ITMI960594A0 - - Google Patents

Info

Publication number
ITMI960594A0
ITMI960594A0 ITMI960594A ITMI960594A ITMI960594A0 IT MI960594 A0 ITMI960594 A0 IT MI960594A0 IT MI960594 A ITMI960594 A IT MI960594A IT MI960594 A ITMI960594 A IT MI960594A IT MI960594 A0 ITMI960594 A0 IT MI960594A0
Authority
IT
Italy
Application number
ITMI960594A
Other languages
Italian (it)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of ITMI960594A0 publication Critical patent/ITMI960594A0/it
Publication of ITMI960594A1 publication Critical patent/ITMI960594A1/en
Application granted granted Critical
Publication of IT1283702B1 publication Critical patent/IT1283702B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Making Paper Articles (AREA)
IT96MI000594A 1995-03-29 1996-03-26 PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT PLATE ARRANGEMENT IT1283702B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19511486A DE19511486A1 (en) 1995-03-29 1995-03-29 Mfr. of laminated circuit boards e.g. for control units in motor vehicle engineering

Publications (3)

Publication Number Publication Date
ITMI960594A0 true ITMI960594A0 (en) 1996-03-26
ITMI960594A1 ITMI960594A1 (en) 1997-09-26
IT1283702B1 IT1283702B1 (en) 1998-04-30

Family

ID=7758034

Family Applications (1)

Application Number Title Priority Date Filing Date
IT96MI000594A IT1283702B1 (en) 1995-03-29 1996-03-26 PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT PLATE ARRANGEMENT

Country Status (3)

Country Link
DE (1) DE19511486A1 (en)
FR (1) FR2733656B1 (en)
IT (1) IT1283702B1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691277A5 (en) * 2000-02-29 2001-06-15 Ascom Ag Making printed circuit board bonded to heat sink, commences by bonding metal layer, insulating board and heat sink, before protecting heat sink and etching
DE10160041A1 (en) * 2001-12-06 2003-09-25 Marconi Comm Gmbh Electronic circuit module and method for its assembly
FR2835689A1 (en) * 2002-02-01 2003-08-08 Siemens Vdo Automotive Method of gluing a rigid integrated circuit on an aluminum plate, used in the fabrication of IC chips
US7416011B2 (en) 2005-01-27 2008-08-26 Delphi Technologies, Inc. Electronic assembly having a substrate laminated within a backplate cavity
DE102005048702B4 (en) * 2005-10-11 2014-02-20 Continental Automotive Gmbh Electrical arrangement of two electrically conductive joining partners and method for fixing a plate on a base plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148788A (en) * 1988-11-29 1990-06-07 Fuji Photo Film Co Ltd Processing method for metal printed wiring board
DE4035526A1 (en) * 1990-11-08 1992-05-14 Bosch Gmbh Robert Electronic circuit module for motor vehicle - is based on flexible circuit foil with heat sinking aluminium@ plates
EP0586841A1 (en) * 1992-07-30 1994-03-16 Reichle + De-Massari AG Elektro-Ingenieure Printed circuit board and mounting module for connection of a shielded cable and distribution system for low-voltage installation construction
JP2734318B2 (en) * 1992-10-09 1998-03-30 太陽誘電株式会社 Manufacturing method of hybrid integrated circuit device

Also Published As

Publication number Publication date
FR2733656A1 (en) 1996-10-31
DE19511486A1 (en) 1996-10-02
IT1283702B1 (en) 1998-04-30
ITMI960594A1 (en) 1997-09-26
FR2733656B1 (en) 1999-06-25

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Legal Events

Date Code Title Description
0001 Granted