IT9053322V0 - Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico - Google Patents

Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico

Info

Publication number
IT9053322V0
IT9053322V0 IT5332290U IT5332290U IT9053322V0 IT 9053322 V0 IT9053322 V0 IT 9053322V0 IT 5332290 U IT5332290 U IT 5332290U IT 5332290 U IT5332290 U IT 5332290U IT 9053322 V0 IT9053322 V0 IT 9053322V0
Authority
IT
Italy
Prior art keywords
electronic power
power components
fixing electronic
thermal dissipator
dissipator
Prior art date
Application number
IT5332290U
Other languages
English (en)
Other versions
IT220643Z2 (it
IT9053322U1 (it
Inventor
Edoardo Dolcet
Original Assignee
Marelli Autronica
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marelli Autronica filed Critical Marelli Autronica
Priority to IT5332290U priority Critical patent/IT220643Z2/it
Publication of IT9053322V0 publication Critical patent/IT9053322V0/it
Priority to EP91830434A priority patent/EP0483080A1/en
Publication of IT9053322U1 publication Critical patent/IT9053322U1/it
Application granted granted Critical
Publication of IT220643Z2 publication Critical patent/IT220643Z2/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT5332290U 1990-10-22 1990-10-22 Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico IT220643Z2 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT5332290U IT220643Z2 (it) 1990-10-22 1990-10-22 Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico
EP91830434A EP0483080A1 (en) 1990-10-22 1991-10-15 A device for fastening electronic power components to a heatsink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT5332290U IT220643Z2 (it) 1990-10-22 1990-10-22 Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico

Publications (3)

Publication Number Publication Date
IT9053322V0 true IT9053322V0 (it) 1990-10-22
IT9053322U1 IT9053322U1 (it) 1992-04-22
IT220643Z2 IT220643Z2 (it) 1993-10-07

Family

ID=11281785

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5332290U IT220643Z2 (it) 1990-10-22 1990-10-22 Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico

Country Status (2)

Country Link
EP (1) EP0483080A1 (it)
IT (1) IT220643Z2 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103391703B (zh) * 2012-05-11 2017-08-18 尼得科控制技术有限公司 夹紧装置
JP6622785B2 (ja) 2017-12-19 2019-12-18 ファナック株式会社 電子部品ユニット

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico

Also Published As

Publication number Publication date
IT220643Z2 (it) 1993-10-07
EP0483080A1 (en) 1992-04-29
IT9053322U1 (it) 1992-04-22

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Legal Events

Date Code Title Description
0001 Granted