IT1391192B1 - Dispositivo a struttura multistrato a transizione verticale tra una microstriscia ed una stripline - Google Patents
Dispositivo a struttura multistrato a transizione verticale tra una microstriscia ed una striplineInfo
- Publication number
- IT1391192B1 IT1391192B1 ITTO2008A000619A ITTO20080619A IT1391192B1 IT 1391192 B1 IT1391192 B1 IT 1391192B1 IT TO2008A000619 A ITTO2008A000619 A IT TO2008A000619A IT TO20080619 A ITTO20080619 A IT TO20080619A IT 1391192 B1 IT1391192 B1 IT 1391192B1
- Authority
- IT
- Italy
- Prior art keywords
- stripline
- multilayer structure
- structure device
- micro strip
- vertical transition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
- Buildings Adapted To Withstand Abnormal External Influences (AREA)
- Tents Or Canopies (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2008A000619A IT1391192B1 (it) | 2008-08-05 | 2008-08-05 | Dispositivo a struttura multistrato a transizione verticale tra una microstriscia ed una stripline |
SI200930458T SI2154747T1 (sl) | 2008-08-05 | 2009-08-04 | Večplastna strukturna naprava z vertikalno tranzicijo med mikrotrakasto linijo in trakastim valovodom |
PL09167215T PL2154747T3 (pl) | 2008-08-05 | 2009-08-04 | Urządzenie o strukturze wielowarstwowej z pionowym przejściem pomiędzy linią mikropaskową i paskową |
EP09167215A EP2154747B1 (en) | 2008-08-05 | 2009-08-04 | Multilayer-structure device with vertical transition between a microstrip and a stripline |
ES09167215T ES2396187T3 (es) | 2008-08-05 | 2009-08-04 | Dispositivo de estructura multicapa con transición vertical entre una microcinta y una línea de cinta |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2008A000619A IT1391192B1 (it) | 2008-08-05 | 2008-08-05 | Dispositivo a struttura multistrato a transizione verticale tra una microstriscia ed una stripline |
Publications (2)
Publication Number | Publication Date |
---|---|
ITTO20080619A1 ITTO20080619A1 (it) | 2010-02-06 |
IT1391192B1 true IT1391192B1 (it) | 2011-11-18 |
Family
ID=40809944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITTO2008A000619A IT1391192B1 (it) | 2008-08-05 | 2008-08-05 | Dispositivo a struttura multistrato a transizione verticale tra una microstriscia ed una stripline |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2154747B1 (it) |
ES (1) | ES2396187T3 (it) |
IT (1) | IT1391192B1 (it) |
PL (1) | PL2154747T3 (it) |
SI (1) | SI2154747T1 (it) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102738550B (zh) * | 2011-04-06 | 2014-11-05 | 安德鲁公司 | 带状线至微带线的电容耦合转换结构及包含该结构的天线 |
CN105490017B (zh) * | 2014-09-19 | 2019-06-04 | 安弗施无线射频系统(上海)有限公司 | 电容耦合接地传输装置和移相器网络设备 |
US9468103B2 (en) | 2014-10-08 | 2016-10-11 | Raytheon Company | Interconnect transition apparatus |
US9660333B2 (en) | 2014-12-22 | 2017-05-23 | Raytheon Company | Radiator, solderless interconnect thereof and grounding element thereof |
US9780458B2 (en) | 2015-10-13 | 2017-10-03 | Raytheon Company | Methods and apparatus for antenna having dual polarized radiating elements with enhanced heat dissipation |
KR102542594B1 (ko) * | 2016-12-16 | 2023-06-14 | 삼성전자 주식회사 | 다층 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
US10361485B2 (en) | 2017-08-04 | 2019-07-23 | Raytheon Company | Tripole current loop radiating element with integrated circularly polarized feed |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4004048B2 (ja) * | 2003-04-11 | 2007-11-07 | Tdk株式会社 | 高周波伝送線路 |
-
2008
- 2008-08-05 IT ITTO2008A000619A patent/IT1391192B1/it active
-
2009
- 2009-08-04 EP EP09167215A patent/EP2154747B1/en active Active
- 2009-08-04 SI SI200930458T patent/SI2154747T1/sl unknown
- 2009-08-04 ES ES09167215T patent/ES2396187T3/es active Active
- 2009-08-04 PL PL09167215T patent/PL2154747T3/pl unknown
Also Published As
Publication number | Publication date |
---|---|
ITTO20080619A1 (it) | 2010-02-06 |
ES2396187T3 (es) | 2013-02-19 |
PL2154747T3 (pl) | 2013-04-30 |
EP2154747A1 (en) | 2010-02-17 |
EP2154747B1 (en) | 2012-10-03 |
SI2154747T1 (sl) | 2013-02-28 |
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