JP1743012S - polishing pad - Google Patents
polishing padInfo
- Publication number
- JP1743012S JP1743012S JP2022014210F JP2022014210F JP1743012S JP 1743012 S JP1743012 S JP 1743012S JP 2022014210 F JP2022014210 F JP 2022014210F JP 2022014210 F JP2022014210 F JP 2022014210F JP 1743012 S JP1743012 S JP 1743012S
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- article
- silicon wafers
- polishing silicon
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
本物品は、シリコンウエハ等の研磨に使用するものである。This article is used for polishing silicon wafers and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022014210F JP1743012S (en) | 2022-07-01 | 2022-07-01 | polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022014210F JP1743012S (en) | 2022-07-01 | 2022-07-01 | polishing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1743012S true JP1743012S (en) | 2023-04-27 |
Family
ID=86055113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022014210F Active JP1743012S (en) | 2022-07-01 | 2022-07-01 | polishing pad |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP1743012S (en) |
-
2022
- 2022-07-01 JP JP2022014210F patent/JP1743012S/en active Active
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