a.
The table 16 is positioned rearward when it is mounted on the
7 is in a lowered state. Therefore, the semiconductor wafer transfer container 11 does not interfere with the table 16 when the semiconductor wafer transfer container 11 is mounted, and the semiconductor wafer transfer container 11 can be smoothly mounted even when the semiconductor wafer transfer container 11 has a long moving stroke in the front-rear direction. Can be done.

Further, a roller 21a is provided on the engaging projection 21, so that the roller 21a is engaged with the projecting wall 14, and the first guide 22 is moved along the guide surface 23a. Therefore, the mounting of the semiconductor wafer transfer container 11 can be performed smoothly. Further, since the table 16 is moved by the actuator 25, the mounting of the semiconductor wafer transfer container 11 can be performed automatically.

Next, another embodiment of the present invention will be described with reference to FIGS. 4 and 5 show only parts different from the above-described embodiment.

In the second embodiment shown in FIG. 4, the engagement rod 17 in the first embodiment has a configuration having an inclined portion 51 (first guide portion) having a guide surface 50, A guide member 54 (second guide portion) having a roller 53 at the tip is provided on the lower surface of the table 16.

In this configuration, when the table 16 moves forward, the roller 53 comes into contact with the guide surface 50, and the roller 53 guides the guide surface 50, whereby the engaging rod 17 is raised. Therefore, in this embodiment, the same operation and effect as those of the above embodiment can be obtained.

The third embodiment shown in FIG. 5 is different from the first embodiment in that the engagement rod 17 has a groove 5 opening downward.
5 while the support member 56 is provided on the lower surface of the table 16.
And a link 57 is provided between the tip of the support member 56 and the groove 55. In this case, link 5
7 has a rear end portion rotatably connected to the support member 56 about a horizontal axis, and a shaft 58 provided at the front end portion thereof is disposed in the groove 55 so that the front end portion is formed. It is rotatably connected to the engaging rod 17. In this case, the link 57 is disposed so as to extend obliquely upward from the rear end toward the front end.

Also in this embodiment, when the table 16 is advanced, the engaging rod 17 can be raised via the link 57, and the same operation and effect as in the above embodiment can be obtained.

[0034]

According to the present invention, the following effects can be obtained. That is, according to the semiconductor wafer transfer container mounting device according to claims 1 and 4, when the semiconductor wafer transfer container is mounted on the semiconductor manufacturing apparatus main body, the engaging rod for initially fixing the container is lowered, After that, the engaging rod is inserted into the container or the opening on the lower surface and mounted, so that the container and the engaging rod do not interfere with each other and can be smoothly mounted even when the stroke of the container in the front-rear direction is large. Can be done. According to the apparatus for mounting a semiconductor wafer transport container according to the second aspect, the first and second guide portions are constituted by the rollers and the guide surfaces, so that the container can be mounted more smoothly. According to the apparatus for mounting a semiconductor wafer transfer container according to the third aspect, since the drive source for moving the table is provided, the mounting of the container can be performed automatically.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention,
It is a side view showing the state where the semiconductor wafer transfer container mounting device of the present invention is not fixed.

FIG. 2 is a side view showing a fixed state of the semiconductor wafer transfer container mounting device in the embodiment.

FIG. 3 is a front view of the semiconductor wafer transfer container mounting apparatus of the present invention as viewed from the direction of arrow D in FIG. 2;

FIG. 4 is a view showing a second embodiment of the present invention;
It is a side view which shows a semiconductor wafer conveyance container mounting apparatus.

FIG. 5 is a diagram showing a third embodiment of the present invention;
It is a side view which shows a semiconductor wafer conveyance container mounting apparatus.

FIG. 6 is a side view before a conventional semiconductor wafer transfer container mounting device and a semiconductor wafer transfer container are fixed.

FIG. 7 is a side view showing a state in which a conventional semiconductor wafer transfer container mounting device and a semiconductor wafer transfer container are fixed.

FIG. 8 is a side view showing a clamp portion of a conventional semiconductor wafer transfer container mounting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor manufacturing apparatus main body 11 Semiconductor wafer transfer container 12 Bottom surface 13 Opening 14 Projection wall part 15 Placement part 16 Table 17 Engagement rod 20 Engagement part 21 Engagement protrusion 22 First guide part 23 Second guide part 24 Coil spring 25 Actuator

Claims (4)

[Claims] 1. A semiconductor wafer transfer container mounting apparatus for mounting a semiconductor wafer transfer container in which a semiconductor wafer is stored in a semiconductor manufacturing apparatus main body, wherein the semiconductor wafer transfer container has an opening at a bottom surface thereof and the opening. The semiconductor manufacturing apparatus main body has a table whose upper surface is a mounting portion of the semiconductor wafer transport container and is supported so as to be movable in the front-rear direction. An engagement rod supported in the vicinity of the table so as to be vertically movable; and the semiconductor wafer mounted on the mounting portion when the table moves forward. An engaging portion that engages with the transfer container and moves the semiconductor wafer transfer container in the same direction is provided. In addition to the engaging projections that are freely adjustable, a first guide portion is provided at an intermediate portion in the vertical direction, and the table is provided with the semiconductor wafer transfer container on which the table is placed. When moving forward, the first guide portion is moved to raise the engaging rod, the engaging protrusion is positioned in the opening, and the second is engaged with the projecting wall. A semiconductor wafer transfer container mounting device, wherein the guide portion is provided. 2. The semiconductor wafer transfer container mounting device according to claim 1, wherein one of the first and second guide portions rotates about a horizontal axis perpendicular to a moving direction of the table. The other end is formed of a member having a guide surface for rolling the roller, and the engaging rod is provided with an urging member for urging the engaging rod downward. An apparatus for mounting a semiconductor wafer transport container, comprising: 3. The apparatus for mounting a semiconductor wafer transport container according to claim 1, further comprising a drive source for moving the table in the front-rear direction. 4. A semiconductor wafer transfer container mounting apparatus for mounting a semiconductor wafer transfer container in which a semiconductor wafer is stored in a semiconductor manufacturing apparatus main body, wherein the semiconductor wafer transfer container has an opening on a bottom surface thereof and the opening. The semiconductor manufacturing apparatus main body has a table whose upper surface is a mounting portion of the semiconductor wafer transport container and is supported so as to be movable in the front-rear direction. An engagement rod supported in the vicinity of the table so as to be vertically movable; and the semiconductor wafer mounted on the mounting portion when the table moves forward. An engaging portion that engages with the transfer container and moves the semiconductor wafer transfer container in the same direction is provided. A mating engagement projection is provided, and a rear end portion is rotatably connected to the table side between the table and the engagement rod, and a front end portion thereof is engaged with the table. When the table is moved together with the semiconductor wafer transfer container placed above, the table is rotatably connected to the bar, and is disposed so as to extend obliquely upward from the rear end toward the front end. And a link for raising the engaging rod, positioning the engaging protrusion in the opening, and engaging the engaging protrusion with the protruding wall. .