IT1320025B1 - SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT - Google Patents

SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT

Info

Publication number
IT1320025B1
IT1320025B1 IT2000TO000334A ITTO20000334A IT1320025B1 IT 1320025 B1 IT1320025 B1 IT 1320025B1 IT 2000TO000334 A IT2000TO000334 A IT 2000TO000334A IT TO20000334 A ITTO20000334 A IT TO20000334A IT 1320025 B1 IT1320025 B1 IT 1320025B1
Authority
IT
Italy
Prior art keywords
procedure
manufacture
component
support
printed circuit
Prior art date
Application number
IT2000TO000334A
Other languages
Italian (it)
Inventor
Giuseppe Pedretti
Carlo Arrigoni
Original Assignee
Viasystems S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viasystems S R L filed Critical Viasystems S R L
Priority to IT2000TO000334A priority Critical patent/IT1320025B1/en
Publication of ITTO20000334A0 publication Critical patent/ITTO20000334A0/en
Priority to PCT/IT2001/000177 priority patent/WO2001078140A2/en
Publication of ITTO20000334A1 publication Critical patent/ITTO20000334A1/en
Application granted granted Critical
Publication of IT1320025B1 publication Critical patent/IT1320025B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
IT2000TO000334A 2000-04-10 2000-04-10 SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT IT1320025B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT2000TO000334A IT1320025B1 (en) 2000-04-10 2000-04-10 SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT
PCT/IT2001/000177 WO2001078140A2 (en) 2000-04-10 2001-04-09 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2000TO000334A IT1320025B1 (en) 2000-04-10 2000-04-10 SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT

Publications (3)

Publication Number Publication Date
ITTO20000334A0 ITTO20000334A0 (en) 2000-04-10
ITTO20000334A1 ITTO20000334A1 (en) 2001-10-10
IT1320025B1 true IT1320025B1 (en) 2003-11-12

Family

ID=11457657

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2000TO000334A IT1320025B1 (en) 2000-04-10 2000-04-10 SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT

Country Status (2)

Country Link
IT (1) IT1320025B1 (en)
WO (1) WO2001078140A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1381260A1 (en) * 2002-07-11 2004-01-14 Ultratera Corporation Method of plating connecting layers on a conductor pattern of a printed circuit board (PCB)
EP1381259A1 (en) * 2002-07-11 2004-01-14 Ultratera Corporation Structure of printed circuit board (PCB)
US7488620B2 (en) 2005-12-29 2009-02-10 Sandisk Corporation Method of fabricating leadframe based flash memory cards including singulation by straight line cuts

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551788A (en) * 1984-10-04 1985-11-05 Daniel Robert P Multi-chip carrier array
DE3817600C2 (en) * 1987-05-26 1994-06-23 Matsushita Electric Works Ltd Method of manufacturing a semiconductor device with a ceramic substrate and an integrated circuit
US5652185A (en) * 1995-04-07 1997-07-29 National Semiconductor Corporation Maximized substrate design for grid array based assemblies
US6140708A (en) * 1996-05-17 2000-10-31 National Semiconductor Corporation Chip scale package and method for manufacture thereof
US5783866A (en) * 1996-05-17 1998-07-21 National Semiconductor Corporation Low cost ball grid array device and method of manufacture thereof
US6177722B1 (en) * 1998-04-21 2001-01-23 Atmel Corporation Leadless array package

Also Published As

Publication number Publication date
ITTO20000334A1 (en) 2001-10-10
WO2001078140A3 (en) 2002-02-07
WO2001078140A2 (en) 2001-10-18
ITTO20000334A0 (en) 2000-04-10

Similar Documents

Publication Publication Date Title
FI20022140A (en) Flexible printed circuit board
DE60232383D1 (en) Multilayer printed circuit board
DE50312856D1 (en) Integrated circuit arrangement comprising a capacitor arrangement and capacitor arrangements
DE60143643D1 (en) INTEGRATED SEMICONDUCTOR CIRCUIT ELEMENT
DE69938585D1 (en) INTEGRATED CIRCUIT ARRANGEMENT
DE60218932D1 (en) Integrated circuit structure
DE60322826D1 (en) Integrated circuit
DE60029524D1 (en) Flexible circuit board, electro-optical device and electronic device
IT1320363B1 (en) CONVERTER CIRCUIT.
DE69927658D1 (en) Integrated semiconductor circuit
NO20006133D0 (en) Electronic semiconductor component
DE60020806D1 (en) ELECTRONIC SPHYGMOMANOMETER
DE60135728D1 (en) Integrated semiconductor circuit
DE60207512D1 (en) Flexible circuit
DE60131485D1 (en) circuit board
DE60143235D1 (en) Multilayer printed circuit board
DE50312845D1 (en) INTEGRATED CIRCUIT ARRANGEMENT WITH INTEGRATED CONDENSER
DE69909375D1 (en) Integrated circuit arrangement
DE60119194D1 (en) Printed circuit board assembly
DE50312210D1 (en) INTEGRATED CIRCUIT ARRANGEMENT WITH CAPACITORS OPERATING PROCEDURE
DE60204745D1 (en) Connecting device between printed circuit boards
DE60137310D1 (en) CIRCUIT BOARD
DE69939157D1 (en) Printed circuit board
IT1320025B1 (en) SUPPORT OF THE PRINTED CIRCUIT TYPE FOR INTEGRATED ELECTRONIC CIRCUITS, PROCEDURE FOR ITS MANUFACTURE, AND COMPONENT
DE60042381D1 (en) Integrated semiconductor circuit arrangement