IT961375B - METHOD OF PRODUCING ELECTRICAL CONDUCTOR ARRANGEMENTS FOR PRINTED CIRCUITS - Google Patents

METHOD OF PRODUCING ELECTRICAL CONDUCTOR ARRANGEMENTS FOR PRINTED CIRCUITS

Info

Publication number
IT961375B
IT961375B IT5149172A IT5149172A IT961375B IT 961375 B IT961375 B IT 961375B IT 5149172 A IT5149172 A IT 5149172A IT 5149172 A IT5149172 A IT 5149172A IT 961375 B IT961375 B IT 961375B
Authority
IT
Italy
Prior art keywords
electrical conductor
printed circuits
producing electrical
conductor arrangements
arrangements
Prior art date
Application number
IT5149172A
Other languages
Italian (it)
Original Assignee
Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd filed Critical Lucas Industries Ltd
Application granted granted Critical
Publication of IT961375B publication Critical patent/IT961375B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IT5149172A 1971-07-14 1972-07-12 METHOD OF PRODUCING ELECTRICAL CONDUCTOR ARRANGEMENTS FOR PRINTED CIRCUITS IT961375B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3293271 1971-07-14

Publications (1)

Publication Number Publication Date
IT961375B true IT961375B (en) 1973-12-10

Family

ID=10346136

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5149172A IT961375B (en) 1971-07-14 1972-07-12 METHOD OF PRODUCING ELECTRICAL CONDUCTOR ARRANGEMENTS FOR PRINTED CIRCUITS

Country Status (4)

Country Link
JP (1) JPS4831462A (en)
DE (1) DE2234408A1 (en)
FR (1) FR2145720B1 (en)
IT (1) IT961375B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332376A (en) * 1976-09-07 1978-03-27 Tokyo Shibaura Electric Co Electric device substrate
JPS5436576A (en) * 1977-08-26 1979-03-17 Shin Kobe Electric Machinery Laminated board for printed wiring circuit with resistance body
FR2462026A1 (en) * 1979-07-23 1981-02-06 Lignes Telegraph Telephon Thin film hybrid circuit mfr. on steel substrate - by multistep process of layer deposition by cathode sputtering
JPH04355990A (en) * 1990-09-18 1992-12-09 Fujitsu Ltd Circuit board and manufacture thereof
CN1290384C (en) * 2003-05-26 2006-12-13 王立华 Printed circuit boarsd with high-radiating metallized holes with Al or Mg or their alloy basement and production thereof

Also Published As

Publication number Publication date
FR2145720A1 (en) 1973-02-23
FR2145720B1 (en) 1976-01-16
DE2234408A1 (en) 1973-01-25
JPS4831462A (en) 1973-04-25

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