JP1778590S - - Google Patents
Info
- Publication number
- JP1778590S JP1778590S JP2024004871F JP2024004871F JP1778590S JP 1778590 S JP1778590 S JP 1778590S JP 2024004871 F JP2024004871 F JP 2024004871F JP 2024004871 F JP2024004871 F JP 2024004871F JP 1778590 S JP1778590 S JP 1778590S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024004871F JP1778590S (en:Method) | 2024-03-08 | 2024-03-08 | |
| US29/961,389 USD1108381S1 (en) | 2024-03-08 | 2024-09-05 | Filler block for substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024004871F JP1778590S (en:Method) | 2024-03-08 | 2024-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1778590S true JP1778590S (en:Method) | 2024-08-28 |
Family
ID=92499660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024004871F Active JP1778590S (en:Method) | 2024-03-08 | 2024-03-08 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1108381S1 (en:Method) |
| JP (1) | JP1778590S (en:Method) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD326272S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
| USD326273S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
| JP5661523B2 (ja) * | 2011-03-18 | 2015-01-28 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| US9679751B2 (en) * | 2012-03-15 | 2017-06-13 | Lam Research Corporation | Chamber filler kit for plasma etch chamber useful for fast gas switching |
| JP1565116S (en:Method) * | 2016-02-10 | 2016-12-12 | ||
| US20180005851A1 (en) * | 2016-07-01 | 2018-01-04 | Lam Research Corporation | Chamber filler kit for dielectric etch chamber |
| CN120432376A (zh) * | 2019-11-29 | 2025-08-05 | Asm Ip私人控股有限公司 | 基板处理设备 |
| KR102707957B1 (ko) * | 2020-07-08 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | 기판 처리 방법 |
| JP2022054653A (ja) * | 2020-09-28 | 2022-04-07 | 東京エレクトロン株式会社 | 凹部埋め込み方法及び基板処理装置 |
| JP1706320S (en:Method) * | 2021-06-28 | 2022-01-31 | ||
| JP1706321S (en:Method) * | 2021-06-28 | 2022-01-31 |
-
2024
- 2024-03-08 JP JP2024004871F patent/JP1778590S/ja active Active
- 2024-09-05 US US29/961,389 patent/USD1108381S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD1108381S1 (en) | 2026-01-06 |