IT974539B - Dispositivo semiconduttore con componenti semiconduttori alli meati in un piano in particola re con componenti raddrizzatori - Google Patents
Dispositivo semiconduttore con componenti semiconduttori alli meati in un piano in particola re con componenti raddrizzatoriInfo
- Publication number
- IT974539B IT974539B IT3075771A IT3075771A IT974539B IT 974539 B IT974539 B IT 974539B IT 3075771 A IT3075771 A IT 3075771A IT 3075771 A IT3075771 A IT 3075771A IT 974539 B IT974539 B IT 974539B
- Authority
- IT
- Italy
- Prior art keywords
- components
- semiconductive
- meati
- plan
- rectifier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Packages (AREA)
- Control Of Conveyors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702054677 DE2054677B2 (de) | 1970-11-06 | 1970-11-06 | Verfahren zum herstellen von halbleitergleichrichteranordnungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT974539B true IT974539B (it) | 1974-07-10 |
Family
ID=5787370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT3075771A IT974539B (it) | 1970-11-06 | 1971-11-05 | Dispositivo semiconduttore con componenti semiconduttori alli meati in un piano in particola re con componenti raddrizzatori |
Country Status (7)
| Country | Link |
|---|---|
| BR (1) | BR7107150D0 (xx) |
| DE (1) | DE2054677B2 (xx) |
| ES (1) | ES396126A2 (xx) |
| FR (1) | FR2119924B1 (xx) |
| GB (1) | GB1318808A (xx) |
| IT (1) | IT974539B (xx) |
| SE (1) | SE363541B (xx) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5038453A (en) * | 1988-07-22 | 1991-08-13 | Rohm Co., Ltd. | Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor |
-
1970
- 1970-11-06 DE DE19702054677 patent/DE2054677B2/de not_active Ceased
-
1971
- 1971-10-07 ES ES396126A patent/ES396126A2/es not_active Expired
- 1971-10-26 BR BR715071A patent/BR7107150D0/pt unknown
- 1971-11-04 FR FR7139498A patent/FR2119924B1/fr not_active Expired
- 1971-11-04 SE SE1409571A patent/SE363541B/xx unknown
- 1971-11-04 GB GB5125471A patent/GB1318808A/en not_active Expired
- 1971-11-05 IT IT3075771A patent/IT974539B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| ES396126A2 (es) | 1974-05-01 |
| DE2054677B2 (de) | 1977-12-22 |
| BR7107150D0 (pt) | 1973-04-17 |
| GB1318808A (en) | 1973-05-31 |
| FR2119924A6 (xx) | 1972-08-11 |
| SE363541B (xx) | 1974-01-21 |
| DE2054677A1 (de) | 1972-05-10 |
| FR2119924B1 (xx) | 1978-06-02 |
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