ITMI20111363A1 - TIGHTENING DEVICE - Google Patents
TIGHTENING DEVICEInfo
- Publication number
- ITMI20111363A1 ITMI20111363A1 ITMI20111363A ITMI20111363A1 IT MI20111363 A1 ITMI20111363 A1 IT MI20111363A1 IT MI20111363 A ITMI20111363 A IT MI20111363A IT MI20111363 A1 ITMI20111363 A1 IT MI20111363A1
- Authority
- IT
- Italy
- Prior art keywords
- tightening device
- tightening
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT12682010A AT510195B1 (en) | 2010-07-28 | 2010-07-28 | JIG |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20111363A1 true ITMI20111363A1 (en) | 2012-01-29 |
Family
ID=44898790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI20111363 ITMI20111363A1 (en) | 2010-07-28 | 2011-07-21 | TIGHTENING DEVICE |
Country Status (3)
Country | Link |
---|---|
AT (1) | AT510195B1 (en) |
DE (1) | DE102011076879B4 (en) |
IT (1) | ITMI20111363A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018207033B3 (en) * | 2018-05-07 | 2019-07-04 | Siemens Aktiengesellschaft | Arrangement of electrical modules, power converters and aircraft with such an arrangement and method for producing the arrangement |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8812158U1 (en) * | 1988-09-26 | 1988-12-22 | Siemens AG, 1000 Berlin und 8000 München | Cooling device for transistors |
US5068764A (en) * | 1990-03-05 | 1991-11-26 | Thermalloy Incorporated | Electronic device package mounting assembly |
US5040096A (en) * | 1990-06-07 | 1991-08-13 | Aavid Engineering, Inc. | High force clip |
US5466970A (en) * | 1992-08-24 | 1995-11-14 | Thermalloy, Inc. | Hooked spring clip |
US5896270A (en) * | 1997-05-21 | 1999-04-20 | Artesyn Technologies, Inc. | Heat sink spring clip |
IT1292590B1 (en) * | 1997-05-30 | 1999-02-08 | El Bo Mec S R L | HEAT SINK, IN PARTICULAR FOR ELECTRONIC COMPONENTS. |
US6266244B1 (en) * | 1999-10-25 | 2001-07-24 | Harman International Industries Incorporated | Mounting method and apparatus for electrical components |
-
2010
- 2010-07-28 AT AT12682010A patent/AT510195B1/en not_active IP Right Cessation
-
2011
- 2011-06-01 DE DE201110076879 patent/DE102011076879B4/en not_active Expired - Fee Related
- 2011-07-21 IT ITMI20111363 patent/ITMI20111363A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE102011076879A1 (en) | 2012-02-02 |
DE102011076879B4 (en) | 2014-07-31 |
AT510195A1 (en) | 2012-02-15 |
AT510195B1 (en) | 2013-08-15 |
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