JP1497021S - - Google Patents

Info

Publication number
JP1497021S
JP1497021S JPD2013-15944F JP2013015944F JP1497021S JP 1497021 S JP1497021 S JP 1497021S JP 2013015944 F JP2013015944 F JP 2013015944F JP 1497021 S JP1497021 S JP 1497021S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2013-15944F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2013-15944F priority Critical patent/JP1497021S/ja
Priority to US29/476,992 priority patent/USD716241S1/en
Application granted granted Critical
Publication of JP1497021S publication Critical patent/JP1497021S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2013-15944F 2013-07-11 2013-07-11 Active JP1497021S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2013-15944F JP1497021S (enrdf_load_stackoverflow) 2013-07-11 2013-07-11
US29/476,992 USD716241S1 (en) 2013-07-11 2013-12-18 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2013-15944F JP1497021S (enrdf_load_stackoverflow) 2013-07-11 2013-07-11

Publications (1)

Publication Number Publication Date
JP1497021S true JP1497021S (enrdf_load_stackoverflow) 2017-05-01

Family

ID=51753690

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2013-15944F Active JP1497021S (enrdf_load_stackoverflow) 2013-07-11 2013-07-11

Country Status (2)

Country Link
US (1) USD716241S1 (enrdf_load_stackoverflow)
JP (1) JP1497021S (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
USD783006S1 (en) * 2016-01-20 2017-04-04 World Products, Inc. Shorted ISM asymmetric omni antenna
USD787483S1 (en) * 2016-05-03 2017-05-23 Avery Dennison Retail Information Services, Llc Antenna design
USD787484S1 (en) * 2016-05-03 2017-05-23 Avery Dennison Retailinformation Services, Llc Antenna design
USD860175S1 (en) * 2018-03-14 2019-09-17 Megabyte Limited RFID tag inlay
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD319814S (en) * 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD318461S (en) * 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
USD319045S (en) * 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
USD328599S (en) * 1990-04-10 1992-08-11 Gemplus Card International Connecting terminal for chip cards
US6268618B1 (en) * 1997-05-08 2001-07-31 Showa Denko K.K. Electrode for light-emitting semiconductor devices and method of producing the electrode
USD532756S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
USD535264S1 (en) * 2005-11-02 2007-01-16 Supernova Optoelectronics Corp. Electrode layer
USD533847S1 (en) * 2005-11-02 2006-12-19 Supernova Optoelectronics Corp. Electrode layer
USD534506S1 (en) * 2005-11-02 2007-01-02 Supernova Optoelectronics Corp. Electrode layer
USD534134S1 (en) * 2005-11-02 2006-12-26 Supernova Optoelectronics Corp. Electrode layer
USD532757S1 (en) * 2005-11-02 2006-11-28 Supernova Optoelectronics Corp. Electrode layer
JP2007189093A (ja) * 2006-01-13 2007-07-26 Disco Abrasive Syst Ltd 半導体ウエーハ
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
JP2011100922A (ja) * 2009-11-09 2011-05-19 Toshiba Corp パターン形成方法、パターン形成システム及び半導体装置の製造方法
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
JP1441120S (enrdf_load_stackoverflow) * 2010-08-17 2015-05-11

Also Published As

Publication number Publication date
USD716241S1 (en) 2014-10-28

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