IT1265414B1 - Process for making metalised openings in dielectric substrates containing interconnected conductive and/or resistive segments in thin film - Google Patents
Process for making metalised openings in dielectric substrates containing interconnected conductive and/or resistive segments in thin filmInfo
- Publication number
- IT1265414B1 IT1265414B1 IT93MI002697A ITMI932697A IT1265414B1 IT 1265414 B1 IT1265414 B1 IT 1265414B1 IT 93MI002697 A IT93MI002697 A IT 93MI002697A IT MI932697 A ITMI932697 A IT MI932697A IT 1265414 B1 IT1265414 B1 IT 1265414B1
- Authority
- IT
- Italy
- Prior art keywords
- metalised
- openings
- thin film
- making
- gold
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000010409 thin film Substances 0.000 title abstract 2
- 229910052763 palladium Inorganic materials 0.000 abstract 5
- 229910052719 titanium Inorganic materials 0.000 abstract 5
- 238000000151 deposition Methods 0.000 abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 230000037361 pathway Effects 0.000 abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 230000008030 elimination Effects 0.000 abstract 1
- 238000003379 elimination reaction Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
A process is described for making metalised openings in dielectric substrates containing conductive and/or resistive segments pertaining to thin film hybrid circuits for microwave applications. The process comprises the phases of deposition of superimposed layers of TaN, Ti and Pd on the front surface; photomasking and depositing of gold along established pathways; removal of TaN, Ti and Pd outside of said pathways; photoengraving of gold, Pd and Ti at the resistors; drilling holes in zones lacking metal; vacuum sputtering of Ti and Pd on the front side and back side; depositing of a negative photoresist on the front side, photomasking of circular zones superimposed on the holes and partially on the conductive segments; developing, and addition of gold by galvanic means; elimination of the residual photoresist; selective chemical attack to eliminate the excess Pd and Ti. <IMAGE>
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT93MI002697A IT1265414B1 (en) | 1993-12-22 | 1993-12-22 | Process for making metalised openings in dielectric substrates containing interconnected conductive and/or resistive segments in thin film |
| EP94117039A EP0670668B1 (en) | 1993-12-22 | 1994-10-27 | Process for the provision of metallized holes in dielectric substrates comprising interconnected thin film conductive and/or resistive paths |
| AT94117039T ATE162924T1 (en) | 1993-12-22 | 1994-10-27 | METHOD FOR PRODUCING METALIZED HOLES IN DIELECTRIC SUBSTRATES WITH INTERCONNECTED THIN FILM CONDUCTOR AND/OR RESISTANCE TRACKS |
| DE69408298T DE69408298D1 (en) | 1993-12-22 | 1994-10-27 | Process for producing metallized holes in dielectric substrates with interconnected thin-film conductor and / or resistance tracks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT93MI002697A IT1265414B1 (en) | 1993-12-22 | 1993-12-22 | Process for making metalised openings in dielectric substrates containing interconnected conductive and/or resistive segments in thin film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| ITMI932697A0 ITMI932697A0 (en) | 1993-12-22 |
| ITMI932697A1 ITMI932697A1 (en) | 1995-06-22 |
| IT1265414B1 true IT1265414B1 (en) | 1996-11-22 |
Family
ID=11367380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT93MI002697A IT1265414B1 (en) | 1993-12-22 | 1993-12-22 | Process for making metalised openings in dielectric substrates containing interconnected conductive and/or resistive segments in thin film |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT1265414B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276443B (en) * | 2020-02-10 | 2023-03-14 | 中国电子科技集团公司第十三研究所 | Preparation method of microwave thin film hybrid integrated circuit |
-
1993
- 1993-12-22 IT IT93MI002697A patent/IT1265414B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| ITMI932697A0 (en) | 1993-12-22 |
| ITMI932697A1 (en) | 1995-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted | ||
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961218 |