FR2819370B1 - Compartiment d'electronique etanche pour appareil de commande integre pour vehicule automobile - Google Patents

Compartiment d'electronique etanche pour appareil de commande integre pour vehicule automobile

Info

Publication number
FR2819370B1
FR2819370B1 FR0200207A FR0200207A FR2819370B1 FR 2819370 B1 FR2819370 B1 FR 2819370B1 FR 0200207 A FR0200207 A FR 0200207A FR 0200207 A FR0200207 A FR 0200207A FR 2819370 B1 FR2819370 B1 FR 2819370B1
Authority
FR
France
Prior art keywords
motor vehicle
control apparatus
integrated control
sealed electronic
electronic compartment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0200207A
Other languages
English (en)
Other versions
FR2819370A1 (fr
Inventor
Michael Ferstl
Detlef Haupt
Frank Franzen
Hans Jurgen Siegl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2819370A1 publication Critical patent/FR2819370A1/fr
Application granted granted Critical
Publication of FR2819370B1 publication Critical patent/FR2819370B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
FR0200207A 2001-01-10 2002-01-09 Compartiment d'electronique etanche pour appareil de commande integre pour vehicule automobile Expired - Fee Related FR2819370B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10100823A DE10100823C1 (de) 2001-01-10 2001-01-10 Dichter Elektronikraum für integriertes Kraftfahrzeug-Steuergerät

Publications (2)

Publication Number Publication Date
FR2819370A1 FR2819370A1 (fr) 2002-07-12
FR2819370B1 true FR2819370B1 (fr) 2005-06-03

Family

ID=7670134

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0200207A Expired - Fee Related FR2819370B1 (fr) 2001-01-10 2002-01-09 Compartiment d'electronique etanche pour appareil de commande integre pour vehicule automobile

Country Status (3)

Country Link
DE (1) DE10100823C1 (fr)
FR (1) FR2819370B1 (fr)
IT (1) ITMI20020016A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004021931A1 (de) * 2004-03-16 2005-10-06 Robert Bosch Gmbh Gehäuse für eine elektronische Schaltung
DE102004036683A1 (de) * 2004-07-28 2006-03-30 Siemens Ag Steuervorrichtung, insbesondere mechatronisches Getriebe- oder Motorsteuergerät
DE102005003448B4 (de) 2005-01-25 2015-08-20 Continental Automotive Gmbh Systemkomponente eines Steuergerätes und Steuergerät mit einer solchen Systemkomponente
WO2008006637A1 (fr) * 2006-07-10 2008-01-17 Continental Automotive Gmbh Dispositif de commande électronique pour une boîte de vitesses automatique
DE102006033269B4 (de) 2006-07-18 2010-10-28 Continental Automotive Gmbh Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper
WO2008022822A1 (fr) * 2006-08-21 2008-02-28 Continental Automotive Gmbh dispositif doté d'un corps de base et d'un couvercle, procédé de fabrication du dispositif et utilisation du dispositif
EP2129195A4 (fr) * 2007-02-09 2011-06-15 Panasonic Corp Carte de circuit imprimé, carte de circuit imprimé multicouche et dispositif électronique
DE102007017529B4 (de) * 2007-04-13 2012-04-26 Continental Automotive Gmbh Modul für eine elektronische Steuervorrichtung mit vereinfachtem Aufbau, Verfahren zur Herstellung sowie Verwendung eines solchen Moduls
DE102007042593B4 (de) 2007-09-07 2018-10-31 Continental Automotive Gmbh Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau
DE102008058287B4 (de) * 2008-11-20 2010-09-16 Continental Automotive Gmbh Elektronisches Modul mit einem Dichtelement und Verfahren zum Herstellen des Moduls
DE102011089474A1 (de) * 2011-12-21 2013-06-27 Robert Bosch Gmbh Elektronikmodul für ein Fahrzeug
DE102021208574A1 (de) 2021-08-06 2023-02-09 Zf Friedrichshafen Ag Elektrische Steuervorrichtung für ölhaltige Umgebungen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317478A (en) * 1991-11-12 1994-05-31 Hughes Aircraft Company Hermetic sealing of flexprint electronic packages
JPH07297575A (ja) * 1994-04-21 1995-11-10 Mitsubishi Electric Corp パワーモジュール装置
DE19542883C2 (de) * 1995-02-02 2002-01-17 Fraunhofer Ges Forschung Chip-Gehäusung sowie Verfahren zur Herstellung einer Chip-Gehäusung
DE19712842C1 (de) * 1997-03-26 1998-08-13 Siemens Ag Steuergerät für ein Kraftfahrzeug
DE19907949C2 (de) * 1999-02-24 2002-11-07 Siemens Ag Steuergerät für ein Kraftfahrzeug

Also Published As

Publication number Publication date
FR2819370A1 (fr) 2002-07-12
DE10100823C1 (de) 2002-02-28
ITMI20020016A0 (it) 2002-01-08
ITMI20020016A1 (it) 2003-07-08

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100930