ITMI20001044A0 - Dispositivo integrato con struttura d'isolamento a trench e relativo processo di realizzazione. - Google Patents
Dispositivo integrato con struttura d'isolamento a trench e relativo processo di realizzazione.Info
- Publication number
- ITMI20001044A0 ITMI20001044A0 IT2000MI001044A ITMI20001044A ITMI20001044A0 IT MI20001044 A0 ITMI20001044 A0 IT MI20001044A0 IT 2000MI001044 A IT2000MI001044 A IT 2000MI001044A IT MI20001044 A ITMI20001044 A IT MI20001044A IT MI20001044 A0 ITMI20001044 A0 IT MI20001044A0
- Authority
- IT
- Italy
- Prior art keywords
- manufacturing process
- isolation structure
- trench isolation
- integrated device
- related manufacturing
- Prior art date
Links
- 238000002955 isolation Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/763—Polycrystalline semiconductor regions
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Pressure Sensors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2000MI001044A IT1317516B1 (it) | 2000-05-11 | 2000-05-11 | Dispositivo integrato con struttura d'isolamento a trench e relativoprocesso di realizzazione. |
US09/853,833 US6798037B2 (en) | 2000-05-11 | 2001-05-10 | Isolation trench structure for integrated devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2000MI001044A IT1317516B1 (it) | 2000-05-11 | 2000-05-11 | Dispositivo integrato con struttura d'isolamento a trench e relativoprocesso di realizzazione. |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI20001044A0 true ITMI20001044A0 (it) | 2000-05-11 |
ITMI20001044A1 ITMI20001044A1 (it) | 2001-11-11 |
IT1317516B1 IT1317516B1 (it) | 2003-07-09 |
Family
ID=11445026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2000MI001044A IT1317516B1 (it) | 2000-05-11 | 2000-05-11 | Dispositivo integrato con struttura d'isolamento a trench e relativoprocesso di realizzazione. |
Country Status (2)
Country | Link |
---|---|
US (1) | US6798037B2 (it) |
IT (1) | IT1317516B1 (it) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7454760B2 (en) * | 2002-04-22 | 2008-11-18 | Rosebud Lms, Inc. | Method and software for enabling n-way collaborative work over a network of computers |
US7902630B2 (en) * | 2002-08-14 | 2011-03-08 | Advanced Analogic Technologies, Inc. | Isolated bipolar transistor |
US7741661B2 (en) * | 2002-08-14 | 2010-06-22 | Advanced Analogic Technologies, Inc. | Isolation and termination structures for semiconductor die |
US7812403B2 (en) * | 2002-08-14 | 2010-10-12 | Advanced Analogic Technologies, Inc. | Isolation structures for integrated circuit devices |
US7825488B2 (en) * | 2006-05-31 | 2010-11-02 | Advanced Analogic Technologies, Inc. | Isolation structures for integrated circuits and modular methods of forming the same |
US20080197408A1 (en) * | 2002-08-14 | 2008-08-21 | Advanced Analogic Technologies, Inc. | Isolated quasi-vertical DMOS transistor |
US8089129B2 (en) * | 2002-08-14 | 2012-01-03 | Advanced Analogic Technologies, Inc. | Isolated CMOS transistors |
US7667268B2 (en) * | 2002-08-14 | 2010-02-23 | Advanced Analogic Technologies, Inc. | Isolated transistor |
US7956391B2 (en) * | 2002-08-14 | 2011-06-07 | Advanced Analogic Technologies, Inc. | Isolated junction field-effect transistor |
US7939420B2 (en) * | 2002-08-14 | 2011-05-10 | Advanced Analogic Technologies, Inc. | Processes for forming isolation structures for integrated circuit devices |
US7834421B2 (en) * | 2002-08-14 | 2010-11-16 | Advanced Analogic Technologies, Inc. | Isolated diode |
US8513087B2 (en) * | 2002-08-14 | 2013-08-20 | Advanced Analogic Technologies, Incorporated | Processes for forming isolation structures for integrated circuit devices |
US6815714B1 (en) * | 2003-02-20 | 2004-11-09 | National Semiconductor Corporation | Conductive structure in a semiconductor material |
JP4326835B2 (ja) * | 2003-05-20 | 2009-09-09 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び半導体装置の製造プロセス評価方法 |
DE102004004512B4 (de) * | 2004-01-23 | 2008-07-10 | Atmel Germany Gmbh | Integrierte Schaltung mit lateraler dielektrischer Isolation aktiver Bereiche über elektrisch kontaktiertem vergrabenem Material und Herstellungsverfahren |
US20060076629A1 (en) * | 2004-10-07 | 2006-04-13 | Hamza Yilmaz | Semiconductor devices with isolation and sinker regions containing trenches filled with conductive material |
US7256119B2 (en) * | 2005-05-20 | 2007-08-14 | Semiconductor Components Industries, L.L.C. | Semiconductor device having trench structures and method |
KR100867977B1 (ko) | 2006-10-11 | 2008-11-10 | 한국과학기술원 | 인도시아닌 그린 혈중 농도 역학을 이용한 조직 관류 분석장치 및 그를 이용한 조직 관류 분석방법 |
US7550361B2 (en) * | 2007-01-02 | 2009-06-23 | International Business Machines Corporation | Trench structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
US7737526B2 (en) * | 2007-03-28 | 2010-06-15 | Advanced Analogic Technologies, Inc. | Isolated trench MOSFET in epi-less semiconductor sustrate |
US7868414B2 (en) * | 2007-03-28 | 2011-01-11 | Advanced Analogic Technologies, Inc. | Isolated bipolar transistor |
US8652925B2 (en) * | 2010-07-19 | 2014-02-18 | International Business Machines Corporation | Method of fabricating isolated capacitors and structure thereof |
US8921202B2 (en) * | 2011-01-07 | 2014-12-30 | Vanguard International Semiconductor Corporation | Semiconductor device and fabrication method thereof |
US10262997B2 (en) * | 2017-09-14 | 2019-04-16 | Vanguard International Semiconductor Corporation | High-voltage LDMOSFET devices having polysilicon trench-type guard rings |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4980747A (en) * | 1986-12-22 | 1990-12-25 | Texas Instruments Inc. | Deep trench isolation with surface contact to substrate |
JPH05109886A (ja) * | 1991-10-17 | 1993-04-30 | N M B Semiconductor:Kk | フイールドシールド分離構造の半導体装置およびその製造方法 |
US5665633A (en) * | 1995-04-06 | 1997-09-09 | Motorola, Inc. | Process for forming a semiconductor device having field isolation |
-
2000
- 2000-05-11 IT IT2000MI001044A patent/IT1317516B1/it active
-
2001
- 2001-05-10 US US09/853,833 patent/US6798037B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6798037B2 (en) | 2004-09-28 |
US20020008299A1 (en) | 2002-01-24 |
ITMI20001044A1 (it) | 2001-11-11 |
IT1317516B1 (it) | 2003-07-09 |
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