JP2000014026A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JP2000014026A JP2000014026A JP10180328A JP18032898A JP2000014026A JP 2000014026 A JP2000014026 A JP 2000014026A JP 10180328 A JP10180328 A JP 10180328A JP 18032898 A JP18032898 A JP 18032898A JP 2000014026 A JP2000014026 A JP 2000014026A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- secondary battery
- package
- semiconductor chip
- thermoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Secondary Cells (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子装置に関し、
特に、パソコン、携帯電子機器などの冷却で得られたエ
ネルギーを電源として再利用する電子装置に関する。TECHNICAL FIELD The present invention relates to an electronic device,
In particular, the present invention relates to an electronic device that reuses energy obtained by cooling a personal computer, a portable electronic device, or the like as a power supply.
【０００２】[0002]
【従来の技術】最近の電子装置は、ノートパソコン、携
帯電話などの例に見られるように高性能化かつ小型化
（携帯性）の、相反する２つの性能が要求されることが
多い。高性能化に関しては、半導体ＬＳＩの高集積化、
高周波数化によりＬＳＩの発熱密度が高くなり、結果と
してＬＳＩの温度が高くなり動作が不安定になるという
問題が生じる。また、小型化に関しては、携帯型電子装
置においてバッテリ（二次電池）性能の長寿命化という
要求が高まっている。しかし、現状ではノートパソコ
ン、ビデオカメラ等のバッテリ稼働時間はその利用用途
に対して十分でないということが問題となっている。2. Description of the Related Art Recent electronic devices often require two contradictory performances such as high performance and miniaturization (portability), as seen in examples of notebook personal computers and mobile phones. Regarding higher performance, higher integration of semiconductor LSI,
As the frequency increases, the heat generation density of the LSI increases, and as a result, the temperature of the LSI increases and the operation becomes unstable. As for miniaturization, there is an increasing demand for longer life of battery (secondary battery) performance in portable electronic devices. However, at present, there is a problem that the battery operating time of a notebook computer, a video camera, and the like is not sufficient for the intended use.
【０００３】これらの問題を解決する目的のために、Ｌ
ＳＩの温度上昇に関しては、放熱フィン、ヒートパイプ
などを用いた冷却構造、あるいは小型ファンを用いた強
制空冷によりＬＳＩの温度上昇を抑えていた。また、バ
ッテリ（二次電池）の寿命の問題に関しては、セカンド
バッテリを搭載して、寿命を長くするなどの方法が採ら
れている。For the purpose of solving these problems, L
Regarding the temperature rise of the SI, the temperature rise of the LSI has been suppressed by a cooling structure using a radiation fin, a heat pipe or the like, or a forced air cooling using a small fan. Regarding the problem of the life of a battery (secondary battery), a method of mounting a second battery to extend the life has been adopted.
【０００４】しかしながら、これらの手法では、例え
ば、放熱フィン、ヒートパイプの採用は、全体的な電子
装置の重量を増加させることになり、また、セカンドバ
ッテリの装着についても同様に総重量を増加させるとい
う、本来の携帯型電子装置という目的に反する結果にな
っていた。また、小型ファンを搭載してＬＳＩを冷却す
ることは、ファンの駆動電力の消費により、二次電池の
寿命を短くするという結果になり、小型化、軽量化とい
う面に於いて十分とは言えなかった。However, in these methods, for example, the adoption of the radiating fins and the heat pipe increases the weight of the entire electronic device, and also increases the total weight of the mounting of the second battery. This is contrary to the purpose of the original portable electronic device. Cooling an LSI by mounting a small fan results in shortening the life of the secondary battery due to the consumption of the driving power of the fan, which can be said to be sufficient in terms of miniaturization and weight reduction. Did not.
【０００５】そこで、例えば、特開平９−９２７６１号
公報には、半導体チップで発生した熱エネルギーを熱電
変換装置により電気エネルギーに変換し、これにより小
型ファンを駆動し、半導体パッケージを冷却する方法が
開示されている。図３に、従来技術である電子装置の断
面図を示す。図面を参照すると、１は半導体パッケー
ジ、７は熱電変換装置、１６は小型ファンを示してい
る。この従来技術は、半導体チップの発熱により発生す
る熱エネルギーを変換して、小型ファンの電力を供給し
ているため、この技術を二次電池搭載電子装置に応用す
ると、ファンを駆動しても二次電池が消耗しないため、
寿命を延ばすという点では一応の効果を奏している。Therefore, for example, Japanese Patent Application Laid-Open No. 9-92761 discloses a method of converting heat energy generated in a semiconductor chip into electric energy by a thermoelectric converter, thereby driving a small fan and cooling a semiconductor package. It has been disclosed. FIG. 3 shows a cross-sectional view of a conventional electronic device. Referring to the drawings, reference numeral 1 denotes a semiconductor package, 7 denotes a thermoelectric converter, and 16 denotes a small fan. This conventional technology converts the thermal energy generated by the heat generated by a semiconductor chip to supply power to a small fan. Therefore, if this technology is applied to an electronic device equipped with a secondary battery, it will not be possible to drive the fan even if the fan is driven. Because the next battery does not run out,
In terms of prolonging the life, there is a certain effect.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、小型フ
ァンを搭載して冷却するという方法は、通常、効率をあ
げるために放熱フィンも有しているため、放熱フィン、
小型ファンの体積の分だけ、電子装置全体の体積、重量
が大きくなるという問題が生じる。この点に於いて、ノ
ートパソコン、携帯電話、ビデオカメラ等への適応を考
えてみると、装置が大型化するために、これらの製品の
最も重要な特徴の一つである、小型、軽量が損なわれて
しまうという問題が発生する。However, the method of cooling by mounting a small fan usually has radiating fins for improving efficiency.
There is a problem that the volume and weight of the entire electronic device increase by the volume of the small fan. In this regard, considering the application to notebook PCs, mobile phones, video cameras, etc., one of the most important features of these products, small and lightweight, is because the size of the device is large. A problem of being damaged occurs.
【０００７】本発明の目的は、電子装置内の半導体パッ
ケージを効率よく冷却すると共に、二次電池の寿命も長
くすることができる、小型・軽量の電子装置を提供する
ことにある。An object of the present invention is to provide a small and lightweight electronic device capable of efficiently cooling a semiconductor package in the electronic device and extending the life of a secondary battery.
【０００８】[0008]
【課題を解決するための手段】本発明に係る電子装置
は、電源と、該電源により駆動する電子部品と、該電子
部品を搭載する基板と、該電源と該基板とを支持する筐
体と、を少なくとも含む電子装置であって、前記電子部
品と前記基板との間に、互いに熱的に接触するように配
設された、前記電子部品で発生する熱エネルギーを電気
エネルギーに変換する手段を備えたものであり、前記手
段は、複数のＰ型半導体とＮ型半導体とを、交互に直列
接続してなる熱電変換素子であり、前記手段により変換
された電気エネルギーを、前記電源に充電することが好
ましい。An electronic device according to the present invention comprises a power supply, an electronic component driven by the power supply, a board on which the electronic component is mounted, a housing for supporting the power supply and the board. An electronic device comprising at least: a unit disposed between the electronic component and the substrate so as to be in thermal contact with each other, and configured to convert thermal energy generated in the electronic component into electric energy. Wherein the means is a thermoelectric conversion element in which a plurality of P-type semiconductors and N-type semiconductors are alternately connected in series, and charges the electric energy converted by the means to the power supply. Is preferred.
【０００９】また、本発明に係る電子装置は、筐体と、
１または複数の二次電池と、該二次電池により駆動する
半導体チップと、該半導体チップを搭載するパッケージ
と、該パッケージを支持するプリント基板と、を少なく
とも含む電子装置であって、前記パッケージと前記プリ
ント基板との間に、互いに熱的に接触するように配設さ
れた熱電変換素子を備え、該熱電変換素子により前記半
導体チップで発生する熱エネルギーを電気エネルギーに
変換する構成としてもよく、前記熱電変換素子により変
換された電気エネルギーは、前記二次電池に充電され、
前記充電する二次電池は、前記半導体チップの駆動に用
いられていない二次電池であることが好ましい。Further, an electronic device according to the present invention includes a housing,
An electronic device including at least one or a plurality of secondary batteries, a semiconductor chip driven by the secondary battery, a package mounting the semiconductor chip, and a printed circuit board supporting the package, wherein the package includes: The printed circuit board may include a thermoelectric conversion element disposed so as to be in thermal contact with each other, and may be configured to convert heat energy generated in the semiconductor chip into electric energy by the thermoelectric conversion element, The electric energy converted by the thermoelectric conversion element is charged in the secondary battery,
It is preferable that the secondary battery to be charged is a secondary battery not used for driving the semiconductor chip.
【００１０】更に、本発明においては、前記電子装置
を、ノート型パソコンまたは携帯電話またはビデオカメ
ラに適用することができる。Further, in the present invention, the electronic device can be applied to a notebook computer, a mobile phone, or a video camera.
【００１１】[0011]
【発明の実施の形態】本発明に係る電子装置は、その好
ましい一実施の形態において、筐体（図１の１）の内部
に、１または複数の二次電池（図１の３）と、二次電池
により駆動する半導体チップ（図１の４）と、半導体チ
ップを搭載するパッケージ（図１の２）と、パッケージ
を搭載するプリント基板（図１の８）と、パッケージと
プリント基板の間に、半導体チップによって発生する熱
エネルギーを電気エネルギーに変換する熱電変換装置
（図１の７）と、を備えたものであり、熱電変換装置に
より変換された電気エネルギーを二次電池に充電するも
のである。BEST MODE FOR CARRYING OUT THE INVENTION In a preferred embodiment of the electronic device according to the present invention, one or a plurality of secondary batteries (3 in FIG. 1) are provided inside a housing (1 in FIG. 1). A semiconductor chip (4 in FIG. 1) driven by a secondary battery, a package (2 in FIG. 1) on which the semiconductor chip is mounted, a printed circuit board (8 in FIG. 1) on which the package is mounted, and between the package and the printed circuit board And a thermoelectric converter (7 in FIG. 1) for converting heat energy generated by the semiconductor chip into electric energy, and charging the secondary battery with the electric energy converted by the thermoelectric converter. It is.
【００１２】本発明に係る電子装置の一実施の形態を、
図面を参照して以下に詳述する。図１及び図２は、本発
明の一実施の形態に係る電子装置を説明するための断面
図であり、図２は、図１の熱電変換装置を内蔵した半導
体パッケージの詳細断面図である。One embodiment of an electronic device according to the present invention is:
The details will be described below with reference to the drawings. 1 and 2 are cross-sectional views illustrating an electronic device according to an embodiment of the present invention, and FIG. 2 is a detailed cross-sectional view of a semiconductor package incorporating the thermoelectric conversion device of FIG.
【００１３】図１を参照すると、１は電子装置の筐体、
２は半導体パッケージ、３は二次電池を示している。ま
た、半導体パッケージ２は、半導体チップ４とリード６
が電気的に接続された構造をしており、プリント基板８
上に半田等により接続されている。７は熱電変換装置で
あり、半導体パッケージ２に内蔵されている。二次電池
３とプリント基板８は、配線ケーブル５により電気的に
接続されている。このような構成により、熱電変換装置
７で発生する起電力を、二次電池３に蓄積することがで
きる。Referring to FIG. 1, reference numeral 1 denotes a housing of an electronic device;
Reference numeral 2 denotes a semiconductor package, and reference numeral 3 denotes a secondary battery. The semiconductor package 2 includes a semiconductor chip 4 and leads 6.
Are electrically connected to each other.
It is connected by solder or the like. Reference numeral 7 denotes a thermoelectric converter, which is built in the semiconductor package 2. The secondary battery 3 and the printed circuit board 8 are electrically connected by a wiring cable 5. With such a configuration, the electromotive force generated in the thermoelectric converter 7 can be stored in the secondary battery 3.
【００１４】また、図２を参照すると、４は半導体チッ
プ、６はリード、７は熱電変換装置、８はプリント基
板、９はワイヤーを示している。ここで、熱電変換装置
７は、例えば、Ｐ型半導体１３とＮ型半導体１４の２種
類の半導体を、正負極を交互に複数個接続したものであ
り、両側の素子プレート１２によって各半導体は支持さ
れている。Ｐ型半導体１３とＮ型半導体１４の材料とし
ては、例えば、ビスマステルルなどの金属合金が用いら
れる。Referring to FIG. 2, reference numeral 4 denotes a semiconductor chip, 6 denotes a lead, 7 denotes a thermoelectric converter, 8 denotes a printed board, and 9 denotes a wire. Here, the thermoelectric conversion device 7 is, for example, a device in which two types of semiconductors of a P-type semiconductor 13 and an N-type semiconductor 14 are alternately connected to a plurality of positive and negative electrodes, and each semiconductor is supported by the element plates 12 on both sides. Have been. As a material of the P-type semiconductor 13 and the N-type semiconductor 14, for example, a metal alloy such as bismuth tellurium is used.
【００１５】熱電変換装置７の上面は、半導体チップ５
を搭載しているプレート１０の下面に金属あるいは樹脂
の接着剤により接合されており、熱電変換装置７の下面
は、プリント基板８の上面に同じく接着剤により接合さ
れている。熱電変換装置７の電極は、素子用ワイヤー１
５によってリード６に接続されており、熱電変換装置７
の電極は、プリント基板８に至っている。半導体パッケ
ージは、最終的にはこれらの半導体チップ４、熱電変換
装置７等を含めてモールド樹脂１１により封止される。The upper surface of the thermoelectric conversion device 7 is
The lower surface of the thermoelectric conversion device 7 is also bonded to the upper surface of the printed circuit board 8 by an adhesive. The electrode of the thermoelectric converter 7 is the element wire 1
5 is connected to the lead 6 by the thermoelectric conversion device 7
These electrodes reach the printed circuit board 8. The semiconductor package, including the semiconductor chip 4, the thermoelectric converter 7, and the like, is finally sealed with the mold resin 11.
【００１６】ここで、熱電変換装置７は、ゼーベック効
果によりＰ型あるいはＮ型の半導体素子の両極の温度差
により起電力を生じる。従って、両極を二次電池に接続
することにより充電を行うことができる。また、図２の
半導体パッケージ構造では、チップとプリント基板の間
という比較的温度差の大きな位置に対して、熱電変換装
置の両極を設置しているため、従来よりも発電効率が高
くなり、且つ半導体パッケージの冷却の面においても従
来よりも効率が高いという特徴を有している。The thermoelectric converter 7 generates an electromotive force due to the temperature difference between the two electrodes of the P-type or N-type semiconductor element due to the Seebeck effect. Therefore, charging can be performed by connecting both electrodes to the secondary battery. Further, in the semiconductor package structure of FIG. 2, since the two poles of the thermoelectric conversion device are installed at a relatively large temperature difference between the chip and the printed circuit board, the power generation efficiency is higher than before, and It also has the feature that the efficiency of cooling the semiconductor package is higher than before.
【００１７】二次電池への充電については、本実施の形
態では、二次電池が一つの場合について説明したが、電
子装置内に二次電池が２個以上搭載されていることが望
ましく、一つの二次電池が電子装置使用中に放電してい
る最中に、別の二次電池に熱電変換装置で充電すること
が望ましい。この構成により、電子装置の使用を中断せ
ずに充電された電力を連続して使用することができる。In the present embodiment, charging of the secondary battery has been described with reference to one secondary battery. However, it is desirable that two or more secondary batteries are mounted in the electronic device. It is desirable to charge another secondary battery with a thermoelectric converter while one secondary battery is discharging during use of the electronic device. With this configuration, the charged power can be continuously used without interrupting the use of the electronic device.
【００１８】また、半導体パッケージの種類として、本
実施の形態では、ＱＦＰ（クワッドフラットパッケー
ジ）の構造を用いて説明したが、それ以外の構造でもよ
く、例えば、ＰＧＡ（ピングリッドアレイ）、ＢＧＡ
（ボールグリッドアレイ）などの任意の構造の半導体パ
ッケージについても、同様の効果が得られることは明白
である。In the present embodiment, the type of semiconductor package has been described using the structure of a QFP (quad flat package). However, other types of semiconductor packages may be used, for example, PGA (pin grid array), BGA
It is apparent that a similar effect can be obtained for a semiconductor package having an arbitrary structure such as a (ball grid array).
【００１９】[0019]
【発明の効果】以上説明したように、本発明によれば、
電子装置の小型、軽量化を図ると同時に、搭載する部品
を効率よく冷却することができるという効果を奏する。As described above, according to the present invention,
This has the effect of reducing the size and weight of the electronic device and efficiently cooling the mounted components.
【００２０】その理由は、半導体パッケージ内の熱電変
換装置で得られる起電力を利用して、二次電池に充電を
行っているため、従来よりも二次電池を用いて電子装置
を動作させるときの使用時間を長くすることができ、ま
た、熱電変換装置により熱エネルギーを電気エネルギー
に変換しているため、半導体パッケージの冷却にも寄与
しており、従来のように放熱フィン、小型ファンなどを
必要とせずに、電子装置の小型、軽量化が図られ、エネ
ルギーの有効利用ができるからである。The reason is that the secondary battery is charged by using the electromotive force obtained by the thermoelectric conversion device in the semiconductor package. The use time can be extended, and thermal energy is converted to electrical energy by a thermoelectric converter, which contributes to cooling of the semiconductor package. This is because the electronic device can be reduced in size and weight without using it, and energy can be effectively used.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の一実施形態を模式的に説明するための
電子装置の断面図を示す。FIG. 1 is a cross-sectional view of an electronic device for schematically explaining one embodiment of the present invention.
【図２】本発明の一実施形態を模式的に説明するための
電子装置の内部の半導体パッケージの詳細断面図であ
る。FIG. 2 is a detailed cross-sectional view of a semiconductor package inside the electronic device, schematically illustrating one embodiment of the present invention.
【図３】従来の電子装置の断面図である。FIG. 3 is a cross-sectional view of a conventional electronic device.
１ 筐体 ２ 半導体パッケージ ３ 二次電池 ４ 半導体チップ ５ 配線ケーブル ６ リード ７ 熱電変換装置 ８ プリント基板 ９ ワイヤー １０ プレート １１ モールド樹脂 １２ 素子プレート １３ Ｐ型半導体 １４ Ｎ型半導体 １５ 素子用ワイヤー １６ 小型ファン DESCRIPTION OF SYMBOLS 1 Housing 2 Semiconductor package 3 Secondary battery 4 Semiconductor chip 5 Wiring cable 6 Lead 7 Thermoelectric conversion device 8 Printed circuit board 9 Wire 10 Plate 11 Mold resin 12 Element plate 13 P-type semiconductor 14 N-type semiconductor 15 Element wire 16 Small fan
Claims (7)
と、該電子部品を搭載する基板と、該電源と該基板とを
支持する筐体と、を少なくとも含む電子装置であって、 前記電子部品と前記基板との間に、互いに熱的に接触す
るように配設された、前記電子部品で発生する熱エネル
ギーを電気エネルギーに変換する手段を備えたことを特
徴とする電子装置。An electronic device comprising at least a power supply, an electronic component driven by the power supply, a substrate on which the electronic component is mounted, and a housing supporting the power supply and the substrate. An electronic device, comprising: means for converting thermal energy generated by the electronic component into electric energy, which is disposed between the component and the substrate so as to be in thermal contact with each other.
体とを、交互に直列接続してなる熱電変換素子であるこ
とを特徴とする請求項１記載の電子装置。2. The electronic device according to claim 1, wherein said means is a thermoelectric conversion element in which a plurality of P-type semiconductors and N-type semiconductors are alternately connected in series.
を、前記電源に充電することを特徴とする請求項１また
は２に記載の電子装置。3. The electronic device according to claim 1, wherein the electric energy converted by the means is charged in the power supply.
次電池により駆動する半導体チップと、該半導体チップ
を搭載するパッケージと、該パッケージを支持するプリ
ント基板と、を少なくとも含む電子装置であって、 前記パッケージと前記プリント基板との間に、互いに熱
的に接触するように配設された熱電変換素子を備え、該
熱電変換素子により前記半導体チップで発生する熱エネ
ルギーを電気エネルギーに変換することを特徴とする電
子装置。4. A semiconductor device including at least a housing, one or more secondary batteries, a semiconductor chip driven by the secondary battery, a package on which the semiconductor chip is mounted, and a printed circuit board supporting the package. An electronic device, comprising: a thermoelectric conversion element disposed so as to be in thermal contact with each other between the package and the printed circuit board; and the thermoelectric conversion element transfers heat energy generated in the semiconductor chip. An electronic device characterized by converting the energy into energy.
ネルギーを、前記二次電池に充電することを特徴とする
請求項４記載の電子装置。5. The electronic device according to claim 4, wherein the secondary battery is charged with the electric energy converted by the thermoelectric conversion element.
プの駆動に用いられていない二次電池であることを特徴
とする請求項５記載の電子装置。6. The electronic device according to claim 5, wherein the secondary battery to be charged is a secondary battery not used for driving the semiconductor chip.
携帯電話またはビデオカメラである、請求項１乃至６の
いずれか一に記載の電子装置。7. The electronic device according to claim 1, wherein the electronic device is a notebook computer, a mobile phone, or a video camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18032898A JP3219055B2 (en) | 1998-06-26 | 1998-06-26 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18032898A JP3219055B2 (en) | 1998-06-26 | 1998-06-26 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000014026A true JP2000014026A (en) | 2000-01-14 |
| JP3219055B2 JP3219055B2 (en) | 2001-10-15 |
Family
ID=16081301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18032898A Expired - Fee Related JP3219055B2 (en) | 1998-06-26 | 1998-06-26 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3219055B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308571A (en) * | 2000-04-18 | 2001-11-02 | Orion Mach Co Ltd | Cooling system for electronic component and the like |
| JP2008192968A (en) * | 2007-02-07 | 2008-08-21 | Nec Corp | Heat radiator, communications equipment and heat radiating method of equipment |
| EP2688193A1 (en) * | 2011-03-17 | 2014-01-22 | FUJIFILM Corporation | Thermoelectric generator device and portable electronic apparatus |
| EP2887533A4 (en) * | 2012-08-16 | 2016-03-23 | Zte Corp | Energy-saving environmental protection apparatus for communication system device |
| CN106169451A (en) * | 2015-05-20 | 2016-11-30 | 联发科技股份有限公司 | Portable electronic piece system, semiconductor subassembly and the method converting heat into electric energy |
| CN109672250A (en) * | 2019-01-27 | 2019-04-23 | 深圳市蓝禾技术有限公司 | The charging method of portable charged fan and portable charged fan |
| JP2020095052A (en) * | 2020-03-11 | 2020-06-18 | 株式会社小松製作所 | Thermoelectric power generation device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602484B (en) * | 2013-10-31 | 2017-04-26 | 展讯通信（上海）有限公司 | Portable apparatus and cooling device thereof |
-
1998
- 1998-06-26 JP JP18032898A patent/JP3219055B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001308571A (en) * | 2000-04-18 | 2001-11-02 | Orion Mach Co Ltd | Cooling system for electronic component and the like |
| JP2008192968A (en) * | 2007-02-07 | 2008-08-21 | Nec Corp | Heat radiator, communications equipment and heat radiating method of equipment |
| EP2688193A1 (en) * | 2011-03-17 | 2014-01-22 | FUJIFILM Corporation | Thermoelectric generator device and portable electronic apparatus |
| EP2688193A4 (en) * | 2011-03-17 | 2014-07-23 | Fujifilm Corp | Thermoelectric generator device and portable electronic apparatus |
| EP2887533A4 (en) * | 2012-08-16 | 2016-03-23 | Zte Corp | Energy-saving environmental protection apparatus for communication system device |
| US9583971B2 (en) | 2012-08-16 | 2017-02-28 | Zte Corporation | Energy-saving and environment-friendly device for communication system equipment |
| EP3096366A3 (en) * | 2015-05-20 | 2016-12-28 | MediaTek, Inc | Semiconductor package assembly with thermal recycling function |
| CN106169451A (en) * | 2015-05-20 | 2016-11-30 | 联发科技股份有限公司 | Portable electronic piece system, semiconductor subassembly and the method converting heat into electric energy |
| US9837595B2 (en) | 2015-05-20 | 2017-12-05 | Mediatek Inc. | Semiconductor package assembly with thermal recycling function |
| CN106169451B (en) * | 2015-05-20 | 2019-01-22 | 联发科技股份有限公司 | Portable electronic piece system, semiconductor subassembly and the method for converting heat into electric energy |
| CN109672250A (en) * | 2019-01-27 | 2019-04-23 | 深圳市蓝禾技术有限公司 | The charging method of portable charged fan and portable charged fan |
| JP2020095052A (en) * | 2020-03-11 | 2020-06-18 | 株式会社小松製作所 | Thermoelectric power generation device |
| JP7108651B2 (en) | 2020-03-11 | 2022-07-28 | 株式会社小松製作所 | thermoelectric generator |
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| Publication number | Publication date |
|---|---|
| JP3219055B2 (en) | 2001-10-15 |
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