IT985188B - Procedimento per la produzione di raddrizzatori a semicondut tore con elevata tensione di scarica inversa - Google Patents
Procedimento per la produzione di raddrizzatori a semicondut tore con elevata tensione di scarica inversaInfo
- Publication number
- IT985188B IT985188B IT50063/73A IT5006373A IT985188B IT 985188 B IT985188 B IT 985188B IT 50063/73 A IT50063/73 A IT 50063/73A IT 5006373 A IT5006373 A IT 5006373A IT 985188 B IT985188 B IT 985188B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- production
- discharge voltage
- high reverse
- reverse discharge
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/054—Flat sheets-substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Weting (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47051435A JPS519269B2 (it) | 1972-05-19 | 1972-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT985188B true IT985188B (it) | 1974-11-30 |
Family
ID=12886837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT50063/73A IT985188B (it) | 1972-05-19 | 1973-05-18 | Procedimento per la produzione di raddrizzatori a semicondut tore con elevata tensione di scarica inversa |
Country Status (7)
Country | Link |
---|---|
US (1) | US3929531A (it) |
JP (1) | JPS519269B2 (it) |
CA (1) | CA980916A (it) |
DE (1) | DE2325351C3 (it) |
FR (1) | FR2185859B1 (it) |
GB (1) | GB1367030A (it) |
IT (1) | IT985188B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2359511C2 (de) * | 1973-11-29 | 1987-03-05 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum lokalisierten Ätzen von Gräben in Siliciumkristallen |
FR2294549A1 (fr) * | 1974-12-09 | 1976-07-09 | Radiotechnique Compelec | Procede de realisation de dispositifs optoelectroniques |
JPS594405Y2 (ja) * | 1978-07-14 | 1984-02-08 | 株式会社東海理化電機製作所 | スイツチ装置 |
US4319265A (en) * | 1979-12-06 | 1982-03-09 | The United States Of America As Represented By The Secretary Of The Army | Monolithically interconnected series-parallel avalanche diodes |
JPS59146114A (ja) * | 1984-02-06 | 1984-08-21 | 松下電器産業株式会社 | スイツチ |
JPS63192632U (it) * | 1987-05-29 | 1988-12-12 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1193766B (de) * | 1961-01-27 | 1965-05-26 | Siemens Ag | Verfahren zur Stabilisierung der durch AEtzen erzielten Sperreigenschaften von Halbleiteranordnungen |
DE1287404B (de) * | 1961-07-06 | 1969-01-16 | Licentia Gmbh | Verfahren zum Vorbereiten von Siliziumkoerpern fuer das Dotieren durch AEtzen |
DE1258235B (de) * | 1965-01-04 | 1968-01-04 | Licentia Gmbh | Verfahren zur Herstellung einer, die Sperrspannungsfestigkeit erhoehenden Randzonenprofilierung von Siliziumscheiben |
US3597289A (en) * | 1967-01-19 | 1971-08-03 | Licentia Gmbh | Method of etching a semiconductor body |
GB1139154A (en) * | 1967-01-30 | 1969-01-08 | Westinghouse Brake & Signal | Semi-conductor devices and the manufacture thereof |
US3666548A (en) * | 1970-01-06 | 1972-05-30 | Ibm | Monocrystalline semiconductor body having dielectrically isolated regions and method of forming |
US3627598A (en) * | 1970-02-05 | 1971-12-14 | Fairchild Camera Instr Co | Nitride passivation of mesa transistors by phosphovapox lifting |
US3699402A (en) * | 1970-07-27 | 1972-10-17 | Gen Electric | Hybrid circuit power module |
NL167277C (nl) * | 1970-08-29 | 1981-11-16 | Philips Nv | Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting. |
US3689993A (en) * | 1971-07-26 | 1972-09-12 | Texas Instruments Inc | Fabrication of semiconductor devices having low thermal inpedance bonds to heat sinks |
US3791948A (en) * | 1971-11-01 | 1974-02-12 | Bell Telephone Labor Inc | Preferential etching in g a p |
US3859127A (en) * | 1972-01-24 | 1975-01-07 | Motorola Inc | Method and material for passivating the junctions of mesa type semiconductor devices |
-
1972
- 1972-05-19 JP JP47051435A patent/JPS519269B2/ja not_active Expired
-
1973
- 1973-05-14 US US360080A patent/US3929531A/en not_active Expired - Lifetime
- 1973-05-15 GB GB2307873A patent/GB1367030A/en not_active Expired
- 1973-05-17 FR FR7317900A patent/FR2185859B1/fr not_active Expired
- 1973-05-18 CA CA171,820A patent/CA980916A/en not_active Expired
- 1973-05-18 IT IT50063/73A patent/IT985188B/it active
- 1973-05-18 DE DE2325351A patent/DE2325351C3/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2185859A1 (it) | 1974-01-04 |
DE2325351A1 (de) | 1973-11-29 |
US3929531A (en) | 1975-12-30 |
JPS519269B2 (it) | 1976-03-25 |
CA980916A (en) | 1975-12-30 |
DE2325351B2 (de) | 1980-05-22 |
DE2325351C3 (de) | 1981-01-29 |
FR2185859B1 (it) | 1977-11-10 |
GB1367030A (en) | 1974-09-18 |
JPS499977A (it) | 1974-01-29 |
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