ITMI20020016A0 - Vano ermetico per l'elettronica di un apparecchio di comando integrato per autoveioli - Google Patents

Vano ermetico per l'elettronica di un apparecchio di comando integrato per autoveioli

Info

Publication number
ITMI20020016A0
ITMI20020016A0 IT2002MI000016A ITMI20020016A ITMI20020016A0 IT MI20020016 A0 ITMI20020016 A0 IT MI20020016A0 IT 2002MI000016 A IT2002MI000016 A IT 2002MI000016A IT MI20020016 A ITMI20020016 A IT MI20020016A IT MI20020016 A0 ITMI20020016 A0 IT MI20020016A0
Authority
IT
Italy
Prior art keywords
electronics
motor vehicles
control equipment
integrated control
hermetic compartment
Prior art date
Application number
IT2002MI000016A
Other languages
English (en)
Inventor
Frank Franzen
Michael Fertl
Detlef Haupt
Hans-Juergen Siegl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ITMI20020016A0 publication Critical patent/ITMI20020016A0/it
Publication of ITMI20020016A1 publication Critical patent/ITMI20020016A1/it

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239Electronic boxes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145Organic substrates, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H61/00Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745Recess in conductor, e.g. in pad or in metallic substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/049Wire bonding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
IT2002MI000016A 2001-01-10 2002-01-08 Vano ermetico per l'elettronica di un apparecchio di comando integrato per autoveioli ITMI20020016A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10100823A DE10100823C1 (de) 2001-01-10 2001-01-10 Dichter Elektronikraum für integriertes Kraftfahrzeug-Steuergerät

Publications (2)

Publication Number Publication Date
ITMI20020016A0 true ITMI20020016A0 (it) 2002-01-08
ITMI20020016A1 ITMI20020016A1 (it) 2003-07-08

Family

ID=7670134

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2002MI000016A ITMI20020016A1 (it) 2001-01-10 2002-01-08 Vano ermetico per l'elettronica di un apparecchio di comando integrato per autoveioli

Country Status (3)

Country Link
DE (1) DE10100823C1 (it)
FR (1) FR2819370B1 (it)
IT (1) ITMI20020016A1 (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004021931A1 (de) * 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung
DE102004036683A1 (de) * 2004-07-28 2006-03-30 Siemens Ag Steuervorrichtung, insbesondere mechatronisches Getriebe- oder Motorsteuergerät
DE102005003448B4 (de) * 2005-01-25 2015-08-20 Continental Automotive Gmbh Systemkomponente eines Steuergerätes und Steuergerät mit einer solchen Systemkomponente
WO2008006637A1 (de) * 2006-07-10 2008-01-17 Continental Automotive Gmbh Elektronische ansteuerungsvorrichtung für ein automatikgetriebe
DE102006033269B4 (de) * 2006-07-18 2010-10-28 Continental Automotive Gmbh Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper
WO2008022822A1 (de) * 2006-08-21 2008-02-28 Continental Automotive Gmbh Vorrichtung mit grundkörper und deckel, verfahren zur herstellung der vorrichtung, verwendung der vorrichtung
JPWO2008096450A1 (ja) * 2007-02-09 2010-05-20 パナソニック株式会社 回路基板、積層回路基板および電子機器
DE102007017529B4 (de) * 2007-04-13 2012-04-26 Continental Automotive Gmbh Modul für eine elektronische Steuervorrichtung mit vereinfachtem Aufbau, Verfahren zur Herstellung sowie Verwendung eines solchen Moduls
DE102007042593B4 (de) 2007-09-07 2018-10-31 Continental Automotive Gmbh Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau
DE102008058287B4 (de) * 2008-11-20 2010-09-16 Continental Automotive Gmbh Elektronisches Modul mit einem Dichtelement und Verfahren zum Herstellen des Moduls
DE102011089474A1 (de) * 2011-12-21 2013-06-27 Robert Bosch Gmbh Elektronikmodul für ein Fahrzeug
DE102021208574A1 (de) 2021-08-06 2023-02-09 Zf Friedrichshafen Ag Elektrische Steuervorrichtung für ölhaltige Umgebungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317478A (en) * 1991-11-12 1994-05-31 Hughes Aircraft Company Hermetic sealing of flexprint electronic packages
JPH07297575A (ja) * 1994-04-21 1995-11-10 Mitsubishi Electric Corp パワーモジュール装置
DE19542883C2 (de) * 1995-02-02 2002-01-17 Fraunhofer Ges Forschung Chip-Gehäusung sowie Verfahren zur Herstellung einer Chip-Gehäusung
DE19712842C1 (de) * 1997-03-26 1998-08-13 Siemens Ag Steuergerät für ein Kraftfahrzeug
DE19907949C2 (de) * 1999-02-24 2002-11-07 Siemens Ag Steuergerät für ein Kraftfahrzeug

Also Published As

Publication number Publication date
FR2819370A1 (fr) 2002-07-12
FR2819370B1 (fr) 2005-06-03
DE10100823C1 (de) 2002-02-28
ITMI20020016A1 (it) 2003-07-08

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