JP1646292S - - Google Patents

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Publication number
JP1646292S
JP1646292S JP2019009163F JP2019009163F JP1646292S JP 1646292 S JP1646292 S JP 1646292S JP 2019009163 F JP2019009163 F JP 2019009163F JP 2019009163 F JP2019009163 F JP 2019009163F JP 1646292 S JP1646292 S JP 1646292S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019009163F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2019009163F priority Critical patent/JP1646292S/ja
Priority to US29/709,587 priority patent/USD913229S1/en
Application granted granted Critical
Publication of JP1646292S publication Critical patent/JP1646292S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019009163F 2019-04-24 2019-04-24 Active JP1646292S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019009163F JP1646292S (en) 2019-04-24 2019-04-24
US29/709,587 USD913229S1 (en) 2019-04-24 2019-10-15 Heater for heating semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019009163F JP1646292S (en) 2019-04-24 2019-04-24

Publications (1)

Publication Number Publication Date
JP1646292S true JP1646292S (en) 2019-11-25

Family

ID=68610485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019009163F Active JP1646292S (en) 2019-04-24 2019-04-24

Country Status (2)

Country Link
US (1) USD913229S1 (en)
JP (1) JP1646292S (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD402156S (en) * 1996-02-02 1998-12-08 Ako-Werke Gmbh & Co. Kg Radiant stove heating element
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
JP3477062B2 (en) * 1997-12-26 2003-12-10 京セラ株式会社 Wafer heating device
USD423028S (en) * 1998-08-26 2000-04-18 Matsushita Electric Industrial Co., Ltd. Coil
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
JP2010080909A (en) * 2008-08-26 2010-04-08 Nuflare Technology Inc Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
USD693301S1 (en) * 2010-03-12 2013-11-12 Fluke Corporation Rogowski coil
JP1541874S (en) * 2015-03-16 2016-01-18
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Also Published As

Publication number Publication date
USD913229S1 (en) 2021-03-16

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