JP2000000656A - Solder immersing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control the soldering quantity to be constant, and to eliminate generation of any non-soldered area by providing a solder immersing device comprising a chuck part to chuck a work, a spring to press the chuck part against the work, a hand to transmit the chucking force to the chuck part, an industrial robot to control the motion of the hand in the vertical and right-to- left direction, and a soldering tank to store the molten solder. SOLUTION: The thickness of a chuck part 5 is preferably changed stepwise. A hand 4 is lowered toward a work 7 arranged in a tray with the hand 4 in an open condition. A spring 6 is contracted, the chuck part 5 is pressed against the work 7, and the hand 4 is closed to chuck the work 7. A robot 3 is elevated, and carried to an upper part of a soldering tank 2, the hand 4 is lowered, and a solder 1 is attached to a part 8 to be soldered of the work 7. The work 7 and can be chucked at a specified place, a spring 6 presses the chuck part 5 against the work 7 and chucks it, and the surface accuracy of the tray need not be considered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solder immersion apparatus. More specifically, the present invention relates to a solder immersion apparatus for immersing a work in a molten solder bath and automatically applying solder to a soldered portion of the work.

[0002]

2. Description of the Related Art In recent years, in the field of electronics, a soldering operation after an electronic component or the like is incorporated into a substrate is mainly performed by a method called a dipping method. In this method, a portion to be soldered is temporarily immersed in a molten solder bath to automatically perform soldering.

[0003] With the development of high density surface mounting technology,
This immersion method has become an increasingly important technology, and the role of a solder immersion device plays a large role.

FIG. 5 is a front view of a conventional solder immersion apparatus.

The apparatus comprises a solder tank 2 for storing a fixed amount of molten solder 1, a hand 4 for chucking a work 7, and an industrial robot 3 for operating the hand 4. The work 7 has a soldering portion 8, which is immersed in the molten solder 1 in the solder bath 2 to perform necessary soldering.

FIG. 6 is an explanatory view showing an operation of the conventional solder immersion apparatus, in which the hand 4 of the robot 3 chucks the work 7. The work 7 is arranged at a predetermined position on the tray 9 with high surface accuracy, and the hand 4 chucks the work 7 from both sides.

[0007] The chucked work 7 is transported by the robot 3 to the upper part of the solder tank 2, and is lowered by a predetermined amount, and the solder 1 is attached to the soldering portion 8.

[0008]

The work 7 placed on the tray 9 is chucked by the hand 4, and the hand 4 descends from the upper part of the solder tank 2 by a fixed amount. Therefore, there is a case where the solder 1 does not normally adhere to the soldering portion 8 of the work 7 due to the following factors.

(1) The portion where the hand 4 chucks the work 7 is not fixed or cannot be chucked.

(2) The amount of the molten solder 1 in the solder bath 2 is not fixed.

(3) The accuracy of the surface of the tray 9 is poor and it is uneven.

The quantity (2) of the molten solder 1 can be easily solved by installing a quantity detector or the like. Further, when the soldered portion 8 is immersed in the solder 1, the quantity of the molten solder 1 may not be so strictly controlled due to the property of the solder that the solder 1 is sucked up by the soldered portion 8. Regarding the surface accuracy of the tray 9 in (3), a plurality of trays 9 with high accuracy may be manufactured and placed, and replaced as needed.

Conventionally, the position at which the hand 4 chucks the work 7 cannot be managed with high accuracy. Therefore, the solder 1 does not normally adhere to the soldering portion 8 of the work 7,
There is a problem that an unsoldered area is generated.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a solder immersion apparatus which solves the above-mentioned disadvantages of the prior art, always chucks a work at a fixed position, and immerses a soldered portion of the work in a solder tank with high accuracy. It is in.

[0015]

According to the present invention, there is provided a chuck for chucking a work, a spring for pressing the chuck against the work, and a hand for transmitting a force for chucking the chuck. And an industrial robot that controls the up, down, left and right movements of the hand, and a solder bath that stores molten solder.

[0016] The thickness of the chuck portion may be changed stepwise.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the solder immersion apparatus of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view of the apparatus. Work 7
, A spring 6 for pressing the chuck 5 against the work 7, a hand 4 for transmitting a force for chucking the chuck 5, and an industrial robot 3 for controlling the up, down, left and right movements of the hand 4. And a solder tank 2 for storing the molten solder 1.

2 to 4 are explanatory diagrams of the operation of the present apparatus. FIG. 2 shows an operation in which the hand 4 is lowered in a state where the hand 4 is open, that is, in a state where the hand 4 is spread right and left until the chuck portion 5 comes into contact with the work 7 arranged on the tray 9. .

FIG. 3 shows an operation continued from FIG. 2, in which the hand 4 is further lowered after the chuck portion 5 comes into contact with the work 7 and the spring 6 provided on the upper portion of the chuck portion 5 is moved.
Is contracted, and the chuck portion 5 is pressed against the work 7.
This operation is completed after the hand 4 descends by a predetermined amount,
Next, the hand 4 closes and transmits the force for chucking the work 7 to the chuck portion 5.

Thereafter, as shown in FIG. 4, the hand 4 is lifted while the work 7 is being chucked by the chuck section 5, and the work 7 is separated from the tray 9. Thereafter, the robot 3 conveys the work 7 to the upper part of the solder tank 2, the hand 4 descends by a predetermined amount, and the solder 1 is attached to the soldering portion 8 of the work 7, and the work is completed. FIG. 1 shows a state in which the work 7 has just been immersed in the solder bath 2.

As can be seen from the operation explanatory views of FIGS. 2, 3 and 4, the shape of the chuck portion 5 is, for example, stepwise changed in thickness so that the work 7 can be easily chucked. Alternatively, a similar effect can be provided by providing a projection on the chuck portion 5.

The material and shape of the spring 6 and the jig for holding the spring 6 can be appropriately selected according to the size and weight of the work 7 to be chucked.

As described above, the work 7 can be always chucked at a fixed place by the action of the hand 4, the spring 6, and the chuck portion 5. In addition, since the spring 6 presses the chuck portion 5 against the work 7 to chuck, the surface accuracy of the tray 9 does not need to be particularly considered.

[0025]

The present invention is industrially useful because it exhibits the following excellent effects.

(1) Since the chuck position of the work is always constant, the soldering amount can be controlled to be constant. Further, it is possible to eliminate the occurrence of the unsoldered area.

(2) Since the workpiece can be chucked irrespective of the accuracy of the tray, the tray can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a solder immersion apparatus according to the present invention.

FIG. 2 is an explanatory diagram of an operation according to an embodiment of the present invention.

FIG. 3 is an operation explanatory diagram according to an embodiment of the present invention.

FIG. 4 is an operation explanatory diagram according to an embodiment of the present invention.

FIG. 5 is a front view of a conventional solder immersion apparatus.

FIG. 6 is an operation explanatory diagram relating to a conventional solder immersion apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder 2 Solder tank 3 Industrial robot 4 Hand 5 Chuck part 6 Spring 7 Work 8 Soldering part 9 Tray

Claims (2)

[Claims] 1. A chuck for chucking a workpiece, a spring for pressing the chuck against the workpiece, a hand for transmitting a force for chucking the chuck, and an industrial robot for controlling the up, down, left, and right movements of the hand. And a solder bath for storing molten solder. 2. The solder immersion apparatus according to claim 1, wherein the thickness of the chuck portion changes stepwise.