IT7928067A0 - CONDITIONING OF POLYAMIDES FOR PLATING WITHOUT THE USE OF CURRENT. - Google Patents

CONDITIONING OF POLYAMIDES FOR PLATING WITHOUT THE USE OF CURRENT.

Info

Publication number
IT7928067A0
IT7928067A0 IT7928067A IT2806779A IT7928067A0 IT 7928067 A0 IT7928067 A0 IT 7928067A0 IT 7928067 A IT7928067 A IT 7928067A IT 2806779 A IT2806779 A IT 2806779A IT 7928067 A0 IT7928067 A0 IT 7928067A0
Authority
IT
Italy
Prior art keywords
polyamides
plating
conditioning
current
Prior art date
Application number
IT7928067A
Other languages
Italian (it)
Other versions
IT1164546B (en
Inventor
David A Dillard
Maguire Eileen
Lawrence P Donovan
Original Assignee
Crown City Plating Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Crown City Plating Co filed Critical Crown City Plating Co
Publication of IT7928067A0 publication Critical patent/IT7928067A0/en
Application granted granted Critical
Publication of IT1164546B publication Critical patent/IT1164546B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/46—Post-polymerisation treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Polyamides (AREA)
IT28067/79A 1978-12-19 1979-12-17 POLYAMIDE CONDITIONING FOR PLATING WITHOUT THE USE OF CURRENT IT1164546B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US97092378A 1978-12-19 1978-12-19

Publications (2)

Publication Number Publication Date
IT7928067A0 true IT7928067A0 (en) 1979-12-17
IT1164546B IT1164546B (en) 1987-04-15

Family

ID=25517714

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28067/79A IT1164546B (en) 1978-12-19 1979-12-17 POLYAMIDE CONDITIONING FOR PLATING WITHOUT THE USE OF CURRENT

Country Status (6)

Country Link
JP (1) JPS55112238A (en)
CA (1) CA1143260A (en)
DE (1) DE2946343C2 (en)
FR (1) FR2444691A1 (en)
GB (1) GB2040969B (en)
IT (1) IT1164546B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
DE3137587A1 (en) * 1981-09-22 1983-04-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Process for the pretreatment of polyamide mouldings for the application of strongly adherent, chemically deposited metal coatings
JPH0427472A (en) * 1990-05-21 1992-01-30 Nippon Parkerizing Co Ltd Washing method for resin molding
DE4328883C2 (en) * 1993-08-27 1996-08-14 Bayer Ag Process for the preparation of molded polyamide parts for the subsequent electroless metallization

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
US3595761A (en) * 1965-02-18 1971-07-27 Enthone Chemical reduction metal plated diallylphthalate polymer and preparation process
US3370974A (en) * 1965-10-20 1968-02-27 Ivan C. Hepfer Electroless plating on non-conductive materials
US3377187A (en) * 1967-02-21 1968-04-09 American Cyanamid Co Glossy, transparent nylon film having an ionically reacted content of a strongly acidic material and method of making same
DE1920238A1 (en) * 1969-04-22 1970-11-12 Du Pont Deutschland Surface pre-treatment of mouldings made of - polyoxymethylene homopolymers
US3686017A (en) * 1970-10-05 1972-08-22 Monsanto Co Surface treatment of nylon shaped articles with aqueous reducing agents
BE792310A (en) * 1971-12-08 1973-06-05 Kalle Ag PROCESS FOR DEPOSITING COPPER COATS ON MOLDED PARTS OF POLYIMIDES
FR2131563A7 (en) * 1972-03-23 1972-11-10 Dynachim Sarl Metal coating - of non-metallic substrates
FR2199012A1 (en) * 1972-09-11 1974-04-05 Aries Robert Etching compsn. for metallisation process - contg alkali hydroxide, org. solvent and surfactant
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating

Also Published As

Publication number Publication date
FR2444691B1 (en) 1983-11-04
GB2040969A (en) 1980-09-03
DE2946343C2 (en) 1983-03-24
CA1143260A (en) 1983-03-22
IT1164546B (en) 1987-04-15
GB2040969B (en) 1983-04-13
FR2444691A1 (en) 1980-07-18
DE2946343A1 (en) 1980-06-26
JPS633950B2 (en) 1988-01-26
JPS55112238A (en) 1980-08-29

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