JP1693552S - - Google Patents
Info
- Publication number
- JP1693552S JP1693552S JPD2021-7523F JP2021007523F JP1693552S JP 1693552 S JP1693552 S JP 1693552S JP 2021007523 F JP2021007523 F JP 2021007523F JP 1693552 S JP1693552 S JP 1693552S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-7523F JP1693552S (cg-RX-API-DMAC10.html) | 2021-04-09 | 2021-04-09 | |
| US29/807,404 USD992519S1 (en) | 2021-04-09 | 2021-09-10 | Semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-7523F JP1693552S (cg-RX-API-DMAC10.html) | 2021-04-09 | 2021-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1693552S true JP1693552S (cg-RX-API-DMAC10.html) | 2021-08-23 |
Family
ID=77389712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2021-7523F Active JP1693552S (cg-RX-API-DMAC10.html) | 2021-04-09 | 2021-04-09 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD992519S1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP1693552S (cg-RX-API-DMAC10.html) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3355637A (en) * | 1965-04-15 | 1967-11-28 | Rca Corp | Insulated-gate field effect triode with an insulator having the same atomic spacing as the channel |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| JP2009043820A (ja) * | 2007-08-07 | 2009-02-26 | Rohm Co Ltd | 高効率モジュール |
| JP5834461B2 (ja) * | 2011-04-14 | 2015-12-24 | 日本電気株式会社 | 半導体レーザモジュール及びその製造方法 |
| JP2017147272A (ja) * | 2016-02-15 | 2017-08-24 | ローム株式会社 | 半導体装置およびその製造方法、ならびに、半導体装置の製造に使用されるリードフレーム中間体 |
| US10262928B2 (en) * | 2017-03-23 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
| JP7100980B2 (ja) * | 2018-01-22 | 2022-07-14 | ローム株式会社 | Ｌｅｄパッケージ |
| US10879146B2 (en) * | 2018-04-06 | 2020-12-29 | Rohm Co., Ltd. | Electronic component and manufacturing method thereof |
| JP7312604B2 (ja) * | 2019-05-13 | 2023-07-21 | ローム株式会社 | 半導体装置 |
| JP1682283S (cg-RX-API-DMAC10.html) * | 2020-07-31 | 2021-03-29 | ||
| JP1680788S (cg-RX-API-DMAC10.html) * | 2020-07-31 | 2021-03-08 | ||
| JP7628810B2 (ja) * | 2020-11-19 | 2025-02-12 | ローム株式会社 | 半導体発光装置 |
-
2021
- 2021-04-09 JP JPD2021-7523F patent/JP1693552S/ja active Active
- 2021-09-10 US US29/807,404 patent/USD992519S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD992519S1 (en) | 2023-07-18 |