JP1646366S - - Google Patents

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Publication number
JP1646366S
JP1646366S JP2019005889F JP2019005889F JP1646366S JP 1646366 S JP1646366 S JP 1646366S JP 2019005889 F JP2019005889 F JP 2019005889F JP 2019005889 F JP2019005889 F JP 2019005889F JP 1646366 S JP1646366 S JP 1646366S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019005889F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2019005889F priority Critical patent/JP1646366S/ja
Priority to TW108305647F priority patent/TWD204223S/zh
Priority to US29/706,143 priority patent/USD916038S1/en
Application granted granted Critical
Publication of JP1646366S publication Critical patent/JP1646366S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019005889F 2019-03-19 2019-03-19 Active JP1646366S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019005889F JP1646366S (enExample) 2019-03-19 2019-03-19
TW108305647F TWD204223S (zh) 2019-03-19 2019-09-18 電漿處理裝置用接地電極
US29/706,143 USD916038S1 (en) 2019-03-19 2019-09-18 Grounded electrode for a plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019005889F JP1646366S (enExample) 2019-03-19 2019-03-19

Publications (1)

Publication Number Publication Date
JP1646366S true JP1646366S (enExample) 2019-11-25

Family

ID=68610633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019005889F Active JP1646366S (enExample) 2019-03-19 2019-03-19

Country Status (3)

Country Link
US (1) USD916038S1 (enExample)
JP (1) JP1646366S (enExample)
TW (1) TWD204223S (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265094B1 (en) * 1998-11-12 2001-07-24 Aer Energy Resources, Inc. Anode can for a metal-air cell
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
JP1546800S (enExample) * 2015-06-12 2016-03-28
USD830434S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
JP1564934S (enExample) * 2016-02-26 2016-12-05
JP1598997S (enExample) * 2017-08-31 2018-03-05
JP1598998S (enExample) * 2017-08-31 2018-03-05
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber

Also Published As

Publication number Publication date
TWD204223S (zh) 2020-04-21
USD916038S1 (en) 2021-04-13

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