IT8606611A0 - DEVICE AND SEMICONDUCTOR ENCAPSULATED IN RESIN AND ELECTRONICALLY INSULATED AND PROCEDURE FOR ITS MANUFACTURE - Google Patents

DEVICE AND SEMICONDUCTOR ENCAPSULATED IN RESIN AND ELECTRONICALLY INSULATED AND PROCEDURE FOR ITS MANUFACTURE

Info

Publication number
IT8606611A0
IT8606611A0 IT8606611A IT661186A IT8606611A0 IT 8606611 A0 IT8606611 A0 IT 8606611A0 IT 8606611 A IT8606611 A IT 8606611A IT 661186 A IT661186 A IT 661186A IT 8606611 A0 IT8606611 A0 IT 8606611A0
Authority
IT
Italy
Prior art keywords
procedure
manufacture
resin
semiconductor encapsulated
electronically insulated
Prior art date
Application number
IT8606611A
Other languages
Italian (it)
Other versions
IT1215023B (en
Inventor
Spatriciano Permicioro Antonio
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Priority to IT8606611A priority Critical patent/IT1215023B/en
Publication of IT8606611A0 publication Critical patent/IT8606611A0/en
Priority to EP87201454A priority patent/EP0257681A3/en
Priority to PH35722A priority patent/PH25368A/en
Priority to JP62209401A priority patent/JPS6362239A/en
Priority to KR1019870009326A priority patent/KR880003426A/en
Priority to US07/090,142 priority patent/US4888307A/en
Priority to MYPI87001498A priority patent/MY102351A/en
Application granted granted Critical
Publication of IT1215023B publication Critical patent/IT1215023B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
IT8606611A 1986-08-27 1986-08-27 RESIN AND ELECTRONICALLY ISOLATED ENCAPSULATED DEVICE AND SEMICONDUCTOR AND PROCESS FOR LASUA MANUFACTURE IT1215023B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IT8606611A IT1215023B (en) 1986-08-27 1986-08-27 RESIN AND ELECTRONICALLY ISOLATED ENCAPSULATED DEVICE AND SEMICONDUCTOR AND PROCESS FOR LASUA MANUFACTURE
EP87201454A EP0257681A3 (en) 1986-08-27 1987-07-30 Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
PH35722A PH25368A (en) 1986-08-27 1987-08-24 Method for manufacturing plastic encapsulated semiconducter devices
JP62209401A JPS6362239A (en) 1986-08-27 1987-08-25 Manufacture of semiconductor device enclosed in plastic capsule
KR1019870009326A KR880003426A (en) 1986-08-27 1987-08-26 Plastic capsule semiconductor device and manufacturing method thereof
US07/090,142 US4888307A (en) 1986-08-27 1987-08-27 Method for manufacturing plastic encapsulated semiconductor devices
MYPI87001498A MY102351A (en) 1986-08-27 1987-09-01 Encapsulation for semiconductor devices.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8606611A IT1215023B (en) 1986-08-27 1986-08-27 RESIN AND ELECTRONICALLY ISOLATED ENCAPSULATED DEVICE AND SEMICONDUCTOR AND PROCESS FOR LASUA MANUFACTURE

Publications (2)

Publication Number Publication Date
IT8606611A0 true IT8606611A0 (en) 1986-08-27
IT1215023B IT1215023B (en) 1990-01-31

Family

ID=11121391

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8606611A IT1215023B (en) 1986-08-27 1986-08-27 RESIN AND ELECTRONICALLY ISOLATED ENCAPSULATED DEVICE AND SEMICONDUCTOR AND PROCESS FOR LASUA MANUFACTURE

Country Status (3)

Country Link
JP (1) JPS6362239A (en)
KR (1) KR880003426A (en)
IT (1) IT1215023B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2596995B2 (en) * 1988-12-21 1997-04-02 シャープ株式会社 Method for manufacturing semiconductor device
JP2752677B2 (en) * 1989-01-11 1998-05-18 日本電気株式会社 Method for manufacturing semiconductor device
JPH02216838A (en) * 1989-02-17 1990-08-29 Fuji Electric Co Ltd Manufacture of resin-sealed semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130129A (en) * 1983-12-16 1985-07-11 Nec Corp Method for sealing isolation-type semiconductor element with resin

Also Published As

Publication number Publication date
JPS6362239A (en) 1988-03-18
KR880003426A (en) 1988-05-17
IT1215023B (en) 1990-01-31

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970829