JP1689064S - 温度センサ - Google Patents
温度センサInfo
- Publication number
- JP1689064S JP1689064S JP2020018343F JP2020018343F JP1689064S JP 1689064 S JP1689064 S JP 1689064S JP 2020018343 F JP2020018343 F JP 2020018343F JP 2020018343 F JP2020018343 F JP 2020018343F JP 1689064 S JP1689064 S JP 1689064S
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- combines
- sensors
- detecting
- present application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020018343F JP1689064S (ja) | 2020-08-31 | 2020-08-31 | 温度センサ |
TW110300511F TWD216927S (zh) | 2020-08-31 | 2021-01-29 | 溫度感測器 |
US29/772,172 USD973520S1 (en) | 2020-08-31 | 2021-02-26 | Temperature sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020018343F JP1689064S (ja) | 2020-08-31 | 2020-08-31 | 温度センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1689064S true JP1689064S (ja) | 2021-07-05 |
Family
ID=76651483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020018343F Active JP1689064S (ja) | 2020-08-31 | 2020-08-31 | 温度センサ |
Country Status (3)
Country | Link |
---|---|
US (1) | USD973520S1 (de) |
JP (1) | JP1689064S (de) |
TW (1) | TWD216927S (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1729419S (ja) * | 2022-03-18 | 2022-11-09 | 温度センサ |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4369795A (en) * | 1980-06-17 | 1983-01-25 | Bicher James I | Implantable microthermocouple member |
USD424016S (en) * | 1998-07-14 | 2000-05-02 | Watlow Electric Manufacturing Company | Thermocouple and RTD connector |
USD421924S (en) * | 1999-02-18 | 2000-03-28 | Precision Mastech Enterprises Company | Thermocouple module |
US20020088640A1 (en) * | 2001-01-09 | 2002-07-11 | Schuh William C. | Temperature sensor, leadwire and method |
USD560126S1 (en) * | 2006-06-22 | 2008-01-22 | Watlow Electric Manufacturing Company | Dual temperature sensor assembly |
USD597423S1 (en) * | 2008-07-30 | 2009-08-04 | James Tech Co., Ltd. | Temperature detecting apparatus for oven |
JP1534940S (de) * | 2015-02-25 | 2015-10-13 | ||
JP1534939S (de) * | 2015-02-25 | 2015-10-13 | ||
JP1577928S (de) * | 2016-07-14 | 2017-06-05 | ||
JP1647666S (de) | 2019-03-04 | 2019-12-09 |
-
2020
- 2020-08-31 JP JP2020018343F patent/JP1689064S/ja active Active
-
2021
- 2021-01-29 TW TW110300511F patent/TWD216927S/zh unknown
- 2021-02-26 US US29/772,172 patent/USD973520S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD973520S1 (en) | 2022-12-27 |
TWD216927S (zh) | 2022-02-01 |
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