JP1497022S - - Google Patents
Info
- Publication number
- JP1497022S JP1497022S JPD2013-15946F JP2013015946F JP1497022S JP 1497022 S JP1497022 S JP 1497022S JP 2013015946 F JP2013015946 F JP 2013015946F JP 1497022 S JP1497022 S JP 1497022S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-15946F JP1497022S (Direct) | 2013-07-11 | 2013-07-11 | |
| US29/476,981 USD716741S1 (en) | 2013-07-11 | 2013-12-18 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-15946F JP1497022S (Direct) | 2013-07-11 | 2013-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1497022S true JP1497022S (Direct) | 2017-05-01 |
Family
ID=51798600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2013-15946F Active JP1497022S (Direct) | 2013-07-11 | 2013-07-11 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD716741S1 (Direct) |
| JP (1) | JP1497022S (Direct) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD745476S1 (en) * | 2012-10-19 | 2015-12-15 | Solumatics CVBA | Print board |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD319045S (en) * | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD319814S (en) * | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
| USD318461S (en) * | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
| USD319629S (en) * | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
| USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
| USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
| US6268618B1 (en) * | 1997-05-08 | 2001-07-31 | Showa Denko K.K. | Electrode for light-emitting semiconductor devices and method of producing the electrode |
| USD535264S1 (en) * | 2005-11-02 | 2007-01-16 | Supernova Optoelectronics Corp. | Electrode layer |
| USD533847S1 (en) * | 2005-11-02 | 2006-12-19 | Supernova Optoelectronics Corp. | Electrode layer |
| USD534506S1 (en) * | 2005-11-02 | 2007-01-02 | Supernova Optoelectronics Corp. | Electrode layer |
| USD532756S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
| USD532757S1 (en) * | 2005-11-02 | 2006-11-28 | Supernova Optoelectronics Corp. | Electrode layer |
| USD534134S1 (en) * | 2005-11-02 | 2006-12-26 | Supernova Optoelectronics Corp. | Electrode layer |
| JP2007189093A (ja) * | 2006-01-13 | 2007-07-26 | Disco Abrasive Syst Ltd | 半導体ウエーハ |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| USD598380S1 (en) * | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
| USD615927S1 (en) * | 2008-05-09 | 2010-05-18 | Fujifilm Corporation | Conductive sheet |
| USD613690S1 (en) * | 2008-12-09 | 2010-04-13 | Fujifilm Corporation | Conductive sheet |
| JP2011100922A (ja) * | 2009-11-09 | 2011-05-19 | Toshiba Corp | パターン形成方法、パターン形成システム及び半導体装置の製造方法 |
| CA138030S (en) * | 2010-08-17 | 2011-11-17 | Sumitomo Electric Industries | Semiconductor substrate |
| JP1441120S (Direct) * | 2010-08-17 | 2015-05-11 |
-
2013
- 2013-07-11 JP JPD2013-15946F patent/JP1497022S/ja active Active
- 2013-12-18 US US29/476,981 patent/USD716741S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD716741S1 (en) | 2014-11-04 |
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