JP1718358S - 微小構造体移載用レセプター基板 - Google Patents
微小構造体移載用レセプター基板Info
- Publication number
- JP1718358S JP1718358S JP2021022478F JP2021022478F JP1718358S JP 1718358 S JP1718358 S JP 1718358S JP 2021022478 F JP2021022478 F JP 2021022478F JP 2021022478 F JP2021022478 F JP 2021022478F JP 1718358 S JP1718358 S JP 1718358S
- Authority
- JP
- Japan
- Prior art keywords
- receptor substrate
- microstructure transfer
- article
- substrate
- microstructures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 1
Abstract
本物品は微小構造体移載用レセプター基板である。本物品は、例えば１辺が１００～１，０００ｍｍの透明基板上に透明樹脂を備えており、他の基板に形成・配置された半導体素子、マイクロＬＥＤ素子等の微小構造体をレーザリフトオフ等により前記透明樹脂に受け取るために用いられる。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022478F JP1718358S (ja) | 2021-10-15 | 2021-10-15 | 微小構造体移載用レセプター基板 |
| TW111301809F TWD233257S (zh) | 2021-10-15 | 2022-04-15 | 受體基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022478F JP1718358S (ja) | 2021-10-15 | 2021-10-15 | 微小構造体移載用レセプター基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1718358S true JP1718358S (ja) | 2022-06-28 |
Family
ID=82164390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021022478F Active JP1718358S (ja) | 2021-10-15 | 2021-10-15 | 微小構造体移載用レセプター基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1718358S (ja) |
| TW (1) | TWD233257S (ja) |
-
2021
- 2021-10-15 JP JP2021022478F patent/JP1718358S/ja active Active
-
2022
- 2022-04-15 TW TW111301809F patent/TWD233257S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD233257S (zh) | 2024-09-01 |
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