JP2000013062A - Electric circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric circuit device which is excellent in routing property of bus bars and terminal connecting property without obstructing cooling property of heat generating components. SOLUTION: In an electronic circuit device where a wiring board 8 for mounting circuit elements is arranged above a base plate 9 for retaining heat generating components 3, 7 in parallel with the base plate, heights of a plurality of heat generating component retaining surfaces 97-99 of the base plate 9 which retain the respective heat generating components 3, 7 are adjusted so as to be different with each other. Terminal heights of the respective heat generating components 3, 7 can be freely adjusted while being made to coincide with the heights of connecting terminals of a wiring board side, so that arrangement and shapes of the connecting terminals (connecting means of a wiring board side) like bus bars are simplified, and design freedom can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device having a heat generating component provided in contact with a metal member and performing heat transfer cooling through the metal member.

[0002]

2. Description of the Related Art As is conventionally known, power D
The C-DC converter circuit includes an inverter circuit that converts input DC power into AC power, a transformer that changes the output voltage of the inverter circuit, a rectifier circuit that rectifies the output of the transformer, and smoothes the output voltage of the rectifier circuit. Output smoothing circuit. It is also common to provide an input smoothing circuit for smoothing the input current of the inverter circuit.

At least the power switching element of the inverter circuit among the above elements constituting the power DC-DC converter circuit is fixed to a wiring board through a metal member for cooling and heat sink, and other elements constituting the DC-DC converter circuit. Normally, circuit components are mounted on a wiring board.

[0004]

However, the power DC
-Among the circuit components constituting the DC converter circuit (hereinafter simply referred to as DC-DC converter circuit), the full-wave rectification circuit module, the transformer, and the choke coil, which are the main heat-generating components, have different heights and use a bus bar. Terminal connection was not easy.

[0005] The bus bar can be bent in a complicated manner, but in such a case, the terminal connection work often becomes difficult. Further, since the height of the transformer or the choke coil is higher than other circuit components, the shape of a bus bar connecting the terminals of the transformer or the choke coil and the other circuit components is complicated, and the required space is increased. There was a problem.

In addition, since these transformers or choke coils are heavier than other circuit components, it is necessary to improve the strength of a wiring board that supports them.
Further, there is a problem that the life of the transformer or the choke coil is also limited due to the heat generation. The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic circuit device which is excellent in the busbar drawability and terminal connection properties without impairing the cooling performance of the heat-generating components.

Next, it is desired that the circuit element mounted on the wiring board, for example, the snubber circuit chip in the above-mentioned DC-DC converter be improved in the cooling property by the heat generation. The present invention has been made in view of the above problems, and to provide an electronic circuit device capable of improving the cooling performance of a wiring board mounted component while avoiding complication of a structure and a manufacturing process.
For other purposes.

[0008]

A DC-D according to claim 1.
In a C converter device, in an electronic circuit device in which a wiring board for mounting circuit elements is provided above and parallel to a base plate for supporting heating components, different heights are provided on a plurality of heating component supporting surfaces of the base plate for supporting different heating components. The terminal height of each heat-generating component can be freely adjusted according to the height of the connection terminal on the wiring board side. The arrangement and shape of the connecting means can be simplified, and the degree of freedom in design can be increased. Further, since the bottom surface of the heat generating component is in close contact with the heat generating component supporting surface of the metal base plate, the cooling performance of the heat generating component does not deteriorate. Furthermore, since the heat-generating component is carried on the base plate below the wiring board, it is not necessary to improve the strength of the wiring board even if the heat-generating component is heavy. After all, according to this configuration, it is possible to realize an electronic circuit device having excellent busbar routing and terminal connectivity without impairing the cooling performance of the heat-generating components.

According to a second aspect of the present invention, in the electronic circuit device according to the first aspect, the height of the heat-generating component supporting surface is adjusted to a height at which the terminals of the heat-generating components to be supported overlap the connection terminals. The terminal of the component is connected to a connection terminal of a bus bar extending on the mounting surface side of the wiring board. In this way, even if the height of the heat-generating component varies, the work of connecting the terminals of the heat-generating component can be simplified without devising the connection terminal structure on the wiring board side.

According to a third aspect of the present invention, in the electronic circuit device according to the first or second aspect, the heat-generating component further projects from a hole or a notch provided in the wiring board toward a mounting surface of the wiring board. Is done. With this configuration, the connection terminal on the wiring board side may be provided at any position around the hole or the cutout of the wiring board into which the heat-generating component is inserted, and the connection between the connection terminal and the terminal of the heat-generating component is sufficient. And the degree of freedom of routing of the connection terminal and the wiring member connected thereto is improved,
The degree of freedom in arranging circuit elements on the wiring board can be increased. Further, the possibility of realizing a reduction in wiring resistance loss by simplifying the wiring member is increased.

According to the electronic circuit device of the present invention, the base plate for cooling or protecting the wiring board is arranged in parallel with the wiring board on the back side of the wiring board on which the circuit elements are mounted on the mounting surface. Is provided with a terminal connection conductor layer to which the terminals of the circuit element are fixed. Further, the base plate has a cooling projection located on the back surface side of the terminal connection conductor layer and closely attached to the non-mounting surface of the wiring board so as to be electrically insulated from the terminal connection conductor layer.

With this configuration, the heat generated in the circuit element mounted on the wiring board is transmitted from the terminal to the cooling projection of the base plate through the terminal connecting conductor layer and the electrical insulating portion. Thus, the circuit elements on the wiring board can be cooled well.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a DC-DC converter as an example of an electronic circuit device of the present invention will be described with reference to the following embodiments.

[0014]

Embodiment 1 D as an embodiment of the electronic circuit device of the present invention
The C-DC converter device will be described with reference to FIG. FIG. 1 is a circuit diagram of the DC-DC converter device.
This DC-DC converter device is for converting a main battery (not shown) for storing running energy of an electric vehicle to an auxiliary device and an auxiliary device battery for supplying power to a control device, and for supplying power. An input smoothing circuit 1 connected to a DC power supply (not shown) for smoothing the current, an inverter circuit 2 for converting DC power input from the input smoothing circuit 1 to AC power, and changing an output voltage of the inverter circuit 2 And an inverter circuit having a full-wave rectifier circuit module 4 for rectifying the output of the transformer 3 and an output smoothing circuit 5 for smoothing the output voltage of the full-wave rectifier circuit module 4 as its main components. The output smoothing circuit 5 further includes a controller for controlling the inverter circuit 2, a current sensor, and the like. The output smoothing circuit 5 includes a smoothing capacitor 6 and a choke coil 7.

Further, this DC-DC converter device has
As shown in FIG. 2 which is a perspective view, a wiring board 8 and a base plate (metal member in the present invention) 9 for mounting the above components and circuit elements are provided. On the mounting surface of the wiring board 8, a large number of busbars 1 are sewn between the components and circuit elements.
0 is extended. As is well known, the inverter circuit 2 includes four IGBT modules (power switching elements)
Each of the IGBT modules 11 is configured by connecting an IGBT and a flyback diode in anti-parallel.

The wiring substrate 8 is a multilayer alumina substrate on which components and circuit elements other than the full-wave rectifier circuit module 4, the IGBT module 11, the transformer 3, and the choke coil 7 are mounted on the mounting surface. To mount each component or circuit element on the wiring board 8, as shown in FIG. 4, terminals are inserted into holes provided in the wiring board 8, and soldering is performed on the non-mounting surface side of the wiring board 8. .

The base plate 9 is an aluminum member, and is a thick plate-shaped parallel plate portion 91 which is proximate to the non-mounting surface of the wiring board 8 and extends in parallel with the mounting surface. It comprises a linear projection 92 erected at right angles to the parallel plate 91 toward the substrate 8 and a power switching element support plate 93. Power switching element support plate 93
Indicates that each I of the inverter circuit 2 is
A heat sink on which the GBT module 11 is mounted, which is fastened to the top surface of the linear projection 92 by a screw 94;
As a result, the parallel plate portion 91 of the base plate 9 faces the non-mounting surface of the wiring board 8 at a predetermined interval. Therefore, the parallel plate portion 91 of the base plate 9 has a case function of protecting the non-mounting surface of the wiring board 8 and also has a function as a heat sink of the IGBT module 11.

One side of the wiring board 8 is fastened to a wiring board supporting projection 95 extending from the power switching element support plate 93 to the wiring board 8 side in parallel with the wiring board 8. The base plate 9 also functions to support the wiring board 8 by being fastened to the wiring board supporting projection 96 erected from the parallel plate portion 91 toward the wiring board 8 side.

As shown in FIGS. 3 and 4, the wiring board 8 has a hole 81 for inserting the transformer 3 and a notch 82 for inserting the full-wave rectifier circuit module 4 and the choke coil 7.
Are provided. The transformer 3 is inserted into the hole 81, and the bottom surface thereof is seated on a transformer base 97 projecting from the upper surface of the parallel plate 91. The full-wave rectifier circuit module 4 is inserted into the notch 82, and the bottom surface thereof is seated on a pedestal 98 projecting from the upper surface of the parallel plate 91. The choke coil 7 is inserted into the notch 82 adjacent to the full-wave rectifier circuit module 4, and the bottom surface thereof is seated on a pedestal 99 projecting from the upper surface of the parallel plate 91. That is, the base plate 9 has a function of carrying the transformer 3 and the choke coil 7 which are heavy components, and the full-wave rectifier circuit module 4 which is a large heat generating component.
It also has the function of supporting and radiating heat.

The full-wave rectifier circuit module 4 is fastened to a screw hole formed on the pedestal 98, but the lower part of the transformer 3 and the choke coil 7 is a core.
99 not concluded. What is important here is that each pedestal 9
The heights of 7 to 99 are different from each other, and the terminals of the full-wave rectifier circuit module 4, the transformer 3 and the choke coil 7 mounted thereon are mounted above the mounting surface of the wiring board 8 for fastening. In that each of the bus bars 10 can be overlapped.

The transformer 3 has a tripod-shaped core 30 on which a primary coil and a secondary coil are wound, and a core pressing plate 31 is put on the tripod-shaped core 30. The core holding plate 31 is formed of a pair of side plates 31 erected from the wiring board 8 along the side surface of the tripod core 30.
1 is a gate-shaped sheet metal member having a top plate portion 312 provided between the distal ends of both side plate portions 311 and in close contact with the top surface of the tripod core 30. The both side plate portions 311 are fastened to the parallel plate portion 91 of the base plate 9 by screws penetrating the wiring board 8, whereby the transformer 3 is fixed to the wiring board 8 and the base plate 9. The top plate portion 312 has a central portion curved toward the transformer 3 side to elastically urge the transformer 3 toward the parallel plate portion 91 of the base plate 9.

The choke coil 7 has a tripod-shaped core 70 on which a coil is wound, and a core pressing plate 71 is put on the tripod-shaped core 70. The core holding plate 71 is provided between a pair of side plate portions 711 erected from the wiring board 8 along the side surface of the tripod core 70 and the front ends of the both side plate portions 711 and is in close contact with the top surface of the tripod core 70. And a top plate portion 712. The both side plate parts 711 are fastened to the parallel plate part 91 of the base plate 9 by screws penetrating the wiring board 8, whereby the choke coil 7 is fixed to the wiring board 8 and the base plate 9. The top plate portion 712 has a central portion curved toward the choke coil 7 side and elastically biases the choke coil 7 toward the parallel plate portion 91 of the base plate 9.

Next, the order of assembling the main parts of the DC-DC converter will be described below. First, necessary components and circuit elements are mounted, and the power switching element support plate 9 is mounted.
3 and the wiring board 8 in which the IGBT module 11 and the connection conductor layer on the wiring board are connected by wires is fastened to the parallel plate portion 91 and the linear projection 92 of the base plate 9.

Next, the transformer 3, the full-wave rectification circuit module 4 and the choke coil 7 are mounted from above, the full-wave rectification circuit module 4 is fastened, and the core holding plate 3
1, 71 are fastened. Finally, the terminals of the transformer 3, the full-wave rectifier circuit module 4, and the choke coil 7 are fastened to the bus bar 10 or the like. D of the present embodiment described above
The advantages of the C-DC converter device will be described below.

A base plate (metal member) 9 that supports and cools the power switching element of the inverter circuit 2 and supports the wiring board protects it at a predetermined interval on the non-mounting surface of the wiring board 8. Further, the base plate 9 can be supported and cooled by closely adhering to the bottom surface of the transformer 3 or the choke coil 7. Also, the terminals of the transformer 3 and the choke coil 7, which are taller due to having the core, can be shifted toward the wiring board 8 by the gap between the base plate 9 and the wiring board 8, so that they are mounted on the wiring board 8. Connection of other short-circuited parts and circuit elements to the terminals of the transformer 3 and the choke coil 7 is facilitated.

In addition, since the transformer 3, the full-wave rectifier circuit module 4 and the choke coil 7 are brought into close contact with the parallel plate 91 of the base plate 9 through holes or cutouts in the wiring board 8, these components such as the transformer 3 Compared to the case where the components are provided around the wiring board 8, they can be provided at appropriate locations on the wiring, the space distribution between the components and the wiring can be simplified, and the physical size of the DC-DC converter device It is also effective for reduction. Further, the hole or notch for inserting the transformer 3 or the choke coil 7 provided on the wiring board 8 can be used as a guide for positioning the transformer 3 or the choke coil 7.

Further, as shown in FIG. 4, the transformer 3, the full-wave rectifier circuit module 4, and the choke coil 7, that is, the top surfaces of the pedestals 97 to 99 of the base plate that carry each heat-generating component, as shown in FIG. The heights are set to be different from each other, whereby the terminals of these heat generating components can be easily fastened to the bus bars 10 above the base plate 9 respectively. In addition, this fastening has the effect of pressing each heat-generating component against the parallel plate portion 91 of the base plate 9 to reduce the heat transfer resistance.

Furthermore, these pedestals 97 to 99 can be manufactured by aluminum die-casting of the base plate 9 without complicating the manufacturing process. (Modification) In the above embodiment, the heat-generating component supporting surface is the top surface of the pedestals (cooling projections) 97 to 99.
It goes without saying that it may be a bottom that is recessed in 1,
It goes without saying that one of the heat generating component carrying surfaces may be the main surface of the parallel plate portion 91.

[0029]

Embodiment 2 An electronic circuit device according to another embodiment will be described with reference to FIG. In this embodiment, since a part of the DC-DC converter of the first embodiment is changed, only the changed points will be described. The terminals 101 and 102 of the chip component 100 are fixed to the via holes 81a and 82a of the wiring board 8a by soldering from the back side.
Numeral 02 is connected to solder layers (terminal connection conductor layers) 103 and 104 extending on the non-mounting surface of the wiring board 8a.

Furthermore, this solder layer (conductor layer for terminal connection)
103 and 104 are in close contact with the cooling projections 92a and 93a, which protrude from the parallel plate portion 91a and have a flat top surface, respectively, through the insulating resin film 105. 102
From the solder layers 103 and 104, the insulating resin film 105
Through the cooling projections 92a and 93a. Also in this case, the cooling projections 92a,
93a can be manufactured by aluminum die casting and does not complicate the manufacturing process.

In this embodiment, the solder layers 103 and 104 on the side opposite to the mounting surface of the wiring board 8a are the conductor layers for terminal connection according to the present invention. Needless to say, the conductor layer for terminal connection may be used.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing one embodiment of a DC-DC converter device of the present invention.

FIG. 2 is a perspective view of the DC-DC converter device shown in FIG.

FIG. 3 is a partial perspective view of the DC-DC converter device shown in FIG.

FIG. 4 is an exploded perspective view of the DC-DC converter device shown in FIG.

FIG. 5 is a partial vertical sectional view showing another embodiment of the DC-DC converter device of the present invention.

[Explanation of symbols]

3 is a transformer (heating component), 4 is a full-wave rectifier circuit module (heating component), 7 is a choke coil (heating component),
8, 8a are wiring boards, 9, 9a are base plates, 10
Is a bus bar; 97 to 99 are pedestals; 81 is a hole in the wiring board 8; 82 is a cutout in the wiring board 8;
Is a solder layer (conductor layer for terminal connection), 92a and 93a are cooling projections

Claims (4)

[Claims] 1. A wiring board on which a circuit element of an electronic circuit including a plurality of heat generating components is mounted on a mounting surface, and a wiring board facing an anti-mounting surface of the wiring board at a predetermined interval and being parallel to the anti-mounting surface. A base plate made of a metal plate extending to fix the wiring board and carrying the plurality of heat-generating components, wherein terminals of the heat-generating components project toward a mounting surface side of the wiring board to mount the wiring board. In the electronic circuit device connected to the surface-side connection terminal, the bottom surfaces of the plurality of heat-generating components are in close contact with heat-generating component-carrying surfaces having different heights provided on a main surface of the base plate on the wiring board side. An electronic circuit device, comprising: 2. The electronic circuit device according to claim 1, wherein the height of the heat-generating component supporting surface is adjusted to a height at which terminals of the heat-generating component to be supported overlap the connection terminals. An electronic circuit device connected to a connection terminal of a bus bar extending on a mounting surface side of the wiring board. 3. The electronic circuit device according to claim 1, wherein the heat-generating component protrudes from a hole or a notch provided in the wiring board toward a mounting surface of the wiring board. Electronic circuit device. 4. A wiring board on which a circuit element of an electronic circuit is mounted on a mounting surface, and said wiring extending parallel to said anti-mounting surface while facing a non-mounting surface of said wiring substrate at a predetermined interval. A base plate made of a metal plate for fixing a board, wherein the wiring board is provided on a mounting surface of the wiring board and has a terminal connection conductor layer to which a terminal of the circuit element is fixed, wherein the electronic circuit device comprises: The base plate is located on the back surface side of the terminal connection conductor layer, and has a cooling projection that is in close contact with the non-mounting surface of the wiring board so as to be electrically insulated from the terminal connection conductor layer. Electronic circuit device characterized by the following.