JP1660180S - - Google Patents

Info

Publication number
JP1660180S
JP1660180S JPD2019-23723F JP2019023723F JP1660180S JP 1660180 S JP1660180 S JP 1660180S JP 2019023723 F JP2019023723 F JP 2019023723F JP 1660180 S JP1660180 S JP 1660180S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-23723F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-23723F priority Critical patent/JP1660180S/ja
Priority to TW109301937D03F priority patent/TWD209201S/zh
Application granted granted Critical
Publication of JP1660180S publication Critical patent/JP1660180S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-23723F 2019-10-25 2019-10-25 Active JP1660180S (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-23723F JP1660180S (enExample) 2019-10-25 2019-10-25
TW109301937D03F TWD209201S (zh) 2019-10-25 2020-04-10 製造半導體裝置用的膜片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-23723F JP1660180S (enExample) 2019-10-25 2019-10-25

Publications (1)

Publication Number Publication Date
JP1660180S true JP1660180S (enExample) 2020-05-25

Family

ID=70775656

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-23723F Active JP1660180S (enExample) 2019-10-25 2019-10-25

Country Status (2)

Country Link
JP (1) JP1660180S (enExample)
TW (1) TWD209201S (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1724476S (ja) 2021-10-15 2022-09-12 微小構造体移載用スタンプ部品
JP1740419S (ja) 2021-10-15 2023-03-30 微小構造体移載用スタンプ部品
JP1727914S (ja) 2021-10-15 2022-10-21 微小構造体移載用スタンプ部品
USD1070795S1 (en) 2021-10-15 2025-04-15 Shin-Etsu Chemical Co., Ltd. Stamp component for transferring microstructure
JP1740485S (ja) 2021-10-15 2023-03-30 微小構造体移載用スタンプ部品
JP1718123S (ja) 2021-10-15 2022-06-23 微小構造体移載用スタンプ部品
JP1724478S (ja) 2021-10-15 2022-09-12 微小構造体移載用スタンプ部品
JP1718080S (ja) 2021-10-15 2022-06-23 微小構造体移載用スタンプ部品
JP1727915S (ja) 2021-10-15 2022-10-21 微小構造体移載用スタンプ部品
JP1739213S (ja) 2022-11-04 2023-03-16 微小構造体移載用スタンプ部品
JP1739772S (ja) 2022-11-04 2023-03-23 微小構造体移載用スタンプ部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5452900B2 (ja) 2007-09-21 2014-03-26 株式会社半導体エネルギー研究所 半導体膜付き基板の作製方法
DE112014005031B4 (de) 2014-11-13 2019-04-25 Shindengen Electric Manufacturing Co., Ltd. Verfahren zur Herstellung eines Halbleiter-Bauelements und Vorrichtung zur Herstellung einer Glasschicht
KR102487552B1 (ko) 2018-02-05 2023-01-11 삼성전자주식회사 보호막 조성물 및 이를 이용한 반도체 패키지 제조 방법

Also Published As

Publication number Publication date
TWD209201S (zh) 2021-01-01

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