JP1649258S - semiconductor module - Google Patents

semiconductor module

Info

Publication number
JP1649258S
JP1649258S JP2019000461F JP2019000461F JP1649258S JP 1649258 S JP1649258 S JP 1649258S JP 2019000461 F JP2019000461 F JP 2019000461F JP 2019000461 F JP2019000461 F JP 2019000461F JP 1649258 S JP1649258 S JP 1649258S
Authority
JP
Japan
Prior art keywords
semiconductor module
resin case
circuit components
housed
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019000461F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2019000461F priority Critical patent/JP1649258S/en
Priority to US29/696,616 priority patent/USD942404S1/en
Application granted granted Critical
Publication of JP1649258S publication Critical patent/JP1649258S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、パワー半導体素子等の回路構成部品が実装された回路基板等を、全体として直方体形状の樹脂ケース内に格納してなる半導体モジュールである。その樹脂ケースの正面側には、内部の回路構成部品に導通する複数の端子を設けている。This product is a semiconductor module in which a circuit board and the like on which circuit components such as power semiconductor elements are mounted are housed in a rectangular parallelepiped resin case as a whole. On the front side of the resin case, there are provided a plurality of terminals that are electrically connected to internal circuit components.

JP2019000461F 2019-01-11 2019-01-11 semiconductor module Active JP1649258S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019000461F JP1649258S (en) 2019-01-11 2019-01-11 semiconductor module
US29/696,616 USD942404S1 (en) 2019-01-11 2019-06-28 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019000461F JP1649258S (en) 2019-01-11 2019-01-11 semiconductor module

Publications (1)

Publication Number Publication Date
JP1649258S true JP1649258S (en) 2022-12-21

Family

ID=69146503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019000461F Active JP1649258S (en) 2019-01-11 2019-01-11 semiconductor module

Country Status (2)

Country Link
US (1) USD942404S1 (en)
JP (1) JP1649258S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
JP1530503S (en) 2014-11-28 2015-08-10
JP1530505S (en) 2014-11-28 2015-08-10
JP1530504S (en) 2014-11-28 2015-08-10
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
WO2016203884A1 (en) 2015-06-17 2016-12-22 富士電機株式会社 Power semiconductor module, flow path member, and power-semiconductor-module structure
CN111162060B (en) 2015-06-17 2024-01-05 富士电机株式会社 Power semiconductor module, flow path member, and power semiconductor module structure
JP6485257B2 (en) 2015-07-01 2019-03-20 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device
JP6488940B2 (en) 2015-08-07 2019-03-27 富士電機株式会社 Semiconductor device
JP6984127B2 (en) 2016-12-28 2021-12-17 富士電機株式会社 Semiconductor devices and methods for manufacturing semiconductor devices
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
JP1585831S (en) * 2017-01-05 2017-09-11
WO2018142863A1 (en) 2017-02-06 2018-08-09 富士電機株式会社 Semiconductor module, electric automobile and power control unit
JP2019000462A (en) 2017-06-16 2019-01-10 日本毛織株式会社 Heat evolution system
JP1603980S (en) * 2017-09-07 2018-05-14
JP1603793S (en) * 2017-09-29 2018-05-14
JP1632173S (en) * 2018-06-01 2019-05-27
JP1643134S (en) * 2019-03-15 2019-10-07
JP1643024S (en) * 2019-03-15 2019-10-07
JP1644633S (en) * 2019-03-26 2019-11-05

Also Published As

Publication number Publication date
USD942404S1 (en) 2022-02-01

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