ITMI20002086A0 - GLUEING PROCEDURE - Google Patents

GLUEING PROCEDURE

Info

Publication number
ITMI20002086A0
ITMI20002086A0 IT2000MI002086A ITMI20002086A ITMI20002086A0 IT MI20002086 A0 ITMI20002086 A0 IT MI20002086A0 IT 2000MI002086 A IT2000MI002086 A IT 2000MI002086A IT MI20002086 A ITMI20002086 A IT MI20002086A IT MI20002086 A0 ITMI20002086 A0 IT MI20002086A0
Authority
IT
Italy
Prior art keywords
glueing
procedure
glueing procedure
Prior art date
Application number
IT2000MI002086A
Other languages
Italian (it)
Inventor
Krause Dieter
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ITMI20002086A0 publication Critical patent/ITMI20002086A0/en
Publication of ITMI20002086A1 publication Critical patent/ITMI20002086A1/en
Application granted granted Critical
Publication of IT1318929B1 publication Critical patent/IT1318929B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
  • Saccharide Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
IT2000MI002086A 1999-09-29 2000-09-26 GLUING PROCEDURE IT1318929B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19946745A DE19946745C1 (en) 1999-09-29 1999-09-29 Surface bonding, for use in e.g. circuit boards, uses laid adhesive strand between surfaces forming sealed zone where pressure difference is formed through surface opening to press surfaces together without mechanical or manual pressures

Publications (3)

Publication Number Publication Date
ITMI20002086A0 true ITMI20002086A0 (en) 2000-09-26
ITMI20002086A1 ITMI20002086A1 (en) 2002-03-26
IT1318929B1 IT1318929B1 (en) 2003-09-19

Family

ID=7923759

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2000MI002086A IT1318929B1 (en) 1999-09-29 2000-09-26 GLUING PROCEDURE

Country Status (3)

Country Link
DE (1) DE19946745C1 (en)
FR (1) FR2798935A1 (en)
IT (1) IT1318929B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2961519B1 (en) 2010-06-18 2012-07-06 Commissariat Energie Atomique CALIBRATION METHOD IN THICKNESS BETWEEN AT LEAST TWO SUBSTRATES
EP2521430A1 (en) * 2011-05-06 2012-11-07 Pierburg Pump Technology GmbH Method for fixing a PCB to a body and pump driven by an electric motor
EP3258596A1 (en) * 2016-06-16 2017-12-20 Morgonsol Väst AB Photovoltaic thermal plant
DE102019132433B4 (en) * 2019-11-29 2021-08-12 Marcel P. HOFSAESS Temperature dependent switch and process for its manufacture

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899377A (en) * 1971-10-20 1975-08-12 Penelope Jane Vesey Luc Bonding aluminium
JPS5757767A (en) * 1980-09-24 1982-04-07 Matsushita Electric Ind Co Ltd Bonding method
JPS5847075A (en) * 1981-09-16 1983-03-18 Mitsubishi Heavy Ind Ltd Bonding process
DE3425853A1 (en) * 1984-07-13 1985-05-02 Gerd 2000 Hamburg Schulz Attachment device by negative pressure on surfaces made of materials which are impermeable to air
DE3803636A1 (en) * 1988-02-06 1989-04-06 Daimler Benz Ag Method and arrangement for adhesively bonding layers of soft material onto three-dimensionally curved sheet-metal components
DE3937943A1 (en) * 1989-11-15 1991-05-16 Nokia Unterhaltungselektronik Liq. crystal cell substrate plate bonding - uses under-pressure to extract air from hollow zone for atmospheric pressure bonding
FR2659344A1 (en) * 1990-03-09 1991-09-13 Thomson Csf Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use
US5176778A (en) * 1991-03-26 1993-01-05 Harold Curtis Method for making fiberglass articles
US5515188A (en) * 1994-06-03 1996-05-07 Motorola, Inc. Method of manufacturing a liquid crystal display device in which a vacuum reservoir attached to the LCD is placed in a conformable container or bag
DE19622684A1 (en) * 1996-06-05 1997-12-11 Siemens Ag Process for producing mechanically strong adhesive bonds between surfaces
FI105845B (en) * 1997-11-26 2000-10-13 Wimacor Oy Process for producing multilayer elements and multilayer elements

Also Published As

Publication number Publication date
ITMI20002086A1 (en) 2002-03-26
FR2798935A1 (en) 2001-03-30
IT1318929B1 (en) 2003-09-19
DE19946745C1 (en) 2001-04-05

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